CN212095829U

CN212095829U - Polishing jig device

Info

Publication number: CN212095829U
Application number: CN201922043833.7U
Authority: CN
Inventors: 匡怡君
Original assignee: Shanghai Lianxing Business Consulting Center
Current assignee: Shanghai Lianxing Business Consulting Center
Priority date: 2019-11-22
Filing date: 2019-11-22
Publication date: 2020-12-08
Anticipated expiration: 2029-11-22

Abstract

The utility model provides a polishing jig device, the device is including polishing jig body and middle carrier, polishing jig body has the trompil, the periphery of trompil includes the transmission structure, middle carrier passes through transmission structural connection is in polishing jig body in the trompil. The device provided by the utility model improve the rigidity of polishing tool in order to overcome the defect of easy explosion dish, shortened the process time of wafer, saved the processing cost effectively.

Description

Polishing jig device

Technical Field

The utility model relates to a wafer processingequipment especially relates to a polishing tool device.

Background

Wafer polishing technology is one of the key technologies for the surface processing of semiconductor materials, and is primarily the process of removing material from the wafer surface by the action of a polishing pad, a polishing liquid, and selected chemical agents.

For a double polishing machine, a polishing jig is used for fixing parts to be processed between an upper disk surface and a lower disk surface of a polishing machine when the two surfaces of a wafer are processed simultaneously, the upper disk surface and the lower disk surface apply pressure to the wafer to fix the wafer in the middle of the disk surfaces, the polishing jig can rotate to drive the wafer to rotate between the disk surfaces, and meanwhile, the upper disk surface and the lower disk surface rotate in the same direction or in opposite directions, and polishing liquid is added to achieve the purpose of polishing.

However, in the conventional polishing process, a wafer to be processed is placed in a polishing jig as shown in fig. 1, and the polishing jig is put in a grinder. Because the thickness of the polishing jig needs to be smaller than the thickness of the wafer, the polishing jig is easy to have insufficient rigidity, so that the external teeth are twisted, and even the disk is exploded. Therefore, when the polishing jig is used for processing, the rotation speed of the grinding machine is not too high, and the pressure of the upper disc surface and the lower disc surface is not too high, so that the phenomenon is prevented.

The device provided by the utility model improve polishing tool rigidity in order to overcome above-mentioned defect, shortened wafer process time, saved the processing cost effectively.

Disclosure of Invention

For solving the not enough defect that leads to exploding the dish easily of above-mentioned polishing tool rigidity, the utility model provides a polishing tool device, its aim at improves polishing tool rigidity to shorten the time of wafer polishing.

In order to achieve the above object, the utility model discloses a technical scheme be: a polishing jig device is characterized by comprising a polishing jig body and an intermediate carrier, wherein the polishing jig body comprises a central opening, and the intermediate carrier is arranged in the central opening; and the inner circumference of the polishing jig body is provided with a transmission structure for driving the intermediate carrier to rotate.

Preferably, the transmission structure comprises at least one protrusion, and the outer circumference of the intermediate carrier comprises the same number of grooves matched with the protrusions.

Preferably, the polishing jig body and/or the intermediate carrier further have holes for the flow of the polishing liquid.

Preferably, the upper and lower surfaces of the intermediate carrier have carrier grooves for fixing the wafer.

Preferably, the bottom surface is pasted with the adsorption pad in the carrier recess for avoid the wafer rotation and drop, the adsorption pad with the height of wafer sum is greater than the height of carrier recess.

Preferably, the thickness of the intermediate carrier is not less than that of the polishing jig body.

Preferably, the intermediate carrier is made of a ceramic material.

The device provided by the utility model utilizes the buckle connection structure of polishing tool body and middle carrier, realizes the quick polishing processing technology of wafer. Compared with the prior art, the device improves the thickness of the polishing jig device, increases the rigidity of the polishing jig device, can improve the rotating speed of the grinding machine and the pressure of the upper disc surface and the lower disc surface, and avoids the risk that the external teeth of the polishing jig are distorted easily and explode the disc when the rapid polishing effect is achieved. Meanwhile, the device only polishes one surface of the wafer at a time, so that different polishing liquids can be used for each polished surface according to different polishing requirements, and the polishing cost is further reduced.

Drawings

In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention and do not constitute a limitation to the scope of the present invention. Those skilled in the art can appropriately expand the scope of the present invention in consideration of the objects and spirit thereof, based on their general knowledge.

FIG. 1: the structure schematic diagram of the polishing jig in the prior art;

FIG. 2: the polishing jig device provided by the embodiment of the invention is a schematic top view structure diagram, wherein (1) is a polishing jig body, (2) is an intermediate carrier, (3) is a transmission structure, (4) is a wafer, and (6) is a hole;

FIG. 3: the embodiment of the invention provides a schematic view structure diagram of a polishing jig device;

FIG. 4: the embodiment of the invention provides a schematic structural view of a polishing jig device, wherein (5) is a carrier groove.

Detailed Description

The present invention will now be described in further detail with reference to the accompanying drawings, but the following embodiments do not limit the present invention.

As shown in fig. 2, an embodiment of the utility model provides a polishing jig device for wafer polishing, including polishing jig body (1) and middle carrier (2), middle carrier (2) are fixed in the trompil of polishing jig body (1), two drive structure (3) have on polishing jig body (1), two recesses and the drive structure (3) buckle of middle carrier (2) are connected, when the machine that grinds is rotatory, it is rotatory to drive polishing jig body (1) along the gear outward through polishing jig body (1), it is rotatory that polishing jig body (1) drives middle carrier (2) through drive structure.

In an alternative embodiment, the intermediate carrier (2) is further provided with holes (6), and since the intermediate carriers (2) used in different double polishing machines are different in size and wafers (4) may be attached to the middle of the ceramic plate in order to achieve more output pieces, the size and position of the holes (6) can be changed according to the actual condition of the wafers, and the holes can also be arranged on the polishing jig body (1). The holes are arranged for the circulation of the polishing solution, so that a better polishing effect can be achieved.

Generally, the polishing level of both sides of the wafer is different, for example, the polishing requirement of the Si side is relatively high, the surface roughness and scratches need to be controlled, and the C side needs to be free of scratches by looking at with a strong light. Therefore, different polishing liquids can be used alternatively for polishing different wafer surfaces.

As shown in fig. 3, another embodiment of the present invention provides a polishing jig device.

In an alternative embodiment, the intermediate carrier (2) is provided with holes, and since the intermediate carriers (2) used in different double polishing machines are different in size and wafers (4) may be attached to the middle of the ceramic plate in order to achieve more output pieces, the size and position of the holes may be changed according to the actual condition of the wafers, and the holes may also be arranged on the polishing tool body (1). The holes are arranged for the circulation of the polishing solution, so that a better polishing effect can be achieved.

In an alternative embodiment, the wafer (4) is fixed on the intermediate carrier (2) by means of an adhesive, which may be wax, double-sided tape, damping cloth, UV-glue, which fixes the wafer (4) relative to the intermediate carrier (2).

As shown in fig. 4, another embodiment of the present invention provides a polishing jig device.

In an alternative embodiment, the intermediate carrier (2) further has a carrier groove (5), and the wafer (4) is fixed relative to the intermediate carrier (2) through the carrier groove (5). The bottom surface in the carrier groove (5) is adhered with an adsorption pad for fixing the wafer (4) to avoid the wafer from rotating and falling off, and the adsorption pad can be repeatedly used without being replaced every time. The superposition height of the wafer (4) and the adsorption pad is higher than the depth of the carrier groove (5).

The polishing jig device provided by the present invention is introduced in detail, and the principle and the implementation of the present invention are explained by applying specific examples, and the explanation of the above implementation is only used to help understand the core idea of the present invention; while the invention has been described in terms of specific embodiments and applications, it will be apparent to those skilled in the art that numerous variations and modifications can be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. The polishing jig device is characterized by comprising a polishing jig body and an intermediate carrier, wherein the polishing jig body comprises a central opening, the intermediate carrier is arranged in the central opening, and a transmission structure is arranged on the inner circumference of the polishing jig body and used for driving the intermediate carrier to rotate.

2. The device of claim 1, wherein the transmission structure comprises at least one protrusion, and the outer circumference of the intermediate carrier comprises the same number of grooves as the protrusion and the same number of grooves are matched with the protrusion.

3. The apparatus of claim 1, wherein the polishing tool body and/or the intermediate carrier further comprises at least one hole for flowing polishing liquid therethrough.

4. The apparatus as claimed in any one of claims 1 to 3, wherein the intermediate carrier has carrier grooves on its upper and lower surfaces for holding wafers.

5. The apparatus as claimed in claim 4, wherein an absorption pad is adhered to the inner bottom surface of the carrier groove for preventing the wafer from rotating and falling off, and the height of the absorption pad and the wafer is greater than the depth of the carrier groove.

6. The apparatus according to any one of claims 1 to 3, wherein the thickness of the intermediate carrier is not lower than the polishing jig body.

7. The apparatus according to any one of claims 1 to 3, wherein the intermediate carrier is made of a ceramic material.