CN219685062U

CN219685062U - Novel wafer polishing clamp

Info

Publication number: CN219685062U
Application number: CN202320379177.1U
Authority: CN
Inventors: 陈自力
Original assignee: Xiamen Jingsheng Semiconductor Technology Co ltd
Current assignee: Xiamen Jingsheng Semiconductor Technology Co ltd
Priority date: 2023-03-03
Filing date: 2023-03-03
Publication date: 2023-09-15
Anticipated expiration: 2033-03-03

Abstract

The utility model provides a novel wafer polishing clamp, which comprises the following components: the disc body is provided with saw teeth which are uniformly distributed at the edge; the disc body is provided with a through polishing hole, and a polishing pad is placed in the polishing hole; the two sides of the polishing pad are provided with adsorption pads for placing wafers; the tray body is also provided with two extending holes communicated with the polishing holes; and at least one liquid leakage hole is also formed in the tray body. Through the adsorption pad that is in the polishing pad both sides, can realize at two sides of two throwing machines simultaneously to the wafer on the adsorption pad of polishing pad both sides realizes single face polishing, has improved polishing efficiency greatly, through be equipped with the fine hair on the adsorption pad surface, is favorable to adsorbing and protecting more the wafer. Through set up two with the extension hole of polished pore intercommunication the disk body, be convenient for get put the polishing backing plate and in time discharge polishing solution and impurity.

Description

Novel wafer polishing clamp

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a novel wafer polishing clamp.

Background

In existing semiconductor technology, excess material is often removed from a semiconductor wafer by chemical mechanical polishing to achieve a planar surface. In the polishing process, a wafer is usually pressed against a polishing pad rotating at a high speed, and a polishing liquid is supplied to the polishing surface of the wafer, so that the wafer, the polishing pad and the polishing liquid are rubbed with each other to achieve the planarization purpose.

At present, double polishing machines are generally used for realizing double-sided polishing of wafers, but in actual production, only single-sided polishing of the wafers is sometimes required according to the requirements of customers, and then a new single polishing machine is required to be purchased, so that the cost is high.

Therefore, designing a new wafer polishing fixture to achieve efficient single-sided polishing of a wafer on a dual polishing machine is a technical problem that needs to be solved by those skilled in the art.

Disclosure of Invention

The utility model provides a novel wafer polishing clamp, which realizes high-efficiency single-sided polishing on a wafer by a double polishing machine.

To achieve the purpose, the utility model adopts the following technical scheme: a novel wafer polishing fixture, comprising: the disc body is provided with saw teeth which are uniformly distributed at the edge; the disc body is provided with a through polishing hole, and a polishing pad is placed in the polishing hole; the two sides of the polishing pad are provided with adsorption pads for placing wafers; the tray body is also provided with two extending holes communicated with the polishing holes; and at least one liquid leakage hole is also formed in the tray body.

Further, the extension hole is semicircular.

Further, the weeping hole and the polishing hole are both circular.

Further, the polishing hole is larger than the weeping hole.

Further, fluff is arranged on the surface of the adsorption pad.

The beneficial effects of the utility model are as follows:

through setting up the adsorption pad in polishing backing plate both sides, place the wafer that waits single face to polish again, then put into two throwing machines, at two sides of two throwing machines simultaneously to the wafer on the adsorption pad of polishing backing plate both sides realizes single face polishing, so both saved the expense of purchasing single throwing machine, simultaneously, also improved polishing efficiency greatly, carry out two wafer polishing simultaneously.

And the surface of the adsorption pad is provided with the fluff, so that the adsorption and the protection of the wafer are facilitated.

Through set up two with the extension hole of polished pore intercommunication the disk body, be convenient for get put polishing backing plate and in time discharge polishing solution and impurity.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and do not constitute a limitation on the utility model. In the drawings:

fig. 1 is a top view of a novel wafer polishing jig.

Fig. 2 is a top view of the polishing pad 13.

Fig. 3 is a bottom view of the polishing pad 13.

Detailed Description

In order to make the present utility model better understood by those skilled in the art, the following description will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1, a novel wafer polishing jig includes: the disc body 10, the edge of the disc body 10 is provided with saw teeth 11 which are uniformly distributed; the disc 10 has a polishing hole 12 therethrough, and a polishing pad (not shown in fig. 1) is placed in the polishing hole 12. The tray body is made of organic glass.

Referring to fig. 2 and 3, both sides of the polishing pad 13 are provided with an adsorption pad 14 for placing a wafer. The surface of the adsorption pad 14 is provided with fluff, the wafer is placed on the adsorption pad 14, during the polishing process, the wafer is generally pressed on the adsorption pad 14 rotating at a high speed, polishing liquid is provided for the polishing surface of the wafer, and the purpose of planarization is achieved by utilizing the mutual friction among the wafer, the polishing pad and the polishing liquid. The surface of the adsorption pad 14 is provided with fluff, which is more beneficial to adsorbing and protecting the wafer. As can be seen from fig. 2 and 3, the polishing pad 13 is symmetrically provided with an adsorption pad 14 for placing a wafer on both sides.

Through the arrangement, the adsorption pads 14 on the two sides of the polishing pad 13 can be used for placing wafers to be polished on one side, then the wafers are placed into the double polishing machine, and the wafers on the adsorption pads 14 on the two sides of the polishing pad 13 are polished on one side at the same time on the upper side and the lower side of the double polishing machine, so that the cost of purchasing the single polishing machine is saved, meanwhile, the polishing efficiency is greatly improved, and meanwhile, 2 polishing sheets are carried out.

With continued reference to fig. 1, the disc body 10 further has two extending holes 15 in communication with the polishing hole 12, and the extending holes 15 are semicircular. The extension holes 15 facilitate access to the polishing pad 13 during use.

With continued reference to fig. 1, the tray body 10 is further provided with at least one weeping hole 16. In the embodiment of the utility model, 3 of the weep holes 16 are provided. The weep hole 16 and the polished hole 12 are both circular. The polishing holes 12 are larger than the weeping holes 16, and the size of the polishing holes is set according to the size of the wafer. The polishing liquid is supplied to the wafer polishing surface, and after polishing, the used polishing liquid and impurities flow from both sides of the extension holes 15 to the lower side of the tray body 10. Through having opened the weeping hole 16, in the in-process of polishing, the polishing liquid is difficult to pile up near polishing hole 12, and most polishing liquid just directly can follow leak the weeping hole 16 is leaked, can not produce to pile up, and the polishing liquid is stayed on the wafer for a long time and is also easy excessively corroded, so, when letting whole polishing liquid contact this product, can be more even.

It is to be understood that the foregoing is only illustrative of the presently preferred embodiments of the utility model and the technical principles that have been developed. It will be understood by those skilled in the art that the present utility model is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the utility model. Therefore, while the utility model has been described in connection with the above embodiments, the utility model is not limited to the embodiments, but may be embodied in many other equivalent forms without departing from the spirit or scope of the utility model, which is set forth in the following claims.

Claims

1. A novel wafer polishing clamp, comprising:

the disc body is provided with saw teeth which are uniformly distributed at the edge;

the disc body is provided with a through polishing hole, and a polishing pad is placed in the polishing hole;

the two sides of the polishing pad are provided with adsorption pads for placing wafers;

the tray body is also provided with two extending holes communicated with the polishing holes;

and at least one liquid leakage hole is also formed in the tray body.

2. The novel wafer polishing jig of claim 1, wherein the extension hole is semicircular.

3. The novel wafer polishing jig of claim 1, wherein the weeping hole and the polishing hole are both circular.

4. The novel wafer polishing jig of claim 3, wherein the polishing hole is larger than the weeping hole.

5. The novel wafer polishing jig according to claim 1, wherein the surface of the suction pad is provided with naps.