JP2009028826A - Double side polisher - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a double side polisher capable of performing parallel and flat surface polishing without having the metallic powder of a gear and a solidified body of a polishing agent contaminating or scratching the surface of a polishing object. <P>SOLUTION: In the double side polisher, a projection 5 is formed on one surface of a carrier 8 holding the polishing object 6. By inserting the projection 5 in a through-hole 4 formed at a lower surface plate 1 or an upper surface plate 2, the carrier 8 is arranged in a rotatable state at a prescribed position in the upper and lower surface plates 1, 2. The upper surface plate 2 is placed on the carrier 8, and the upper and lower surface plates 1, 2 are rotated. Thereby, the carrier 8 is made to perform planetary motion to polish both surfaces of the polishing object 6 held by the carrier 8. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a double-side polishing machine that performs double-side polishing of a plate of metal, ceramics, semiconductor, glass or the like.

  Usually, a double-side polishing machine called a double-sided lapping machine or a double-sided polishing machine is used for parallel flat polishing of a thin plate of an optical material such as glass or a semiconductor wafer.

  A general double-side polishing machine has a structure as shown in FIG. A plurality of disk-shaped carriers 78 are arranged on the lower surface plate 71, an object to be polished 76 is inserted into a holding hole provided in the carrier 78, and the upper surface plate 72 is placed thereon. The carrier 78 is provided with a gear 77 on the outer periphery, and meshes with the external gear 73 on the center side of the lower surface plate 71 and the internal gear 74 on the outer peripheral side, thereby revolving while rotating with the rotation of the external gear 73 and the internal gear 74. (Planetary motion). In this state, both surfaces of the object to be polished 76 are polished by rotating the upper and lower surface plates while supplying an abrasive between the upper and lower surface plates.

  Usually, the external gear and the internal gear of such a double-side polishing machine are made of metal, so that minute metal powder is generated by the meshing of the gear. This metal powder penetrates between the upper and lower surface plates via the gear 77 of the carrier 78 and contaminates or damages the surface of the object to be polished.

  In order to prevent the generation of such metal powder, a method of coating a metal gear with a resin (Patent Document 1), a method of making the entire gear a hard resin (Patent Document 2), or a structure that does not use an external gear and an internal gear. There is a method (Patent Document 3).

Japanese Patent Laid-Open No. 10-329013 JP 09-254026 A Japanese Patent Laid-Open No. 10-76460

  In a double-side polishing machine using an external gear or the like as described in Patent Documents 1 and 2, the abrasive adhered to the gear and stagnated there is dried and solidified while the operation of the polishing machine is stopped. To do. The abrasive solidified between the gear teeth (referred to as a “solidified body”) interferes with the rotation of the gear and may damage the surface of the object to be polished like the metal powder.

  The double-side polishing machine described in Patent Document 3 does not use an external gear, but uses a disc-shaped carrier holder provided with a plurality of holes having a diameter slightly larger than that of the carrier for regulating the movement of the carrier. Therefore, there is a problem that the mechanism is complicated and it takes time to set an object to be polished and to clean parts.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a double-side polishing machine capable of performing parallel plane polishing without contaminating or damaging the surface of an object to be polished. Is to provide.

The double-side polishing machine according to the present invention made to solve the above problems is
In a double-side polishing machine that sandwiches a carrier holding an object to be polished between a lower surface plate and an upper surface plate, and polishes the upper and lower surfaces of the object to be polished by planetary movement of the carrier,
The carrier has a protrusion on one side;
The lower surface plate or the upper surface plate has a through hole into which the protrusion can be inserted.

In the double-side polishing machine according to the present invention, the carrier protrusion is inserted into the through hole provided in the lower surface plate or the upper surface plate. As a result, the carrier revolves as the fixed surface plate rotates, and also rotates around the protrusion due to friction with the opposite surface plate. That is, it performs planetary motion. The upper and lower surfaces of the object to be polished held on the carrier are polished by the planetary motion of the carrier.
Since the double-side polishing machine according to the present invention uses the rotation of the upper and lower surface plates to cause the carrier to perform planetary motion, firstly, an external gear or the like that is a source of metal powder is unnecessary, A solidified body of the abrasive is not generated, and they do not contaminate or damage the surface of the object to be polished. Secondly, no extra or complicated parts such as an external gear or a carrier holder are required, and the structure is simple, so that the set time of the object to be polished and the cleaning time of the parts can be shortened.

  Hereinafter, an embodiment of a double-side polishing machine according to the present invention will be described with reference to the accompanying drawings.

  FIG. 1 is a perspective view of a state in which the upper surface plate 2 is lifted in the double-side polishing machine according to the present embodiment. As shown in this figure, the double-side polishing machine according to this embodiment includes a lower surface plate 1, an upper surface plate 2, and a carrier 8. FIG. 2 is a plan view in which the carrier 8 is disposed on the lower surface plate 1, and FIG. 3A is a perspective view of the lower surface of the carrier 8.

  The lower surface plate 1 and the upper surface plate 2 are discs having a circular opening at the center, and each facing surface is a polished surface. The lower surface plate 1 has a plurality of through holes 4 arranged at a predetermined interval on a circle between the outer diameter and the inner diameter. The upper surface plate 2 has, on its upper surface, circumferential and radial flow paths 10 for pouring the abrasive into the polishing surface, and two hooks 17 extending inward (center) from the edge of the opening. . The carrier 8 is a disk having four holding holes for holding the workpiece 6, has no gear on the outer periphery, and has a protrusion 5 on the lower surface as shown in FIG. An upper surface plate driving unit 3 for rotating the upper surface plate 2 is disposed in the central opening of the lower surface plate 1, and the upper surface plate is disposed on the upper surface edge of the upper surface plate driving unit 3. Two cuts are provided for engaging the two hooks 17.

  Polishing by the double-side polishing machine according to the present embodiment is performed as follows. First, as shown in FIG. 1, each carrier 8 is attached to a predetermined position of the lower surface plate 1 by inserting the protruding portion 5 of the carrier 8 into the through hole 4 of the lower surface plate 1. Next, the workpiece 6 is inserted into the holding holes provided in the carrier 8, and the upper surface plate 2 is placed thereon. At this time, the carriers 8 and the objects to be polished 6 may be arranged symmetrically as shown in FIG. 2, for example, so that the load of the upper surface plate 2 is applied to the upper surfaces of the objects to be polished 6 evenly. desirable. Thereafter, while supplying the polishing agent from the flow path 10 of the upper surface plate 2 to the polishing surface, the lower surface plate 1 and the upper surface plate 2 are rotated by the lower surface plate driving unit (not shown) and the upper surface plate driving unit 3. Accordingly, the carrier 8 moves in a planetary motion, and both surfaces of the object 6 to be polished held on the carrier 8 are polished. The lower surface plate 1 is connected to the lower surface plate driving unit separately from the upper surface plate driving unit 3, and can rotate independently of the upper surface plate 2.

  Further, according to the double-side polishing machine according to the present embodiment, an abrasive is interposed between the metal surface of the upper and lower surface plate and the object to be polished, and the object to be polished is polished by rubbing them, that is, lapping is performed. It can be carried out. Further, if the metal surface of the upper and lower surface plates is covered with a soft polishing cloth or polishing pad, it is possible to polish the object to be polished by adding an abrasive to them, that is, polishing.

  Here, the through hole 4 provided in the surface plate will be described. In this embodiment, the through hole 4 is provided in the lower surface plate 1, but this may be provided in the upper surface plate 2. It is desirable that the diameter of the through hole 4 is larger than that of the protrusion 5 so that a gap is generated between the protrusion 5 and the through hole 4. Thereby, first, the rotation of the carrier 8 becomes smooth. Secondly, since the abrasive flows through the gap between the protrusion 5 and the through hole 4, a flow of the abrasive is formed from the outer periphery of the carrier 8 toward the center, and the entire surface of the object to be polished is polished. The agent can be supplied. Further, the abrasive comes to play a role as a lubricant in the rotation of the protrusion 5 and contributes to the smooth rotation of the carrier 8. Furthermore, by making the diameter of the through hole 4 larger and allowing the protrusion 5 to move in the through hole 4, the upper and lower surface plates can be used more widely for polishing.

  As shown in FIG. 2, the number of through holes 4 is 12 in this embodiment, which is larger than the number of carriers 8 (4) used simultaneously. Thereby, the mounting position of the carrier 8 can be shifted every time polishing is performed, and the uneven consumption of the surface plate can be reduced.

  In this embodiment, the position of the protrusion 5 on the carrier 8 is the center of the carrier 8 as shown in FIG. 3A. However, the protrusion 35 is eccentric from the center of the carrier 38 as shown in FIG. You may provide in the position. This allows the carrier 38 to first hold a larger workpiece 36 (greater than its own radius) and secondly rotate the workpiece over a wider range of surface plates. it can. The protrusions 5 and 35 may be bonded to the lower surfaces of the carriers 8 and 38 with an adhesive, screws, or the like, or may be provided integrally with the carrier instead of being bonded.

  It is desirable that the length of the protruding portion 5 is such that the protruding portion 5 protrudes from the lower surface of the carrier 8 attached to the lower surface plate 1. Thus, when the carrier 8 is removed after polishing, the carrier 8 is brought into close contact with the surface tension of the abrasive by pushing the protruding portion 5 protruding from the lower surface of the lower surface plate 1 and difficult to remove from the lower surface plate 1. Can also be removed easily. Moreover, you may make the protrusion part 5 into a shape which becomes so thin that it goes ahead, as shown to Fig.3 (a). Thereby, it becomes easier for the abrasive to flow between the through holes 4.

Since the plurality of carriers 8 can rotate independently of each other, the rotation speeds differ from each other if there is a difference in the thickness, surface roughness, etc. of each workpiece 6 immediately after the start of polishing. However, when the polishing progresses and becomes the same level, the rotation speed becomes almost the same. Therefore, by monitoring the rotation speed of each carrier 8 during polishing, it can be determined whether or not each object 6 has been uniformly polished.
One of the simplest methods for monitoring the rotation speed of each carrier 8 is that each carrier 8 is sandwiched between the upper and lower surface plates 1 and 2, and the carrier 8 itself or a part of the protrusion 5 is visually recognized from the outside. It is to be possible. In this case, if a part of the outer periphery of the carrier 8 is exposed from the upper or lower surface plate, or the protrusion 5 protrudes from the upper or lower surface plate, the visual recognition becomes easy. Furthermore, if markers are attached to these, detection of their rotational speed becomes easier.

  FIG. 4 is a conceptual diagram for explaining that the carrier 8 performs planetary motion in the double-side polishing machine according to the present embodiment. Here, the planetary motion of the carrier 8 can be described separately for revolution and rotation.

  First, the revolution will be described. Since the carrier 8 is fixed to the lower surface plate 1 by the protrusion 5 and the through hole 4 as described above, the carrier 8 rotates around the center of the upper and lower surface plates 1 and 2 together with the lower surface plate 1, that is, It is clear that it will revolve.

  Next, rotation will be described. The rotation of the carrier 8 may be due to inertia or due to friction with the upper surface plate 2 (non-fixed side surface plate). First, rotation due to inertia will be described. FIG. 4A is a view of the rotating lower surface plate 1 as viewed from above. The lower surface plate 1 rotates in the lower surface plate rotation direction 15 (clockwise), and the carrier 48 attached to the upper surface of the lower surface plate 1 moves from position A to position B. , Position C, position D, position A in order, ie, revolving. During this time, since the carrier 48 is rotatable about the protrusion 45, the carrier 48 maintains a constant orientation with respect to the space outside the surface plate even during revolution due to inertia. Therefore, if the lower surface plate 1 that rotates clockwise is used as a reference, the carrier 48 rotates counterclockwise.

  Next, rotation by friction with the upper surface plate 2 will be described. FIG. 4B is a view of the rotating upper platen 2 as viewed from above. Since the upper surfaces of the objects 56 and 66 are in contact with the lower surface of the upper surface plate 2, when the upper surface plate 2 rotates in the upper surface plate rotation direction 16 (counterclockwise), the objects 56 and 66 are Due to friction with the surface plate 2, forces 19 and 20 are received in the same direction. The magnitudes of these forces are proportional to the relative speeds of the workpieces 56 and 66 and the upper surface plate 2, but the relative speed is proportional to the distance from the center of the upper surface plate 18, and therefore is larger than the inner force 19. The outer force 20 is greater. Due to the difference between these forces 19 and 20, the carrier 58 rotates counterclockwise around the protrusion 55.

  As described above, the carrier 8 rotates counterclockwise by the rotating lower surface plate 1 and upper surface plate 2 while revolving together with the lower surface plate 1. In other words, planetary motion. Here, the lower surface plate 1 and the upper surface plate 2 are rotated in the opposite directions. However, the present invention is not limited to this. For example, the upper surface plate 2 is stationary and only the lower surface plate 1 is rotated. Even if the direction and the rotation speed are appropriately determined, the carrier 8 performs planetary motion according to the above principle.

  The double-side polishing machine according to the present embodiment does not require an external gear or an internal gear, but it is also possible to use an existing double-side polishing machine equipped with them. That is, a hole similar to the through hole 4 of the present embodiment is provided in the lower or upper surface plate of the existing double-side polishing machine, and the carrier is properly used depending on the purpose of polishing depending on the purpose of polishing. Can do.

  Further, in the double-side polishing machine according to the present embodiment, a dedicated correction carrier having a protrusion similar to the protrusion 5 can be used to correct a slight level difference generated on the polishing surface by repeating polishing. . Or if it is a double-side polisher provided also with the external gear etc. as mentioned above, the conventional correction | amendment carrier which has a gear in the outer periphery can also be used.

The perspective view of the state which lifted the upper surface plate in the double-side polisher which is one Example of this invention The top view which has arrange | positioned the carrier 8 in the lower surface plate 1 in the double-side polisher of an Example. The perspective view of the lower surface of the carrier in the double-side polishing machine of the embodiment Conceptual diagram (a) of the rotating lower surface plate 1 and conceptual diagram (b) of the rotating upper surface plate 2 in the double-side polishing machine of the embodiment. A perspective view of the conventional general double-side polishing machine with the upper platen lifted

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 71 ... Lower surface plate 2, 72 ... Upper surface plate 3 ... Upper surface plate drive part 4 ... Through-hole 5, 35, 45, 55 ... Projection part 6, 36, 46, 56, 66, 76 ... Polishing object 7 , 77: Gears 8, 38, 48, 58, 78 ... Carrier 10 ... Flow path 15 ... Lower surface plate rotation direction 16 ... Upper surface plate rotation direction 17 ... Hook 18 ... Upper surface plate center 19, 20 ... Upper surface of workpiece Force 73 applied to ... External gear 74 ... Internal gear A ... Position 48 of carrier 48
B: Position B of carrier 48
C: Position C of carrier 48
D: Position D of carrier 48

Claims (7)

In a double-side polishing machine that sandwiches a carrier holding an object to be polished between a lower surface plate and an upper surface plate, and polishes the upper and lower surfaces of the object to be polished by planetary movement of the carrier,
The carrier has a protrusion on one side;
The double-side polishing machine, wherein the lower surface plate or the upper surface plate has a through hole into which the protrusion can be inserted. The double-side polishing machine according to claim 1,
A double-side polishing machine, wherein the through hole creates a gap between the through hole and the protrusion inserted into the through hole. The double-side polishing machine according to claim 1 or 2,
The double-side polishing machine is characterized in that the through holes are provided in the lower surface plate or the upper surface plate more than the number of carriers used simultaneously. The double-side polishing machine according to any one of claims 1 to 3,
The double-side polishing machine, wherein the protrusion is in a position eccentric from the center of the carrier. The double-side polishing machine according to any one of claims 1 to 4,
The through hole is provided in the lower surface plate,
The double-side polishing machine, wherein the protrusion protrudes from the lower surface of the lower surface plate with the carrier attached to the lower surface plate. The double-side polishing machine according to any one of claims 1 to 5,
A double-side polishing machine, wherein the carrier itself or a part of the protrusion is visible from outside in a state where the carrier is sandwiched between upper and lower surface plates. The double-side polishing machine according to claim 6,
A double-side polishing machine characterized in that a part of the outer periphery of the carrier is exposed from the upper or lower surface plate.

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