JP2014002818A - Manufacturing method of carrier plate and discoidal substrate, and double-side processing device of discoidal substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier plate capable of suppressing an increase in difference between polishing (grinding) amounts of an upper surface and a lower surface of a discoidal substrate after polishing (grinding) processing.SOLUTION: A carrier plate 30 is provided in a double-side processing device 60 for polishing or grinding both upper and lower surfaces of a discoidal substrate 10. The carrier plate 30 includes: a substrate holding hole for holding the discoidal substrate 10; and a belt-like blade protrusively formed on at least one surface. The double-side processing device 60 includes: a pair of upper and lower surface plates oppositely arranged via the carrier plate 30; supply means for supplying polishing liquid or grinding liquid to the discoidal substrate 10; and drive means for relatively moving the carrier plate 30 and the pair of upper and lower surface plates. The carrier plate 30 polishes or grinds both the upper and lower surfaces of the discoidal substrate 10 by relatively moving the carrier plate 30 and the pair of upper and lower surface plates.

Description

  The present invention relates to a carrier plate used for polishing or grinding a disk-like substrate suitably used for a magnetic recording medium for a magnetic recording / reproducing apparatus such as a hard disk drive, and a method of manufacturing a disk-like substrate using the carrier plate The present invention relates to a double-sided processing apparatus for a disk-shaped substrate provided with a carrier plate.

  In recent years, with the increasing demand for recording media, the manufacture of disk-shaped disk substrates has been activated. As a magnetic disk substrate which is one of the disk substrates, an aluminum substrate and a glass substrate are widely used. The aluminum substrate is characterized by excellent workability and low cost, while the glass substrate is characterized by excellent strength.

  Conventionally, in the manufacturing process of a disk-shaped substrate, polishing or grinding of the disk-shaped substrate has been performed. As a method of polishing (grinding) the disk-shaped substrate, the disk-shaped substrate is held in the substrate holding hole of the carrier plate, the carrier plate is sandwiched between a pair of upper and lower surface plates arranged opposite to each other, and a pair of upper and lower surface plates There is a method of processing the front and back surfaces of the disk-shaped substrate by relatively moving the carrier plate and the carrier plate.

For example, in Patent Document 1, a plate-like workpiece is accommodated in the accommodation hole of the carrier plate, and the carrier plate is rotated while supplying a polishing liquid between the upper surface plate and the lower surface plate, A technique for flatly polishing both surfaces of the workpiece is described.
Further, in Patent Document 2, the workpiece is positioned in the workpiece holding hole of the carrier for the polishing machine, and the upper and lower surfaces of the workpiece in the polishing agent supplied between the upper surface plate or the lower surface plate that moves relative to these workpieces. Techniques for polishing with abrasive grains are described.

JP 2000-280167 A JP 2000-198064 A

  However, in the conventional technique, a plurality of disks are used by a method in which a carrier plate holding a disk-shaped substrate is sandwiched between a pair of upper and lower surface plates and both surfaces of the disk-shaped substrate are polished (grinded). When both surfaces of the cylindrical substrate are continuously polished (ground), the polishing (grinding) processing speed on the upper surface and the lower surface of the disk-shaped substrate changes with time. For this reason, the difference in the amount of polishing (grinding) between the upper surface and the lower surface of the disk-shaped substrate after polishing (grinding) processing gradually increases, and the variation in quality of the disk-shaped substrate after polishing (grinding) processing increases. There was a problem.

  The present invention has been made in order to solve the above-described problem. The carrier plate holding the disk-shaped substrate is sandwiched between a pair of upper and lower surface plates to polish (grind) both surfaces of the disk-shaped substrate. Even when both surfaces of a plurality of disk-shaped substrates are continuously polished (grinded) using the processing method, changes in the polishing (grinding) speed on the upper and lower surfaces of the disk-shaped substrate occur. An object of the present invention is to provide a carrier plate that is difficult and can suppress an increase in the amount of polishing (grinding) between the upper surface and the lower surface of a disk-shaped substrate after polishing (grinding).

  Also provided are a disk-like substrate manufacturing method and a disk-like substrate double-sided processing apparatus that are capable of continuously manufacturing a plurality of disk-like substrates with small variations in quality using the carrier plate of the present invention. With the goal.

In order to solve the above-mentioned problems, the present inventor has a method for polishing (grinding) both surfaces of a disk-shaped substrate by sandwiching a carrier plate that holds the disk-shaped substrate between a pair of upper and lower surface plates. Focusing on the discharge of the polishing (grinding) liquid supplied to the polishing (grinding) surface, investigations were repeated as shown below.
That is, the polishing (grinding) liquid is used for polishing (grinding), and is then discharged together with the polishing (grinding) waste mainly to the outer peripheral portion of the lower surface plate. However, if both surfaces of a plurality of disk-shaped substrates are continuously polished (grinded), the polishing (grinding) waste and the polishing (grinding) liquid to be discharged gradually move toward the polishing (grinding) surface of the disk-shaped substrate. It remains between the lower surface plate.

Residual polishing (grinding) scraps and polishing (grinding) liquid move downward due to gravity, changing the polishing (grinding) processing speed of the lower surface of the disk-shaped substrate, and especially the surface of the lower polishing cloth or surface plate Wear out. As a result, it was found that the difference in the amount of polishing (grinding) between the upper surface and the lower surface of the disk-shaped substrate after polishing (grinding) processing was increased.
Therefore, the present inventor, when polishing (grinding) both sides of the disk-shaped substrate, the polishing (grinding) liquid and the polishing (grinding) waste to be discharged after being used for polishing (grinding) processing, In order to ensure stable discharge, intensive investigations were repeated.

As a result, when the carrier plate is provided with a belt-like blade formed so as to protrude on at least one surface and the disk-like substrate is polished (grinded), the belt-like blade is polished on the surface plate ( It has been found that it is sufficient to function as a scraper for wiping off grinding and scraping and grinding (grinding) liquids.
When a carrier plate having such a belt-like blade is used, when polishing (grinding), if the pair of upper and lower surface plates and the carrier plate are relatively moved, the upper and lower surfaces of the disk-shaped substrate are polished (ground). ) And polishing (grinding) waste and polishing (grinding) liquid to be discharged on the surface of the pair of upper and lower surface plates facing the belt-like blades are moved by the belt-like blades.

This promotes the discharge of polishing (grinding) waste and polishing (grinding) liquid from the surface facing the strip blades of a pair of upper and lower surface plates, and continuously polishes both surfaces of a plurality of disk-shaped substrates ( Even in the case of (grinding) processing, residual polishing (grinding) waste and polishing (grinding) liquid to be discharged are prevented. Therefore, a change in the polishing (grinding) processing speed between the upper surface and the lower surface of the disk-shaped substrate is suppressed.
The present invention relates to the following.

(1) A carrier plate provided in a double-sided processing apparatus that polishes or grinds both the upper and lower surfaces of a disk-shaped substrate, and the carrier plate is formed to protrude from at least one surface of a substrate holding hole for holding the disk-shaped substrate. A pair of upper and lower surface plates disposed opposite to each other via the carrier plate, and supply means for supplying a polishing liquid or a grinding liquid to the disk-shaped substrate. Drive means for relatively moving the carrier plate and the pair of upper and lower surface plates, and by moving the carrier plate and the pair of upper and lower surface plates relatively, A carrier plate for polishing or grinding both surfaces.

(2) The carrier plate according to (1), wherein the belt-like blade is formed on both upper and lower surfaces.
(3) The carrier plate has a circular shape in plan view, and the belt-like blade extends in a direction intersecting the circumferential direction in plan view (1) or (2) ) Carrier plate.
(4) The carrier plate according to (3), wherein the belt-like blade includes a plurality of belt-like portions arranged in the circumferential direction at equal intervals in the same shape in plan view.

(5) A method for manufacturing a disk-shaped substrate comprising a step of polishing or grinding both upper and lower surfaces of the disk-shaped substrate, wherein the step of polishing or grinding holds the disk-shaped substrate in a substrate holding hole provided in a carrier plate. A step of placing the disk-shaped substrate held on the carrier plate between a pair of upper and lower surface plates, and supplying the polishing liquid or the grinding liquid to the disk-shaped substrate while supplying the pair of upper and lower carrier plates to the disk-shaped substrate. The upper and lower surfaces of the disk-shaped substrate are polished or ground by moving the surface plate relative to each other, and the pair of upper and lower surfaces are fixed by a belt-like blade formed to protrude from at least one surface of the carrier plate. A surface processing step of moving the polishing waste or grinding waste on the surface of the disc facing the belt-like blade and the polishing liquid or grinding liquid. Method for producing a disk-shaped substrate, wherein.

(6) The disk-shaped substrate manufacturing method according to (5), wherein the carrier plate is one in which the belt-like blades are formed on both upper and lower surfaces.
(7) A grinding surface plate is used as the pair of upper and lower surface plates,
In the surface processing step, the upper and lower surfaces of the disk-shaped substrate are ground while supplying a coolant as a grinding liquid. The method for manufacturing a disk-shaped substrate according to (5) or (6),
(8) A polishing surface plate is used as the pair of upper and lower surface plates,
In the surface processing step, the upper and lower surfaces of the disk-shaped substrate are polished while supplying a slurry containing an abrasive as a polishing liquid. The method for manufacturing a disk-shaped substrate according to (5) or (6) .

(9) A disk-like double-sided processing apparatus for polishing or grinding the upper and lower surfaces of the disk-like substrate, comprising a substrate holding hole for holding the disk-like substrate and a belt-like blade formed to protrude on at least one surface. A carrier plate, a pair of upper and lower surface plates disposed opposite to each other via the carrier plate, supply means for supplying a polishing liquid or a grinding liquid to the disk-shaped substrate, the carrier plate and the pair of upper and lower surface plates A disk-side substrate double-side processing apparatus, comprising: a drive unit that relatively moves.

  Since the carrier plate of the present invention is provided with a belt-like blade formed to protrude on at least one surface, the disk-shaped substrate held by the carrier plate of the present invention is disposed between a pair of upper and lower surface plates, When the upper and lower surfaces of the disk-shaped substrate are polished or ground by relatively moving the upper and lower pair of surface plates and the carrier plate, the upper and lower surfaces of the disk-shaped substrate are polished (ground) and on the surface plate by the belt blade Abrasive (grinding) scraps and polishing (grinding) to be discharged on the surface facing the strip blades of a pair of upper and lower surface plates by the function of a scraper for wiping away polishing (grinding) scraps and polishing (grinding) liquid ) The liquid is moved.

This facilitates the removal of polishing (grinding) debris and polishing (grinding) liquid from the surface of the upper and lower surface plates facing the strip blades, and continuously polishes (grinds) both surfaces of a plurality of disk-shaped substrates. Even when processed, the residue of polishing (grinding) waste and polishing (grinding) liquid to be discharged is prevented. Therefore, a change in the polishing (grinding) processing speed between the upper surface and the lower surface of the disk-shaped substrate is suppressed.
Therefore, the manufacturing method of the disk-shaped substrate of the present invention using the carrier plate of the present invention is a method with excellent productivity capable of continuously manufacturing a plurality of disk-shaped substrates with small variations in quality.

FIG. 1 is a schematic perspective view showing an example of a double-sided processing apparatus for a disk-shaped substrate according to the present invention. FIG. 2 is an enlarged schematic perspective view showing a carrier plate provided in the disk-side substrate double-side processing apparatus shown in FIG. FIG. 3 is a schematic perspective view showing another example of the carrier plate of the present invention. FIG. 4 is a schematic perspective view showing another example of the carrier plate of the present invention. FIG. 5 is a schematic perspective view showing another example of the carrier plate of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
The present invention relates to a carrier plate used for polishing (grinding) a disk-shaped substrate used for a magnetic recording medium for a hard disk drive and the like, a method for manufacturing a disk-shaped substrate using the carrier plate, and a disk-shaped substrate including the carrier plate. The present invention relates to a double-sided processing apparatus for substrates.

"Double-sided processing equipment"
FIG. 1 is a schematic perspective view showing an example of a disk-like substrate double-sided processing apparatus according to the present invention. FIG. 2 is an enlarged view of a carrier plate provided in the disk-like substrate double-sided processing apparatus shown in FIG. It is the shown schematic perspective view. A double-sided processing apparatus 60 shown in FIG. 1 is a double-side polishing apparatus that polishes the upper and lower surfaces of the disk-shaped substrate 10 or a double-side grinding apparatus that grinds the upper and lower surfaces of the disk-shaped substrate 10.

  As shown in FIG. 1, the double-sided processing device 60 of the present embodiment includes a carrier plate 30, a pair of upper and lower surface plates 21 a and 21 b that are arranged to face each other via the carrier plate 30, and a disc-like substrate 10. Supply means (not shown) for supplying the grinding fluid and drive means (not shown) for moving the carrier plate 30 and the pair of upper and lower surface plates 21a, 21b relatively are provided.

The disk-shaped substrate 10 is used as a substrate for a magnetic recording medium for a hard disk drive, by polishing and / or grinding both upper and lower surfaces. Examples of the disk-like substrate 10 include those made of an aluminum alloy substrate or a glass substrate made of a disk-like thin plate having an opening at the center. The aluminum alloy substrate may have a NiP plating film formed on the surface.
Such a disk-shaped substrate 10 is subjected to polishing and / or grinding described later, and then, on the upper surface, layers constituting the magnetic recording medium such as a magnetic layer, a protective layer, and a lubricating film are laminated to form a magnetic recording medium. It is supposed to be.

  The double-sided processing apparatus 60 shown in FIG. 1 includes a pair of upper and lower surface plates (hereinafter sometimes simply referred to as “surface plate”) composed of a lower surface plate 21a and an upper surface plate 21b. The lower surface plate 21a is on which the disk-shaped substrate 10 is placed. The upper surface plate 21 b presses the disk-shaped substrate 10 placed on the lower surface plate 21 from above and applies a processing pressure to the disk-shaped substrate 10.

  The surface plates 21a and 21b shown in FIG. 1 have a circular shape in a plan view, and rotation axes (center axes) 46a and 46b for rotating the lower surface plate 21a and the upper surface plate 21b are provided at the central portions of the surface plates 21a and 21b, respectively. ing. The surface plates 21a and 21b shown in FIG. 1 can rotate about the central axes 46a and 46b, respectively. The directions of rotation of the surface plates 21a and 21b are opposite to each other as indicated by arrows in FIG.

  As the surface plates 21a and 21b, when the double-sided processing device 60 of the present embodiment is used as a double-sided polishing device, a polishing surface plate whose surface is an opposite surface between the lower surface plate 21a and the upper surface plate 21b. Is used. As the polishing surface plate, for example, a polishing pad for polishing the surface of the disk-shaped substrate 10 is provided on the opposing surface of the lower surface plate 21a and the upper surface plate 21b which are the polishing surfaces 21a and 21b. Is used.

  The polishing pad can be determined according to the material of the disk-shaped substrate 10, the type of slurry containing an abrasive used for polishing, the purpose of polishing, and the like. For example, when the disk-shaped substrate 10 has an NiP plating film formed on the surface of an aluminum alloy substrate, it is preferable to use a hard polishing cloth formed of urethane or a suede-like soft polishing cloth as a polishing pad. . Moreover, when the disk-shaped board | substrate 10 consists of glass substrates, it is preferable to use a suede-like soft polishing cloth as a polishing pad, for example.

  Moreover, when using the double-sided processing apparatus 60 of this embodiment as a double-sided grinding apparatus, the grinding surface plate which uses the opposing surface of the surface plates 21a and 21b of the lower surface plate 21a and the upper surface plate 21b as a grinding surface is used. The grinding surface plate can be determined according to the material of the disk-shaped substrate 10 and the purpose of grinding. For example, when the disk-shaped substrate 10 is a glass substrate, it is preferable to use a grinding wheel using abrasive grains made of alumina or diamond as the grinding surface plate.

Moreover, as shown in FIG. 1, the ring-shaped recessed part 22 along the circumferential direction is formed in the surface facing the upper surface plate 21b of the lower surface plate 21a. The recess 22 is for accommodating the carrier plate 30.
As shown in FIG. 1, a tooth portion 42 is provided on the outer wall surface of the recess 22. A sun gear 44 is provided along the inner wall surface of the recess 22. The width of the recess 22 in the radial direction of the lower surface plate 21a is set to a dimension corresponding to the diameter of the carrier plate 30 as shown in FIG.

  The carrier plate 30 is placed on the lower surface plate 21a, and is disposed between the surface plates 21a and 21b as shown in FIG. As shown in FIG. 1, the carrier plate 30 is accommodated in a ring-shaped recess 22 formed on a surface facing the upper surface plate 21b of the lower surface plate 21a. In the double-sided processing apparatus 60 shown in FIG. 1, five carrier plates 30 are accommodated in the recess 22. In the double-side processing apparatus 60 shown in FIG. 1, five carrier plates 30 are arranged between the surface plates 21a and 21b, but the number of carrier plates 30 arranged between the surface plates 21a and 21b is particularly limited. Is not to be done.

  As shown in FIG. 2, the carrier plate 30 has a circular shape in plan view, and includes a substrate holding hole 34 and a belt-like blade 36 that protrudes from the upper and lower surfaces of the carrier plate 30. In the carrier plate 30 shown in FIG. 2, the belt-like blade 36 formed on the upper surface and the belt-like blade 36 formed on the lower surface are symmetrical with respect to the center of the belt-like blade 36 in the thickness direction. In FIG. 2, the illustration of the belt-like blades 36 on the lower surface of the carrier plate 30 is omitted to make it easier to see the drawing and to facilitate the description of the arrangement and shape of the belt-like blades 36.

  The substrate holding hole 34 holds the disk-shaped substrate 10. The substrate holding hole 34 is circular in plan view, and a plurality of substrate holding holes 34 are provided through the carrier plate 30. When polishing (grinding) the disk-shaped substrate 10, the disk-shaped substrate 10 can be stably and precisely polished (ground) by installing the disk-shaped substrate 10 in the substrate holding hole 34. The number of the substrate holding holes 34 is not particularly limited, and can be appropriately determined depending on the thickness and strength of the carrier plate 30, the thickness of the disk-like substrate 10 to be held, and the like.

  The inner diameter of the substrate holding hole 34 is determined according to the diameter of the disk-shaped substrate 10 and is larger than the diameter of the disk-shaped substrate 10 in a range where the disk-shaped substrate 10 can be held. As described above, when the inner diameter of the substrate holding hole 34 is larger than the diameter of the disk-shaped substrate 10, when performing polishing (grinding) processing of the disk-shaped substrate 10, an extra portion is added to a part of the outer peripheral end of the disk-shaped substrate 10. It is possible to prevent stress from being applied, which is preferable.

  The belt-like blade 36 shown in FIG. 2 includes four belt-like portions 36a that are the same shape in plan view and are arranged at equal intervals in the circumferential direction. The number of the belt-like portions 36a is not particularly limited, and may be 1 to 3, or 5 or more. Further, in the belt-like blade 36 shown in FIG. 2, all of the four belt-like portions 36a have the same shape, but some or all of the plurality of belt-like portions may have different shapes.

  As shown in FIG. 2, each belt-like portion 36 a has a linear shape extending in a direction intersecting the circumferential direction of the carrier plate 30 in a plan view, and is disposed between adjacent substrate holding holes 34. ing. When the belt-like portion 36a extends in a direction intersecting with the circumferential direction of the carrier plate 30 in plan view, compared to the case where the belt-like portion extends in the circumferential direction of the carrier plate 30, The belt-like blade 36 effectively functions as a scraper for wiping off polishing (grinding) waste and polishing (grinding) liquid existing on the surface plates 21a and 21b.

  As shown in FIG. 2, the extending direction of each strip 36 a is inclined at a predetermined angle with respect to the radial direction of the carrier plate 30. When the belt-like portion 36a extends in a direction intersecting the circumferential direction of the carrier plate 30, and the extending direction of the belt-like portion 36a is inclined with respect to the radial direction of the carrier plate 30, the belt-like blade 36 is It can effectively function as a scraper for wiping off polishing (grinding) scraps and polishing (grinding) liquid present on the surface plate.

  The inclination of the extending direction of the band-shaped part 36a with respect to the radial direction of the carrier plate 30 is such that the extending direction of the band-shaped part 36a and the radius of the carrier plate 30 can function more effectively as the scraper blade 36 as a scraper. Of the angles formed with the direction, the angle θ on the outer peripheral side of the carrier plate 30 is preferably in the range of 0 ° to 80 °, more preferably in the range of 1 ° to 45 °.

As will be described later, the carrier plate 30 is capable of rotating in the direction indicated by the arrow in FIG. 2 around the central axis 37 of the carrier plate 30. The inclination of the extending direction of the belt-shaped portion 36 a with respect to the radial direction of the carrier plate 30 is preferably determined according to the rotation direction of the carrier plate 30.
In the carrier plate 30 shown in FIG. 2, the center side end portion 3a of the strip-shaped portion 36a is more forward than the outer peripheral side end portion 3b of the strip-shaped portion 36a in the rotation direction of the carrier plate 30 with respect to the radial direction of the carrier plate 30. Has been placed.

  As a result, when the upper and lower surfaces of the disc-like substrate 10 are polished (ground) while the carrier plate 30 is rotated about the central axis 37 of the carrier plate 30 by the driving means, the belt-like blade 36 is fixed to the surface plate 21a. The polishing (grinding) debris and the polishing (grinding) liquid existing on 21b are effectively wiped toward the outer periphery of the carrier plate 30. As a result, in the carrier plate 30 shown in FIG. 2, for example, as compared with the case where the rotation direction of the carrier plate 30 is opposite to the direction shown in FIG. The discharge from the boards 21a and 21b can be further promoted.

The width, thickness, length, planar shape, and the like of the belt-like portion 36 a of the belt-like blade 36 can be appropriately determined according to the size of the carrier plate 30.
The width of the belt-like blade 36 (band-like portion 36a) is preferably 2 mm to 10 mm, for example. By setting the width of the belt-like blade 36 to 2 mm or more, the belt-like blade 36 has sufficient strength to function as a scraper. Further, by setting the width of the belt-like blade 36 to 10 mm or less, even if the plurality of substrate holding holes 34 are arranged at a high density, the belt-like blade 36 can be easily placed between adjacent substrate holding holes 34. Can be placed.

  The thickness of the belt-like blade 36 (band-like portion 36a) (height from the surface of the carrier plate 30) is appropriately selected according to the thickness of the disc-like substrate 10 that is the workpiece, the thickness of the carrier plate 30, and the like. Although it can do and it is not specifically limited, It is preferable that it is 0.2 mm-2 mm. By setting the thickness of the belt-like blade 36 to 0.2 mm or more, the belt-like blade 36 can function more effectively as a scraper, and the polishing (grinding) waste and the polishing (grinding) liquid are discharged from the surface plate. Can be further promoted. By setting the thickness of the belt-like blade 36 to 0.2 mm or more, the abrasive (grinding) liquid to be discharged, the abrasive grains used for the polishing (grinding) processing, and the polishing (grinding) debris are removed from the outer periphery of the carrier plate 30. Therefore, it is difficult to accumulate in the tooth portion 35 provided in the. Further, the thickness of the belt-like blade 36 is preferably 2 mm or less from the viewpoint of easy attachment of the belt-like blade 36 to the carrier plate 30.

  The total thickness of the carrier plate 30 and the band-shaped blade 36 (band-shaped portion 36a) is equal to or less than the thickness of the disk-shaped substrate 10 after polishing (grinding). The difference from the thickness of the subsequent disk-shaped substrate 10 is preferably in the range of 0.2 mm to 1 mm. By setting the difference in thickness to 0.2 mm or more, when the disk-shaped substrate 10 is polished (ground), the band-shaped blade 36 and the surface plates 21a and 21b come into contact with each other, and the disk-shaped substrate 10 It is possible to prevent the polishing (grinding) process from being hindered. In addition, by setting the difference in thickness to 1 mm or less, the difference in thickness is sufficiently small, and the belt-like blade 36 can function more effectively as a scraper. Further, the discharge of the polishing (grinding) liquid from the surface plates 21a and 21b can be further promoted.

  In the carrier plate 30 shown in FIG. 2, the belt-like blades 36 are provided on the upper and lower surfaces of the carrier plate 30, but the belt-like blades 36 may be provided on at least one surface of the carrier plate 30, and only on the upper surface. It may be provided, or may be provided only on the lower surface. When the belt-like blades 36 are formed on both upper and lower surfaces, the discharge from the lower surface plate 21a and the upper surface plate 21b of the polishing (grinding) waste and the polishing (grinding) liquid is promoted, and the polishing (grinding) to be discharged It is possible to more effectively prevent waste and polishing (grinding) liquid from remaining.

In addition, when the carrier plate 30 is provided only on one surface, the one provided only on the lower surface effectively discharges the polishing (grinding) waste and the polishing (grinding) liquid from the lower surface plate 21a. Since it can promote, it is preferable. This is because the polishing (grinding) liquid and the polishing (grinding) waste used for the polishing (grinding) process easily accumulate on the lower surface plate 21a side due to the influence of gravity.
Although it does not specifically limit as a material of the carrier plate 30, For example, the epoxy resin etc. which were strengthened by mixing an aramid fiber or glass fiber can be used. The belt-like blade 36 is preferably formed integrally with the carrier plate 30 using the same material as the carrier plate 30.

As shown in FIGS. 1 and 2, a tooth portion 35 is provided on the outer peripheral portion of the carrier plate 30. As shown in FIG. 1, in the carrier plate 30 accommodated in the ring-shaped recess 22 of the lower surface plate 21 a, the tooth portion 35 meshes with the tooth portion 42 on the outer wall surface of the recess 22, and the recess 22 The inner wall surface meshes with the sun gear 44.
As a result, the carrier plate 30 shown in FIG. 2 rotates up and down around the central axis 37 of the carrier plate 30 by the driving means when polishing (grinding) both surfaces of the disk-shaped substrate 10. The planetary motion revolves around the central axes 46a and 46b of 21a and 21b. Further, the rotation direction of the carrier plate 30 shown in FIG. 1 is the same as the rotation direction of the lower surface plate 21a, and is the opposite direction to the rotation direction of the upper surface plate 21b.

The shape of the belt-like blade 36 can be appropriately determined according to the number and density of the substrate holding holes 34 provided in the carrier plate 30, and is not limited to the shape shown in FIG. For example, the belt-like blade may have the shape shown in FIGS.
3 to 5 are schematic perspective views showing other examples of the carrier plate of the present invention. 3 to 5 indicate the rotation direction when the carrier plate is rotated about the center axis 37 of the carrier plate.

The belt-like blade provided in the carrier plate 31 shown in FIG. 3 is composed of three belt-like portions 36b arranged in the circumferential direction of the carrier plate 31 at equal intervals in the same shape in plan view. Each belt-like portion 36 b is a linear member extending in the radial direction of the carrier plate 31, and is disposed between adjacent substrate holding holes 34.
In the present invention, like the carrier plate 30 shown in FIG. 2, the extending direction of the strip 36a may be inclined at a predetermined angle with respect to the radial direction of the carrier plate 30, or the carrier plate shown in FIG. 31, the extending direction of the band-shaped portion 36 a may be the radial direction of the carrier plate 31.
In the present invention, since the polishing (grinding) waste and the polishing (grinding) liquid to be discharged on the surface plate are moved to the outer peripheral side of the carrier plate by the centrifugal force accompanying the rotation of the carrier plate, The present direction may be the radial direction of the carrier plate 31 as shown in FIG. 3 (the angle θ on the outer peripheral side of the carrier plate 30 in FIG. 2 is 0 °).

  The belt-like blade provided on the carrier plate 32 shown in FIG. 4 is composed of three belt-like portions 36c arranged in the circumferential direction of the carrier plate 32 at regular intervals in the same shape in plan view. Each band-like portion 36c extends in a direction intersecting the circumferential direction of the carrier plate 30 in plan view, like the band-like portion 36a shown in FIG. 2, and the extending direction of the band-like portion 36c is the carrier plate. It is a linear thing inclined with respect to the radial direction of 32, and is arrange | positioned between adjacent board | substrate holding holes 34. FIG.

The carrier plate 33 shown in FIG. 5 includes three belt-like portions 36d that are the same shape in plan view and are arranged at equal intervals in the circumferential direction. Each band-like portion 36d is a substantially C-shaped curved line in a plan view that is convex in the rotation direction of the carrier plate 33, extends in a direction intersecting the circumferential direction, and between adjacent substrate holding holes 34. Is arranged.
In the carrier plate 33 shown in FIG. 5, the outer peripheral side end 3d of the belt-like portion 36d is more forward of the carrier plate 33 in the rotation direction than the center-side end portion 3c of the belt-like portion 36a with respect to the radial direction of the carrier plate 33. Has been placed.

  In the carrier plate 33 shown in FIG. 5, the belt-like portion 36 d has a substantially C-shaped curved shape in a plan view in which the carrier plate 33 is convex in the rotation direction of the carrier plate 33. When the upper and lower surfaces of the disk-shaped substrate 10 are polished (grinded) while rotating around the shaft 37, polishing (grinding) scraps and polishing (grinding) liquid existing on the surface plates 21a and 21b are removed from the belt-like blade 36d. The polishing (grinding) debris and the polishing (grinding) liquid existing on the surface plates 21a and 21b are effectively wiped toward the outer periphery of the carrier plate 33 without being accumulated in the C-shaped curved portion. it can. Therefore, the carrier plate 33 shown in FIG. 5 has, for example, a surface plate for polishing (grinding) waste and polishing (grinding) liquid as compared with the case where the rotation direction of the carrier plate 33 is opposite to the direction shown in FIG. The discharge from 21a and 21b can be promoted.

As a means for supplying the polishing liquid or the grinding liquid, any means may be used as long as it can supply the polishing liquid or the grinding liquid to the disk-shaped substrate 10. The supply means may be provided on the upper surface plate 21b, for example, and may have a supply port for supplying a polishing liquid or a grinding liquid at a predetermined flow rate.
The polishing liquid or the grinding liquid can be appropriately determined according to the material of the disc-shaped substrate 10 and the purpose of polishing (grinding). For example, as the polishing liquid, a slurry containing an abrasive can be used. Moreover, a coolant can be used as a grinding fluid.

  The driving means relatively moves the carrier plate 30 and the pair of upper and lower surface plates 21a and 21b. In the double-sided processing apparatus 60 shown in FIG. 1, the driving means rotates the surface plates 21a and 21b in the opposite directions around the center axes 46a and 46b of the surface plates 21a and 21b, and the center shaft 37 of the carrier plate 30 is rotated. By rotating the carrier plate 30 as the center, the carrier plate 30 is caused to make a planetary motion.

"Manufacturing method of disk-shaped substrate"
Next, as a method for manufacturing a disk-shaped substrate of the present invention, the disk-shaped substrate double-side processing apparatus 60 of the present invention shown in FIG. 1 provided with the carrier plate 30 of the present invention shown in FIG. A case where the upper and lower surfaces of the plurality of disk-shaped substrates 10 are continuously polished or ground will be described as an example.

  When grinding or polishing both surfaces of the disk-like substrate 10 using the double-sided processing apparatus 60 shown in FIG. 1 having the carrier plate 30 shown in FIG. 2, first, the carrier plate 30 is placed in the ring-shaped recess 22 of the lower surface plate 21a. Accommodate. As a result, as shown in FIG. 1, the tooth portion 35 of the carrier plate 30 meshes with the tooth portion 42 at the outer wall surface portion of the recess 22 and meshes with the sun gear 44 at the inner wall surface portion of the recess 22. .

  Next, the disk-shaped substrate 10 is placed in the substrate holding hole 34 provided in the carrier plate 30, and the disk-shaped substrate 10 is held on the carrier plate 30. Next, the upper surface plate 21 b is placed on the lower surface plate 21 a in which the carrier plate 30 holding the disk-shaped substrate 10 is accommodated. Thus, the disc-like substrate 10 held on the carrier plate 30 is disposed between the pair of upper and lower surface plates 21a and 21b.

Next, the carrier plate 30 is driven by the driving means while supplying the polishing liquid or the grinding liquid to the grinding surface or the polishing surface of the disk-shaped substrate 10 at a predetermined flow rate from the supply port of the supply means provided on the upper surface plate 21b, for example. And the surface plates 21a and 21b are relatively moved.
As a result, both the upper and lower surfaces of the disk-shaped substrate 10 are polished (ground), and the surface of the surface of the surface plates 21 a and 21 b facing the belt blades 36 is formed by the belt blades 36 protruding from the upper and lower surfaces of the carrier plate 30. The polishing debris or grinding debris and the polishing liquid or grinding liquid are moved (surface processing step).

In the surface processing step of this embodiment, the driving means rotates the pair of upper and lower surface plates 21a and 21b around the center axes 46a and 46b of the pair of upper and lower surface plates 21a and 21b, respectively, While rotating around the center axis 37 of the carrier plate 30, the planet plate revolves around the center axes 46a and 46b of the pair of upper and lower surface plates 21a and 21b to cause planetary motion. Specifically, the carrier plate 30 and the lower surface plate 21a are rotated in the same direction by the driving means, and the upper surface plate 21b is rotated in the opposite direction to the carrier plate 30 and the lower surface plate 21a.
According to the manufacturing method of the present embodiment, the disk-like substrate 10 placed in the substrate holding hole 34 of the carrier plate 30 is also planetarily moved when the carrier plate 30 is planetarily moved by the driving means in the surface processing step. Therefore, the disk-shaped substrate 10 can be polished or ground accurately and quickly.

  In the manufacturing method of the present embodiment, since the carrier plate 30 is provided with the belt-like blades 36 on the upper and lower surfaces, the upper and lower surfaces of the disk-shaped substrate 10 are polished (ground) in the surface processing step. Along with the scraper function of the belt-like blade 36, polishing (grinding) scraps to be discharged on the surface of the upper and lower surface plates 21a, 21b facing the belt-like blade 36, abrasive grains used for grinding (grinding) processing, and polishing (Grinding) fluid is moved.

  Therefore, in the surface processing step of the present embodiment, the polishing (grinding) liquid to be discharged after being used for polishing (grinding) processing, the abrasive grains used for polishing (grinding) processing, and polishing (grinding) scrap are The belt plate 36 obtained by the rotation and revolution of the carrier plate 30 as a scraper, the centrifugal force generated by the rotation of the surface plates 21a and 21b, and the gravity, are mainly stabilized on the outer periphery of the lower surface plate 21a. Then discharged.

On the other hand, for example, when a surface processing step is continuously performed in the same manner as in this embodiment using a carrier plate not provided with a belt-like blade, as shown below, polishing (grinding) to be discharged Debris and polishing (grinding) liquid remain between the polishing (grinding) surface of the disk-shaped substrate 10 and the lower surface plate 21a.
That is, when a carrier plate not provided with a belt-like blade is used, the sweeping action of the polishing (grinding) liquid accompanying the rotation and revolution of the carrier plate in the surface processing step is performed by a tooth portion provided on the outer periphery of the carrier plate ( It corresponds to reference numeral 35 in the carrier plate 30 shown in FIG.

  Since the teeth of the carrier plate have a complicated uneven shape, if the surface processing step is continuously performed, the used polishing (grinding) liquid to be discharged, polishing (grinding) waste, polishing ( Grinding) The abrasive grains used for processing are gradually accumulated in the teeth. The polishing (grinding) liquid, polishing (grinding) waste, and abrasive grains accumulated in the tooth portion inhibit the discharge of the polishing (grinding) liquid, polishing (grinding) waste, and abrasive grains to the outer peripheral portion of the lower surface plate 21a. For this reason, when polishing (grinding) processing is performed continuously, the sweeping action of the carrier plate gradually decreases, and the polishing (grinding) liquid to be discharged, polishing (grinding) waste, and polishing (grinding) processing The used abrasive grains remain between the polishing (grinding) surface of the disk-shaped substrate 10 and the lower surface plate 21a. The remaining polishing (grinding) liquid, polishing (grinding) waste, and abrasive grains used for the polishing (grinding) process cause a change in the polishing (grinding) processing speed and wear the surface of the lower surface plate 21a. For this reason, if the surface processing step is continuously performed using a carrier plate not provided with a belt-like blade, a difference in polishing (grinding) processing speed between the upper surface and the lower surface of the disk-shaped substrate 10 is likely to occur, and polishing (grinding) is performed. ) The difference in the amount of polishing (grinding) between the upper and lower surfaces of the disk-shaped substrate after processing was likely to be large.

  On the other hand, in the manufacturing method of the present embodiment, the strip blades 36 of the upper and lower surface plates 21a and 21b are used in the surface processing step by the sweeping action as a scraper of the strip blades 36 obtained as the carrier plate 30 rotates and revolves. The discharge of the abrasive (grinding) liquid, the abrasive grains used for the polishing (grinding) processing, and the polishing (grinding) waste from the surface opposite to the surface is promoted.

  Further, since the belt-like blades 36 are formed so as to protrude on both the upper and lower surfaces of the carrier plate 30, the tooth portions 35 of the carrier plate 30 are brought into a non-contact state with the upper and lower surface plates 21a and 21b, and the carrier plate 30 rotates and revolves. However, the abrasive (grinding) liquid to be discharged, the abrasive grains used for the polishing (grinding) processing, and the polishing (grinding) scraps are difficult to accumulate in the tooth portion 35 provided on the outer peripheral portion of the carrier plate 30. Polishing (grinding) liquid and polishing (grinding) on the outer peripheral portion of the lower surface plate 21a by the polishing (grinding) liquid accumulated in the tooth portion 35, abrasive grains used for polishing (grinding) processing, and polishing (grinding) scrap It is also possible to prevent the discharge of abrasive grains and polishing (grinding) debris used in the processing.

  Therefore, according to the manufacturing method of the present embodiment, polishing (grinding) on the upper surface and the lower surface of the disk-shaped substrate 10 even when both surfaces of the plurality of disk-shaped substrates 10 are continuously polished (ground). ) Changes in machining speed are suppressed. Therefore, according to the manufacturing method of the present embodiment, a plurality of disk-shaped substrates 10 with small variations in quality can be manufactured continuously, and excellent productivity can be obtained.

Next, the double-sided processing apparatus 60 including the carrier plate 30 of this embodiment is used as a double-side polishing apparatus, and the upper and lower surfaces of the disk-shaped substrate 10 on which the NiP plating film is formed on the surface of the aluminum alloy substrate are continuously polished (polishing). ) Will be described in detail.
In the step of polishing both the upper and lower surfaces of the disk-shaped substrate 10, a polishing surface plate is used as the pair of upper and lower surface plates 21 a and 21 b, and a slurry containing an abrasive is supplied as a polishing liquid in the surface processing step. It is preferable to polish the upper and lower surfaces.

As the polishing surface plate, a polishing pad made of a hard polishing cloth or a suede-like soft polishing cloth made of urethane is provided on the opposing surfaces of the lower surface plate 21a and the upper surface plate 21b of the surface plates 21a and 21b, which are polishing surfaces. It is preferable to use what is said.
As a slurry containing an abrasive to be supplied to the upper and lower surfaces of the disk-shaped substrate 10, for example, a known solvent such as water, methanol, ethanol, propanol, isopropanol, or butanol, and abrasive grains made of alumina or colloidal silica as an abrasive are used. A dispersion and slurry can be used. Known additives such as an oxidizing agent, a surfactant, a dispersant, and a rust preventive agent can be added to the slurry containing the abrasive as necessary.

  The concentration of the abrasive grains contained in the slurry containing the abrasive (slurry concentration) is preferably 1 to 50% by mass, more preferably 3 to 40% by mass, and even more preferably 5 to 10% by mass. If the slurry concentration is less than 1% by mass, it will be difficult to exert sufficient polishing performance, while if the slurry concentration exceeds 50% by mass, the viscosity of the slurry containing the abrasive will increase and the fluidity will deteriorate. The surface of the disk-shaped substrate 10 after polishing may be roughened, and it becomes uneconomical due to excessive use of abrasive grains.

In the present embodiment, it is preferable to perform a two-step polishing process using a separate polishing surface plate as a process of polishing the disk-shaped substrate 10. The separate polishing surface plate means that a common polishing surface plate is not used in the two-step polishing process, and the polishing surface plate used in the two-step polishing step is the same or different. There may be.
The process of polishing the disk-shaped substrate 10 is a multi-stage polishing process of two or more stages using separate polishing surface plates, so that the process of polishing the disk-shaped substrate 10 is only a single-stage polishing process. In comparison, productivity can be improved, and after polishing, a high-quality disk-shaped substrate 10 having a smooth surface with fewer scratches can be obtained.

In this embodiment, a case where a rough polishing process and a final polishing process are performed as a two-stage polishing process will be described as an example.
(Rough polishing process)
The rough polishing step is performed using the disk-shaped substrate manufacturing method of this embodiment using the double-sided processing device 60 of this embodiment as a double-side polishing device.
Specifically, the rough polishing step is a step of polishing the upper and lower surfaces of the disk-shaped substrate 10 while supplying a slurry containing alumina abrasive grains as an abrasive in the surface processing step using the first polishing surface plate. It is preferable.
After the rough polishing step, the polished disc-like substrate 10 is washed. Thereafter, a finish polishing step is performed.

(Finishing polishing process)
The final polishing step is performed using the disk-shaped substrate manufacturing method of this embodiment using the double-sided processing apparatus 60 of this embodiment as a double-side polishing apparatus.
Specifically, the final polishing step is a step of polishing the upper and lower surfaces of the disk-shaped substrate 10 while using the second polishing surface plate and supplying the slurry containing colloidal silica abrasive grains as an abrasive in the surface processing step. Preferably there is.

  In the finish polishing step, the 50% cumulative average diameter (D50) in terms of volume of the colloidal silica abrasive used as the abrasive is preferably 5 to 180 nm. By using such an abrasive, scratches on the surface of the disk-shaped substrate 10 can be effectively removed in the final polishing step, and the disk-shaped substrate 10 with higher smoothness can be obtained.

  The rough polishing step and the finish polishing step are performed using the disk-like substrate manufacturing method of the present embodiment using the double-sided processing apparatus 60 including the carrier plate 30 of the present embodiment as the double-side polishing apparatus. Due to the function as a scraper for wiping off slurry containing polishing scraps and abrasive grains present on the surface plates 21a and 21b, changes in the polishing speed on the upper and lower surfaces of the disk-shaped substrate 10 are suppressed. Therefore, according to the manufacturing method of the present embodiment, the surface of the aluminum alloy substrate is formed with the NiP plating film, and a plurality of disk-shaped substrates 10 with small variations in quality can be continuously manufactured, which is excellent. Productivity is obtained.

  Next, using the double-sided processing device 60 including the carrier plate 30 of the present embodiment as a double-sided grinding device, a process of continuously grinding the upper and lower surfaces of the disk-shaped substrate 10 made of a glass substrate, and the double-sided processing device of the present embodiment A method of manufacturing a disk-shaped substrate including a step of continuously polishing upper and lower surfaces of the disk-shaped substrate 10 made of a glass substrate using 60 as a double-side polishing apparatus will be described.

In the process of grinding both the upper and lower surfaces of the disk-shaped substrate 10, a grinding surface plate is used as the pair of upper and lower surface plates 21 a, 21 b, and coolant is supplied as a grinding liquid in the surface processing step, It is preferable to grind.
In the present embodiment, a primary grinding step, an inner and outer peripheral grinding step, an inner peripheral polishing step, a secondary grinding step, an outer peripheral polishing step, a primary polishing step, and a secondary polishing are performed on the disk-shaped substrate 10 made of a glass substrate. The process and the final cleaning / inspection process are performed in this order.

(Primary grinding process)
The primary grinding step is performed by using the method for manufacturing a disk-shaped substrate of the present embodiment using the double-sided processing device 60 of the present embodiment as a double-sided grinding device.
The primary grinding process is a process of smoothly grinding the surface of the disk-shaped substrate 10 made of a glass substrate. In the primary grinding step, it is preferable to use a grinding wheel using abrasive grains made of alumina or diamond as the grinding surface plate and water as the coolant.

(Inner and outer grinding process)
The inner and outer peripheral grinding process is a process of performing rough grinding on the inner and outer peripheral end faces of the disk-shaped substrate 10 made of a glass substrate.
In the inner and outer peripheral grinding machine, an inner peripheral grindstone and an outer peripheral grindstone are provided, and a laminated body in which a plurality of disk-shaped substrates 10 are laminated with a spacer sandwiched in a state where the center holes are aligned with each other, is rotated around an axis, A device that grinds the inner peripheral end face of the disk-shaped substrate 10 and simultaneously grinds the outer peripheral end face is used. As the inner peripheral grindstone and the outer peripheral grindstone, for example, diamond abrasive grains fixed with a binder can be used.

(Inner grinding process)
The inner peripheral polishing step is a step of performing polishing to smooth the inner peripheral end surface of the disc-like substrate 10 after the inner and outer peripheral grinding steps. Examples of the inner peripheral polishing step include a step of rotating the brush at a high speed in the opening while pouring a polishing liquid into the opening of the disk-shaped substrate 10. As the polishing liquid, for example, it is preferable to use a slurry obtained by dispersing cerium oxide abrasive grains in water.

(Secondary grinding process)
The secondary grinding step is performed by using the method for manufacturing a disk-shaped substrate according to the present embodiment using the double-sided processing apparatus 60 according to the present embodiment as a double-sided grinding apparatus.
The secondary grinding step is a step of further smoothly grinding the surface of the disc-like substrate 10 after the primary grinding step. In the secondary grinding process, it is preferable to use a grinding wheel using abrasive grains made of alumina or diamond as the grinding surface plate as in the primary grinding process, and the grain size of the abrasive grains is higher than that used in the primary grinding process. Also, it is preferable to be fine. In the secondary grinding step, it is preferable to use water as the coolant.

(Outer periphery polishing process)
The outer peripheral polishing step is a step of performing polishing to smooth the outer peripheral end surface of the disc-shaped substrate 10 after the inner and outer peripheral grinding steps. Examples of the outer peripheral polishing step include a step of bringing a rotated brush into contact with the outer peripheral portion of the disk-shaped substrate 10 while flowing a polishing liquid. As the polishing liquid, for example, a slurry obtained by dispersing cerium oxide abrasive grains in water can be used.

(Primary polishing process)
The primary polishing step is performed using the disk-shaped substrate manufacturing method of this embodiment using the double-sided processing apparatus 60 of this embodiment as a double-side polishing apparatus.
The primary polishing step is a step of further smoothly polishing the surface of the disk-shaped substrate 10 after the secondary grinding step. In the primary polishing step, a polishing pad made of a hard polishing cloth formed of urethane is provided on the opposing surfaces of the lower surface plate 21a and the upper surface plate 21b as the polishing surface plate as the polishing surface plate. It is preferable to use what is. As the slurry containing the abrasive supplied to the upper and lower surfaces of the disk-shaped substrate 10, it is preferable to use a slurry obtained by dispersing cerium oxide abrasive grains, which are an abrasive, in water.

(Secondary polishing process)
The secondary polishing step is performed using the disk-shaped substrate manufacturing method of this embodiment using the double-sided processing apparatus 60 of this embodiment as a double-side polishing apparatus.
The secondary polishing step is a step of further smoothly polishing the surface of the disk-shaped substrate 10 after the primary polishing step as a final finish. In the secondary polishing step, as the polishing surface plate, a polishing pad made of a suede-like soft polishing cloth is provided on the opposing surface of the lower surface plate 21a and the upper surface plate 21b as the polishing surfaces 21a and 21b. Is preferably used. As the slurry containing the abrasive supplied to the upper and lower surfaces of the disk-shaped substrate 10, it is preferable to use a slurry obtained by dispersing cerium oxide abrasive grains or colloidal silica as an abrasive in a solvent such as water.

(Final cleaning / inspection process)
By performing the final cleaning, the abrasive used in the above-described series of steps is removed from the surface of the disk-shaped substrate 10. As the final cleaning method, for example, a chemical cleaning method using a detergent (chemical) that uses ultrasonic waves can be used.
Moreover, as an inspection process, the method of inspecting the surface of the disk-shaped board | substrate 10 for the presence or absence of a damage | wound, a distortion | strain, etc. can be performed, for example with the optical inspection device using a laser.

  The primary grinding step and the secondary grinding step are performed using the disk-like substrate manufacturing method of the present embodiment using the double-sided processing device 60 including the carrier plate 30 of the present embodiment as a double-side grinding device. By the function as a scraper for wiping away grinding scraps, abrasive grains used for processing, and coolant existing on the surface plates 21a and 21b by the blade 36, changes in the polishing processing speed on the upper and lower surfaces of the disk-shaped substrate 10 are suppressed. The

In addition, the primary polishing step and the secondary polishing step described above are performed using the disk-shaped substrate manufacturing method of this embodiment using the double-sided processing device 60 including the carrier plate 30 of this embodiment as a double-side polishing device. By the function as a scraper for wiping off slurry containing polishing scraps and abrasive grains existing on the surface plates 21a and 21b by the belt-like blade 36, changes in the polishing processing speed on the upper and lower surfaces of the disk-like substrate 10 are suppressed. .
Therefore, according to the manufacturing method of the present embodiment, a plurality of disk-shaped substrates 10 made of a glass substrate and having small variations in quality can be continuously manufactured, and excellent productivity can be obtained.

  Hereinafter, the effects of the present invention will be made clearer by examples. In addition, this invention is not limited to a following example, In the range which does not change the summary, it can change suitably and can implement.

(Example)
Using the double-sided processing apparatus provided with the carrier plate 30 shown in FIG. 2, the upper and lower surfaces of a plurality of disk-shaped substrates 10 for magnetic recording media were continuously polished by the method shown below.
After turning the inner and outer peripheral end faces and the data face of a disc-shaped aluminum alloy (corresponding to the material symbol A5086) of a disc-like aluminum alloy (corresponding to material symbol A5086) as the disc-like substrate 10, An electroless Ni—P plating treatment was applied to the surface to form a NiP plating film having a thickness of about 10 μm.

As steps for polishing the upper and lower surfaces of the disk-shaped substrate 10, a rough polishing step and a final polishing step were performed as described below.
In the rough polishing step and the finish polishing step, the carrier plate 30 shown in FIG. 2 having a belt-like blade 36 composed of four belt-like portions 36a having a width of 5 mm and a height of 0.3 mm was used. Of the angles formed by the extending direction of the strip 36a and the radial direction of the carrier plate 30, the angle θ on the outer peripheral side of the carrier plate 30 was 2 °.

In the rough polishing step and the finish polishing step, a three-way type double-side polishing machine (type 11B manufactured by System Seiko Co., Ltd.) was used as a double-sided processing device.
This double-sided processing apparatus includes a carrier plate 30 shown in FIG. 2 and a polishing surface plate in which a polishing pad made of a suede-like soft polishing cloth is provided on the opposite surface of the lower surface plate and the upper surface plate which are polishing surfaces. And a supply means for supplying the polishing liquid at a predetermined flow rate from a supply port provided in the upper surface plate and a pair of upper and lower surface plates, respectively, and the carrier plate 30 around the central axis 37 of the carrier plate 30 Driving means for revolving around the central axis of the pair of upper and lower surface plates and causing planetary movement while rotating.

In the rough polishing process and the finish polishing process, first, the disk-shaped substrate 10 was placed in the substrate holding hole 34 provided in the carrier plate 30, and the 30 disk-shaped substrates 10 were held on the carrier plate 30. Next, the upper platen is placed on the lower platen in which the carrier plate 30 holding the disk-like substrate 10 is accommodated, and the disk-like substrate 10 held on the carrier plate 30 is placed between a pair of upper and lower platens. Arranged between. The processing pressure between the lower surface plate and the upper surface plate was 110 g / cm ² .

Thereafter, in the rough polishing step and the final polishing step, the carrier plate 30 and the surface plate are relatively moved by the driving means while supplying the polishing liquid from the supply port of the supply means to the polishing surface of the disk-shaped substrate 10. (Surface processing step).
In the surface processing steps of the rough polishing step and the finish polishing step, the carrier plate 30 was rotated in the same direction as the lower surface plate by the driving means, and the upper surface plate was rotated in the opposite direction to the carrier plate 30 and the lower surface plate. The rotation speed of the lower surface plate and the upper surface plate was 20 rpm.

In the rough polishing step, a polishing solution containing an aqueous solution prepared by adding a chelating agent and an oxidizing agent to an acidic region having a pH of 1.5 and an alumina polishing agent having a D50 value of 0.3 μm as the polishing agent. A slurry obtained by dispersing particles at a concentration of 5% by mass to form a slurry was used. The rough polishing step was performed while supplying the polishing liquid to the polishing surface of the disk-shaped substrate 10 at a flow rate of 500 ml / min.
In the rough polishing process, the carrier plate 30 and the surface plate are relatively moved for 6 minutes while supplying the polishing liquid, and then the carrier plate 30 and the surface plate are relatively moved for 2 minutes while supplying water instead of the slurry. Moved.
In the rough polishing step, the polishing amount per one side of the disk-shaped substrate 10 was set to about 1.5 μm.

After the rough polishing step, the polished disc-like substrate 10 was washed with water.
Thereafter, a finish polishing step was performed. In the final polishing step, 7 colloidal silica abrasive grains having a D50 value of 10 nm as an abrasive are added to a solvent consisting of an aqueous solution prepared by adding a chelating agent and an oxidizing agent as a polishing liquid to an acidic region of pH 1.5. A slurry which was dispersed and slurried at a concentration of mass% was used. The finish polishing step was performed while supplying the polishing liquid to the polishing surface of the disk-shaped substrate 10 at a flow rate of 500 ml / min.
In the final polishing process, the carrier plate 30 and the surface plate were relatively moved for 10 minutes while supplying the polishing liquid.
In the final polishing step, the polishing amount per one side of the disk-shaped substrate 10 was set to about 0.5 μm.

After the final polishing step, the polished disc-like substrate 10 was washed with water to finish the step of polishing the disc-like substrate 10.
Thereafter, the polished disc-like substrate 10 held on the carrier plate 30 and the unpolished disc-like substrate 10 are exchanged and the disc-like substrate 10 is polished in the same manner as described above, for a total of 40,000. A single disk-shaped substrate 10 was polished continuously.

(Comparative example)
40,000 disk-shaped substrates were continuously polished in the same manner as in the example except that a carrier plate without the belt-like blade 36 was used.
(Evaluation)
The polishing amount of the upper surface and the lower surface of the disk-shaped substrate polished in the examples and comparative examples was measured every 600 sheets, the difference between the polishing amounts of the upper surface and the lower surface was calculated, and the average value was obtained.
As a result, in the example, the average value of the polishing amount difference between the upper surface and the lower surface was 0.005 μm. On the other hand, in the comparative example, the average value of the difference in polishing amount between the upper surface and the lower surface was 0.048 μm.

3a, 3c ... center side end, 3b, 3d ... outer peripheral side end, 10 ... disc substrate, 21a ... lower surface plate, 21b ... upper surface plate, 22 ... concave portion, 30, 31, 32, 33 ... carrier plate, 34 ... Substrate holding hole, 36 ... Band-shaped blade, 36a, 36b, 36c, 36d ... Band-shaped portion, 37, 46a, 46b ... Center axis, 35, 42 ... Tooth portion, 44 ... Sun gear, 60 ... Double-sided processing device.

Claims (9)

It is a carrier plate provided in a double-sided processing device that polishes or grinds the upper and lower surfaces of a disk-shaped substrate,
The carrier plate is provided with a substrate holding hole for holding the disk-shaped substrate, and a belt-like blade formed to protrude on at least one surface,
A pair of upper and lower surface plates on which the double-sided processing device is disposed to face the carrier plate;
Supply means for supplying a polishing liquid or a grinding liquid to the disk-shaped substrate;
Drive means for relatively moving the carrier plate and the pair of upper and lower surface plates;
A carrier plate characterized in that the upper and lower surfaces of the disk-shaped substrate are polished or ground by relatively moving the carrier plate and the pair of upper and lower surface plates.   The carrier plate according to claim 1, wherein the belt-like blade is formed on both upper and lower surfaces.   3. The carrier plate according to claim 1, wherein the carrier plate has a circular shape in a plan view, and the belt-like blade extends in a direction intersecting a circumferential direction in the plan view. Carrier plate.   The carrier plate according to claim 3, wherein the belt-like blade is composed of a plurality of belt-like portions arranged in the circumferential direction at equal intervals in the same shape in plan view. A method of manufacturing a disk-shaped substrate comprising a step of polishing or grinding both upper and lower surfaces of the disk-shaped substrate,
The polishing or grinding step includes the step of holding the disk-shaped substrate in a substrate holding hole provided in a carrier plate;
Placing the disk-shaped substrate held by the carrier plate between a pair of upper and lower surface plates;
While supplying a polishing liquid or a grinding liquid to the disk-shaped substrate, the carrier plate and the pair of upper and lower surface plates are moved relatively to polish or grind the upper and lower surfaces of the disk-shaped substrate, and A surface for moving the polishing waste or grinding waste and the polishing liquid or grinding liquid on the surface of the pair of upper and lower surface plates facing the belt-like blade by a belt-like blade formed to protrude from at least one surface of the carrier plate A disk-shaped substrate manufacturing method comprising: a processing step.   6. The method for manufacturing a disk-shaped substrate according to claim 5, wherein the carrier plate is one in which the belt-like blade is formed on both upper and lower surfaces. As a pair of upper and lower surface plates, using a grinding surface plate,
The method for manufacturing a disk-shaped substrate according to claim 5 or 6, wherein, in the surface processing step, upper and lower surfaces of the disk-shaped substrate are ground while supplying a coolant as a grinding liquid. As a pair of upper and lower surface plates, using a polishing surface plate,
The method for manufacturing a disk-shaped substrate according to claim 5 or 6, wherein in the surface processing step, upper and lower surfaces of the disk-shaped substrate are polished while supplying a slurry containing an abrasive as a polishing liquid. . A disk-like double-sided processing device that polishes or grinds the upper and lower surfaces of a disk-like substrate,
A carrier plate comprising a substrate holding hole for holding a disk-shaped substrate, and a belt-like blade formed to project on at least one surface;
A pair of upper and lower surface plates disposed opposite to each other via the carrier plate;
Supply means for supplying a polishing liquid or a grinding liquid to the disk-shaped substrate;
A double-sided processing apparatus for a disk-shaped substrate, comprising: a drive unit that relatively moves the carrier plate and the pair of upper and lower surface plates.

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