WO2015002152A1 - Carrier, method for producing substrate for magnetic disks, and method for producing magnetic disk - Google Patents
Carrier, method for producing substrate for magnetic disks, and method for producing magnetic disk Download PDFInfo
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- WO2015002152A1 WO2015002152A1 PCT/JP2014/067448 JP2014067448W WO2015002152A1 WO 2015002152 A1 WO2015002152 A1 WO 2015002152A1 JP 2014067448 W JP2014067448 W JP 2014067448W WO 2015002152 A1 WO2015002152 A1 WO 2015002152A1
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- WIPO (PCT)
- Prior art keywords
- carrier
- substrate
- polishing
- glass substrate
- resin
- Prior art date
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
Definitions
- the present invention relates to a glass substrate for a magnetic disk mounted on a magnetic recording device such as a hard disk drive (hereinafter abbreviated as “HDD”) or a carrier used for manufacturing an aluminum alloy substrate having a NiP film formed on the surface.
- the present invention also relates to a method for manufacturing a magnetic disk substrate using the carrier, and a method for manufacturing a magnetic disk.
- a magnetic disk as one of information recording media mounted on a magnetic recording apparatus such as an HDD.
- a magnetic disk is configured by forming a thin film such as a magnetic layer on a substrate, and an aluminum substrate has been conventionally used as the substrate.
- the ratio of the glass substrate capable of narrowing the distance between the magnetic head and the magnetic disk as compared with the aluminum substrate is gradually increasing.
- the surface of the glass substrate is polished with high accuracy so as to increase the recording density so that the flying height of the magnetic head can be reduced as much as possible.
- HDDs high recording capacity and lower prices. In order to achieve this, it is necessary to further improve the quality and cost of glass substrates for magnetic disks. It is coming.
- a glass substrate for a magnetic disk is usually manufactured through a rough grinding process, a shape processing process, a fine grinding process, an end surface polishing process, a main surface polishing process (first polishing process, second polishing process), a chemical strengthening process, and the like.
- the glass substrate and the polishing pad are brought into contact with each other, and the polishing pad and the glass substrate are relatively moved while supplying the polishing liquid containing the polishing abrasive grains. Polish in a mirror shape.
- a planetary gear type double-side polishing apparatus as shown in FIG. 5 is generally used.
- the double-side polishing apparatus shown in FIG. 5 meshes with the sun gear 2, the internal gear 3 arranged concentrically on the outer side, the sun gear 2 and the internal gear 3, and the sun gear 2 and the internal gear 3.
- a polishing liquid supply unit (not shown) for supplying a polishing liquid is provided between 5 and the lower surface plate 6.
- the workpiece 1 held on the carrier 10 that is, the glass substrate is sandwiched between the upper surface plate 5 and the lower surface plate 6 during polishing, and the upper and lower surface plates 5 and 6 are polished.
- the carrier 10 revolves and rotates according to the rotation of the sun gear 2 and the internal gear 3, and the upper and lower surfaces of the workpiece 1 are moved. Polished. Also in the grinding step, processing is performed using a double-side grinding apparatus having the same configuration as the double-side polishing apparatus.
- the carrier holds the glass substrate when grinding or polishing the glass substrate, which is a workpiece, and is formed of, for example, a resin material.
- a whole holding member 11 having a plurality of holding holes 12 for holding the substrate is a disc-shaped holding member 11.
- This carrier is used while being rotated by the sun gear and the internal gear in a state of being sandwiched between the upper and lower surface plates in the apparatus in the same manner as the processing object while being a non-processing object. Therefore, when the glass substrate is ground or polished, the holding hole of the carrier is always in contact with or away from the outer peripheral end surface of the glass substrate. At this time, the inner wall of the holding hole and the glass substrate rub against each other, so that scratches may occur on the end surface (particularly the side wall surface) of the glass substrate. If there is such a scratch, it becomes a dust generation source not only during the manufacture of the magnetic disk glass substrate but also during the subsequent manufacture of the magnetic disk or HDD.
- the carrier material is insufficient for the carrier base material alone, the composite material such as glass fiber and epoxy resin is usually used to increase the strength.
- the glass fiber is used on the inner wall of the holding hole. If it protrudes or is exposed, it will be scratched or damaged when it comes into contact with the glass substrate end face.
- Patent Document 1 for example, by etching a polishing carrier with hydrofluoric acid or the like, the glass fiber on the inner wall of the holding hole of the carrier is dissolved and removed to a certain depth, and a resin material having a plurality of recesses on the surface layer portion of the inner wall
- Patent Document 2 provides damage to the glass substrate end face by providing a resin contact portion formed thicker than the fiber protruding from the inner wall surface on the inner wall surface of the holding hole of the polishing carrier. Techniques for reducing are disclosed.
- the glass substrate for magnetic disks is normally processed into the thickness of 2 mm or less also including the thing in the middle of a process, the thing with an extremely thin board thickness of 2 mm or less is used also about the carrier holding this glass substrate.
- a contact portion can be provided on the inner wall surface of the holding hole by, for example, resin coating, but the inner wall surface of the holding hole becomes a very narrow region because the plate thickness is thin. The adhesion of the abutting portion to the inner wall surface of the holding hole is low, and the abutting portion breaks or falls off due to contact with the glass substrate during processing, and the problem of damage due to exposure of the glass fiber is fundamental. It is difficult to solve.
- the above-mentioned problem occurs not only in the glass substrate but also in the manufacture of an aluminum alloy substrate having a NiP film formed on the surface.
- the main surface of the aluminum alloy substrate on which the NiP film is formed is polished using a double-side polishing apparatus while the substrate is held by a carrier.
- the NiP film has a lower hardness than the glass substrate, the outer peripheral end face is easily scratched. Also, NiP sludge is generated by polishing.
- the present invention has been made to solve such a conventional problem.
- the purpose of the present invention is, first, to reduce the occurrence of scratches during processing, and for a magnetic disk having good durability. It is to provide a carrier used for processing a substrate.
- a second object of the present invention is to provide a method for manufacturing a magnetic disk substrate and a method for manufacturing a magnetic disk, including processing for grinding or polishing the magnetic disk substrate using such a carrier.
- the present inventor has found that the above-described problems can be solved by the invention having the following configuration, and has completed the present invention. That is, the present invention has the following configuration in order to achieve the above object.
- a carrier that is formed using a composite material including fibers and a resin material and has a holding hole for holding the substrate when the main surface of the disk-shaped substrate is polished or ground, and the holding hole
- the inner peripheral wall surface of the carrier has a plurality of recesses extending in the in-plane direction of the carrier and free of fibers, and the plurality of recesses are filled with a resin.
- (Configuration 4) 4. The carrier according to claim 1, wherein Ra of the inner peripheral wall surface of the holding hole has a Ra of 1.0 ⁇ m or less.
- (Configuration 5) The carrier according to any one of configurations 1 to 4, wherein a distance in a carrier in-plane direction of a region including the plurality of concave portions filled with the resin is 100 ⁇ m or less.
- (Configuration 8) The processing is performed by supplying a polishing liquid containing abrasive grains between a polishing pad affixed to the surface of a surface plate and a main surface of the disk-shaped substrate, and the main surface of the disk-shaped substrate A method for manufacturing a magnetic disk substrate according to Configuration 7, wherein the magnetic disk substrate is polished. (Configuration 9) 8. The method for manufacturing a magnetic disk substrate according to Configuration 7, wherein the processing is a grinding process in which a main surface of the disk-shaped substrate is ground with a surface plate to which fixed abrasive grains are attached.
- a magnetic disk manufacturing method comprising: forming at least a magnetic recording layer on a magnetic disk substrate obtained by the manufacturing method according to any one of Structures 7 to 11.
- the carrier according to the present invention has the above-described configuration, so that the agglomerates in which abrasive grains and glass sludge during processing are accumulated in the recesses from which the glass fibers existing on the inner walls of the holding holes of the carrier are removed, It is possible to provide a carrier used for processing a magnetic disk substrate having excellent durability, which can reduce the occurrence of debris due to the destruction of the surroundings, or scratches caused by glass fibers exposed on the inner wall of the holding hole. . In addition, by grinding or polishing a magnetic disk substrate using such a carrier, it is possible to reduce scratches on the substrate main surface and end surface, which are obstructive factors in realizing high recording density of the medium. It is possible to manufacture a high-quality magnetic disk substrate that can be used. Furthermore, by using this substrate, it is possible to obtain a highly reliable magnetic disk that can obtain stable characteristics without failure.
- FIG. 2 It is a whole perspective view of the glass substrate for magnetic discs. It is a top view of the carrier concerning the present invention. It is a longitudinal cross-sectional view of the carrier of FIG. 2 which shows one Embodiment of the carrier based on this invention. It is a longitudinal cross-sectional view of the carrier of FIG. 2 which shows other embodiment of the carrier which concerns on this invention. It is a longitudinal cross-sectional view which shows schematic structure of a double-side polish apparatus.
- a glass substrate for a magnetic disk is usually manufactured through a rough grinding process, a shape processing process, a fine grinding process, an end surface polishing process, a main surface polishing process (first polishing process, second polishing process), a chemical strengthening process, and the like.
- a disk-shaped glass substrate (glass disk) is molded from molten glass by direct pressing.
- a glass substrate may be obtained by cutting into a predetermined size from a plate glass manufactured by a downdraw method or a float method.
- rough grinding is performed on the main surface of the molded glass substrate to improve dimensional accuracy and shape accuracy.
- a double-side grinding apparatus is usually used to grind the main surface of the glass substrate using loose abrasive grains or fixed abrasive grains.
- a shape processing (chamfering) step is performed. Thereafter, a precision grinding process is performed as appropriate.
- a grinding method using fixed abrasive grains using a diamond pad is suitable.
- a diamond pad is an agglomerate in which diamond particles or some diamond particles are hardened with a binder such as glass, ceramic, metal, resin, etc., and fixed using a support material such as resin (for example, acrylic resin).
- a pellet is pasted on a sheet.
- the diamond pad is not necessarily a general name, but is referred to as “diamond pad” here for convenience.
- the main surface is mirror-polished to obtain a highly accurate plane.
- a polishing pad such as polyurethane foam while supplying a slurry (polishing liquid) containing a metal oxide abrasive such as cerium oxide or colloidal silica. .
- the colloidal silica abrasive grains contained in the above polishing liquid are those having an average particle diameter in the range of 1 to 50 nm.
- the abrasive grains contained in the polishing liquid used in the finishing mirror polishing process (second polishing process in the subsequent stage) should have an average particle diameter of 10 nm or more and less than 30 nm from the viewpoint of further reducing the surface roughness. It is preferred to use. More preferably, it is in the range of 10 to 20 nm.
- the average particle size is a point where the cumulative curve is 50% when the cumulative curve is obtained with the total volume of the powder population in the particle size distribution measured by the light scattering method as 100%. (Hereinafter referred to as “cumulative average particle diameter (50% diameter)”).
- the cumulative average particle diameter (50% diameter) is specifically a value obtained by measurement using a particle diameter / particle size distribution measuring apparatus.
- the glass substrate and the polishing pad are brought into contact with each other, and the polishing pad and the glass substrate are moved relative to each other while supplying a polishing liquid containing polishing abrasive grains, thereby polishing the surface of the glass substrate in a mirror shape. do it.
- FIG. 5 is a longitudinal sectional view showing a schematic configuration of a planetary gear type double-side polishing apparatus that can be used in a mirror polishing process of a glass substrate, and the configuration thereof is as already described.
- the double-side polishing apparatus shown in FIG. 5 meshes with the sun gear 2, the internal gear 3 arranged concentrically on the outside thereof, the sun gear 2 and the internal gear 3, and the sun gear 2 and the internal gear 3.
- An upper surface plate 5 and a lower surface plate 6 each having a carrier 10 that revolves and rotates in accordance with the rotation of the substrate 10 and a polishing pad 7 that can hold the workpiece 1 held by the carrier 10.
- a polishing liquid supply unit (not shown) for supplying a polishing liquid is provided between the panel 5 and the lower surface plate 6.
- the workpiece 1 held on the carrier 10 that is, the glass substrate is sandwiched between the upper surface plate 5 and the lower surface plate 6 during polishing, and the upper and lower surface plates 5 and 6 are polished.
- the carrier 10 revolves and rotates according to the rotation of the sun gear 2 and the internal gear 3, and the upper and lower surfaces of the workpiece 1 are moved. Polished.
- the present invention relates to the carrier 10 used for holding a glass substrate which is an object to be processed in the above polishing process.
- the carrier according to the present invention for example, presses the processing surface of the surface plate against the main surface of the glass substrate, relatively moves the processing surface of the surface plate and the glass substrate, and moves the main surface of the glass substrate. It is a carrier that is used when processing and holds the glass substrate horizontally.
- FIG. 2 and 3 each show an embodiment of a carrier according to the present invention.
- FIG. 2 is a plan view of the carrier according to the present invention.
- FIG. 3 is a longitudinal sectional view of the carrier of FIG. 2 showing an embodiment of the carrier according to the present invention.
- a carrier 10 is composed of a disk-shaped holding member 11 as a whole and includes a plurality of holding holes 12 for holding a glass substrate.
- the plurality of holding holes 12 are all circular in order to uniformly grind and polish the main surface of the glass substrate, and to suppress generation of scratches due to local contact with the end surface of the glass substrate. Desirably, it is formed in a perfect circle as in this embodiment.
- the roundness of the holding hole is preferably, for example, 20 ⁇ m or less.
- the roundness of the holding hole can be measured by, for example, a roundness / cylindrical shape measuring machine.
- the holding hole 12 can be formed, for example, by drilling a hole of a predetermined size in the base material of the disk-shaped holding member 11.
- the difference between the hole diameter (diameter) of the holding hole 12 and the outer diameter of the glass substrate held in the holding hole 12 is usually 0.1 to 1.0 mm regardless of the size of the glass substrate. It is preferable. If it is larger than 1.0 mm, the followability to the carrier motion (planetary gear motion) of the glass substrate is deteriorated, and grinding or polishing unevenness may occur on the main surface. On the other hand, if the thickness is less than 0.1 mm, the degree of freedom of movement of the glass substrate in the holding hole becomes too low, and the force concentrates on the same portion of the end portion, which may easily cause scratches. Moreover, it becomes difficult to attach and detach the substrate from the carrier.
- a plurality of gear teeth 13 that mesh with the sun gear 2 and the internal gear 3 of the double-side polishing apparatus are formed on the outer peripheral portion of the holding member 11.
- the holding member 11 is formed of a composite material including glass fibers 30 and a resin material A (for example, epoxy resin) 31 except for a region A1 described later. Yes. Specifically, for example, it is formed of a base material in which glass fibers are laminated in an epoxy resin (or a laminate of a plurality of such base materials). In addition, for example, metal fibers can be used instead of glass fibers. In this case, the case where a holding member is formed with the composite material containing glass fiber and a resin material is illustrated as an example. In FIG. 3, for convenience of illustration, the internal cross-sectional structure of the holding member 11 (particularly, the region made of the composite material) is merely depicted as an image, and the actual internal structure is not necessarily accurately depicted. .
- a resin material A for example, epoxy resin
- the inner peripheral wall surface of the holding hole 12 includes a plurality of glass fibers extending in the in-plane direction of the carrier that are orthogonal to the inner peripheral wall surface and do not exist.
- the plurality of recesses 20 are filled with a resin material B21 that is the same as or different from the resin material A31. Then, the resin material A31 including the plurality of recesses 20 and the resin material B21 are formed in the in-plane direction of the carrier main surface from the inner peripheral wall surface of the holding hole 12 toward the outside of the holding hole. A region A1 is provided.
- the predetermined area A1 extending outward from the inner peripheral wall surface of the holding hole 12 is formed by the resin material A31 and a plurality of recesses 20 filled with the same or different resin material B21 as the resin material A31.
- region A1 is formed with the composite material containing the glass fiber 30 and the resin material A31 as above-mentioned.
- glass fibers stretched in a direction parallel to the inner peripheral wall surface of the holding hole 12 may exist.
- the concave portion 20 included in the region A1 is exposed on the inner peripheral wall surface of the holding hole 12 formed by drilling a hole of a predetermined size in the base material of the holding member 11 made of the composite material, for example.
- the glass fiber can be formed by dissolving and removing it to a certain depth (corresponding to the region A1). Examples of the method for dissolving and removing the glass fiber in this case include a method of etching the carrier in which the holding hole 12 is formed with hydrofluoric acid or the like. Then, the resin material B21 is filled in the recess formed by melting and removing the glass fiber to a certain depth in this way, so that the resin material A31 and the resin material B21 that is the same as or different from the resin material A31 are filled.
- a region A1 composed of the plurality of recessed portions 20 is formed.
- the resin material A31 contained in the glass fiber and resin composite material basically constituting the carrier 10 of the present invention is generally an epoxy resin, but in addition to this, for example, a phenol resin, Bismaleimide resin, silicone resin, diallyl phthalate resin, unsaturated polyester resin, polyphenylene sulfide resin, etc. may be used.
- the resin material B21 filled in the recess 20 included in the region A1 of the carrier 10 of the present invention is, for example, an epoxy resin as long as it is the same resin material as the resin material A31. Further, any resin material different from the above resin material A31 can be used without any particular restriction, but from the viewpoint of the filling method described later, a thermoplastic resin is particularly preferable.
- polycarbonate, polyoxymethylene, polypropylene At least selected from resins such as polyphenylene sulfide, polyamide, polyethylene, polystyrene, acrylic, polyethylene terephthalate, polyphenylene ether, polyacetal, polybutylene terephthalate, polyphephenylene sulfide, polyether ether ketone, fluororesin, urethane resin, liquid crystal polymer, and elastomer.
- resins such as polyphenylene sulfide, polyamide, polyethylene, polystyrene, acrylic, polyethylene terephthalate, polyphenylene ether, polyacetal, polybutylene terephthalate, polyphephenylene sulfide, polyether ether ketone, fluororesin, urethane resin, liquid crystal polymer, and elastomer.
- resins such as polyphenylene sulfide, polyamide, polyethylene, polystyrene, acrylic, polyethylene
- thermosetting epoxy resin is generally used for the resin material of the carrier substrate for the convenience of the manufacturing process. Therefore, when the concave portion 20 is filled with the same thermosetting epoxy resin, strong friction is generated between the wall surface of the holding hole and the edge of the glass substrate during processing, and even when frictional heat is locally generated, Since it does not deform
- the concave portion 20 is filled with, for example, a thermoplastic resin different from the resin material of the carrier base material, the glass substrate is not easily damaged because of a slight deformation due to frictional heat. Further, when a resin having a lower hardness than the epoxy resin of the carrier substrate is used, it plays a role of a cushion, so that the end face scratch is hardly generated on the glass substrate.
- the resin filled in the recess 20 is a thermoplastic resin.
- resin with which the said recessed part 20 is filled is resin whose hardness is lower than the resin material which comprises the composite material which is a carrier base material.
- the resin to be filled has a Rockwell hardness of less than M80. By setting it within this range, it is possible to make the hardness lower than that of the epoxy resin of the base material, so that it is possible to make it difficult to cause scratches on the end face of the glass substrate.
- the hardness of the epoxy resin is generally M80 to 100 in terms of Rockwell hardness.
- Examples of the method for filling the recess 20 with the resin material B21 include the following methods. After the resin material B21 is applied to the inner peripheral wall surface of the holding hole 12, heating is performed to melt and fill the resin material B21. At this time, if the inside of the recessed portion of the filling portion can be depressurized, it is more preferable because the bottom of the recessed portion can be filled.
- the coating may be performed in a reduced pressure environment and then heated to normal pressure.
- a heating method it is preferable to apply a hot plate welding method, a vibration welding method, an ultrasonic welding method, a laser transmission welding method, or the like.
- the above filling operation can be efficiently performed in a state where a large number of carrier holding members 11 are stacked.
- a rotary blade can be used to remove the resin.
- the resin material B21 may not be completely filled up to the bottom of the recess. As long as the entrance of the recess is blocked, it is possible to prevent abrasive grains and sludge from entering the recess.
- the depth at which the resin material B21 is filled from the entrance of the recess is 1 ⁇ m or more because the resin material B21 is less likely to drop off and durability due to the thickness is increased.
- the depth is more preferably 2 ⁇ m or more, and further preferably 5 ⁇ m or more. Note that it is most preferable that the resin material B21 is completely filled in the concave portion because the adhesiveness with the carrier is maximized.
- the distance between the resin material A31 and a region A1 (including) a plurality of recesses 20 filled with the same or different resin material B21 as the resin material A31 is 100 ⁇ m or less. Is preferred. When it exceeds 100 ⁇ m, the strength of the region near the inner wall of the holding hole is lowered, and the roundness of the holding hole may be deteriorated. On the other hand, if it is less than 1 ⁇ m, the effects of the present invention may not be sufficiently obtained.
- the surface roughness of the inner peripheral wall surface of the holding hole is preferably an arithmetic average roughness Ra of 1.0 ⁇ m or less. If it is this range, the flaw generation
- the carrier 10 of the present invention has a plurality of recesses 20 filled on the inner peripheral wall surface of the holding hole 12 with the resin material B21 that is the same as or different from the resin material A31. Since the region A1 including the recess 20 filled with resin is provided in the direction from the inner peripheral wall surface to the outside of the holding hole, the region A1 in the vicinity of the inner peripheral wall surface of the holding hole 12 is made of only the resin material. Since glass fibers formed and at least stretched in a direction perpendicular to the inner peripheral wall surface are not included, the glass substrate end face can be protected by elastic deformation of the resin material in the region A1, and a glass substrate due to conventional glass fiber protrusion or exposure There will be no scratches on the end face.
- the plurality of recesses 20 in the inner wall of the holding hole 12 are filled with the resin material B21, abrasive grains and glass sludge do not stay in the recesses 20, and the abrasive grains and glass sludge collected in the recesses of the prior art. Can solve the problem of coarsening and coming out of the recess and causing scratches and surface contamination on the main surface of the glass substrate. Further, since the recess 20 is filled with the resin material B21, the strength reduction around the recess is suppressed, the periphery of the recess of the prior art is destroyed, and the fragments become contamination, and the glass substrate main surface is scratched. Problems that cause surface contamination can be solved.
- the carrier 10 of the present invention can solve various problems of the prior art that are particularly prominent during mass production, it is excellent in durability when the carrier is used for a long period of time.
- FIG. 4 is a longitudinal sectional view of the carrier of FIG. 2 showing another embodiment of the carrier according to the present invention.
- the surface of the inner peripheral wall surface of the holding hole 12 is covered with the resin material B21 filled in the recess 20, and the recess 20 filled with the resin material B21.
- the surface portion of the inner peripheral wall surface covered with the resin material B21 is continuous.
- the thickness t in the carrier plane direction of the resin material B21 covering the inner peripheral wall surface of the holding hole 12 is not particularly limited, but is preferably in the range of about 1 ⁇ m to 2 mm.
- the thickness and surface properties can be adjusted by forming the film thickly and then cutting it with a rotary blade.
- the entire inner peripheral wall surface of the holding hole 12 is made of resin material.
- the effect that the surface roughness of the inner peripheral wall surface of the holding hole 12 can be further improved can be obtained.
- Ra can be 0.5 ⁇ m or less.
- the inner wall surface of the holding hole is a very narrow region because the thickness of the carrier is thin, the surface portion of the inner peripheral wall surface of the holding hole covered with the resin material B21 is continuous with the concave portion 20 filled with the resin material B21. Therefore, it is possible to prevent the surface portion covering the inner peripheral wall surface of the holding hole from being damaged or dropped due to contact with the glass substrate during processing.
- a carrier having a thin plate thickness of 2 mm or less such as for a magnetic disk glass substrate
- a resin material for example, a coating method
- the thickness could be increased only to about 50 microns in the in-plane direction. This is because the thickness of the carrier is small and the adhesive surface is small, and when the thickness is increased, the carrier is peeled off from the inner peripheral wall surface.
- the adhesive force can be strengthened more than the conventional method.
- the thickness t can be greatly increased.
- the thickness t can be 100 ⁇ m or more, or 0.5 mm or more. Since the thickness can be increased in this way, the effect of preventing end face scratches can be stably obtained over a long period of time.
- the applied load is preferably in the range of 10 gf / cm 2 or more and 300 gf / cm 2 or less.
- the lower limit value is more preferably 50 gf / cm 2 or more.
- the upper limit is more preferably 200 gf / cm 2 or less.
- the mirror polishing process is performed in the first polishing process for removing scratches and distortions remaining in the lapping process, and the surface roughness of the main surface of the glass substrate while maintaining the flat surface obtained in the first polishing process.
- it is performed through two stages of a second polishing process that finishes the surface to a smooth mirror surface (however, multistage polishing of three or more stages may be performed).
- the first polishing and the second polishing Since it is preferable to carry out using the same polishing apparatus, it is preferable to apply the carrier of the present invention in both the first polishing and the second polishing.
- the double-side grinding apparatus having the same configuration as the above-described double-side polishing apparatus is also used in the grinding process of the glass substrate main surface. Therefore, it is preferable to apply the carrier according to the present invention described above also in the grinding processing of the glass substrate performed using this double-side grinding apparatus.
- the carrier of the present invention is particularly suitable for grinding using fixed abrasive grains (for example, precision grinding using the aforementioned diamond pad). In precision grinding using fixed abrasive grains, only a large amount of glass sludge is generated, so that the purity of the glass sludge tends to be high. This is because a problem occurs remarkably.
- an aluminosilicate glass containing SiO 2 as a main component and further containing alumina as the glass (glass type) constituting the glass substrate.
- a glass substrate using such glass can be finished to a smooth mirror surface by mirror polishing the surface, and the strength after processing is good. Further, the strength can be further increased by chemical strengthening.
- the glass may be crystallized glass or amorphous glass. By using amorphous glass, the surface roughness of the main surface when the glass substrate is used can be further reduced.
- an aluminosilicate glass SiO 2 is 58 wt% to 75 wt%, Al 2 O 3 is 5 wt% to 23 wt%, Li 2 O is 3 wt% to 10 wt%, Na 2
- An aluminosilicate glass containing O as a main component in an amount of 4 wt% or more and 13 wt% or less can be used.
- the alkaline earth metal oxide is 5% by weight or more
- SiO 2 is 62% by weight or more and 75% by weight or less
- Al 2 O 3 is 5% by weight or more and 15% by weight or less
- Li 2 O is added.
- amorphous aluminosilicate glass containing no phosphorus oxide having a weight ratio of 0.5 to 2.0 and a weight ratio of Al 2 O 3 / ZrO 2 of 0.4 to 2.5 can be obtained.
- the surface of the glass substrate after the mirror polishing treatment has an arithmetic average surface roughness Ra of 0.20 nm or less when the AFM is used to measure a range of 1 ⁇ m ⁇ 1 ⁇ m with a resolution of 256 ⁇ 256 pixels.
- Ra is a roughness calculated in accordance with Japanese Industrial Standard (JIS) B0601.
- the glass substrate for a magnetic disk manufactured by the present invention is suitable for a glass substrate used for a magnetic disk mounted on an HDD having a DFH type magnetic head capable of realizing an ultra-low flying height.
- the present invention is mainly applied to the manufacture of a glass substrate for a magnetic disk has been described.
- the present invention forms not only such a glass substrate but also a NiP film on the surface.
- the present invention can be applied in the same manner to the manufactured aluminum alloy substrate, and the same effect of the present invention can be obtained.
- the present invention also provides a method of manufacturing a magnetic disk using, for example, a glass substrate for the above magnetic disk.
- the magnetic disk is manufactured by forming at least a magnetic recording layer (magnetic layer) on the glass substrate for a magnetic disk according to the present invention. Further, a protective layer and a lubricating layer may be formed in this order on the magnetic recording layer.
- the glass substrate obtained by the present invention By using the glass substrate obtained by the present invention, a highly reliable magnetic disk that can obtain stable characteristics without causing a head crash or the like even when recording / reproducing with a DFH head, for example, can be obtained. . Therefore, it is suitable for manufacturing a magnetic disk having a higher recording density than ever before, for example, exceeding 500 gigabytes.
- Example 1 Comparative Example 1
- a glass substrate for a magnetic disk was manufactured through a main surface polishing step (second polishing step).
- a glass substrate made of disc-shaped aluminosilicate glass having a diameter of 66 mm ⁇ and a thickness of 1.0 mm was obtained from molten glass by direct pressing using an upper die, a lower die, and a barrel die.
- a glass substrate may be obtained by cutting into a predetermined size from a plate glass manufactured by a downdraw method or a float method. This glass substrate was subjected to a rough grinding process in order to improve dimensional accuracy and shape accuracy. This rough grinding process was performed using a double-side grinding machine.
- the carrier according to the embodiment of the present invention shown in FIG. 2 and FIG. 3 was applied as the carrier.
- This carrier uses a composite material containing glass fiber and epoxy resin as a carrier base material, and the glass fiber on the inner wall of the holding hole is dissolved and removed to a depth of 10 ⁇ m by etching with hydrofluoric acid, and the formed recess is filled with polycarbonate resin.
- a polycarbonate resin was applied under reduced pressure conditions, returned to normal pressure, and then heated to completely fill the recess, and the polycarbonate resin protruding from the recess after the treatment was removed with a rotary blade.
- the polycarbonate resin has a Rockwell hardness of M78.
- the diameter of the holding hole was set to 65.5 mm so as to be suitable for processing a 2.5-inch glass substrate.
- the roundness of the holding hole was 15 ⁇ m.
- the thickness of the carrier is 0.5 mm.
- the polishing liquid was supplied between the polishing pad and the polishing surface of the glass substrate and rotated, whereby the glass substrate revolved while rotating on the surface plate, and both surfaces were polished simultaneously.
- a hard polisher hard urethane foam
- the polishing liquid was a dispersion of cerium oxide having an average particle size of 1.5 ⁇ m as an abrasive.
- the glass substrate after the first polishing step was washed and dried. In the first polishing step, when a plurality of carriers are used in one polishing, the same type is used, and 100 batches are processed without replacing the carriers. The number of processed sheets per batch is 50 sheets.
- the glass substrate for magnetic disk was produced through the above steps.
- the obtained glass substrate has a circular hole 103 in the center as shown in FIG. 1, and is a disk provided with both main surfaces 101, 102 and an inner peripheral end surface 104 and an outer peripheral end surface 105 between the two main surfaces.
- a glass substrate 100 having an outer diameter of 65 mm, an inner diameter of 20 mm, a plate thickness of 0.635 mm, and a roundness of 1.5 ⁇ m.
- the outer peripheral end face of the glass substrate was visually observed while applying a condenser lamp in a dark room, and the presence or absence of scratches due to contact with the carrier was confirmed. I could't see it. Further, when the main surface was measured with an optical surface analyzer, no particular scratch was found.
- a composite material containing glass fibers and an epoxy resin is used as a carrier substrate, and the inner wall of the holding hole is etched by hydrofluoric acid.
- a carrier in which glass fibers are dissolved and removed to a predetermined depth (10 ⁇ m) that is, nothing is filled in the recesses formed on the inner wall
- a glass substrate was produced.
- Example 2 comparative example 2
- Example 2 Furthermore, in the fine grinding step of (3) above, similarly to the above, grinding is performed 100 batches using the same carrier as in Example 1 and Comparative Example 1, and the glass substrate of the 100th batch is washed and dried, The main surface and the outer peripheral end face were observed (Example 2 and Comparative Example 2). The main surface was observed by visual inspection.
- the same carrier as in Comparative Example 1 was used in the fine grinding step, an average of 13 scratches at the outer peripheral edge and an average of 3 long scratches on the main surface were found.
- the glass substrate of the 100th batch has surface defects such as scratches. It was observed on both the main surface and the outer peripheral end face. Moreover, when the carrier after 100 batches of glass substrate preparation was observed in detail, the damage of the inner wall of a holding hole was seen.
- Example 3 the carrier according to the embodiment shown in FIG. 4 was applied.
- This carrier uses a composite material containing glass fiber and epoxy resin as a carrier base material, and the glass fiber on the inner wall of the holding hole is dissolved and removed to a depth of 10 ⁇ m by etching with hydrofluoric acid, and the formed recess is filled with polycarbonate resin. Thereafter, the removal amount was adjusted with a cutting blade so that the thickness t in the carrier plane direction from the inner wall of the holding hole was 1 mm. In this state, the diameter of the holding hole was set to 65.5 mm.
- 200 batches of glass substrates were processed using the carrier for the first and second polishing. When the glass substrate of the 200th batch was observed on the outer peripheral end face and the main surface of the glass substrate in the same manner as in Example 1, no scratches or scratches were found on the outer peripheral end face and the main surface.
- the following film formation process was performed on the magnetic disk glass substrate obtained in Example 1 to obtain a magnetic disk for perpendicular magnetic recording. That is, an adhesion layer made of a Ti-based alloy thin film, a soft magnetic layer made of a CoTaZr alloy thin film, an underlayer made of a Ru thin film, a perpendicular magnetic recording layer made of a CoCrPt alloy, a carbon protective layer, and a lubricating layer are sequentially formed on the glass substrate. A film was formed.
- the protective layer is for preventing the magnetic recording layer from deteriorating due to contact with the magnetic head, and is made of hydrogenated carbon, and provides wear resistance.
- the lubricating layer was formed by dipping a liquid lubricant of alcohol-modified perfluoropolyether.
- the obtained magnetic disk was incorporated into an HDD together with a DFH head and subjected to a long-term operation test. As a result, no problems such as a head crash occurred and a good result was obtained.
Abstract
Description
また、上記研削工程においても、上記両面研磨装置と同様の構成の両面研削装置を用いて加工が行われる。 With such a double-side polishing apparatus, the
Also in the grinding step, processing is performed using a double-side grinding apparatus having the same configuration as the double-side polishing apparatus.
また、特許文献2には、研磨用キャリアの保持穴の内壁面に、該内壁面から突出した繊維質よりも厚く形成された樹脂製の当接部を設けることで、ガラス基板端面に対する損傷を低減させる技術が開示されている。 Therefore, in
Further,
上記特許文献2に開示された研磨用キャリアの場合、保持穴の内壁面に例えば樹脂コーティングによって当接部を設けることができるが、板厚が薄いので保持穴の内壁面は非常に狭い領域となり、保持穴内壁面に対する当接部の密着性は低く、加工中にガラス基板と接触することにより上記当接部は破損したり脱落してしまい、ガラス繊維が露出することによるダメージの問題を根本的に解決することは困難である。
なお、上記の課題は、ガラス基板だけでなく、表面にNiP膜が形成されたアルミニウム合金基板の製造においても発生するものである。NiP膜が形成されたアルミニウム合金基板の主表面を研磨する場合、当該基板をキャリアに保持させながら両面研磨装置を用いて研磨される。このとき、NiP膜はガラス基板より硬度が低いため、外周端面にキズが付きやすい。また、研磨によりNiPのスラッジが発生する。 Moreover, since the glass substrate for magnetic disks is normally processed into the thickness of 2 mm or less also including the thing in the middle of a process, the thing with an extremely thin board thickness of 2 mm or less is used also about the carrier holding this glass substrate.
In the case of the polishing carrier disclosed in
The above-mentioned problem occurs not only in the glass substrate but also in the manufacture of an aluminum alloy substrate having a NiP film formed on the surface. When the main surface of the aluminum alloy substrate on which the NiP film is formed is polished using a double-side polishing apparatus while the substrate is held by a carrier. At this time, since the NiP film has a lower hardness than the glass substrate, the outer peripheral end face is easily scratched. Also, NiP sludge is generated by polishing.
すなわち、本発明は上記目的を達成するために、以下の構成を有する。 As a result of earnest research, the present inventor has found that the above-described problems can be solved by the invention having the following configuration, and has completed the present invention.
That is, the present invention has the following configuration in order to achieve the above object.
繊維と樹脂材料とを含む複合材料を用いて形成され、円板状の基板の主表面を研磨または研削処理する際に当該基板を保持するための保持穴を有するキャリアであって、前記保持穴の内周壁面は、前記キャリアの面内方向に延伸した、繊維が存在していない複数の凹部を有し、当該複数の凹部は、樹脂が充填されていることを特徴とするキャリア。 (Configuration 1)
A carrier that is formed using a composite material including fibers and a resin material and has a holding hole for holding the substrate when the main surface of the disk-shaped substrate is polished or ground, and the holding hole The inner peripheral wall surface of the carrier has a plurality of recesses extending in the in-plane direction of the carrier and free of fibers, and the plurality of recesses are filled with a resin.
前記凹部に充填されている樹脂は、前記複合材料を構成する樹脂材料よりも硬度が低い樹脂であることを特徴とする構成1に記載のキャリア。
(構成3)
前記凹部に充填されている樹脂は、熱可塑性樹脂であることを特徴とする構成1又は2に記載のキャリア。 (Configuration 2)
The carrier according to
(Configuration 3)
The carrier according to
前記保持穴の内周壁面の表面の粗さは、Raが1.0μm以下であることを特徴とする構成1乃至3のいずれかに記載のキャリア。
(構成5)
前記樹脂が充填された複数の凹部を含む領域のキャリア面内方向の距離は、100μm以下であることを特徴とする構成1乃至4のいずれかに記載のキャリア。 (Configuration 4)
4. The carrier according to
(Configuration 5)
The carrier according to any one of
前記凹部に充填されている樹脂が前記保持穴の内周壁面を覆っていることを特徴とする構成1乃至5のいずれかに記載のキャリア。
(構成7)
構成1乃至6のいずれかに記載のキャリアを用い、該キャリアの保持穴に円板状の基板を水平に保持して、定盤の加工面を前記円板状の基板の主表面に押圧し、前記定盤の加工面と前記円板状の基板とを相対的に移動させて、当該円板状の基板の主表面を加工する処理を含むことを特徴とする磁気ディスク用基板の製造方法。 (Configuration 6)
6. The carrier according to any one of
(Configuration 7)
Using the carrier according to any one of
前記加工処理は、定盤の表面に貼り付けた研磨パッドと前記円板状の基板の主表面との間に研磨砥粒を含む研磨液を供給して、前記円板状の基板の主表面を研磨する研磨処理であることを特徴とする構成7に記載の磁気ディスク用基板の製造方法。
(構成9)
前記加工処理は、固定砥粒を貼り付けた定盤で前記円板状の基板の主表面を研削する研削処理であることを特徴とする構成7に記載の磁気ディスク用基板の製造方法。 (Configuration 8)
The processing is performed by supplying a polishing liquid containing abrasive grains between a polishing pad affixed to the surface of a surface plate and a main surface of the disk-shaped substrate, and the main surface of the disk-shaped substrate A method for manufacturing a magnetic disk substrate according to
(Configuration 9)
8. The method for manufacturing a magnetic disk substrate according to
前記保持穴の穴径と前記円板状の基板の外径との差が、0.1~1.0mmであることを特徴とする構成7乃至9のいずれかに記載の磁気ディスク用基板の製造方法。
(構成11)
前記基板はガラス基板であることを特徴とする構成7乃至10のいずれかに記載の磁気ディスク用基板の製造方法。 (Configuration 10)
10. The magnetic disk substrate according to any one of
(Configuration 11)
11. The method for manufacturing a magnetic disk substrate according to any one of
構成7乃至11のいずれかに記載の製造方法によって得られた磁気ディスク用基板上に、少なくとも磁気記録層を形成することを特徴とする磁気ディスクの製造方法。 (Configuration 12)
A magnetic disk manufacturing method comprising: forming at least a magnetic recording layer on a magnetic disk substrate obtained by the manufacturing method according to any one of
また、このようなキャリアを用いて磁気ディスク用基板の研削または研磨加工を行うことで、媒体の高記録密度化を実現する上で阻害要因となる基板主表面や端面の傷等を低減させることができる高品質の磁気ディスク用基板を製造することが可能である。さらに、この基板を用いて、故障が無く安定した特性が得られる信頼性の高い磁気ディスクを得ることが可能である。 The carrier according to the present invention has the above-described configuration, so that the agglomerates in which abrasive grains and glass sludge during processing are accumulated in the recesses from which the glass fibers existing on the inner walls of the holding holes of the carrier are removed, It is possible to provide a carrier used for processing a magnetic disk substrate having excellent durability, which can reduce the occurrence of debris due to the destruction of the surroundings, or scratches caused by glass fibers exposed on the inner wall of the holding hole. .
In addition, by grinding or polishing a magnetic disk substrate using such a carrier, it is possible to reduce scratches on the substrate main surface and end surface, which are obstructive factors in realizing high recording density of the medium. It is possible to manufacture a high-quality magnetic disk substrate that can be used. Furthermore, by using this substrate, it is possible to obtain a highly reliable magnetic disk that can obtain stable characteristics without failure.
磁気ディスク用ガラス基板は、通常、粗研削工程、形状加工工程、精研削工程、端面研磨工程、主表面研磨工程(第1研磨工程、第2研磨工程)、化学強化工程、等を経て製造される。 Hereinafter, embodiments of the present invention will be described in detail. In the following embodiments, manufacturing of a glass substrate for a magnetic disk will be mainly described.
A glass substrate for a magnetic disk is usually manufactured through a rough grinding process, a shape processing process, a fine grinding process, an end surface polishing process, a main surface polishing process (first polishing process, second polishing process), a chemical strengthening process, and the like. The
次に、この成型したガラス基板の主表面に対して寸法精度及び形状精度を向上させるための粗研削を行う。この粗研削工程は、通常両面研削装置を用い、遊離砥粒や固定砥粒を用いてガラス基板主表面の研削を行う。なお、本発明のキャリアを用いてもよい。こうしてガラス基板主表面を研削することにより、所定の板厚、平坦度に加工するとともに、所定の表面粗さを得る。この粗研削工程は適宜省略してもよい。 In manufacturing the magnetic disk glass substrate, first, a disk-shaped glass substrate (glass disk) is molded from molten glass by direct pressing. In addition to such a direct press, a glass substrate may be obtained by cutting into a predetermined size from a plate glass manufactured by a downdraw method or a float method.
Next, rough grinding is performed on the main surface of the molded glass substrate to improve dimensional accuracy and shape accuracy. In this rough grinding process, a double-side grinding apparatus is usually used to grind the main surface of the glass substrate using loose abrasive grains or fixed abrasive grains. In addition, you may use the carrier of this invention. By grinding the main surface of the glass substrate in this way, a predetermined plate thickness and flatness are processed, and a predetermined surface roughness is obtained. This rough grinding step may be omitted as appropriate.
その後、適宜、精研削工程を行う。この精研削工程では、たとえばダイヤモンドパッドを用いた固定砥粒による研削方法が好適である。ダイヤモンドパッドとは、ダイヤモンド粒子や、いくつかのダイヤモンド粒子がガラス、セラミック、金属、樹脂等のバインダーで固められた凝集体を、樹脂(例えばアクリル系樹脂等)などの支持材を用いて固定したペレットをシートに貼り付けたものである。なお、ダイヤモンドパッドは必ずしも一般的な呼び名ではないが、ここでは便宜上「ダイヤモンドパッド」と呼ぶこととする。
ダイヤモンドパッドを用いた固定砥粒による研削では、シート表面に砥粒が均一に存在しているため、荷重が集中することなく、加えて樹脂を用いて砥粒をシートに固定しているため、砥粒に荷重が加わっても砥粒を固定している樹脂の高弾性作用により、加工面のクラック(加工変質層)は浅く、加工表面粗さの低下が可能となり、後工程への負荷(取代など)が低減される。なお、固定砥粒による研削時には、水等のクーラントを加工面に供給しながら行うことが好ましい。 After the rough grinding step, a shape processing (chamfering) step is performed.
Thereafter, a precision grinding process is performed as appropriate. In this fine grinding step, for example, a grinding method using fixed abrasive grains using a diamond pad is suitable. A diamond pad is an agglomerate in which diamond particles or some diamond particles are hardened with a binder such as glass, ceramic, metal, resin, etc., and fixed using a support material such as resin (for example, acrylic resin). A pellet is pasted on a sheet. The diamond pad is not necessarily a general name, but is referred to as “diamond pad” here for convenience.
In grinding with fixed abrasive grains using a diamond pad, since the abrasive grains are uniformly present on the sheet surface, the load is not concentrated, and in addition, the abrasive grains are fixed to the sheet using resin, Even if a load is applied to the abrasive grains, the high elasticity of the resin that fixes the abrasive grains makes the cracks on the machined surface (work-affected layer) shallow, allowing the machined surface roughness to be reduced and reducing the load on subsequent processes ( The allowance is reduced. In addition, it is preferable to perform the grinding with the fixed abrasive while supplying a coolant such as water to the processing surface.
本発明に係るキャリアは、たとえば、定盤の加工面をガラス基板の主表面に押圧し、前記定盤の加工面と前記ガラス基板とを相対的に移動させて、当該ガラス基板の主表面を加工する際に用いられ、前記ガラス基板を水平に保持するためのキャリアである。そして、上記構成1にあるように、繊維と樹脂材料とを含む複合材料を用いて形成され、円板状のガラス基板の主表面を研磨または研削処理する際に当該ガラス基板を保持するための保持穴を有するキャリアであって、前記保持穴の内周壁面は、該内周壁面に対して例えばほぼ直交する方向であり前記キャリアの面内方向に延伸した、繊維が存在していない複数の凹部を有し、当該複数の凹部は、樹脂が充填されている構成としたものである。 The present invention relates to the
The carrier according to the present invention, for example, presses the processing surface of the surface plate against the main surface of the glass substrate, relatively moves the processing surface of the surface plate and the glass substrate, and moves the main surface of the glass substrate. It is a carrier that is used when processing and holds the glass substrate horizontally. And as it exists in the said
なお、ガラス繊維の代わりに、例えば、金属繊維を用いることもできる。本件では、ガラス繊維と樹脂材とを含む複合材料により保持部材が形成される場合を一例として例示する。
なお、図3では、図示の便宜上、上記保持部材11の内部断面構造(特に上記複合材料からなる領域)をあくまでもイメージとして描いたものであり、実際の内部構造を必ずしも正確に描いたものではない。 As shown in the longitudinal sectional view of FIG. 3, the holding
In addition, for example, metal fibers can be used instead of glass fibers. In this case, the case where a holding member is formed with the composite material containing glass fiber and a resin material is illustrated as an example.
In FIG. 3, for convenience of illustration, the internal cross-sectional structure of the holding member 11 (particularly, the region made of the composite material) is merely depicted as an image, and the actual internal structure is not necessarily accurately depicted. .
また、上記凹部20に充填される樹脂は、キャリア基材である複合材料を構成する樹脂材料よりも硬度が低い樹脂であることが好ましい。この場合、充填する樹脂の硬度は、ロックウェル硬度でM80未満であることが好ましい。この範囲内とすることで、基材のエポキシ樹脂よりも硬度を低くすることができるので、ガラス基板の端面傷を生じにくくすることが可能となる。エポキシ樹脂の硬度は、一般的にロックウェル硬度でM80~100である。 Therefore, it is preferable that the resin filled in the
Moreover, it is preferable that resin with which the said recessed
上記保持穴12の内周壁面に上記樹脂材料B21を塗布した後、加熱を行い、樹脂材料B21を溶かして充填を行う。このとき、充填部分の凹部内部を減圧することができれば、凹部の底部まで充填することが可能になるのでより望ましい。例えば、減圧環境下で塗布を行い、その後常圧として加熱すればよい。加熱方法としては、熱板溶着法、振動溶着法、超音波溶着法、レーザー透過溶着法などを適用することが好適である。なお、キャリアの保持部材11を多数枚積層した状態で上述の充填作業を行うと効率よく行うことができる。なお、充填処理後、凹部からはみ出した樹脂を除去してもよい。樹脂の除去には、例えば回転刃を用いることができる。 Examples of the method for filling the
After the resin material B21 is applied to the inner peripheral wall surface of the holding
本発明のキャリア10は、特に大量生産時に顕著に発生する従来技術の種々の問題を解決することができるので、キャリアを長期間使用する場合の耐久性に優れている。 Furthermore, when the conventional recess is broken, a step is generated on the inner wall of the holding hole, which may cause a new scratch on the end surface of the glass substrate, or the roundness of the inner diameter of the holding hole may be lost. The problem of breaking down to the extent can also be solved.
Since the
図4に示されるように、本実施の形態では、前記保持穴12の内周壁面の表面が、前記凹部20に充填された樹脂材料B21で覆われ、樹脂材料B21が充填された前記凹部20と、樹脂材料B21で覆われた前記内周壁面の表面部とは連続している構成としたものである。 FIG. 4 is a longitudinal sectional view of the carrier of FIG. 2 showing another embodiment of the carrier according to the present invention.
As shown in FIG. 4, in the present embodiment, the surface of the inner peripheral wall surface of the holding
しかし、本実施の形態では、保持穴の内周壁面に根(上記凹部に形成された凸部)を生やすような形態となるので、従来の方法よりも接着力を強固にすることができるため、上記の厚みtを大幅に増加させることができる。例えば、厚みtは、100μm以上や、0.5mm以上とすることができる。このように厚くすることができるので、端面傷の防止効果を長期間に亘って安定して得ることができる。 Conventionally, in a carrier having a thin plate thickness of 2 mm or less, such as for a magnetic disk glass substrate, for example, when the inner peripheral wall surface of a holding hole as disclosed in
However, in the present embodiment, since the root (convex portion formed in the concave portion) is formed on the inner peripheral wall surface of the holding hole, the adhesive force can be strengthened more than the conventional method. The thickness t can be greatly increased. For example, the thickness t can be 100 μm or more, or 0.5 mm or more. Since the thickness can be increased in this way, the effect of preventing end face scratches can be stably obtained over a long period of time.
上記荷重が、10gf/cm2よりも低いと、ガラス基板の加工性(研磨速度)が低下する場合があるために好ましくない。また、250gf/cm2よりも高い場合には、ガラス基板表面にスクラッチ等の傷が発生する場合があるため好ましくない。 In addition, in the mirror polishing process of the glass substrate using the carrier of the present invention as described above, the applied load (working surface pressure) is preferably in the range of 10 gf / cm 2 or more and 300 gf / cm 2 or less. The lower limit value is more preferably 50 gf / cm 2 or more. Further, the upper limit is more preferably 200 gf / cm 2 or less.
When the load is lower than 10 gf / cm 2 , the workability (polishing rate) of the glass substrate may be lowered, which is not preferable. Moreover, when higher than 250 gf / cm < 2 >, since scratches, such as a scratch, may generate | occur | produce on the glass substrate surface, it is unpreferable.
本発明のキャリアは、固定砥粒を用いる研削加工(例えば前述のダイヤモンドパッドを用いる精研削)に特に好適である。固定砥粒を用いる精研削では、ガラススラッジのみが大量に発生するので、ガラススラッジの純度が高くなりやすく、従来のキャリアでは、これらガラススラッジが凹部の中で溜まって結晶化しやすいため、従来の課題が顕著に発生するからである。 In addition, although the case where the carrier according to the present invention is applied in the polishing treatment of the glass substrate has been described above, the double-side grinding apparatus having the same configuration as the above-described double-side polishing apparatus is also used in the grinding process of the glass substrate main surface. Therefore, it is preferable to apply the carrier according to the present invention described above also in the grinding processing of the glass substrate performed using this double-side grinding apparatus.
The carrier of the present invention is particularly suitable for grinding using fixed abrasive grains (for example, precision grinding using the aforementioned diamond pad). In precision grinding using fixed abrasive grains, only a large amount of glass sludge is generated, so that the purity of the glass sludge tends to be high. This is because a problem occurs remarkably.
また、上記ガラスは、結晶化ガラスであってもよく、アモルファスガラスであってもよい。アモルファスガラスとすることで、ガラス基板としたときの主表面の表面粗さをより一層下げることができる。 In the present invention, it is preferable to use an aluminosilicate glass containing SiO 2 as a main component and further containing alumina as the glass (glass type) constituting the glass substrate. A glass substrate using such glass can be finished to a smooth mirror surface by mirror polishing the surface, and the strength after processing is good. Further, the strength can be further increased by chemical strengthening.
The glass may be crystallized glass or amorphous glass. By using amorphous glass, the surface roughness of the main surface when the glass substrate is used can be further reduced.
なお、上記の実施の形態では、本発明を主に磁気ディスク用のガラス基板の製造に適用した場合について説明したが、本発明は、このようなガラス基板だけでなく、表面にNiP膜が形成されたアルミニウム合金基板の製造においても同様に適用することが可能であり、同様な本発明の効果が得られる。 According to the present invention, it is possible to produce a high-quality glass substrate that can reduce scratches on the main surface and end face of the glass substrate, which is an impediment to achieving high recording density of the medium, The glass substrate for a magnetic disk manufactured by the present invention is suitable for a glass substrate used for a magnetic disk mounted on an HDD having a DFH type magnetic head capable of realizing an ultra-low flying height.
In the above embodiment, the case where the present invention is mainly applied to the manufacture of a glass substrate for a magnetic disk has been described. However, the present invention forms not only such a glass substrate but also a NiP film on the surface. The present invention can be applied in the same manner to the manufactured aluminum alloy substrate, and the same effect of the present invention can be obtained.
磁気ディスクは、本発明による磁気ディスク用ガラス基板の上に少なくとも磁気記録層(磁性層)を形成して製造される。また、磁気記録層の上に、保護層、潤滑層をこの順に形成するとよい。 The present invention also provides a method of manufacturing a magnetic disk using, for example, a glass substrate for the above magnetic disk.
The magnetic disk is manufactured by forming at least a magnetic recording layer (magnetic layer) on the glass substrate for a magnetic disk according to the present invention. Further, a protective layer and a lubricating layer may be formed in this order on the magnetic recording layer.
(実施例1、比較例1)
以下の(1)粗研削工程、(2)形状加工工程、(3)精研削工程、(4)端面研磨工程、(5)主表面研磨工程(第1研磨工程)、(6)化学強化工程、(7)主表面研磨工程(第2研磨工程)を経て磁気ディスク用ガラス基板を製造した。 Hereinafter, embodiments of the present invention will be specifically described with reference to examples. In addition, this invention is not limited to a following example.
(Example 1, Comparative Example 1)
The following (1) rough grinding step, (2) shape processing step, (3) fine grinding step, (4) end surface polishing step, (5) main surface polishing step (first polishing step), (6) chemical strengthening step (7) A glass substrate for a magnetic disk was manufactured through a main surface polishing step (second polishing step).
まず、溶融ガラスから上型、下型、胴型を用いたダイレクトプレスにより直径66mmφ、厚さ1.0mmの円盤状のアルミノシリゲートガラスからなるガラス基板を得た。なお、このようなダイレクトプレス以外に、ダウンドロー法やフロート法で製造された板ガラスから所定の大きさに切り出してガラス基板を得てもよい。
このガラス基板に寸法精度及び形状精度の向上させるため粗研削工程を行った。この粗研削工程は両面研削装置を用いて行った。 (1) Coarse grinding step First, a glass substrate made of disc-shaped aluminosilicate glass having a diameter of 66 mmφ and a thickness of 1.0 mm was obtained from molten glass by direct pressing using an upper die, a lower die, and a barrel die. In addition to such a direct press, a glass substrate may be obtained by cutting into a predetermined size from a plate glass manufactured by a downdraw method or a float method.
This glass substrate was subjected to a rough grinding process in order to improve dimensional accuracy and shape accuracy. This rough grinding process was performed using a double-side grinding machine.
次に、円筒状の砥石を用いてガラス基板の中央部分に孔を空けると共に、外周端面の研削をして直径を65mmφとした後、外周端面および内周端面に所定の面取り加工を施した。
(3)精研削工程
この精研削工程は両面研削装置を用い、上記の固定砥粒による研削処理を行った。 (2) Shape processing step Next, a cylindrical grindstone is used to make a hole in the central portion of the glass substrate, and the outer peripheral end face is ground to a diameter of 65 mmφ. Chamfered.
(3) Precision grinding process This precision grinding process performed the grinding process by said fixed abrasive using the double-sided grinding apparatus.
次いで、ブラシ研磨により、ガラス基板を回転させながらガラス基板の端面(内周、外周)を研磨した。そして、上記端面研磨を終えたガラス基板の表面を洗浄した。 (4) End surface grinding | polishing process Next, the end surface (inner periphery, outer periphery) of the glass substrate was grind | polished by brush grinding | polishing, rotating a glass substrate. And the surface of the glass substrate which finished the said end surface grinding | polishing was wash | cleaned.
次に、両面研磨装置を用いて、主表面の第1研磨工程を行なった。両面研磨装置においては、研磨パッドが貼り付けられた上下研磨定盤の間にキャリアにより保持したガラス基板を密着させ、このキャリアを太陽歯車(サンギア)と内歯歯車(インターナルギア)とに噛合させ、上記ガラス基板を上下定盤によって挟圧する。 (5) Main surface polishing step (first polishing step)
Next, the 1st grinding | polishing process of the main surface was performed using the double-side polish apparatus. In a double-side polishing machine, a glass substrate held by a carrier is closely attached between an upper and lower polishing surface plate to which a polishing pad is attached, and this carrier is engaged with a sun gear (sun gear) and an internal gear (internal gear). The glass substrate is sandwiched between upper and lower surface plates.
なお、上記の第1研磨工程では、1回の研磨で用いるキャリアが複数の場合は同一種類のものとし、キャリアを交換しないで100バッチ加工した。なお、1バッチあたりの加工枚数は50枚である。 Thereafter, the polishing liquid was supplied between the polishing pad and the polishing surface of the glass substrate and rotated, whereby the glass substrate revolved while rotating on the surface plate, and both surfaces were polished simultaneously. A hard polisher (hard urethane foam) was used as the polishing pad, and the polishing liquid was a dispersion of cerium oxide having an average particle size of 1.5 μm as an abrasive. The glass substrate after the first polishing step was washed and dried.
In the first polishing step, when a plurality of carriers are used in one polishing, the same type is used, and 100 batches are processed without replacing the carriers. The number of processed sheets per batch is 50 sheets.
次に、上記洗浄を終えたガラス基板に化学強化を施した。 (6) Chemical strengthening process Next, the glass substrate which finished the said washing | cleaning was chemically strengthened.
次いで上記の第1研磨工程で使用したものと同じ両面研磨装置を用い、研磨パッドを軟質ポリシャ(スウェード)の研磨パッド(発泡ポリウレタン)に替えて第2研磨工程を実施した。また、第2研磨工程におけるキャリアは、上記第1研磨工程に用いたキャリアと同種類のものを適用した。この第2研磨工程は、ガラス基板主表面の表面粗さをRaで0.2nm程度以下の平滑な鏡面に仕上げるための鏡面研磨加工である。研磨液としては平均粒径20nmのコロイダルシリカの研磨砥粒を水に分散させたものを用いた。上記第2研磨工程を終えたガラス基板を、洗浄し、乾燥した。 (7) Main surface polishing step (second polishing step)
Next, using the same double-side polishing apparatus as used in the first polishing step, the polishing pad was replaced with a polishing pad (foamed polyurethane) of a soft polisher (suede), and a second polishing step was performed. The carrier used in the second polishing step was the same type as the carrier used in the first polishing step. This second polishing step is a mirror polishing process for finishing the surface roughness of the glass substrate main surface to a smooth mirror surface with an Ra of about 0.2 nm or less. As the polishing liquid, a dispersion of colloidal silica polishing abrasive grains having an average particle diameter of 20 nm in water was used. The glass substrate after the second polishing step was washed and dried.
第1研磨工程の100バッチ目のガラス基板について、上記実施例1と同様に、そのガラス基板の外周端面及び主表面について観察したところ、外周端面にはキャリアとの接触による傷が基板1枚当たり平均6個見つかり、主表面には基板1面当たり平均5個のスクラッチ又はピット欠陥が観察された。 Further, as Comparative Example 1 with respect to Example 1 described above, in the first polishing step and the second polishing step, a composite material containing glass fibers and an epoxy resin is used as a carrier substrate, and the inner wall of the holding hole is etched by hydrofluoric acid. For a magnetic disk in the same manner as in Example 1 except that a carrier in which glass fibers are dissolved and removed to a predetermined depth (10 μm) (that is, nothing is filled in the recesses formed on the inner wall) is applied. A glass substrate was produced.
About the glass substrate of the 100th batch of the 1st grinding | polishing process, when the outer periphery end surface and main surface of the glass substrate were observed similarly to the said Example 1, the damage | wound by contact with a carrier is per 1 board | substrate on an outer periphery end surface. An average of 6 scratches was found, and an average of 5 scratches or pit defects was observed per substrate surface on the main surface.
さらに、上記(3)の精研削工程において、上記と同様に、実施例1および比較例1と同じキャリアを用いて100バッチずつ研削加工を行い、100バッチ目のガラス基板を洗浄、乾燥し、主表面と外周端面とを観察した(実施例2及び比較例2)。なお、主表面の観察は目視検査にて行った。その結果、上記の精研削工程において、比較例1と同じキャリアを用いた場合、外周端部におけるキズは平均13個、主表面に長いスクラッチが平均3個見つかった。一方、実施例1と同じキャリアを用いた場合は、両方とも0個であった。 (Example 2, comparative example 2)
Furthermore, in the fine grinding step of (3) above, similarly to the above, grinding is performed 100 batches using the same carrier as in Example 1 and Comparative Example 1, and the glass substrate of the 100th batch is washed and dried, The main surface and the outer peripheral end face were observed (Example 2 and Comparative Example 2). The main surface was observed by visual inspection. As a result, when the same carrier as in Comparative Example 1 was used in the fine grinding step, an average of 13 scratches at the outer peripheral edge and an average of 3 long scratches on the main surface were found. On the other hand, when the same carrier as in Example 1 was used, both were 0.
1.保持穴内壁の凹部に砥粒やガラススラッジが溜まって粗大化した凝集物が研磨中に凹部から出てガラス基板端面や主表面にスクラッチや表面汚染を引き起こした。
2.保持穴の内壁には、ガラス繊維が存在しておらず、何も充填されていない複数の凹部を有し、保持穴の内壁の強度が低いため、加工中にガラス基板と接触することにより破損して、その破片がコンタミネーションとなり、上記1と同様のガラス基板端面や主表面にスクラッチや表面汚染を引き起こした。 Thus, when the carrier of a comparative example is applied, the following points are mentioned as a cause which surface defects, such as a crack | wound, generate | occur | produced in the glass substrate.
1. Agglomerates, which were coarsened due to accumulation of abrasive grains and glass sludge in the recesses in the inner wall of the holding hole, came out of the recesses during polishing and caused scratches and surface contamination on the end surfaces and the main surface of the glass substrate.
2. There is no glass fiber on the inner wall of the holding hole, it has a plurality of recesses that are not filled with anything, and the strength of the inner wall of the holding hole is low, so it breaks due to contact with the glass substrate during processing As a result, the fragments were contaminated, and scratches and surface contamination were caused on the glass substrate end face and the main surface as in 1 above.
本実施例では、前述の図4に示す実施形態に係るキャリアを適用した。このキャリアは、ガラス繊維とエポキシ樹脂とを含む複合材料をキャリア基材とし、フッ酸によるエッチングによって保持穴内壁のガラス繊維を10μmの深さまで溶解除去し、形成された凹部にポリカーボネート樹脂を充填した後、保持穴内壁からのキャリア面内方向の厚みtが1mmとなるように切断刃で除去量を調節した。その状態で保持穴の直径は65.5mmとなるようにした。
実施例1と同様に上記キャリアを第1および第2研磨に用いてガラス基板を200バッチ加工した。200バッチ目のガラス基板について、上記実施例1と同様に、そのガラス基板の外周端面及び主表面について観察したところ、外周端面、主表面ともにスクラッチや傷等は見られなかった。 Example 3
In this example, the carrier according to the embodiment shown in FIG. 4 was applied. This carrier uses a composite material containing glass fiber and epoxy resin as a carrier base material, and the glass fiber on the inner wall of the holding hole is dissolved and removed to a depth of 10 μm by etching with hydrofluoric acid, and the formed recess is filled with polycarbonate resin. Thereafter, the removal amount was adjusted with a cutting blade so that the thickness t in the carrier plane direction from the inner wall of the holding hole was 1 mm. In this state, the diameter of the holding hole was set to 65.5 mm.
As in Example 1, 200 batches of glass substrates were processed using the carrier for the first and second polishing. When the glass substrate of the 200th batch was observed on the outer peripheral end face and the main surface of the glass substrate in the same manner as in Example 1, no scratches or scratches were found on the outer peripheral end face and the main surface.
従来のキャリア(ガラス繊維とエポキシ樹脂とを含む複合材料をキャリア基材とし、フッ酸エッチングによる保持穴内壁のガラス繊維の溶解除去を行っていない)の保持穴内壁に厚み1mmとなるようにポリカーボネート樹脂コーティングを施した。その状態で保持穴の直径は65.5mmとなるようにした。実施例3と同様に、このキャリアを第1および第2研磨に用いてガラス基板を200バッチ加工した。200バッチ目のガラス基板について、その外周端面及び主表面について観察したところ、外周端面にはキャリアとの接触による傷が基板1枚当たり平均25個見つかり、主表面には基板1面当たり平均11個のスクラッチ又はピット欠陥が観察された。 (Comparative Example 3)
Polycarbonate so that the inner wall of the holding hole of a conventional carrier (a composite material containing glass fiber and epoxy resin is used as a carrier base material and the glass fiber of the inner wall of the holding hole is not dissolved and removed by hydrofluoric acid etching) has a thickness of 1 mm. Resin coating was applied. In this state, the diameter of the holding hole was set to 65.5 mm. As in Example 3, 200 batches of glass substrates were processed using this carrier for the first and second polishing. As for the 200th batch of glass substrates, the outer peripheral end face and the main surface were observed. On the outer peripheral end face, an average of 25 scratches per substrate were found, and the main surface averaged 11 per substrate face. Scratch or pit defects were observed.
上記従来のキャリア(エッチング処理無し)の保持穴内壁に厚み1mmのリング状ポリカーボネート樹脂部材をはめた。その状態で保持穴の直径は65.5mmとなるようにした。このキャリアを第1および第2研磨に用いてガラス基板を加工したところ、第1、第2研磨ともに、研磨途中でリング状部材が外れてしまい、200バッチ加工できなかった。 (Comparative Example 4)
A ring-shaped polycarbonate resin member having a thickness of 1 mm was fitted to the inner wall of the holding hole of the conventional carrier (without etching treatment). In this state, the diameter of the holding hole was set to 65.5 mm. When the glass substrate was processed using this carrier for the first and second polishing, the ring-shaped member was detached during the polishing for both the first and second polishing, and 200 batch processing could not be performed.
上記実施例1で得られた磁気ディスク用ガラス基板に以下の成膜工程を施して、垂直磁気記録用磁気ディスクを得た。
すなわち、上記ガラス基板上に、Ti系合金薄膜からなる付着層、CoTaZr合金薄膜からなる軟磁性層、Ru薄膜からなる下地層、CoCrPt合金からなる垂直磁気記録層、カーボン保護層、潤滑層を順次成膜した。保護層は、磁気記録層が磁気ヘッドとの接触によって劣化することを防止するためのもので、水素化カーボンからなり、耐磨耗性が得られる。また、潤滑層は、アルコール変性パーフルオロポリエーテルの液体潤滑剤をディップ法により形成した。 (Manufacture of magnetic disk)
The following film formation process was performed on the magnetic disk glass substrate obtained in Example 1 to obtain a magnetic disk for perpendicular magnetic recording.
That is, an adhesion layer made of a Ti-based alloy thin film, a soft magnetic layer made of a CoTaZr alloy thin film, an underlayer made of a Ru thin film, a perpendicular magnetic recording layer made of a CoCrPt alloy, a carbon protective layer, and a lubricating layer are sequentially formed on the glass substrate. A film was formed. The protective layer is for preventing the magnetic recording layer from deteriorating due to contact with the magnetic head, and is made of hydrogenated carbon, and provides wear resistance. The lubricating layer was formed by dipping a liquid lubricant of alcohol-modified perfluoropolyether.
2 太陽歯車
3 内歯歯車
5 上定盤
6 下定盤
7 研磨パッド
10 キャリア
11 保持部材
12 保持穴
13 ギア歯
20 凹部
21 樹脂材料B
30 ガラス繊維
31 樹脂材料A
100 磁気ディスク用ガラス基板
101,102 主表面
103 円孔
104 内周端面
105 外周端面 1 Workpiece to be polished (glass substrate)
2
30
DESCRIPTION OF
Claims (12)
- 繊維と樹脂材料とを含む複合材料を用いて形成され、円板状の基板の主表面を研磨または研削処理する際に当該基板を保持するための保持穴を有するキャリアであって、
前記保持穴の内周壁面は、前記キャリアの面内方向に延伸した、繊維が存在していない複数の凹部を有し、
当該複数の凹部は、樹脂が充填されていることを特徴とするキャリア。 A carrier having a holding hole for holding the substrate when polishing or grinding the main surface of the disk-shaped substrate, formed using a composite material including fibers and a resin material,
The inner peripheral wall surface of the holding hole has a plurality of recesses extending in the in-plane direction of the carrier and free of fibers,
The carrier, wherein the plurality of recesses are filled with resin. - 前記凹部に充填されている樹脂は、前記複合材料を構成する樹脂材料よりも硬度が低い樹脂であることを特徴とする請求項1に記載のキャリア。 2. The carrier according to claim 1, wherein the resin filled in the recess is a resin having a lower hardness than a resin material constituting the composite material.
- 前記凹部に充填されている樹脂は、熱可塑性樹脂であることを特徴とする請求項1又は2に記載のキャリア。 3. The carrier according to claim 1 or 2, wherein the resin filled in the recess is a thermoplastic resin.
- 前記保持穴の内周壁面の表面の粗さは、Raが1.0μm以下であることを特徴とする請求項1乃至3のいずれかに記載のキャリア。 The carrier according to any one of claims 1 to 3, wherein Ra of the inner peripheral wall surface of the holding hole has a surface roughness Ra of 1.0 µm or less.
- 前記樹脂が充填された複数の凹部を含む領域のキャリア面内方向の距離は、100μm以下であることを特徴とする請求項1乃至4のいずれかに記載のキャリア。 The carrier according to any one of claims 1 to 4, wherein a distance in a carrier in-plane direction of a region including a plurality of concave portions filled with the resin is 100 µm or less.
- 前記凹部に充填されている樹脂が前記保持穴の内周壁面を覆っていることを特徴とする請求項1乃至5のいずれかに記載のキャリア。 The carrier according to any one of claims 1 to 5, wherein the resin filled in the recess covers an inner peripheral wall surface of the holding hole.
- 請求項1乃至6のいずれかに記載のキャリアを用い、該キャリアの保持穴に円板状の基板を水平に保持して、定盤の加工面を前記円板状の基板の主表面に押圧し、前記定盤の加工面と前記円板状の基板とを相対的に移動させて、当該円板状の基板の主表面を加工する処理を含むことを特徴とする磁気ディスク用基板の製造方法。 A carrier according to any one of claims 1 to 6, wherein a disk-shaped substrate is horizontally held in a holding hole of the carrier, and a processing surface of a surface plate is pressed against a main surface of the disk-shaped substrate. And manufacturing the magnetic disk substrate, wherein the processing surface of the surface plate and the disk-shaped substrate are relatively moved to process the main surface of the disk-shaped substrate. Method.
- 前記加工処理は、定盤の表面に貼り付けた研磨パッドと前記円板状の基板の主表面との間に研磨砥粒を含む研磨液を供給して、前記円板状の基板の主表面を研磨する研磨処理であることを特徴とする請求項7に記載の磁気ディスク用基板の製造方法。 The processing is performed by supplying a polishing liquid containing abrasive grains between a polishing pad affixed to the surface of a surface plate and a main surface of the disk-shaped substrate, and the main surface of the disk-shaped substrate The method for manufacturing a magnetic disk substrate according to claim 7, wherein the magnetic disk substrate is a polishing process for polishing the substrate.
- 前記加工処理は、固定砥粒を貼り付けた定盤で前記円板状の基板の主表面を研削する研削処理であることを特徴とする請求項7に記載の磁気ディスク用基板の製造方法。 The method for manufacturing a magnetic disk substrate according to claim 7, wherein the processing is a grinding process in which a main surface of the disk-shaped substrate is ground with a surface plate to which fixed abrasive grains are attached.
- 前記保持穴の穴径と前記円板状の基板の外径との差が、0.1~1.0mmであることを特徴とする請求項7乃至9のいずれかに記載の磁気ディスク用基板の製造方法。 10. The magnetic disk substrate according to claim 7, wherein a difference between a diameter of the holding hole and an outer diameter of the disk-shaped substrate is 0.1 to 1.0 mm. Manufacturing method.
- 前記基板はガラス基板であることを特徴とする請求項7乃至10のいずれかに記載の磁気ディスク用基板の製造方法。 11. The method for manufacturing a magnetic disk substrate according to claim 7, wherein the substrate is a glass substrate.
- 請求項7乃至11のいずれかに記載の製造方法によって得られた磁気ディスク用基板上に、少なくとも磁気記録層を形成することを特徴とする磁気ディスクの製造方法。
A method for manufacturing a magnetic disk, comprising forming at least a magnetic recording layer on a magnetic disk substrate obtained by the manufacturing method according to claim 7.
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CN201480024723.3A CN105163908B (en) | 2013-06-30 | 2014-06-30 | The manufacture method of pallet, the manufacture method of substrate for magnetic disc and disk |
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WO2015002152A1 true WO2015002152A1 (en) | 2015-01-08 |
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PCT/JP2014/067448 WO2015002152A1 (en) | 2013-06-30 | 2014-06-30 | Carrier, method for producing substrate for magnetic disks, and method for producing magnetic disk |
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JP (1) | JP6063044B2 (en) |
CN (1) | CN105163908B (en) |
MY (1) | MY170789A (en) |
SG (1) | SG11201509844VA (en) |
WO (1) | WO2015002152A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019151185A1 (en) * | 2018-01-31 | 2019-08-08 | Hoya株式会社 | Method for producing glass substrate for magnetic disk |
Families Citing this family (1)
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JP6895918B2 (en) * | 2018-03-23 | 2021-06-30 | 古河電気工業株式会社 | Manufacturing method of aluminum alloy substrate for magnetic disk, disk drive, and aluminum alloy substrate for magnetic disk |
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JP2002326156A (en) * | 2001-04-27 | 2002-11-12 | Nippon Sheet Glass Co Ltd | Carrier for polishing glass substrate, and glass substrate polishing device |
JP2006068895A (en) * | 2004-08-02 | 2006-03-16 | Showa Denko Kk | Manufacturing method of carrier for polishing and silicon substrate for magnetic recording medium and silicon substrate for magnetic recording medium |
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JP2008006526A (en) * | 2006-06-28 | 2008-01-17 | Konica Minolta Opto Inc | Polishing carrier |
JP2012218103A (en) * | 2011-04-07 | 2012-11-12 | Asahi Glass Co Ltd | Polishing carrier, method for polishing glass substrate using the carrier, method for manufacturing glass substrate, and glass substrate for magnetic recording medium |
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JP4224517B2 (en) * | 2007-02-20 | 2009-02-18 | 昭和電工株式会社 | Polishing method for disk-shaped substrate |
JP2010257561A (en) * | 2009-03-30 | 2010-11-11 | Hoya Corp | Method for manufacturing substrate for magnetic disk |
JP5452984B2 (en) * | 2009-06-03 | 2014-03-26 | 不二越機械工業株式会社 | Wafer double-side polishing method |
JP5580130B2 (en) * | 2010-07-20 | 2014-08-27 | Hoya株式会社 | Manufacturing method of grinding pad and glass substrate for magnetic disk |
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2014
- 2014-06-30 WO PCT/JP2014/067448 patent/WO2015002152A1/en active Application Filing
- 2014-06-30 CN CN201480024723.3A patent/CN105163908B/en active Active
- 2014-06-30 JP JP2015525212A patent/JP6063044B2/en active Active
- 2014-06-30 SG SG11201509844VA patent/SG11201509844VA/en unknown
- 2014-06-30 MY MYPI2015704366A patent/MY170789A/en unknown
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JPH11309665A (en) * | 1998-04-30 | 1999-11-09 | Toshiba Corp | Manufacture of oxide single crystal substrate |
JP2002326156A (en) * | 2001-04-27 | 2002-11-12 | Nippon Sheet Glass Co Ltd | Carrier for polishing glass substrate, and glass substrate polishing device |
JP2006068895A (en) * | 2004-08-02 | 2006-03-16 | Showa Denko Kk | Manufacturing method of carrier for polishing and silicon substrate for magnetic recording medium and silicon substrate for magnetic recording medium |
JP2008000823A (en) * | 2006-06-20 | 2008-01-10 | Konica Minolta Opto Inc | Polishing carrier |
JP2008006526A (en) * | 2006-06-28 | 2008-01-17 | Konica Minolta Opto Inc | Polishing carrier |
JP2012218103A (en) * | 2011-04-07 | 2012-11-12 | Asahi Glass Co Ltd | Polishing carrier, method for polishing glass substrate using the carrier, method for manufacturing glass substrate, and glass substrate for magnetic recording medium |
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Publication number | Priority date | Publication date | Assignee | Title |
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WO2019151185A1 (en) * | 2018-01-31 | 2019-08-08 | Hoya株式会社 | Method for producing glass substrate for magnetic disk |
JPWO2019151185A1 (en) * | 2018-01-31 | 2020-07-30 | Hoya株式会社 | Disk-shaped glass base plate manufacturing method and magnetic disk glass substrate manufacturing method |
Also Published As
Publication number | Publication date |
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MY170789A (en) | 2019-08-28 |
JP6063044B2 (en) | 2017-01-18 |
SG11201509844VA (en) | 2015-12-30 |
CN105163908A (en) | 2015-12-16 |
CN105163908B (en) | 2017-10-13 |
JPWO2015002152A1 (en) | 2017-02-23 |
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