SG10202005438WA - Slurry used in polishing a substrate - Google Patents
Slurry used in polishing a substrateInfo
- Publication number
- SG10202005438WA SG10202005438WA SG10202005438WA SG10202005438WA SG10202005438WA SG 10202005438W A SG10202005438W A SG 10202005438WA SG 10202005438W A SG10202005438W A SG 10202005438WA SG 10202005438W A SG10202005438W A SG 10202005438WA SG 10202005438W A SG10202005438W A SG 10202005438WA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing
- substrate
- slurry used
- slurry
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012137764A JP5613723B2 (en) | 2012-06-19 | 2012-06-19 | Carrier plate and disk-shaped substrate manufacturing method, disk-shaped substrate double-sided processing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202005438WA true SG10202005438WA (en) | 2020-07-29 |
Family
ID=50035837
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201510276UA SG10201510276UA (en) | 2012-06-19 | 2013-06-07 | Slurry used in polishing a substrate |
SG10202005438WA SG10202005438WA (en) | 2012-06-19 | 2013-06-07 | Slurry used in polishing a substrate |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201510276UA SG10201510276UA (en) | 2012-06-19 | 2013-06-07 | Slurry used in polishing a substrate |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5613723B2 (en) |
MY (1) | MY164088A (en) |
SG (2) | SG10201510276UA (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110752143A (en) * | 2019-09-03 | 2020-02-04 | 福建晶安光电有限公司 | Process for improving flatness of sapphire substrate |
JP7291795B2 (en) * | 2019-09-30 | 2023-06-15 | Hoya株式会社 | SUBSTRATE ARRANGEMENT SUPPORT JIG AND SUBSTRATE MANUFACTURING METHOD |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1128657A (en) * | 1997-07-08 | 1999-02-02 | Syst Seiko Kk | Dressing method and device of polishing tool |
JP2000198064A (en) * | 1999-01-07 | 2000-07-18 | Daido Steel Co Ltd | Polishing machine carrier |
JP2000237949A (en) * | 1999-02-12 | 2000-09-05 | Komag Inc | Method and device for cleaning polishing pad |
JP2000280167A (en) * | 1999-03-30 | 2000-10-10 | Kyocera Corp | Carrier plate and double surface polishing device using the same |
JP2004023038A (en) * | 2002-06-20 | 2004-01-22 | Sumitomo Mitsubishi Silicon Corp | Grinding device of semiconductor wafer |
-
2012
- 2012-06-19 JP JP2012137764A patent/JP5613723B2/en active Active
-
2013
- 2013-06-07 SG SG10201510276UA patent/SG10201510276UA/en unknown
- 2013-06-07 SG SG10202005438WA patent/SG10202005438WA/en unknown
- 2013-06-13 MY MYPI2013701000A patent/MY164088A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP5613723B2 (en) | 2014-10-29 |
MY164088A (en) | 2017-11-30 |
SG10201510276UA (en) | 2016-01-28 |
JP2014002818A (en) | 2014-01-09 |
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