EP2732917A4 - Polishing pad - Google Patents

Polishing pad

Info

Publication number
EP2732917A4
EP2732917A4 EP12815419.2A EP12815419A EP2732917A4 EP 2732917 A4 EP2732917 A4 EP 2732917A4 EP 12815419 A EP12815419 A EP 12815419A EP 2732917 A4 EP2732917 A4 EP 2732917A4
Authority
EP
European Patent Office
Prior art keywords
polishing pad
polishing
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12815419.2A
Other languages
German (de)
French (fr)
Other versions
EP2732917A1 (en
Inventor
Nana Takeuchi
Seiji Fukuda
Ryoji Okuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Publication of EP2732917A1 publication Critical patent/EP2732917A1/en
Publication of EP2732917A4 publication Critical patent/EP2732917A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
EP12815419.2A 2011-07-15 2012-07-12 Polishing pad Withdrawn EP2732917A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011156424 2011-07-15
PCT/JP2012/067835 WO2013011921A1 (en) 2011-07-15 2012-07-12 Polishing pad

Publications (2)

Publication Number Publication Date
EP2732917A1 EP2732917A1 (en) 2014-05-21
EP2732917A4 true EP2732917A4 (en) 2015-04-15

Family

ID=47558099

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12815419.2A Withdrawn EP2732917A4 (en) 2011-07-15 2012-07-12 Polishing pad

Country Status (7)

Country Link
US (1) US20140141704A1 (en)
EP (1) EP2732917A4 (en)
JP (1) JPWO2013011921A1 (en)
KR (1) KR20140039043A (en)
CN (1) CN103648718A (en)
TW (1) TW201313388A (en)
WO (1) WO2013011921A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103648717A (en) * 2011-07-15 2014-03-19 东丽株式会社 Polishing pad
JPWO2013039181A1 (en) * 2011-09-15 2015-03-26 東レ株式会社 Polishing pad
US8980749B1 (en) * 2013-10-24 2015-03-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing silicon wafers
JP2017001111A (en) * 2015-06-05 2017-01-05 株式会社ディスコ Polishing pad and CMP polishing method
US9925637B2 (en) * 2016-08-04 2018-03-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapered poromeric polishing pad
TWI595968B (en) * 2016-08-11 2017-08-21 宋建宏 Polishing pad and method for manufacturing the same
CN109562506B (en) * 2017-02-06 2021-11-12 株式会社大辉 Method for forming concave portion of polishing pad and polishing pad
JP7105334B2 (en) * 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド Polishing pad and method for manufacturing semiconductor device using the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163192A (en) * 2001-11-29 2003-06-06 Shin Etsu Handotai Co Ltd Grooved polishing cloth and method and device for polishing work
JP2004186392A (en) * 2002-12-03 2004-07-02 Toshiba Ceramics Co Ltd Polishing cloth

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5882251A (en) * 1997-08-19 1999-03-16 Lsi Logic Corporation Chemical mechanical polishing pad slurry distribution grooves
WO2000059680A1 (en) * 1999-03-30 2000-10-12 Nikon Corporation Polishing body, polisher, polishing method, and method for producing semiconductor device
US6238271B1 (en) * 1999-04-30 2001-05-29 Speed Fam-Ipec Corp. Methods and apparatus for improved polishing of workpieces
JP4855571B2 (en) 2000-08-31 2012-01-18 ニッタ・ハース株式会社 Polishing pad and method of polishing a workpiece using the polishing pad
US7070480B2 (en) * 2001-10-11 2006-07-04 Applied Materials, Inc. Method and apparatus for polishing substrates
CN1270356C (en) * 2003-02-14 2006-08-16 中芯国际集成电路制造(上海)有限公司 Chemical mechanical polishing pad
TW200744786A (en) * 2005-12-28 2007-12-16 Jsr Corp Chemical mechanical polishing pad and chemical mechanical polishing method
JP2009023018A (en) * 2007-07-17 2009-02-05 Jsr Corp Chemical machine polishing pad and method
JP2009220265A (en) * 2008-02-18 2009-10-01 Jsr Corp Chemical machinery polishing pad
CN101637888B (en) * 2008-08-01 2013-09-18 智胜科技股份有限公司 Grinding pad and method for manufacturing same
JP2010045306A (en) 2008-08-18 2010-02-25 Kuraray Co Ltd Polishing pad
TWM352127U (en) * 2008-08-29 2009-03-01 Bestac Advanced Material Co Ltd Polishing pad
JPWO2013039181A1 (en) * 2011-09-15 2015-03-26 東レ株式会社 Polishing pad
JPWO2013039203A1 (en) * 2011-09-16 2015-03-26 東レ株式会社 Polishing pad

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163192A (en) * 2001-11-29 2003-06-06 Shin Etsu Handotai Co Ltd Grooved polishing cloth and method and device for polishing work
JP2004186392A (en) * 2002-12-03 2004-07-02 Toshiba Ceramics Co Ltd Polishing cloth

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013011921A1 *

Also Published As

Publication number Publication date
KR20140039043A (en) 2014-03-31
EP2732917A1 (en) 2014-05-21
CN103648718A (en) 2014-03-19
WO2013011921A1 (en) 2013-01-24
US20140141704A1 (en) 2014-05-22
JPWO2013011921A1 (en) 2015-02-23
TW201313388A (en) 2013-04-01

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20140122

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DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20150312

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Ipc: B24B 37/26 20120101AFI20150306BHEP

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