EP2732917A4 - Polierkissen - Google Patents

Polierkissen

Info

Publication number
EP2732917A4
EP2732917A4 EP12815419.2A EP12815419A EP2732917A4 EP 2732917 A4 EP2732917 A4 EP 2732917A4 EP 12815419 A EP12815419 A EP 12815419A EP 2732917 A4 EP2732917 A4 EP 2732917A4
Authority
EP
European Patent Office
Prior art keywords
polishing pad
polishing
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12815419.2A
Other languages
English (en)
French (fr)
Other versions
EP2732917A1 (de
Inventor
Nana Takeuchi
Seiji Fukuda
Ryoji Okuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Publication of EP2732917A1 publication Critical patent/EP2732917A1/de
Publication of EP2732917A4 publication Critical patent/EP2732917A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP12815419.2A 2011-07-15 2012-07-12 Polierkissen Withdrawn EP2732917A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011156424 2011-07-15
PCT/JP2012/067835 WO2013011921A1 (ja) 2011-07-15 2012-07-12 研磨パッド

Publications (2)

Publication Number Publication Date
EP2732917A1 EP2732917A1 (de) 2014-05-21
EP2732917A4 true EP2732917A4 (de) 2015-04-15

Family

ID=47558099

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12815419.2A Withdrawn EP2732917A4 (de) 2011-07-15 2012-07-12 Polierkissen

Country Status (7)

Country Link
US (1) US20140141704A1 (de)
EP (1) EP2732917A4 (de)
JP (1) JPWO2013011921A1 (de)
KR (1) KR20140039043A (de)
CN (1) CN103648718A (de)
TW (1) TW201313388A (de)
WO (1) WO2013011921A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140037891A (ko) * 2011-07-15 2014-03-27 도레이 카부시키가이샤 연마 패드
WO2013039181A1 (ja) * 2011-09-15 2013-03-21 東レ株式会社 研磨パッド
US8980749B1 (en) * 2013-10-24 2015-03-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing silicon wafers
JP2017001111A (ja) * 2015-06-05 2017-01-05 株式会社ディスコ 研磨パッド及びｃｍｐ研磨方法
US9925637B2 (en) * 2016-08-04 2018-03-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Tapered poromeric polishing pad
TWI595968B (zh) * 2016-08-11 2017-08-21 宋建宏 研磨墊及其製造方法
WO2018142623A1 (ja) * 2017-02-06 2018-08-09 株式会社大輝 ポリッシングバッドの凹部形成方法およびポリッシングパッド
JP7105334B2 (ja) * 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163192A (ja) * 2001-11-29 2003-06-06 Shin Etsu Handotai Co Ltd 溝入り研磨布並びにワークの研磨方法及び研磨装置
JP2004186392A (ja) * 2002-12-03 2004-07-02 Toshiba Ceramics Co Ltd 研磨布

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5882251A (en) * 1997-08-19 1999-03-16 Lsi Logic Corporation Chemical mechanical polishing pad slurry distribution grooves
CN1345264A (zh) * 1999-03-30 2002-04-17 株式会社尼康 抛光盘、抛光机、抛光方法及制造半导体器件的方法
US6238271B1 (en) * 1999-04-30 2001-05-29 Speed Fam-Ipec Corp. Methods and apparatus for improved polishing of workpieces
JP4855571B2 (ja) 2000-08-31 2012-01-18 ニッタ・ハース株式会社 研磨パッド及びその研磨パッドを用いた被加工物の研磨方法
US7070480B2 (en) * 2001-10-11 2006-07-04 Applied Materials, Inc. Method and apparatus for polishing substrates
CN1270356C (zh) * 2003-02-14 2006-08-16 中芯国际集成电路制造(上海)有限公司 化学机械研磨垫
US7357703B2 (en) * 2005-12-28 2008-04-15 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
JP2009023018A (ja) * 2007-07-17 2009-02-05 Jsr Corp 化学機械研磨パッドおよび化学機械研磨方法
JP2009220265A (ja) * 2008-02-18 2009-10-01 Jsr Corp 化学機械研磨パッド
CN101637888B (zh) * 2008-08-01 2013-09-18 智胜科技股份有限公司 研磨垫及其制造方法
JP2010045306A (ja) 2008-08-18 2010-02-25 Kuraray Co Ltd 研磨パッド
TWM352127U (en) * 2008-08-29 2009-03-01 Bestac Advanced Material Co Ltd Polishing pad
WO2013039181A1 (ja) * 2011-09-15 2013-03-21 東レ株式会社 研磨パッド
SG11201400637XA (en) * 2011-09-16 2014-05-29 Toray Industries Polishing pad

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163192A (ja) * 2001-11-29 2003-06-06 Shin Etsu Handotai Co Ltd 溝入り研磨布並びにワークの研磨方法及び研磨装置
JP2004186392A (ja) * 2002-12-03 2004-07-02 Toshiba Ceramics Co Ltd 研磨布

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013011921A1 *

Also Published As

Publication number Publication date
JPWO2013011921A1 (ja) 2015-02-23
KR20140039043A (ko) 2014-03-31
TW201313388A (zh) 2013-04-01
EP2732917A1 (de) 2014-05-21
WO2013011921A1 (ja) 2013-01-24
US20140141704A1 (en) 2014-05-22
CN103648718A (zh) 2014-03-19

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Legal Events

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