SG11201502768UA - Polishing composition - Google Patents
Polishing compositionInfo
- Publication number
- SG11201502768UA SG11201502768UA SG11201502768UA SG11201502768UA SG11201502768UA SG 11201502768U A SG11201502768U A SG 11201502768UA SG 11201502768U A SG11201502768U A SG 11201502768UA SG 11201502768U A SG11201502768U A SG 11201502768UA SG 11201502768U A SG11201502768U A SG 11201502768UA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- polishing
- composition
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
- C09K3/1445—Composite particles, e.g. coated particles the coating consisting exclusively of metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012243126 | 2012-11-02 | ||
PCT/JP2013/079267 WO2014069457A1 (en) | 2012-11-02 | 2013-10-29 | Polishing composition |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201502768UA true SG11201502768UA (en) | 2015-05-28 |
Family
ID=50627360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201502768UA SG11201502768UA (en) | 2012-11-02 | 2013-10-29 | Polishing composition |
Country Status (8)
Country | Link |
---|---|
US (1) | US9486892B2 (en) |
JP (1) | JPWO2014069457A1 (en) |
KR (1) | KR20150083085A (en) |
CN (1) | CN104755580A (en) |
DE (1) | DE112013005264T5 (en) |
SG (1) | SG11201502768UA (en) |
TW (1) | TW201422798A (en) |
WO (1) | WO2014069457A1 (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG190765A1 (en) * | 2010-12-24 | 2013-07-31 | Hitachi Chemical Co Ltd | Polishing liquid and method for polishing substrate using the polishing liquid |
JP6377726B2 (en) * | 2013-05-15 | 2018-08-22 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | Method of using chemical mechanical polishing composition containing polyethyleneimine |
KR102456079B1 (en) * | 2014-12-24 | 2022-11-21 | 삼성디스플레이 주식회사 | Cleaning composition for removing oxide and method of cleaning using the same |
JP6604061B2 (en) * | 2015-07-10 | 2019-11-13 | 日立化成株式会社 | Polishing liquid and polishing method for CMP |
JP6900366B2 (en) * | 2015-08-12 | 2021-07-07 | ビーエイエスエフ・ソシエタス・エウロパエアBasf Se | How to use a chemical mechanical polishing (CMP) composition for polishing substrates containing cobalt |
US10703936B2 (en) * | 2016-03-30 | 2020-07-07 | Fujimi Incorporated | Polishing composition |
WO2017186283A1 (en) * | 2016-04-27 | 2017-11-02 | Basf Se | Use of a chemical mechanical polishing (cmp) composition for polishing of cobalt and / or cobalt alloy comprising substrates |
CN106010297B (en) * | 2016-06-20 | 2018-07-31 | 上海新安纳电子科技有限公司 | A kind of preparation method of alumina polishing solution |
JP6890656B2 (en) * | 2017-02-28 | 2021-06-18 | 富士フイルム株式会社 | Polishing liquid, polishing liquid manufacturing method, polishing liquid stock solution, polishing liquid stock solution container, chemical mechanical polishing method |
JP6901297B2 (en) * | 2017-03-22 | 2021-07-14 | 株式会社フジミインコーポレーテッド | Polishing composition |
US11655394B2 (en) * | 2017-08-09 | 2023-05-23 | Resonac Corporation | Polishing solution and polishing method |
US10600655B2 (en) * | 2017-08-10 | 2020-03-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for tungsten |
US20190085205A1 (en) * | 2017-09-15 | 2019-03-21 | Cabot Microelectronics Corporation | NITRIDE INHIBITORS FOR HIGH SELECTIVITY OF TiN-SiN CMP APPLICATIONS |
KR102634300B1 (en) * | 2017-11-30 | 2024-02-07 | 솔브레인 주식회사 | Slurry composition for polishing and method for polishing semiconductor thin film of high aspect raio |
US10759970B2 (en) * | 2018-12-19 | 2020-09-01 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of using same |
US10763119B2 (en) | 2018-12-19 | 2020-09-01 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of using same |
CN110791254B (en) * | 2019-11-06 | 2022-02-11 | 浙江博莱特制冷设备有限公司 | Valve plate grinding fluid for refrigeration compressor |
JP6780800B1 (en) * | 2020-04-09 | 2020-11-04 | 信越半導体株式会社 | Wafer polishing method and polishing equipment |
WO2022026355A1 (en) * | 2020-07-28 | 2022-02-03 | Cmc Materials, Inc. | Cmp composition including anionic and cationic inhibitors |
US11680186B2 (en) | 2020-11-06 | 2023-06-20 | Fujifilm Electronic Materials U.S.A., Inc. | Polishing compositions and methods of using same |
WO2024064127A1 (en) * | 2022-09-22 | 2024-03-28 | Cmc Materials Llc | Tungsten cmp composition including a sulfur containing anionic surfactant |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4944836A (en) | 1985-10-28 | 1990-07-31 | International Business Machines Corporation | Chem-mech polishing method for producing coplanar metal/insulator films on a substrate |
JP3397501B2 (en) | 1994-07-12 | 2003-04-14 | 株式会社東芝 | Abrasive and polishing method |
US6821309B2 (en) * | 2002-02-22 | 2004-11-23 | University Of Florida | Chemical-mechanical polishing slurry for polishing of copper or silver films |
US20040077295A1 (en) * | 2002-08-05 | 2004-04-22 | Hellring Stuart D. | Process for reducing dishing and erosion during chemical mechanical planarization |
JP4012180B2 (en) | 2004-08-06 | 2007-11-21 | 株式会社東芝 | CMP slurry, polishing method, and semiconductor device manufacturing method |
JP5314839B2 (en) * | 2006-08-02 | 2013-10-16 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method |
SG139699A1 (en) | 2006-08-02 | 2008-02-29 | Fujimi Inc | Polishing composition and polishing process |
JP5178121B2 (en) * | 2007-09-28 | 2013-04-10 | 富士フイルム株式会社 | Polishing liquid and polishing method |
JP5314329B2 (en) * | 2008-06-12 | 2013-10-16 | 富士フイルム株式会社 | Polishing liquid |
WO2010098278A1 (en) | 2009-02-24 | 2010-09-02 | ニッタ・ハース株式会社 | Composition for metal film polishing |
JP2011171446A (en) | 2010-02-17 | 2011-09-01 | Hitachi Chem Co Ltd | Polishing liquid for cmp and polishing method using the same |
-
2013
- 2013-10-29 SG SG11201502768UA patent/SG11201502768UA/en unknown
- 2013-10-29 DE DE112013005264.4T patent/DE112013005264T5/en not_active Withdrawn
- 2013-10-29 KR KR1020157010713A patent/KR20150083085A/en not_active Application Discontinuation
- 2013-10-29 JP JP2014544520A patent/JPWO2014069457A1/en active Pending
- 2013-10-29 US US14/440,208 patent/US9486892B2/en active Active
- 2013-10-29 CN CN201380057157.1A patent/CN104755580A/en active Pending
- 2013-10-29 WO PCT/JP2013/079267 patent/WO2014069457A1/en active Application Filing
- 2013-11-01 TW TW102139746A patent/TW201422798A/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20150344738A1 (en) | 2015-12-03 |
JPWO2014069457A1 (en) | 2016-09-08 |
CN104755580A (en) | 2015-07-01 |
DE112013005264T5 (en) | 2015-09-24 |
KR20150083085A (en) | 2015-07-16 |
WO2014069457A1 (en) | 2014-05-08 |
TW201422798A (en) | 2014-06-16 |
US9486892B2 (en) | 2016-11-08 |
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