JP4905238B2 - Polishing method of glass substrate for magnetic recording medium - Google Patents

Polishing method of glass substrate for magnetic recording medium Download PDF

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JP4905238B2
JP4905238B2 JP2007118569A JP2007118569A JP4905238B2 JP 4905238 B2 JP4905238 B2 JP 4905238B2 JP 2007118569 A JP2007118569 A JP 2007118569A JP 2007118569 A JP2007118569 A JP 2007118569A JP 4905238 B2 JP4905238 B2 JP 4905238B2
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JP2008273777A (en
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明男 藤村
狩人 宮本
透 吉田
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Konica Minolta Opto Inc
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Description

この発明は、磁気ディスク記録装置の基板に用いられる磁気記録媒体用ガラス基板の研磨方法に関する。 The present invention relates to a polishing how the glass substrate for a magnetic recording medium for use in the substrate of a magnetic disk recording apparatus.

コンピュータ等に用いられる磁気ディスク記録装置、例えばハードディスクには、アルミニウム合金又はガラスのディスクが基板として用いられている。この基板上に金属磁気薄膜が形成され、金属磁気薄膜を磁気ヘッドで磁化することにより情報が記録される。   An aluminum alloy or glass disk is used as a substrate in a magnetic disk recording device used in a computer or the like, for example, a hard disk. A metal magnetic thin film is formed on this substrate, and information is recorded by magnetizing the metal magnetic thin film with a magnetic head.

磁気記録媒体用の基板として、従来は、主にアルミニウム合金が用いられていた。しかし、近年は、ノート型パソコン等の携帯型の端末にも磁気ディスク記録装置が採用されており、また、磁気ディスク記録装置の応答速度を高めるために、磁気記録媒体を10000[rpm]以上で高速回転させる必要がある。そのため、高強度な磁気記録媒体用の基板が必要とされてきており、これらの必要性を満たすものとしてガラス基板が用いられるようになった。このガラス基板には、アモルファスガラス基板、結晶化ガラス基板、又は化学強化ガラス基板が用いられている。   Conventionally, aluminum alloys have been mainly used as substrates for magnetic recording media. However, in recent years, magnetic disk recording devices have also been adopted in portable terminals such as notebook computers, and in order to increase the response speed of magnetic disk recording devices, magnetic recording media can be used at 10,000 [rpm] or more. Need to rotate at high speed. For this reason, a substrate for a high-strength magnetic recording medium has been required, and a glass substrate has been used to satisfy these needs. As this glass substrate, an amorphous glass substrate, a crystallized glass substrate, or a chemically strengthened glass substrate is used.

ここで、従来技術(例えば特許文献1)に係る磁気記録媒体用ガラス基板の製造方法について説明する。まず、アモルファスガラス基板の製造方法について説明する。   Here, the manufacturing method of the glass substrate for magnetic recording media which concerns on a prior art (for example, patent document 1) is demonstrated. First, a method for manufacturing an amorphous glass substrate will be described.

はじめに、ガラス素材を溶融し(ガラス溶融工程)、溶融したガラスを平面形状の金型に流し込み、その金型で溶融ガラスを挟むことによりプレス成形し、円盤状のガラス基板を作製する(プレス成形工程)。このプレス成形工程により作製され、以下に示す研削・研磨工程が施される前段階の半製品のガラス基板を「ブランクス材」と称する。そのブランクス材の表面の中心部にダイヤモンドコアドリルを用いて円状の貫通孔を形成し、ドーナツ状のガラス基板(孔あきブランクス材)を作製する(コアリング工程)。   First, a glass material is melted (glass melting step), the molten glass is poured into a planar mold, and the molten glass is sandwiched between the molds to be press-molded to produce a disk-shaped glass substrate (press molding) Process). A glass substrate of a semi-finished product that is produced by this press molding process and subjected to the grinding / polishing process described below is referred to as a “blank material”. A circular through hole is formed in the center of the surface of the blank material using a diamond core drill to produce a donut-shaped glass substrate (perforated blank material) (coring step).

その後、ダイヤモンドペレットを貼り付けたプレートを保持した両面研磨機にて、ドーナツ状のガラス基板(孔あきブランクス材)を研削加工する(第1ラッピング工程)。この第1ラッピング工程では、孔あきブランクス材の両表面を研削加工し、ガラス基板の平行度、平坦度、及び厚さを予備調整する。   Thereafter, the doughnut-shaped glass substrate (perforated blanks material) is ground by a double-side polishing machine holding a plate on which diamond pellets are attached (first lapping step). In this first lapping step, both surfaces of the perforated blanks are ground and the parallelism, flatness and thickness of the glass substrate are preliminarily adjusted.

平行度等が予備調整されたガラス基板は、外周端面、孔の内周端面が研削され、面取りされて、ガラス基板の外径寸法及び真円度、並びに孔の内径寸法等が微調整される(端面研削工程)。   The glass substrate whose parallelism is preliminarily adjusted is ground and chamfered on the outer peripheral end surface and the inner peripheral end surface of the hole, and the outer diameter and roundness of the glass substrate, the inner diameter of the hole, and the like are finely adjusted. (End grinding process).

外径寸法等が微調整されたガラス基板は、内周端面及び外周端面が研磨され、端面の鏡面化が行われる(端面研磨工程)。例えば、ガラス基板に研磨材を供給し、ナイロンブラシを回転させながらガラス基板の端面に所定圧力で押し当てることで、端面を研磨する。この研磨工程によって、内周端面及び外周端面に対する加工で発生したダメージを除去し、内周端面及び外周端面を鏡面化する。   The glass substrate whose outer diameter is finely adjusted has its inner peripheral end surface and outer peripheral end surface polished, and the end surface is mirrored (end surface polishing step). For example, the end surface is polished by supplying an abrasive to the glass substrate and pressing the end surface of the glass substrate with a predetermined pressure while rotating the nylon brush. By this polishing step, the damage generated by the processing on the inner peripheral end face and the outer peripheral end face is removed, and the inner peripheral end face and the outer peripheral end face are mirror-finished.

端面が研磨されたガラス基板は両表面を再度、研削加工され、ガラス基板の平行度、平坦度、及び厚さが微調整される(第2ラッピング工程)。平行度等が微調整されたガラス基板は、両表面が研磨され、表面の凹凸が均一にされる(ポリッシング工程)。ポリッシング加工されたガラス基板は洗浄され(洗浄工程)、さらに検査されて、合格したガラス基板が、磁気記録媒体用の基板として用いられる。   The glass substrate whose end face is polished is ground again on both surfaces, and the parallelism, flatness, and thickness of the glass substrate are finely adjusted (second lapping step). The glass substrate with the finely adjusted parallelism or the like is polished on both surfaces to make the surface unevenness uniform (polishing step). The polished glass substrate is cleaned (cleaning step), further inspected, and a glass substrate that passes the test is used as a substrate for a magnetic recording medium.

また、結晶化ガラス基板を作製する場合は、上記のプレス成形工程の後に、アモルファスガラス基板(ブランクス材)をセラミック製の板で挟んで熱処理して結晶化させる(結晶化工程)。アニール工程の後は、上述したコアリング工程〜ポリッシング工程の処理を施す。   Moreover, when producing a crystallized glass substrate, after an above-mentioned press molding process, an amorphous glass substrate (blanks material) is pinched | interposed with the board | plates made from a ceramic, and it is made to crystallize (crystallization process). After the annealing process, the above-described coring process to polishing process are performed.

また、化学強化ガラス基板を作製する場合は、溶融及びプレス成形して得られたガラス基板(ブランクス材)に対して、ポリッシング工程までの処理を施した後、硝酸ナトリウム、硝酸カリウム等の混合された溶融塩中に浸漬することにより表面に圧縮応力層を形成して破壊強度を高める。その後洗浄工程の処理を施す。   Moreover, when producing a chemically strengthened glass substrate, the glass substrate (blanks material) obtained by melting and pressing is subjected to the treatment up to the polishing step, and then mixed with sodium nitrate, potassium nitrate, and the like. By immersing in molten salt, a compressive stress layer is formed on the surface to increase the fracture strength. Thereafter, the cleaning process is performed.

以上のようにして作製されたガラス基板の表面に磁性層等を積層することにより、磁気記録媒体を作製する。   A magnetic recording medium is produced by laminating a magnetic layer or the like on the surface of the glass substrate produced as described above.

特開2003−63831号公報JP 2003-63831 A

ところで、従来技術に係る磁気記録媒体用ガラス基板の製造方法における端面研磨工程では、内周端面と外周端面に対してそれぞれ1つ研磨工程を施し、内周端面と外周端面をそれぞれ研磨している。内周端面を研磨することにより、磁性膜を成膜する工程において用いられる内周保持具の寿命が延びる。外周端面については、磁性膜の成膜時に成膜装置上の制限から、端面への成膜量が少なくなる。このため、外周端面の表面が粗いと、成膜されないガラス面が出現し、ガラス中に含有されるイオン成分が溶出することになる。そのため、外周端面の表面状態は記録面と同等のレベルが要求されている。しかしながら、外周端面に対する1つの研磨工程では、外周端面を加工した際に発生したダメージを取り除き、さらに、外周端面を鏡面に仕上げることは困難であった。   By the way, in the end surface polishing step in the manufacturing method of the glass substrate for magnetic recording media according to the prior art, one polishing step is applied to each of the inner peripheral end surface and the outer peripheral end surface, and the inner peripheral end surface and the outer peripheral end surface are respectively polished. . By polishing the inner peripheral end face, the life of the inner peripheral holder used in the step of forming the magnetic film is extended. With respect to the outer peripheral end surface, the amount of film formation on the end surface is reduced due to limitations on the film forming apparatus when the magnetic film is formed. For this reason, if the surface of the outer peripheral end surface is rough, a glass surface on which no film is formed appears, and ion components contained in the glass are eluted. For this reason, the surface state of the outer peripheral end surface is required to have a level equivalent to that of the recording surface. However, in one polishing process for the outer peripheral end face, it has been difficult to remove the damage generated when the outer peripheral end face is processed and to finish the outer peripheral end face into a mirror surface.

端面加工で発生したダメージを取り除くことを重視する場合、粒径が大きい研磨材を供給し、硬くて太いナイロンブラシを用い、そのナイロンブラシをガラス基板の外周端面に押し当てて、外周端面を研磨する。この条件で外周端面を研磨することで、研磨に要する加工時間を短縮することができるが、研磨後の外周端面には、ブラシ傷に相当する加工ダメージが残ってしまう問題がある。   When emphasizing the removal of damage caused by end face processing, supply abrasive material with large particle size, use a hard and thick nylon brush, press the nylon brush against the outer peripheral end face of the glass substrate, and polish the outer peripheral end face To do. By polishing the outer peripheral end surface under these conditions, the processing time required for polishing can be shortened, but there is a problem that processing damage corresponding to brush scratches remains on the outer peripheral end surface after polishing.

一方、端面を鏡面に仕上げることを重視する場合、粒径が小さい研磨材を供給し、細くて長いナイロンブラシを用い、そのナイロンブラシをガラス基板の外周端面に押し当てて、外周端面を研磨する。この場合、研磨後の外周端面にはブラシ傷は残らないが、研磨に要する加工時間が長くなり、生産性が大きく損なわれる問題がある。   On the other hand, when emphasizing finishing the end surface to a mirror surface, supply an abrasive with a small particle size, use a thin and long nylon brush, and press the nylon brush against the outer peripheral end surface of the glass substrate to polish the outer peripheral end surface . In this case, brush scratches do not remain on the outer peripheral end surface after polishing, but there is a problem that the processing time required for polishing becomes long and productivity is greatly impaired.

粒径が大きい研磨材を用い、太くて短いナイロンブラシを用いることで、例えば、1[μm/分]程度の速さで外周端面を研磨することができる。この条件であれば、40[μm]程度の研磨を約40分で研磨することができる。一方、粒径が小さい研磨材を用い、細くて長いナイロンブラシを用いた場合、40[μm]程度の厚さを研磨するためには、90分から120分の時間を要してしまう。このように、鏡面化に適した条件でガラス基板の端面を研磨すると、研磨に要する時間が長くなり、生産性が悪くなってしまう。   By using a polishing material having a large particle size and using a thick and short nylon brush, the outer peripheral end face can be polished at a speed of about 1 [μm / min], for example. Under these conditions, polishing of about 40 [μm] can be performed in about 40 minutes. On the other hand, in the case of using an abrasive having a small particle diameter and a thin and long nylon brush, it takes 90 to 120 minutes to polish a thickness of about 40 [μm]. As described above, when the end face of the glass substrate is polished under conditions suitable for mirroring, the time required for polishing becomes long, and the productivity is deteriorated.

この発明は上記の問題を解決するものであり、ブラシ傷が少ない端面を形成しつつ、端面の研磨に要する時間を短縮することが可能な磁気記録媒体用ガラス基板の研磨方法を提供することを目的とする。 The present invention has been made to solve the above problems, while forming a brush wound small end face, to provide a polishing how the magnetic recording medium glass substrate which can shorten the time required for the polishing of the end face With the goal.

この発明は、研磨ブラシを用いてガラス基板の端面を研磨する研磨工程を、第1の研磨工程と第2の研磨工程に分け、それぞれ異なる研磨条件でガラス基板の端面を研磨する。例えば、第2の研磨工程で用いる第2の研磨ブラシの剛性を第1の研磨工程で用いる第1の研磨ブラシの剛性よりも低くしたり、第2の研磨工程で供給する第2の研磨材の粒径を第1の研磨工程で供給する第1の研磨材の粒径よりも小さくしたりすることで、第1の研磨工程では、研磨時間を短縮しつつ端面加工で発生するダメージを取り除くことができ、第2の研磨工程では、端面のブラシ傷を取り除いて、ブラシ傷が少ない端面を形成することが可能となる。
具体的には、この発明の第1の形態は、表面及び前記表面の周囲に端面を有する円板状のガラス基板の前記端面を研磨する磁気記録媒体用ガラス基板の研磨方法であって、第1の研磨ブラシを回転させながら前記端面に押し当てて、前記端面を研磨する第1の研磨工程と、前記第1の研磨工程の後、前記第1の研磨ブラシよりも剛性が低い第2の研磨ブラシを回転させながら前記端面に押し当てて、前記端面を研磨する第2の研磨工程と、を含み、前記第1の研磨工程と前記第2の研磨工程を施すことにより、前記端面の表面粗さRaを、0.5〜1[nm]とすることを特徴とする磁気記録媒体用ガラス基板の研磨方法である。
また、この発明の第2の形態は、第1の形態に係る磁気記録媒体用ガラス基板の研磨方法であって、前記第1の研磨工程では、所定の粒径を有する第1の研磨材を前記ガラス基板に供給しながら、前記第1の研磨ブラシを前記端面に押し当てて前記端面を研磨し、前記第2の研磨工程では、前記第1の研磨材よりも粒径が小さい第2の研磨剤を前記ガラス基板に供給しながら、前記第2の研磨ブラシを前記端面に押し立てて前記端面を研磨することを特徴とする。
また、この発明の第3の形態は、第2の形態に係る磁気記録媒体用ガラス基板の研磨方法であって、前記第1の研磨ブラシ及び前記第2の研磨ブラシには、第3の研磨材が含まれていることを特徴とする。
また、この発明の第4の形態は、第1の形態から第3の形態のいずれかに係る磁気記録媒体用ガラス基板の研磨方法であって、前記第1の研磨ブラシの長さが25[mm]〜30[mm]で、前記第2の研磨ブラシの長さが28[mm]〜38[mm]であることを特徴とする。
In the present invention, the polishing step of polishing the end surface of the glass substrate using a polishing brush is divided into a first polishing step and a second polishing step, and the end surface of the glass substrate is polished under different polishing conditions. For example, the second polishing brush used in the second polishing step is made less rigid than the first polishing brush used in the first polishing step, or supplied in the second polishing step. By reducing the particle size of the first polishing material smaller than the particle size of the first abrasive supplied in the first polishing step, in the first polishing step, the damage caused by the end face processing is reduced while shortening the polishing time. In the second polishing step, it is possible to remove brush scratches on the end surface and form an end surface with few brush scratches.
Specifically, a first aspect of the present invention is a method for polishing a glass substrate for a magnetic recording medium, wherein the end surface of a disk-shaped glass substrate having an end surface around the surface and the surface is polished. A first polishing step in which the polishing blade is pressed against the end surface while rotating, and the end surface is polished; and after the first polishing step, a second lower rigidity than the first polishing brush. pressing a polishing brush to the end face while rotating, and a second polishing step of polishing the end face, viewing including the by performing the first polishing step and the second polishing step, the end face A method for polishing a glass substrate for a magnetic recording medium , wherein the surface roughness Ra is 0.5 to 1 [nm] .
According to a second aspect of the present invention, there is provided a method for polishing a glass substrate for a magnetic recording medium according to the first aspect. In the first polishing step, a first abrasive having a predetermined particle size is used. While supplying the glass substrate, the first polishing brush is pressed against the end surface to polish the end surface, and in the second polishing step, a second particle size smaller than that of the first abrasive is used. While supplying the abrasive to the glass substrate, the end surface is polished by pushing the second polishing brush against the end surface.
According to a third aspect of the present invention, there is provided a method for polishing a glass substrate for a magnetic recording medium according to the second aspect, wherein the first polishing brush and the second polishing brush include a third polishing. Material is included.
According to a fourth aspect of the present invention, there is provided a method for polishing a glass substrate for a magnetic recording medium according to any one of the first to third aspects, wherein the length of the first polishing brush is 25 [ mm] to 30 [mm], and the length of the second polishing brush is 28 [mm] to 38 [mm].

この発明によると、ガラス基板の端面を研磨する工程を、第1の研磨工程と第2の研磨工程に分け、それぞれ異なる条件で端面を研磨することで、ブラシ傷が少ない端面を形成しつつ、端面研磨の加工時間を短縮することが可能となる。   According to this invention, the step of polishing the end surface of the glass substrate is divided into a first polishing step and a second polishing step, and by polishing the end surface under different conditions, forming an end surface with less brush scratches, It becomes possible to shorten the processing time of end face polishing.

例えば、第2の研磨ブラシの剛性を第1の研磨ブラシの剛性よりも低くしたり、第2の研磨工程で供給する第2の研磨材の粒径を第1の研磨工程で供給する第1の研磨材の粒径よりも小さくしたりすることで、第1の研磨工程では、研磨時間を短縮しつつ端面のダメージを取り除くことができ、第2の研磨工程では、ブラシ傷を取り除いて、ブラシ傷が少ない端面を形成することが可能となる。   For example, the rigidity of the second polishing brush is made lower than the rigidity of the first polishing brush, or the particle diameter of the second abrasive supplied in the second polishing process is supplied in the first polishing process. In the first polishing step, it is possible to remove the end face damage while shortening the polishing time, and in the second polishing step, the brush scratches are removed in the first polishing step. It is possible to form an end face with few brush scratches.

以下、この発明の実施形態に係る磁気記録媒体用ガラス基板の研磨方法について、図1を参照しつつ説明する。図1は、この発明の実施形態に係る磁気記録媒体用ガラス基板の研磨工程を順番に示すフローチャートである。   Hereinafter, a method for polishing a glass substrate for a magnetic recording medium according to an embodiment of the present invention will be described with reference to FIG. FIG. 1 is a flowchart showing in sequence the steps of polishing a glass substrate for a magnetic recording medium according to an embodiment of the present invention.

まず、ガラス素材を溶融し(S01:ガラス溶融工程)、溶融したガラスを平面形状の金型に流し込み、その金型で溶融ガラスを挟むことによりプレス成形し、円盤状のガラス基板を作製する(S02:プレス成形工程)。このプレス成形工程により、半製品のガラス基板であるブランクス材が作製される。そして、そのブランクス材の中心部にダイヤモンドコアドリルを用いて貫通孔を形成し、ドーナツ状のガラス基板(孔あきブランクス材)を作製する(ステップS03:コアリング工程)。   First, a glass material is melted (S01: glass melting step), the melted glass is poured into a planar mold, and the molten glass is sandwiched between the molds and press-molded to produce a disk-shaped glass substrate ( S02: Press molding process). The blank material which is a semi-finished glass substrate is produced by this press molding process. And a through-hole is formed in the center part of the blanks material using a diamond core drill, and a doughnut-shaped glass substrate (perforated blanks material) is produced (step S03: coring process).

次に、孔あきブランクス材に対して第1ラッピング工程を施す。具体的には、ダイヤモンドペレットを貼り付けたプレートを保持した両面研磨機にて、ブランクス材を研削加工する(ステップS04:第1ラッピング工程)。この第1ラッピング工程では、ブランクス材の両面を研削加工し、ガラス基板の平行度、平坦度、及び厚さを予備調整する。   Next, a first lapping step is performed on the perforated blanks material. Specifically, the blanks material is ground by a double-side polishing machine holding a plate on which diamond pellets are attached (step S04: first lapping step). In this first lapping step, both sides of the blanks material are ground and the parallelism, flatness, and thickness of the glass substrate are preliminarily adjusted.

そして、平行度等が予備調整されたガラス基板は、外周端面、及び孔の内周端面が研削され、面取りされて、ガラス基板の外径寸法及び真円度、並びに孔の内径寸法等が微調整される(ステップS05:端面研削工程)。   The glass substrate whose parallelism and the like are preliminarily adjusted is ground and chamfered on the outer peripheral end surface and the inner peripheral end surface of the hole, so that the outer diameter and roundness of the glass substrate, the inner diameter of the hole, etc. are fine. It is adjusted (step S05: end face grinding step).

その後、外径寸法等が微調整されたガラス基板は、孔の内周端面が研磨され(ステップS06、S07:内周端面研磨工程)、さらに、外周端面が研磨される(ステップS08、S09:外周端面研磨工程)。これらの研磨工程では、ガラス基板の内周端面及び外周端面を研磨することで、微細なキズ等を除去し、ガラス基板の内周端面及び外周端面を鏡面化する。   Thereafter, the glass substrate with finely adjusted outer diameter dimensions and the like is polished at the inner peripheral end face of the hole (steps S06, S07: inner peripheral end face polishing step), and further, the outer peripheral end face is polished (steps S08, S09: Peripheral edge polishing step). In these polishing steps, the inner peripheral end face and the outer peripheral end face of the glass substrate are polished to remove fine scratches and the inner peripheral end face and the outer peripheral end face of the glass substrate are mirror-finished.

具体的には、内周端面研磨工程及び外周端面研磨工程では、研磨ブラシと研磨材を用いて内周端面と外周端面をそれぞれ研磨する。研磨材には、例えば、酸化セリウム、炭化ケイ素、ジルコニア、シリカなどが用いられる。また、研磨ブラシには、例えば、アルミナ粒子が含まれるナイロンブラシが用いられる。また、研磨ブラシには、ポリプロピレン、ポリエチレン、ポリエステル、ポリカーボネートなどが用いられる。そして、研磨材をガラス基板に供給し、研磨ブラシを回転させながらガラス基板の内周端面と外周端面に所定圧力で押し当てることで、内周端面と外周端面をそれぞれ研磨する。   Specifically, in the inner peripheral end face polishing step and the outer peripheral end face polishing step, the inner peripheral end face and the outer peripheral end face are polished using a polishing brush and an abrasive, respectively. For example, cerium oxide, silicon carbide, zirconia, silica, or the like is used as the abrasive. Moreover, for example, a nylon brush containing alumina particles is used as the polishing brush. For the polishing brush, polypropylene, polyethylene, polyester, polycarbonate, or the like is used. Then, the inner peripheral end surface and the outer peripheral end surface are each polished by supplying an abrasive to the glass substrate and pressing it against the inner peripheral end surface and the outer peripheral end surface of the glass substrate with a predetermined pressure while rotating the polishing brush.

この実施形態では、外周端面を研磨する工程を2つの工程に分けた。つまり、外周端面を研磨する工程を、第1研磨工程と第2研磨工程に分け、第1研磨工程と第2研磨工程とで、異なる研磨条件で外周端面を研磨する。   In this embodiment, the process of polishing the outer peripheral end face is divided into two processes. That is, the process of polishing the outer peripheral end face is divided into a first polishing process and a second polishing process, and the outer peripheral end face is polished under different polishing conditions in the first polishing process and the second polishing process.

ここで、外周端面研磨工程に用いられる研磨装置について図2及び図3を参照して説明する。図2は、この発明の実施形態に係る研磨装置を正面から見た断面図である。図3は、この発明の実施形態に係る研磨装置を上面から見た平面図である。   Here, a polishing apparatus used in the outer peripheral end surface polishing step will be described with reference to FIGS. FIG. 2 is a sectional view of the polishing apparatus according to the embodiment of the present invention as seen from the front. FIG. 3 is a plan view of the polishing apparatus according to the embodiment of the present invention as viewed from above.

基板保持部2は、多数のガラス基板1を重ねて保持する。回転保持台3は、基板保持部2を回転自在に保持する。研磨ブラシ4は、多数枚重ねられたガラス基板1の外周端面部分に接触して設置されている。以下、各部について詳しく説明する。   The substrate holding unit 2 holds a number of glass substrates 1 in a stacked manner. The rotation holding table 3 holds the substrate holding unit 2 rotatably. The polishing brush 4 is installed in contact with the outer peripheral end surface portion of the glass substrate 1 stacked in large numbers. Hereinafter, each part will be described in detail.

基板保持部2は、軸21に挿入したガラス基板1を受け部材22で受け、軸方向上部からカラー23を介して締め付け治具24で積層されたガラス基板1を締め込むことで、各ガラス基板1同士の主表面間の摩擦係数により、基板保持部2の回転や研磨ブラシ4の回転によってずれることなくガラス基板1を保持する。   The substrate holding unit 2 receives the glass substrate 1 inserted into the shaft 21 with the receiving member 22, and tightens the glass substrate 1 laminated with the tightening jig 24 through the collar 23 from the upper part in the axial direction. The glass substrate 1 is held without being displaced by the rotation of the substrate holding part 2 or the rotation of the polishing brush 4 due to the friction coefficient between the main surfaces of the two.

回転保持台3は、回転軸31に結合され、その回転軸31を回転駆動する回転駆動装置(図示しない)によって正逆の双方向に回転できるようになっている。なお、この回転駆動装置はその回転数を可変できるようになっており、研磨目的に応じた適切な回転数を選定できるようになっている。   The rotation holding table 3 is coupled to a rotation shaft 31 and can be rotated in both forward and reverse directions by a rotation drive device (not shown) that rotationally drives the rotation shaft 31. The rotation drive device can change the rotation speed, and can select an appropriate rotation speed according to the purpose of polishing.

研磨ブラシ4は、回転駆動装置(図示しない)の回転軸41に接続されており、正逆の双方向に回転可能に構成されている。研磨ブラシ4は、基板のセッティング時及び基板の取り出し時に矢印Aの方向に移動し、図3に示す位置まで退避可能に構成されている。また、研磨ブラシ4は、研磨時には図3に示す矢印Bの方向に移動し、ブラシ毛43のガラス基板1への接触長さを加減するため、ガラス基板1の外周端面部分への押しつけ量を調整可能に構成されている。研磨ブラシ4は、カム機構(図示しない)によって、研磨ブラシ4の回転軸方向(矢印Cの方向)に沿って往復運動ができるように構成されている。研磨ブラシ4の往復運動範囲は、セットされたガラス基板1の最下部から最上部までの範囲が研磨ブラシ4のブラシ毛の植毛範囲内に収まる範囲内とする。   The polishing brush 4 is connected to a rotation shaft 41 of a rotation drive device (not shown), and is configured to be rotatable in both forward and reverse directions. The polishing brush 4 is configured to move in the direction of arrow A when the substrate is set and when the substrate is taken out, and can be retracted to the position shown in FIG. Further, the polishing brush 4 moves in the direction of arrow B shown in FIG. 3 at the time of polishing, so that the contact length of the bristles 43 to the glass substrate 1 is adjusted. It is configured to be adjustable. The polishing brush 4 is configured to reciprocate along the rotation axis direction (the direction of arrow C) of the polishing brush 4 by a cam mechanism (not shown). The range of the reciprocating motion of the polishing brush 4 is set such that the range from the lowermost part to the uppermost part of the set glass substrate 1 is within the range of the brush hairs of the polishing brush 4.

研磨ブラシ4は、例えば、円筒形の胴部にブラシ毛を帯状且つ螺旋状に植毛したものである。また、研磨ブラシ4として、円筒形の胴部にブラシ毛を点在して植毛したものを用いても良い。研磨ブラシ4には、上述したナイロンブラシなどが用いられる。   The polishing brush 4 is obtained by, for example, planting brush hairs in a strip shape and a spiral shape in a cylindrical body portion. Further, as the polishing brush 4, a brush body in which brush hairs are scattered in a cylindrical body portion may be used. The above-described nylon brush or the like is used for the polishing brush 4.

研磨液供給部5は、研磨液供給ノズル51と研磨液供給管52を備え、ガラス基板1が多数枚積層され積層ガラス基板10に研磨液を供給する。研磨液供給部6は、研磨液供給口61と研磨液供給管62を備え、積層ガラス基板10に研磨液を供給する。研磨液に用いられる研磨剤には、上述した酸化セリウムなどが用いられる。   The polishing liquid supply unit 5 includes a polishing liquid supply nozzle 51 and a polishing liquid supply pipe 52, and a large number of glass substrates 1 are laminated to supply the polishing liquid to the laminated glass substrate 10. The polishing liquid supply unit 6 includes a polishing liquid supply port 61 and a polishing liquid supply pipe 62 and supplies the polishing liquid to the laminated glass substrate 10. As the abrasive used in the polishing liquid, the above-described cerium oxide or the like is used.

なお、この実施形態に係る研磨装置は、研磨液供給部5、6から供給された研磨液を研磨室7の底面に設けた回収口から回収する研磨液回収部と、回収した研磨液を清浄にし、再び研磨液供給部5、6へと循環させる循環機構が設けられている。   The polishing apparatus according to this embodiment includes a polishing liquid recovery unit that recovers the polishing liquid supplied from the polishing liquid supply units 5 and 6 from a recovery port provided on the bottom surface of the polishing chamber 7, and cleans the recovered polishing liquid. In addition, a circulation mechanism that circulates again to the polishing liquid supply units 5 and 6 is provided.

研磨室7は、底面、側面、及び上面を備えている、研磨室7の上面には、研磨ブラシなどの回転及び回転軸41のC方向への往復運動及びA方向への移動を妨げることないように、開口部71が設けられている。   The polishing chamber 7 has a bottom surface, a side surface, and an upper surface. The upper surface of the polishing chamber 7 does not hinder the rotation of the polishing brush or the like, the reciprocating motion of the rotating shaft 41 in the C direction, and the movement in the A direction. Thus, an opening 71 is provided.

水供給部8は、積層ガラス基板10の積層方向から見て、積層ガラス基板10に対して2方向から水80を供給する。   The water supply unit 8 supplies water 80 from two directions to the laminated glass substrate 10 when viewed from the lamination direction of the laminated glass substrate 10.

そして、ガラス基板1と研磨ブラシ4とを互いに逆方向に回転させた状態で、ガラス基板1の外周端面に研磨液を供給して研磨を行う。次に、研磨ブラシ4の退避を開始させ、研磨ブラシ4のブラシ毛43がガラス基板1の外周端面から離れた時点で研磨液の供給を止め、水供給部8からガラス基板1の外周端面に向けて水を供給する。   Then, with the glass substrate 1 and the polishing brush 4 rotated in opposite directions, polishing is performed by supplying a polishing liquid to the outer peripheral end surface of the glass substrate 1. Next, the retraction of the polishing brush 4 is started, and when the bristle 43 of the polishing brush 4 is separated from the outer peripheral end surface of the glass substrate 1, the supply of the polishing liquid is stopped, and the water supply unit 8 moves to the outer peripheral end surface of the glass substrate 1. Supply water towards.

外周端面を研磨する工程について、第1研磨工程(ステップS08)と第2研磨工程(ステップS09)に分け、それぞれの研磨工程で異なる研磨条件で外周端面を研磨する。例えば、第1研磨工程と第2研磨工程とでは、異なる研磨ブラシを用いたり、異なる粒径の研磨材を用いたりして、ガラス基板の外周端面を研磨する。   The process of polishing the outer peripheral end face is divided into a first polishing process (step S08) and a second polishing process (step S09), and the outer peripheral end face is polished under different polishing conditions in each polishing process. For example, in the first polishing step and the second polishing step, the outer peripheral end surface of the glass substrate is polished by using different polishing brushes or using abrasives having different particle sizes.

例えば、研磨ブラシの条件を変える場合、第2研磨工程(ステップS09)で用いる第2の研磨ブラシ(ナイロンブラシ)は、第1研磨工程(ステップS08)で用いる第1の研磨ブラシ(ナイロンブラシまたは砥粒入りナイロンブラシ)よりも、剛性が低いブラシを用いる。例えば、第1の研磨ブラシとして、硬くて太いブラシを用い、第2の研磨ブラシには、第1の研磨ブラシよりも軟らかくて細いブラシを用いる。   For example, when changing the conditions of the polishing brush, the second polishing brush (nylon brush) used in the second polishing step (step S09) is the first polishing brush (nylon brush or nylon brush) used in the first polishing step (step S08). Use a brush with lower rigidity than abrasive nylon brushes. For example, a hard and thick brush is used as the first polishing brush, and a softer and thinner brush than the first polishing brush is used as the second polishing brush.

例えば、第1の研磨ブラシには、ブラシの長さが25[mm]〜30[mm]で、ブラシの線径が0.3[mm]の研磨ブラシを用いることが好ましい。また、第2の研磨ブラシには、ブラシの長さが28[mm]〜38[mm]で、ブラシの線径が0.1〜0.3[mm]の研磨ブラシを用いることが好ましい。   For example, as the first polishing brush, it is preferable to use a polishing brush having a brush length of 25 [mm] to 30 [mm] and a brush wire diameter of 0.3 [mm]. Further, it is preferable to use a polishing brush having a brush length of 28 [mm] to 38 [mm] and a brush wire diameter of 0.1 to 0.3 [mm] as the second polishing brush.

また、研磨材の粒径を変える場合、第2研磨工程(ステップS09)では、第1研磨工程(ステップS08)よりも、粒径が小さい研磨材をガラス基板に供給する。例えば、第1研磨工程では、粒径が2[μm]の酸化セリウムを研磨材として用い、第2研磨工程では、粒径が0.8[μm]の酸化セリウムや0.1[μm]以下の粒径のシリカを研磨材として用いる。   Further, when changing the particle size of the abrasive, in the second polishing step (step S09), an abrasive having a smaller particle size is supplied to the glass substrate than in the first polishing step (step S08). For example, in the first polishing step, cerium oxide having a particle size of 2 [μm] is used as an abrasive, and in the second polishing step, cerium oxide having a particle size of 0.8 [μm] or 0.1 [μm] or less. A silica having a particle size of 5 mm is used as an abrasive.

第1研磨工程は、外周端面の加工で発生したダメージを取り除くことに適した研磨工程であり、第2研磨工程は、外周端面の鏡面化に適した研磨工程である。第1研磨工程を施すことにより、ガラス基板の外周端面を加工した際に発生したダメージを取り除くことができ、さらに、第2研磨工程を施すことにより、外周端面を鏡面化することが可能となる。   A 1st grinding | polishing process is a grinding | polishing process suitable for removing the damage which generate | occur | produced by the process of an outer peripheral end surface, and a 2nd grinding | polishing process is a grinding | polishing process suitable for mirror-finishing an outer peripheral end surface. By performing the first polishing step, it is possible to remove the damage generated when the outer peripheral end surface of the glass substrate is processed. Furthermore, by performing the second polishing step, the outer peripheral end surface can be mirrored. .

つまり、第1研磨工程(ステップS08)では、硬くて太いナイロンブラシを用いたり、粒径が大きい研磨材を供給したりすることで、外周端面を加工した際に発生したダメージを取り除くことができる。また、この第1研磨工程の条件で研磨することで、研磨に要する時間を短縮することができる。   That is, in the first polishing step (step S08), damage generated when the outer peripheral end face is processed can be removed by using a hard and thick nylon brush or supplying an abrasive having a large particle diameter. . Further, by polishing under the conditions of the first polishing step, the time required for polishing can be shortened.

なお、第1研磨工程では、硬くて太いナイロンブラシを用い、さらに、粒径が大きい研磨材を供給して、外終端面を研磨してもよい。   In the first polishing step, a hard and thick nylon brush may be used, and an abrasive having a large particle size may be supplied to polish the outer terminal surface.

しかしながら、第1研磨工程を施すことで、研磨後のガラス基板の外周端面には、研磨ブラシの傷に相当するダメージが残ってしまう。この研磨ブラシに起因するダメージを取り除くために、第2研磨工程を施す。   However, by performing the first polishing process, damage corresponding to the scratches on the polishing brush remains on the outer peripheral end surface of the polished glass substrate. In order to remove the damage caused by the polishing brush, a second polishing step is performed.

第2研磨工程(ステップS09)では、軟らかくて細いナイロンブラシを用いたり、粒径が小さい研磨材を供給したりすることで、第1研磨工程で発生する研磨ブラシの傷に相当するダメージを取り除き、外周端面を鏡面化することができる。   In the second polishing step (step S09), a soft and thin nylon brush is used or an abrasive having a small particle diameter is supplied to remove damage corresponding to the scratches on the polishing brush generated in the first polishing step. The outer peripheral end face can be mirrored.

なお、第2研磨工程では、軟らかくて細いナイロンブラシを用い、さらに、粒径が小さい研磨材を供給して、外終端面を研磨してもよい。   In the second polishing step, the outer end surface may be polished by using a soft and thin nylon brush and further supplying an abrasive having a small particle size.

以上のように、第1研磨工程で外周端面を加工する際に発生するダメージを除去し、第2研磨工程で外周端面を鏡面化することで、ブラシ傷が少ない外周端面を形成しつつ、研磨に要する時間を短縮することが可能となる。このように、ブラシ傷が少ない端面を形成することができるため、磁気記録媒体を作製する工程で発生する、外周端面の傷に起因する欠陥の発生を抑えることが可能となる。また、第1研磨工程を施すことで研磨に要する時間を短縮することができるため、磁気記録媒体用ガラス基板の生産性を向上させることができる。   As described above, the damage generated when the outer peripheral end surface is processed in the first polishing step is removed, and the outer peripheral end surface is mirror-finished in the second polishing step, thereby forming the outer peripheral end surface with less brush damage. It is possible to reduce the time required for the process. As described above, since the end surface with few brush scratches can be formed, it is possible to suppress the occurrence of defects due to the scratches on the outer peripheral end surface, which are generated in the process of manufacturing the magnetic recording medium. In addition, since the time required for polishing can be shortened by performing the first polishing step, the productivity of the glass substrate for a magnetic recording medium can be improved.

また、第1研磨工程と第2研磨工程を施すことにより、外終端面の表面粗さRaを、0.5〜1[nm]にすることができる。   Moreover, surface roughness Ra of an outer terminal surface can be 0.5-1 [nm] by giving a 1st grinding | polishing process and a 2nd grinding | polishing process.

内周端面と外周端面が研磨されたガラス基板は、両表面を再度、研削加工され、ガラス基板の平行度、平坦度、及び厚さが微調整される(ステップS10:第2ラッピング工程)。平行度等が微調整されたガラス基板は、両表面が研磨され、表面の凹凸が均一にされる(ステップS11:ポリッシング工程)。ポリッシング加工されたガラス基板は洗浄され(ステップS12:洗浄工程)、さらに検査されて、その検査に合格したガラス基板が、磁気記録媒体用の基板として用いられる。   The glass substrate whose inner peripheral end face and outer peripheral end face are polished is ground again on both surfaces, and the parallelism, flatness, and thickness of the glass substrate are finely adjusted (step S10: second lapping step). The glass substrate whose degree of parallelism and the like is finely adjusted has both surfaces polished to make the surface unevenness uniform (step S11: polishing step). The polished glass substrate is cleaned (step S12: cleaning process), further inspected, and a glass substrate that has passed the inspection is used as a substrate for a magnetic recording medium.

上記工程によって作製された磁気記録媒体用ガラス基板に磁性層を成膜することにより、磁気記録媒体を作製する。   A magnetic recording medium is produced by forming a magnetic layer on the glass substrate for a magnetic recording medium produced by the above process.

なお、この実施形態に係る製造方法によって製造されるガラス基板の大きさは、特に限定されることはない。例えば、0.85インチ、1インチ、2.5インチ、3.5インチのガラス基板を対象としてこの実施形態に係る製造方法を適用してもよい。   In addition, the magnitude | size of the glass substrate manufactured by the manufacturing method which concerns on this embodiment is not specifically limited. For example, the manufacturing method according to this embodiment may be applied to glass substrates of 0.85 inch, 1 inch, 2.5 inch, and 3.5 inch.

[実施例]
次に、上記実施形態の具体的な実施例について説明する。
[Example]
Next, specific examples of the above embodiment will be described.

(実施例1)
以下に、実施例1に用いた第1ラッピング工程と外周・内周の研削加工工程終了後のガラス基板(孔あきブランクス材)の寸法を示す。
大きさ:直径(2R)=65.1[mm]
ガラス基板の厚さ=0.9[mm]
ガラス基板の孔の径=20[mm]
なお、実施例1では、ホウ珪酸ガラスのアモルファスガラス基板を用いた。
Example 1
Below, the dimension of the glass substrate (perforated blanks material) after the 1st lapping process used for Example 1 and the grinding process of an outer periphery and an inner periphery is shown.
Size: Diameter (2R) = 65.1 [mm]
Glass substrate thickness = 0.9 [mm]
Glass substrate hole diameter = 20 [mm]
In Example 1, a borosilicate glass amorphous glass substrate was used.

(ステップS08:外周端面の第1研磨工程)
外周端面の第1研磨工程を施すことにより、ガラス基板の外周端面を研磨した。この外周端面の第1研磨工程における研磨の条件を以下に示す。
第1の研磨ブラシ:線径0.3mmのナイロンブラシ、ブラシ長さは30[mm]
第1の研磨材:三井金属製、ミレークE10
研磨した量:30[μm]
(Step S08: First polishing step of outer peripheral end face)
By performing the 1st grinding | polishing process of an outer peripheral end surface, the outer peripheral end surface of the glass substrate was grind | polished. The polishing conditions in the first polishing step of the outer peripheral end surface are shown below.
First polishing brush: nylon brush with a wire diameter of 0.3 mm, brush length is 30 [mm]
First abrasive: Mireiku E10, made by Mitsui Kinzoku
Polished amount: 30 [μm]

(ステップS09:外周端面の第2研磨工程)
外周端面の第1研磨工程が施されたガラス基板に対して、外周端面の第2研磨工程を施すことにより、ガラス基板の外周端面を研磨した。この外周端面の第2研磨工程における研磨条件を以下に示す。この第2研磨工程では、第2の研磨ブラシを第1の研磨ブラシよりも細くて長いブラシとし、第1研磨工程における加工条件や研磨材の粒径と同じにした。
第2の研磨ブラシ:線径0.1mmのナイロンブラシ、ブラシ長さは30[mm]
第2の研磨材:三井金属製、ミレークE10
研磨した量:10[μm]
(Step S09: Second polishing step of outer peripheral end face)
The outer peripheral end surface of the glass substrate was polished by applying the second polishing step of the outer peripheral end surface to the glass substrate on which the first polishing step of the outer peripheral end surface was performed. The polishing conditions in the second polishing step of the outer peripheral end surface are shown below. In the second polishing step, the second polishing brush was made thinner and longer than the first polishing brush, and the processing conditions in the first polishing step and the particle size of the abrasive were the same.
Second polishing brush: nylon brush with a wire diameter of 0.1 mm, brush length is 30 [mm]
Second abrasive: Mitsui Metal, Milleak E10
Polished amount: 10 [μm]

(評価)
以上の条件でガラス基板の外周端面を研磨し、その研磨に要した時間と、研磨後の外周端面の表面粗さRaを測定した。
研磨に要した時間:第1研磨:30分、第2研磨:15分
表面粗さRa:0.9[nm]
(Evaluation)
The outer peripheral end face of the glass substrate was polished under the above conditions, and the time required for the polishing and the surface roughness Ra of the outer peripheral end face after polishing were measured.
Time required for polishing: First polishing: 30 minutes, Second polishing: 15 minutes Surface roughness Ra: 0.9 [nm]

(実施例2)
次に、実施例2について説明する。実施例2に用いた第1ラッピング工程と外周・内周の研削加工工程終了後のガラス基板(孔あきブランクス材)の寸法及び材料は、実施例1に係る孔あきブランクス材の寸法及び材料と同じであるため、説明を省略する。
(Example 2)
Next, Example 2 will be described. The dimensions and materials of the glass substrate (perforated blanks material) after completion of the first lapping process and the outer and inner peripheral grinding processes used in Example 2 are the same as the dimensions and materials of the perforated blanks material according to Example 1. Since it is the same, description is abbreviate | omitted.

(ステップS08:外周端面の第1研磨工程)
外周端面の第1研磨工程を施すことにより、ガラス基板の外周端面を研磨した。この外周端面の第1研磨工程における研磨の条件を以下に示す。
第1の研磨ブラシ:線径0.3mmのナイロンブラシ、ブラシ長さは25[mm]
第1の研磨材:三井金属製、ミレークE10
研磨した量:30[μm]
(Step S08: First polishing step of outer peripheral end face)
By performing the 1st grinding | polishing process of an outer peripheral end surface, the outer peripheral end surface of the glass substrate was grind | polished. The polishing conditions in the first polishing step of the outer peripheral end surface are shown below.
First polishing brush: nylon brush with a wire diameter of 0.3 mm, brush length is 25 [mm]
First abrasive: Mireiku E10, made by Mitsui Kinzoku
Polished amount: 30 [μm]

(ステップS09:外周端面の第2研磨工程)
外周端面の第1研磨工程が施されたガラス基板に対して、外周端面の第2研磨工程を施すことにより、ガラス基板の外周端面を研磨した。この外周端面の第2研磨工程における研磨条件を以下に示す。研磨ブラシの剛性、研磨材の粒径は、第1研磨工程における研磨ブラシの剛性、研磨材の粒径よりも小さくした。
第2の研磨ブラシ:線径0.3mmのナイロンブラシ、ブラシ長さは28[mm]
第2の研磨材:昭和電工製、ロックスV−210
研磨した量:10[μm]
(Step S09: Second polishing step of outer peripheral end face)
The outer peripheral end surface of the glass substrate was polished by applying the second polishing step of the outer peripheral end surface to the glass substrate on which the first polishing step of the outer peripheral end surface was performed. The polishing conditions in the second polishing step of the outer peripheral end surface are shown below. The rigidity of the polishing brush and the particle size of the abrasive were made smaller than the rigidity of the polishing brush and the particle size of the abrasive in the first polishing step.
Second polishing brush: nylon brush with a wire diameter of 0.3 mm, brush length is 28 [mm]
Second abrasive: Showa Denko, Rocks V-210
Polished amount: 10 [μm]

(評価)
以上の条件でガラス基板の外周端面を研磨し、その研磨に要した時間と、研磨後の外周端面の表面粗さRaを測定した。
研磨に要した時間:第1研磨:25分、第2研磨:12分
表面粗さRa:0.95[nm]
(Evaluation)
The outer peripheral end face of the glass substrate was polished under the above conditions, and the time required for the polishing and the surface roughness Ra of the outer peripheral end face after polishing were measured.
Time required for polishing: 1st polishing: 25 minutes, 2nd polishing: 12 minutes Surface roughness Ra: 0.95 [nm]

(実施例3)
次に、実施例3について説明する。実施例3に用いた第1ラッピング工程と外周・内周の研削加工工程終了後のガラス基板(孔あきブランクス材)の寸法及び材料は、実施例1に係るブランクス材の寸法及び材料と同じであるため、説明を省略する。
Example 3
Next, Example 3 will be described. The dimensions and materials of the glass substrate (perforated blanks material) after completion of the first lapping process and the outer and inner peripheral grinding processes used in Example 3 are the same as the dimensions and materials of the blanks material according to Example 1. Therefore, the description is omitted.

(ステップS08:外周端面の第1研磨工程)
外周端面の第1研磨工程を施すことにより、ガラス基板の外周端面を研磨した。この外周端面の第1研磨工程における研磨の条件を以下に示す。
第1の研磨ブラシ:線径0.3mmのナイロンブラシ、ブラシ長さは30[mm]
第1の研磨材:三井金属製、ミレークE10
研磨した量:30[μm]
(Step S08: First polishing step of outer peripheral end face)
By performing the 1st grinding | polishing process of an outer peripheral end surface, the outer peripheral end surface of the glass substrate was grind | polished. The polishing conditions in the first polishing step of the outer peripheral end surface are shown below.
First polishing brush: nylon brush with a wire diameter of 0.3 mm, brush length is 30 [mm]
First abrasive: Mireiku E10, made by Mitsui Kinzoku
Polished amount: 30 [μm]

(ステップS09:外周端面の第2研磨工程)
外周端面の第1研磨工程が施されたガラス基板に対して、外周端面の第2研磨工程を施すことにより、ガラス基板の外周端面を研磨した。この外周端面の第2研磨工程における研磨条件を以下に示す。この第2研磨工程では、第1の研磨ブラシよりも細くて長いブラシを用いた。さらに、第2の研磨材の粒径を、第1の研磨材の粒径よりも小さくした。
第2の研磨ブラシ:線径0.1mmのナイロンブラシ、ブラシ長さは35[mm]
第2の研磨材:昭和電工製、ロックスV−210
研磨した量:10[μm]
(Step S09: Second polishing step of outer peripheral end face)
The outer peripheral end surface of the glass substrate was polished by applying the second polishing step of the outer peripheral end surface to the glass substrate on which the first polishing step of the outer peripheral end surface was performed. The polishing conditions in the second polishing step of the outer peripheral end surface are shown below. In the second polishing step, a brush that is thinner and longer than the first polishing brush was used. Furthermore, the particle size of the second abrasive was made smaller than the particle size of the first abrasive.
Second polishing brush: nylon brush with a wire diameter of 0.1 mm, brush length is 35 [mm]
Second abrasive: Showa Denko, Rocks V-210
Polished amount: 10 [μm]

(評価)
以上の条件でガラス基板の外周端面を研磨し、その研磨に要した時間と、研磨後の外周端面の表面粗さRaを測定した。
研磨に要した時間:第1研磨:30分、第2研磨:20分
表面粗さRa:0.87[nm]
(Evaluation)
The outer peripheral end face of the glass substrate was polished under the above conditions, and the time required for the polishing and the surface roughness Ra of the outer peripheral end face after polishing were measured.
Time required for polishing: First polishing: 30 minutes, Second polishing: 20 minutes Surface roughness Ra: 0.87 [nm]

(実施例4)
次に、実施例4について説明する。実施例4に用いた第1ラッピング工程と外周・内周の研削加工工程終了後のガラス基板(孔あきブランクス材)の寸法及び材料は、実施例1に係るブランクス材の寸法及び材料と同じであるため、説明を省略する。
Example 4
Next, Example 4 will be described. The dimensions and materials of the glass substrate (perforated blanks material) after completion of the first lapping process and the outer and inner circumference grinding processes used in Example 4 are the same as the dimensions and materials of the blanks material according to Example 1. Therefore, the description is omitted.

(ステップS08:外周端面の第1研磨工程)
外周端面の第1研磨工程を施すことにより、ガラス基板の外周端面を研磨した。この外周端面の第1研磨工程における研磨の条件を以下に示す。
第1の研磨ブラシ:線径0.3mmのナイロンブラシ、ブラシ長さは30[mm]
第1の研磨材:三井金属製、ミレークE10
研磨した量:30[μm]
(Step S08: First polishing step of outer peripheral end face)
By performing the 1st grinding | polishing process of an outer peripheral end surface, the outer peripheral end surface of the glass substrate was grind | polished. The polishing conditions in the first polishing step of the outer peripheral end surface are shown below.
First polishing brush: nylon brush with a wire diameter of 0.3 mm, brush length is 30 [mm]
First abrasive: Mireiku E10, made by Mitsui Kinzoku
Polished amount: 30 [μm]

(ステップS09:外周端面の第2研磨工程)
外周端面の第1研磨工程が施されたガラス基板に対して、外周端面の第2研磨工程を施すことにより、ガラス基板の外周端面を研磨した。この外周端面の第2研磨工程における研磨条件を以下に示す。この第2研磨工程では、第1の研磨ブラシよりも細くて長いブラシを用いた。さらに、第2の研磨材の粒径を、第1の研磨材の粒径よりも小さくした。
第2の研磨ブラシ:線径0.1mmのナイロンブラシ、ブラシ長さは38[mm]
第2の研磨材:フジミインコーポレーテッド製コンポール80
研磨した量:10[μm]
(Step S09: Second polishing step of outer peripheral end face)
The outer peripheral end surface of the glass substrate was polished by applying the second polishing step of the outer peripheral end surface to the glass substrate on which the first polishing step of the outer peripheral end surface was performed. The polishing conditions in the second polishing step of the outer peripheral end surface are shown below. In the second polishing step, a brush that is thinner and longer than the first polishing brush was used. Furthermore, the particle size of the second abrasive was made smaller than the particle size of the first abrasive.
Second polishing brush: nylon brush with a wire diameter of 0.1 mm, brush length is 38 [mm]
Second abrasive: Fujimi Incorporated Compol 80
Polished amount: 10 [μm]

(評価)
以上の条件でガラス基板の外周端面を研磨し、その研磨に要した時間と、研磨後の外周端面の表面粗さRaを測定した。
研磨に要した時間:第1研磨:30分、第2研磨:30分
表面粗さRa:0.53[nm]
(Evaluation)
The outer peripheral end face of the glass substrate was polished under the above conditions, and the time required for the polishing and the surface roughness Ra of the outer peripheral end face after polishing were measured.
Time required for polishing: first polishing: 30 minutes, second polishing: 30 minutes Surface roughness Ra: 0.53 [nm]

(比較例1)
次に、上記実施例1から実施例4に対する比較例を説明する。以下に、比較例に用いた第1ラッピング工程と外周・内周の研削加工工程終了後のガラス基板(孔あきブランクス材)の寸法を示す。
大きさ:直径(2R)=65[mm]
ガラス基板の厚さ=0.9[mm]
ガラス基板の孔の径=20[mm]
なお、比較例では、実施例と同様に、ホウ珪酸ガラスのアモルファスガラス基板を用いた。
(Comparative Example 1)
Next, a comparative example for Example 1 to Example 4 will be described. Below, the dimension of the glass substrate (perforated blanks material) after the 1st lapping process used for the comparative example and the grinding process of the outer periphery and the inner periphery is shown.
Size: Diameter (2R) = 65 [mm]
Glass substrate thickness = 0.9 [mm]
Glass substrate hole diameter = 20 [mm]
In addition, in the comparative example, the amorphous glass substrate of the borosilicate glass was used similarly to the Example.

(比較例1)
研磨ブラシ:線径0.3mmのナイロンブラシ、ブラシ長30[mm]
研磨材:三井金属製ミレークE−20
研磨量:40[μm]
(Comparative Example 1)
Polishing brush: nylon brush with a wire diameter of 0.3 mm, brush length 30 [mm]
Abrasives: Mitsui Metal Mille E-20
Polishing amount: 40 [μm]

(評価)
研磨に要した時間:35分
表面粗さRa:1.53[nm]
(Evaluation)
Time required for polishing: 35 minutes Surface roughness Ra: 1.53 [nm]

(比較例2)
研磨ブラシ:線径0.1mmのナイロンブラシ、ブラシ長35[mm]
研磨材:三井金属製ミレークE−20
研磨量:40[μm]
(Comparative Example 2)
Polishing brush: nylon brush with a wire diameter of 0.1 mm, brush length 35 [mm]
Abrasives: Mitsui Metal Mille E-20
Polishing amount: 40 [μm]

(評価)
研磨に要した時間:90分
表面粗さRa:0.95[nm]
(Evaluation)
Time required for polishing: 90 minutes Surface roughness Ra: 0.95 [nm]

(比較例3)
研磨ブラシ:線径0.3mmのナイロンブラシ、ブラシ長25[mm]
研磨材:昭和電工製ロックスV−210
研磨量:40[μm]
(Comparative Example 3)
Polishing brush: nylon brush with a wire diameter of 0.3 mm, brush length 25 [mm]
Abrasive: Showa Denko Rocks V-210
Polishing amount: 40 [μm]

(評価)
研磨に要した時間:45分
表面粗さRa:1.35[nm]
(Evaluation)
Time required for polishing: 45 minutes Surface roughness Ra: 1.35 [nm]

(比較例4)
研磨ブラシ:線径0.1mmのナイロンブラシ、ブラシ長38[mm]
研磨材:昭和電工製ロックスV−210
研磨量:40[μm]
(Comparative Example 4)
Polishing brush: nylon brush with a wire diameter of 0.1 mm, brush length 38 [mm]
Abrasive: Showa Denko Rocks V-210
Polishing amount: 40 [μm]

(評価)
研磨に要した時間:120分
表面粗さRa:0.65[nm]
(Evaluation)
Time required for polishing: 120 minutes Surface roughness Ra: 0.65 [nm]

以上のように、実施例1から実施例4、比較例1から比較例4の結果をまとめると、実施例1から実施例4では、比較例1から比較例4に比べて、外周端面の表面粗さRaを小さくすることができ、さらに、研磨に要する時間を短縮することができた。このように、ブラシ傷が少ない端面を形成することができるため、磁気記録媒体を作製する工程で発生する、端面の傷に起因する欠陥の発生を抑えることが可能となる。また、研磨に要する時間を短縮することができるため、磁気記録媒体用ガラス基板の生産性を向上させることができる。   As described above, the results of Example 1 to Example 4 and Comparative Example 1 to Comparative Example 4 are summarized. In Example 1 to Example 4, the surface of the outer peripheral end face is larger than Comparative Example 1 to Comparative Example 4. The roughness Ra can be reduced, and the time required for polishing can be shortened. As described above, since the end face with few brush scratches can be formed, it is possible to suppress the occurrence of defects due to the scratch on the end face, which occurs in the process of manufacturing the magnetic recording medium. Moreover, since the time required for polishing can be shortened, the productivity of the glass substrate for magnetic recording media can be improved.

なお、上記実施例及び比較例では、ガラスの種類として、ホウ珪酸ガラスを用いたが、それ以外のガラス基板を用いても、上記実施例及び比較例と同じ結果が得られる。例えば、アルミノシリケートガラスを用いても、上記実施例と同じ効果を奏することができる。   In addition, although the borosilicate glass was used as a kind of glass in the said Example and comparative example, even if it uses another glass substrate, the same result as the said Example and comparative example is obtained. For example, even if an aluminosilicate glass is used, the same effects as those of the above embodiment can be obtained.

この発明の実施形態に係る磁気記録媒体用ガラス基板の製造工程を順番に示すフローチャートである。It is a flowchart which shows in order the manufacturing process of the glass substrate for magnetic recording media which concerns on embodiment of this invention. この発明の実施形態に係る研磨装置を正面から見た断面図である。It is sectional drawing which looked at the polish device concerning the embodiment of this invention from the front. この発明の実施形態に係る研磨装置を上面から見た平面図である。It is the top view which looked at the polish device concerning the embodiment of this invention from the upper surface.

符号の説明Explanation of symbols

1 ガラス基板
2 基板保持部
3 回転保持台
4 研磨ブラシ
5、6 研磨液供給部
7 研磨室
8 水供給部
10 積層ガラス基板
51 研磨液供給ノズル
52、62 研磨液供給管
61 研磨液供給口
DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Substrate holding part 3 Rotation holding stand 4 Polishing brush 5, 6 Polishing liquid supply part 7 Polishing chamber 8 Water supply part 10 Laminated glass substrate 51 Polishing liquid supply nozzle 52, 62 Polishing liquid supply pipe 61 Polishing liquid supply port

Claims (4)

表面及び前記表面の周囲に端面を有する円板状のガラス基板の前記端面を研磨する磁気記録媒体用ガラス基板の研磨方法であって、
第1の研磨ブラシを回転させながら前記端面に押し当てて、前記端面を研磨する第1の研磨工程と、
前記第1の研磨工程の後、前記第1の研磨ブラシよりも剛性が低い第2の研磨ブラシを回転させながら前記端面に押し当てて、前記端面を研磨する第2の研磨工程と、
を含み、
前記第1の研磨工程と前記第2の研磨工程を施すことにより、前記端面の表面粗さRaを、0.5〜1[nm]とすることを特徴とする磁気記録媒体用ガラス基板の研磨方法。
A method of polishing a glass substrate for a magnetic recording medium, wherein the end surface of a disk-shaped glass substrate having an end surface around the surface and the surface is polished,
A first polishing step of pressing the end face while rotating the first polishing brush to polish the end face;
After the first polishing step, a second polishing step of pressing the end surface while rotating a second polishing brush having a rigidity lower than that of the first polishing brush to polish the end surface;
Only including,
Polishing the glass substrate for a magnetic recording medium, wherein the first polishing step and the second polishing step are performed, so that the end surface has a surface roughness Ra of 0.5 to 1 [nm]. Method.
前記第1の研磨工程では、所定の粒径を有する第1の研磨材を前記ガラス基板に供給しながら、前記第1の研磨ブラシを前記端面に押し当てて前記端面を研磨し、
前記第2の研磨工程では、前記第1の研磨材よりも粒径が小さい第2の研磨剤を前記ガラス基板に供給しながら、前記第2の研磨ブラシを前記端面に押し立てて前記端面を研磨することを特徴とする請求項1に記載の磁気記録媒体用ガラス基板の研磨方法。
In the first polishing step, while supplying a first abrasive having a predetermined particle size to the glass substrate, the end surface is polished by pressing the first polishing brush against the end surface,
In the second polishing step, the second polishing brush is pushed up against the end surface while supplying the second abrasive having a particle size smaller than that of the first abrasive to the glass substrate, and the end surface is The method for polishing a glass substrate for a magnetic recording medium according to claim 1, wherein polishing is performed.
前記第1の研磨ブラシ及び前記第2の研磨ブラシには、第3の研磨材が含まれていることを特徴とする請求項2に記載の磁気記録媒体用ガラス基板の研磨方法。   The method for polishing a glass substrate for a magnetic recording medium according to claim 2, wherein the first polishing brush and the second polishing brush contain a third abrasive. 前記第1の研磨ブラシの長さが25[mm]〜30[mm]で、前記第2の研磨ブラシの長さが28[mm]〜38[mm]であることを特徴とする請求項1から請求項3のいずれかに記載の磁気記録媒体用ガラス基板の研磨方法。   The length of the first polishing brush is 25 [mm] to 30 [mm], and the length of the second polishing brush is 28 [mm] to 38 [mm]. The method for polishing a glass substrate for a magnetic recording medium according to claim 3.
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