JP4992306B2 - Work carrier, manufacturing method thereof and double-side polishing machine - Google Patents

Description

The present invention relates to a work carrier used when polishing a work, a manufacturing method thereof, and a double-side polishing machine provided with the work carrier.

Conventionally, an upper surface plate and a lower surface plate are provided so that the polishing surfaces are parallel to each other, and loose abrasive grains (abrasive) with a flaky workpiece sandwiched between the upper surface plate and the lower surface plate Slurry containing (
2. Description of the Related Art There is known a double-side polishing machine that polishes both surfaces of a workpiece by rotating relative to each other while supplying slurry.
In the polishing process using such a double-side polishing machine, a thin plate-like work carrier is used which is disposed in a state where a work is held between an upper surface plate and a lower surface plate. Work carrier
The work surface is sandwiched between the upper surface plate and lower surface plate with the work in a holding hole provided in a part of it, and both surfaces of the work surface are always polished surfaces of the upper surface plate and lower surface plate during polishing. Are held so as to be slid at the same time.

The double-side polishing machine as described above is widely used not only for polishing glass and semiconductors but also for polishing quartz substrates used in various quartz devices such as quartz crystal resonators.
In recent years, with the miniaturization of equipment in which quartz devices are incorporated, the quartz substrate used is also becoming smaller and thinner, and a thickness of 30 to 100 μm and an outer diameter of about 10 to 50 mm are required. There is a need for a double-side polishing machine suitable for polishing a substrate.

In addition, in Patent Document 1, as a work carrier for a double-side polishing machine suitable for polishing an extremely thin work, the work carrier rigidity and wear resistance of the work carrier are contained by including an aggregate of a metal structure inside the work carrier. A work carrier for a double-sided polishing machine and a method for manufacturing the same have been disclosed.
JP 2004-195571 A

By the way, when lapping or polishing a workpiece using a double-side polishing machine,
In order to increase the accuracy of the parallelism and flatness of the workpiece and maintain the appearance, it is an important factor that the workpiece carrier is flat. Note that lapping refers to loose abrasive processing in which a workpiece is polished while performing a sliding motion in a state containing an abrasive, and the workpiece is polished while being finely cut, thereby finishing the workpiece more flat. Polishing is a process in which an abrasive is held by a polishing cloth (cloth, pad) to polish the workpiece, and is usually performed as a post-lapping process.

FIG. 5 is a plan view of a conventional work carrier used for a double-side polishing machine.
A work carrier 50 shown in FIG. 5 is a carrier body 51 made of an extremely thin and disc-like metal.
A plurality of protrusions 52 provided on the outer periphery of the carrier body 51, and the carrier body 5
A plurality of holding holes 53 each having a rectangular shape provided in the middle of one radial direction and a central hole 54 having a circular shape provided in the central portion. Work carrier 50 configured in this way
When wrapping or polishing a workpiece using, the workpiece is stored in the holding hole 53 of the workpiece carrier body 51 and polished on the polishing surfaces of the upper and lower surface plates (not shown).

However, when lapping or polishing is performed using the work carrier 50 as shown in FIG. 5, the work carrier 50 itself warps depending on the processing conditions. For example, even if the carrier body 51 before polishing is a flat plate as shown in FIG. 6A, the carrier body 51 after polishing is warped as shown in FIG. 6B. Such warpage of the carrier main body 51 occurs when stress is applied to the work carrier 50 during polishing by an abrasive that is interposed between the work carrier 50 and the upper and lower surface plates during polishing. When the workpiece carrier 50 is continuously used, the workpiece 60 may fall off the holding hole 53. Originally, the work carrier 50 that should come into contact with the center of the side surface of the work 60 comes in contact with the position shifted from the center of the side surface of the work 60. Or work 60
Is slanted and the quality deteriorates. In particular, in the case where the workpiece 60 is a quartz substrate, if the workpiece 60 is polished obliquely, the cutting angle of the quartz substrate that is the workpiece 60 changes, and the temperature characteristics of the quartz crystal element using the quartz substrate are from the target characteristics. It will be shifted.

Therefore, conventionally, when the polishing process is performed by the double-side polishing machine, the warp of the work carrier 50 is corrected by inverting the front and back of the work carrier 50 at regular intervals (for example, for each lot). Since the conventional work carrier 50 cannot distinguish the front and back from the appearance, there is a problem that an operator who performs the reversing work easily makes a mistake. As a result, the quality of the lapped or polished quartz substrate or the like could not be improved.

In addition, the work carrier disclosed in Patent Document 1 has a problem that the cost is significantly increased because it is necessary to contain an aggregate of a metal structure inside the carrier.
Therefore, the present invention has been made in view of the above-described points, and provides a work carrier, a manufacturing method thereof, and a double-side polishing machine capable of reliably performing reversing work and its management for preventing the work carrier from warping. The purpose is to provide.

In order to achieve the above object, the work carrier of the present invention is a work carrier that holds a work when the work is polished by a double-side polishing machine, and has a disc-like carrier having a plurality of holding holes for holding the work. The main body and a marking portion provided on the carrier main body for visually distinguishing the front and back of the carrier main body are provided, and the marking portion is provided on the center portion of the disk-shaped carrier main body and on the board surface avoiding the holding hole. .
According to the present invention, since the front and back of the carrier main body can be visually determined by the marking portion formed on the carrier main body, the reversing work for preventing the work carrier from warping and its management are surely performed. be able to.

Moreover, the workpiece carrier of this invention formed the marking part by the through-hole. This
Even when the carrier body is viewed from the front side or the back side, the front and back sides can be easily distinguished. In addition, the marking portion does not disappear while using the work carrier.

In the work carrier of the present invention, when the center angle between the holding hole and the through hole is A and the center angle between the adjacent holding holes is B, the through hole satisfies the relationship 0 <A <B / 2. It was made to form in a position. According to the present invention, since the position of the through hole is different when the carrier body is viewed from one board surface and when viewed from the other board surface, the front and back of the work carrier can be easily discriminated.

The work carrier of the present invention has a through hole diameter Dm and a holding hole diameter Dw.
The through hole was formed in a size satisfying the relationship of 0.2 mm ≦ Dm <Dw. According to the present invention as described above, a work carrier that can be visually recognized by an operator and has sufficient strength can be realized.

Moreover, the work carrier of this invention made the marking part the recessed part formed in the one board surface of a carrier main body. Thus, the operator can easily discriminate between the front and back of the carrier body depending on whether or not there is a recess in the board surface.

The work carrier manufacturing method of the present invention is a work carrier manufacturing method for holding a work when the work is polished by a double-side polishing machine, and at least a plurality of holding holes for holding the work in the carrier body, An etching process for forming a marking portion for discriminating the front and back of the carrier body is provided. According to the present invention, since the holding hole for holding the workpiece in the carrier body and the marking portion for discriminating the front and back of the workpiece carrier can be formed at the same time, the marking portion is produced in the carrier body without increasing the cost. It becomes possible to do.

Further, the double-side polishing machine of the present invention has an upper surface plate, a lower surface plate, and between the upper surface plate and the lower surface plate,
A double-side polishing machine that simultaneously polishes both the front and back surfaces of a workpiece with a workpiece carrier holding the workpiece interposed therebetween, and the workpiece carrier is the workpiece carrier of the present invention.
According to the present invention, since the work carrier can be reversed and managed reliably when lapping or polishing is performed, the quality of the work can be improved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a plan view showing a configuration of a work carrier for a double-side polishing machine according to an embodiment of the present invention.
A work carrier 1 shown in FIG. 1 is a work carrier that holds a work when the work is polished by a double-side polishing machine, and includes a disc-shaped carrier main body 2 having a plurality of holding holes 4 that hold the work, and a carrier. In order to distinguish the front and back of the main body 2 by visual observation, a marking portion 6 provided on the carrier main body 2 is provided. The carrier body 2 is made of ultra-thin steel steel. The material of the carrier body 2 is not limited to steel, but can be configured using stainless steel, vinyl chloride resin, glass epoxy resin, or the like.

A central hole 5 is formed in the center of the carrier body 2, and a plurality of protrusions 3 are provided on the outer periphery of the carrier body 2. A plurality of (for example, four) circular holding holes 4 are formed in the middle of the carrier body 2 in the radial direction. In the present embodiment, the shape of the holding hole 4 is circular, but may be rectangular.
And in the work carrier 1 of this embodiment, the board surface shape of the carrier main body 2 which avoided the center part and the holding hole 4 of the disk-shaped carrier main body 2 as a marking part for an operator to discriminate | determine the front and back of the work carrier 1 This is characterized in that the through hole 6 is formed in. Work carrier 1
There is no distinction between the front and back surfaces, such as the front surface or the back surface.
One board surface may be referred to as the front surface and the other board surface as the back surface.

The through-hole 6 as a marking portion is formed at a position where the positional relationship with the holding hole 4 is different when the work carrier 1 is viewed from one board surface (front surface) and from the other board surface (back surface). Has been.
Specifically, for example, when the center angle of the adjacent holding holes 4 and 4 formed in the carrier body 2 is 90 °, the through hole 6 is located at the intermediate position between the holding holes 4 and 4, that is, the center with the holding hole 4. When the through hole 6 is formed at an angle of 45 °, the positional relationship between the holding hole 4 and the through hole 6 is the same when the work carrier 1 is viewed from the front surface and from the back surface. The front and back cannot be distinguished. Therefore, in the present embodiment, when the work carrier 1 is viewed from the front surface and the back surface, the positional relationship with the holding hole 4 is different, that is, the holding hole 4 and the through hole 6.
The through hole 6 is formed at a position where the central angle is other than 45 °. The through hole 6 may have a rectangular shape.
Therefore, the position of the through hole 6 in the work carrier 1 of the present embodiment is that the center angle between the holding hole 4 and the through hole 6 is A and the center angle between the adjacent holding holes 4 and 4 when viewed from the center of the carrier body 2. Is defined as B, the through hole 6 can be defined as a position satisfying a relationship of 0 <A <B / 2.

Since the through hole 6 must be formed inside the protrusion 3 provided on the outer periphery of the carrier body 2 , the distance between the center of the carrier body 2 and the center of the through hole 6 is R 0, If the diameter is Dm and the root radius of the carrier body 2 is R2, the through hole 6 can be defined as a position satisfying the relationship of (R0 + Dm / 2) <R2. When the through hole 6 has a rectangular shape, the diameter Dm of the through hole 6 is a diagonal dimension.
Further, the diameter of the through hole 6 needs to be formed in a size that can be visually confirmed by the operator and does not decrease the strength of the carrier body 2. According to the experiment, it was found that the diameter of the through hole that can be visually confirmed by the operator is about 0.2 mm. Moreover, since the strength of the carrier body 2 is usually determined based on the size of the holding hole 4 formed in the carrier body 2,
The maximum size of the through hole 6 within a range in which the strength of the carrier body 2 is not lowered may be equal to or smaller than the size of the holding hole 4. Incidentally, when the through hole 6 is made larger than the holding hole 4, the strength balance of the carrier body 2 is varied, and the finished quality of the workpiece is also varied. From the above, the diameter Dm of the through hole 6 is 0.2 m if the diameter of the holding hole 4 is Dw.
It can be defined as a size satisfying the relationship of m (visible size) ≦ Dm <Dw. In addition,
When the holding hole 4 is rectangular, the diameter Dw of the holding hole 4 is a diagonal dimension.

Therefore, if the work carrier 1 having the through hole 4 that satisfies the above-described definition is configured, the operator can easily and reliably discriminate the front and back of the work carrier 1 by the through hole 6. Thus, the reversing work for preventing the work carrier 1 from warping and its management can be performed reliably. That is, it is possible to reliably perform the work carrier reversal work and its management used when polishing an extremely thin work such as a quartz substrate.

Moreover, in this embodiment, when seeing the work carrier 1 from the front surface and from the back surface,
By forming the through holes 6 and the holding holes 4 at different positions, the operator can discriminate the front and back of the work carrier 1 from any surface of the work carrier 1.
As a method of forming the through hole 6 in the carrier body 2, if the work carrier 1 itself is a finished product, the through hole may be formed in the carrier body 2 using a drill or the like. When a new work carrier 1 is manufactured, if the work carrier is an etched product, the through hole 6 may be formed simultaneously with the holding hole 4.

Further, in the above description, the through hole 6 is formed in the carrier body 2 as a marking portion for discriminating the front and back of the work carrier 1, but the carrier body 2 is used instead of the through hole 6.
A recess 6 may be formed on any one of the board surfaces, and the front and back of the work carrier 1 may be determined based on the presence or absence of the recess 6.
In addition, it is conceivable to mark either side of the carrier body 2 with an oil pen to distinguish the front and back, but in this case, the marking disappears during polishing, so the carrier body as in this embodiment It is preferable to form a recess in 2.

In addition, it may be possible to discriminate the front and back surfaces by scratching one surface of the carrier body 2 with a diamond cutter. In this case, the carrier body 2 may be plastically deformed and the strength may be reduced. It is preferable to form a recess in the carrier body 2 as in the embodiment.
As a method of forming the concave portion 6 as a marking portion on the carrier body 2, if the work carrier 1 itself is a finished product, the carrier body 2 may be counterbored. If the work carrier 1 is an etched product, it can be formed by performing half etching or the like.
In this embodiment, the work carrier used when polishing the quartz substrate is described as an example. However, this is only an example, and the work carrier used when polishing a semiconductor or the like is also applied. It goes without saying that it is possible.

FIG. 2 is a diagram showing a work carrier manufacturing process according to the present embodiment.
The manufacturing process of the work carrier of this embodiment is performed by the process according to the photolithography method. That is, first, in a pattern drawing step S1, a highly accurate drawing pattern (etching pattern) is created on a film sensitive material and a glass dry plate by a laser plotter based on data input by a CAD system. Next, as a pretreatment step S2, a degreasing cleaning process is performed to remove the adhesion of oil and dirt on the metal plate (steel steel) serving as the work carrier 1 in order to improve the adhesion of the resist. Thereafter, as a resist coating step S3, a resist photosensitive film whose adhesion is controlled in a clean room is uniformly coated on both surfaces of the metal plate. Next, as an exposure step S4, both the front and back surfaces are simultaneously exposed using an etching pattern on a metal plate coated with a resist, and a photosensitive film for forming the holding holes 4 and the through holes 6 is transferred to the metal plate. .

Next, as the developing step S5, the film is removed from the unexposed portion on the exposed and transferred metal plate to expose the metal film, and as the etching step S6, the exposed portion of the metal coated with the resist is etched with an etching solution. After that, the resist photosensitive film is removed as a peeling step S7, and the product is washed with a peeling machine. Finally, a dimension / appearance inspection is performed in the inspection step S8.
In this way, since the through hole 6 can be formed simultaneously with the holding hole 4, the work carrier 1 of the present embodiment can be manufactured in the same process as the conventional work carrier manufacturing process. The work carrier 1 of this embodiment can be produced at the same cost as the carrier.

FIG. 3 is a diagram showing a state in which the work carrier 1 of the present embodiment is used for polishing by a double-side polishing machine. In addition, FIG. 3 is a figure which abbreviate | omitted and showed the upper surface plate and lower surface plate of the double-side polisher. Moreover, FIG. 4 is the figure which showed the XX cross section which added the upper surface plate and lower surface plate of the double-side polisher shown in FIG. Although the work carrier 1 and the work 20 are negligibly thin as compared with the upper surface plate 11 and the lower surface plate 12, in FIG. 4, the work carrier 1 is shown thicker for easy understanding.
As shown in FIGS. 3 and 4, the upper surface plate 11 and the lower surface plate 12 are constituted by disk-like members having the same size with a polishing pad 13 attached to each polishing surface. And
The polished surfaces are arranged coaxially so as to be parallel to each other. Further, between the upper surface plate 11 and the lower surface plate 12, for example, three work carriers 1, a center gear 14, and a ring gear 15 constitute a planetary gear.

At the time of polishing by the double-side polishing machine 10 configured in this way, each work carrier 1 is fitted between the center gear 14 and the ring gear 15 with the work 20 stored in each of the plurality of holding holes 4, It is sandwiched between the upper surface plate 11 and the lower surface plate 12. Then, for example, while supplying the abrasive, the upper surface plate 11 and the lower surface plate 12 are rotated relative to the work carrier 1 around the axis thereof, and the center gear 14 or the ring gear 15 is rotated around the axis. Thus, both surfaces of the work 20 are brought into sliding contact with the surfaces of the polishing pads 13 provided on the upper surface plate 11 and the lower surface plate 12, respectively, so that both surfaces of the work 20 are polished. At this time, the center gear 14, the ring gear 15, and the lower surface plate 12 rotate in the same direction, and only the upper surface plate 11 rotates in the opposite direction. Further, by rotating the lower surface plate 12 faster than the work carrier 1 and rotating the upper surface plate 11 slower than the work carrier 1, the relative speed of the upper surface plate 11 and the lower surface plate 12 with respect to the work 20 is kept uniform. Yes.

Therefore, if the double-side polishing machine 10 is configured using the work carrier 1 of the present embodiment and the double-side polishing machine 10 performs lapping or polishing of the workpiece 20 such as a quartz substrate, the parallelism and flatness of the workpiece 20 are achieved. And the quality of the appearance can be improved.

It is a top view showing composition of a work carrier for double-side polish machines concerning an embodiment of the present invention. It is the figure which showed the manufacturing process of the work carrier of this embodiment. It is the figure which showed a mode that the work carrier 1 of this embodiment was used for the grinding | polishing process by a double-side polisher. It is the figure which showed XX cross section which added the upper surface plate and the lower surface plate to the double-side polisher shown in FIG. It is a top view of the work carrier for the conventional double-side polisher. It is explanatory drawing of the curvature which generate | occur | produces in the conventional work carrier.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Work carrier, 2 ... Carrier main body, 3 ... Projection part, 4 ... Holding hole, 5 ... Center hole, 6 ...
Holding part (through hole, recess), 10 ... Double-side polishing machine, 11 ... Upper surface plate, 12 ... Lower surface plate, 13 ... Polishing pad, 14 ... Center gear, 15 ... Ring gear, 20 ... Workpiece

Claims (5)

A disk-shaped carrier body which has a holding hole in multiple that holds the workpiece during the polishing of the workpiece by a double-sided polishing machine,
And a marking portion which is provided on the carrier body in order to determine different front and back of the carrier body,
The center angle A between the marking portion and the holding hole and the center angle B between the adjacent holding holes satisfy the relationship 0 <A <B / 2,
Further, the work carrier is characterized in that a diameter Dm of the marking portion and a diameter Dw of the holding hole satisfy a relationship of 0.2 mm ≦ Dm <Dw . The work carrier according to claim 1, wherein the marking portion is a through hole. The work carrier according to claim 1, wherein the marking portion is a concave portion. The marking portion has a distance R0 between the center of the carrier body and the center of the marking portion, a diameter Dm of the marking portion, and a root circle radius R2 (mm) of the carrier body (R0 + Dm / 2) The work carrier according to any one of claims 1 to 3, wherein a relationship of <R2 is satisfied. An upper surface plate, a lower surface plate, and a double-side polishing machine that simultaneously polishes both the front and back surfaces of a work with a work carrier holding the work between the upper surface plate and the lower surface plate,
The double-side polishing machine according to claim 1, wherein the work carrier is the work carrier according to claim 1.

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