KR101026574B1 - Carrier for double side polishing apparatus and plate used in the same and Apparatus for double side polishing - Google Patents

Abstract

The carrier for a double-side polishing apparatus according to the present invention is a carrier for a double-side polishing apparatus which is installed between the upper and lower plates of the double-side polishing apparatus and rotated by a sun gear and an internal gear. A center plate having one or more mounting holes; And a fitting hole to which the center plate is fitted is formed on the center, and an outer circumferential surface thereof includes an outer circumferential plate having a gear portion engaged with the sun gear and an internal gear, wherein the outer circumferential plate has a relatively higher strength than the material of the center plate. The central plate is made of epoxy glass material, and the outer plate is made of sus, sus DLC, or a metal material according to an embodiment. It is done.

According to the present invention, by forming the carrier used for the double-side polishing apparatus by dualizing the center plate and the outer plate with different material properties, the life cycle of the carrier is enhanced as well as the effect of performing a more improved double-side polishing process It can be created.

Description

Carrier and double side polishing apparatus and plate used in the same and Apparatus for double side polishing}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier for a double-side polishing apparatus, a plate and a double-side polishing apparatus used therein, and more particularly, a rotational driving force is transmitted by being engaged with a center plate and a driving gear on which a wafer to be an object of double-side polishing is mounted. The present invention relates to a carrier and the like, which are dualized into outer circumferential plates, wherein the dualized center plates and outer circumferential plates are made of differential materials.

The main process of manufacturing a silicon wafer is a slicing process in which a single crystal ingot is sliced to create a thin disk-shaped wafer, and a chamfered outer peripheral portion to prevent cracking, cracking, or grooves of the wafer produced by the slicing process. Chamfering process to chamfer, Lapping process to planarize wafer, Etching process to remove process deformed parts remaining on wafer where chamfering and lapping process is completed, Polishing process to mirror surface of wafer It consists of a cleaning process for removing foreign matters, and additional processes may be added according to the manufacturing environment or the specification of the target wafer, and the order of performing the above processes may be changed somewhat.

The polishing process may be divided into a single side polishing process or a double side polishing process, and the double side polishing process (DSP.Double Side Polishing) is polishing on both sides of the upper and lower surfaces of the wafer. This is the process to make it progress.

1 and 2 will be described in brief with the double-side polishing apparatus for performing the double-side polishing process as follows.

The double-sided polishing apparatus 10 includes an upper plate 150 having a polishing pad attached to a lower surface thereof, a lower plate 110 having a polishing pad attached to an upper surface thereof, and an upper plate 150 having an polishing pad attached to an upper surface thereof. And a carrier 130 installed between the bottom plate 110 and the wafer 100 to be polished.

Briefly looking at the operation and the structural relationship, the inner gear 120 is provided on the outer periphery of the lower plate, and the sun gear 140 is installed in the central portion of the device. The carrier 130 on which the at least one wafer is mounted is engaged with the internal gear 120 and the sun gear 140 to rotate.

In the structure as described above, the target wafer to be subjected to double-side polishing is a slurry, which is a polishing liquid obtained by mixing friction particles and various additives with frictional force by rotational movement with polishing pads attached to the upper and lower plates. Polishing is carried out in the reaction and the like.

That is, the internal gear and the sun gear are configured to be capable of independent rotation, and the degree (cycle, frequency, etc.) of the carrier rotation and revolution is determined according to the rotation ratio or the speed of each axis. The wafer loaded on the carrier 130 undergoes a rotational motion corresponding to the degree of rotation or revolving of the carrier. Accordingly, the wafer is polished by frictional force with the pads on both sides of the upper and lower surfaces contacting the wafer.

Among carriers that perform the most important functions among the flatness control factors according to the double-side polishing process, carriers of epoxy glass and carriers of Sus DLC are currently used the most. The Sus DLC refers to a material having a carbon coating on a metal surface of stainless steel.

Hereinafter, the problems of the conventional carrier structure will be described with reference to FIGS. 3 and 4, which are cross-sectional views of the conventional carrier structure along the line AA ′ of FIG. 2.

As described above, the carrier 130 on which the wafer 100 is mounted is interposed between the upper plate 150 to which the upper pad 151 is attached and the lower plate 110 to which the lower pad 111 is attached. The carrier 130 has a gear portion formed on the outer circumferential surface such that the internal gear 120 is engaged with the outer circumferential surface and the sun gear 140 is engaged with the inner circumferential surface.

When the carrier, in particular the carrier made of epoxy glass, performs rotational and orbital motion, the rotational momentum or torque is applied to the outer peripheral surface of the carrier on which the gear part engaged with the gears is formed. As the rotational motion as described above continues, the applied force is continuously accumulated so that a crack is generated on the outer circumferential surface of the carrier as shown in FIG.

This crack damages the pad edge area facing the wafer, thereby deforming the pad to a non-uniform pad surface and consequently lowering the flatness of the wafer to be polished. .

That is, the carrier of the epoxy material as described above may result in the early degradation of the pad condition and the flatness at the time of polishing the wafer by damage of the outer peripheral surface, and of course, the service life of the carrier itself is shortened.

On the other hand, Sus DLC carrier has a stronger strength than the carrier of epoxy material, so the damage of the outer circumferential surface is relatively small, but there is a limit in thickness control, so that it is somewhat limited in securing stable quality for flatness. have.

The present invention was devised to solve the above problems, and dualizes the carrier used for the double-side polishing apparatus into a central plate and an outer circumferential plate, and increases the service life by differentially constructing each binary plate with a material having heterogeneous properties. Of course, there is an object to provide a carrier and the like that can improve the flatness according to both sides polishing.

Other objects and advantages of the present invention will be described below and will be appreciated by the embodiments of the present invention. In addition, the objects and advantages of the present invention can be realized by the configuration and combination of configurations shown in the claims.

The carrier for a double-side polishing apparatus of the present invention for achieving the above object is provided between the upper and lower plates of the double-side polishing apparatus and rotated by a sun gear and an internal gear. A center plate provided with at least one mounting hole for mounting a wafer; And a fitting hole to which the center plate is fitted is formed on the center, and an outer circumferential surface thereof includes an outer circumferential plate having a gear portion engaged with the sun gear and an internal gear, wherein the outer circumferential plate has a relatively higher strength than the material of the center plate. It is configured to be made of a material.

In addition, according to the embodiment, the center plate is formed of epoxy glass, and the outer plate is composed of Sus, Sus DLC, or a metal material.

In addition, the outer circumferential surface of the center plate is formed with a plurality of protrusions, the insertion hole of the outer circumference plate may be configured to be formed so that the groove portion corresponding to the protrusion to be fitted with the protrusion, the protrusion and the groove portion are mutually corresponding It is preferable to configure so that a step may be formed.

In order to implement a more preferred embodiment, the outer circumferential plate may be configured to have a distance of 10 mm to 40 mm from the outer circumferential surface of the outer circumferential plate to the fitting hole.

On the other hand, the plate structure used for the carrier according to another aspect of the present invention is a disk-shaped plate that is installed between the upper and lower plates of the double-side polishing apparatus rotated by the sun gear and the internal gear, the mounting hole for mounting the wafer The one or more provided center plate is fitted with a fitting hole: and formed on the outer circumferential surface and includes a gear portion engaged with the sun gear and the internal gear, and is composed of a material having a relatively higher strength than the center plate, preferably It may be configured using Sus, Sus DLC, or a metal material.

The carrier according to the present invention and the plate used for the carrier and the double-side polishing apparatus using the same can first effectively prevent wear, cracking, or cracking of the carrier of the double-side polishing apparatus, thereby extending the service life of the carrier. Of course, it creates the effect of prolonging the replacement time in the device.

According to the basic working effects of the present invention can maintain a good condition for the polishing pad for polishing the wafer, thereby ensuring a stable and high flatness of the polishing process.

In addition, it is possible to effectively shorten the process cost and time required for carrier replacement through the extension of the carrier life cycle, thereby creating higher economics and productivity.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

5 is an exploded view of a carrier for a double-side polishing apparatus according to a preferred embodiment of the present invention, Figure 6 is a plan view of a carrier for a double-side polishing apparatus according to a preferred embodiment of the present invention.

The carrier according to the present invention relates to a carrier for a double-side polishing apparatus installed between a top and a bottom plate of a double-side polishing apparatus and rotated by a sun gear and an internal gear, as shown in the drawing. As described above, the carrier 200 of the present invention is first composed of a central plate 210 and an outer circumferential plate 220.

Conventionally, the carrier is manufactured and used in a single plate-like shape of a single material, but as described above, since the present invention has a process problem according to each material, the present invention provides a wafer mounting, a thickness control, an internal gear The dual structure of the center plate and the outer plate is adopted as described above, depending on whether or not the sun gear is engaged with the sun gear.

The central plate 210 is provided with one or more mounting holes 211, and the mounting hole 211 is equipped with a wafer to be subjected to a double-side polishing process. Since the central plate 210 is directly engaged with the sun gear or the internal gear, and is not a part in which physical friction occurs directly, the center plate 210 may be made of a material having a weak rigidity in order to increase the efficiency of thickness control.

In addition, the outer plate 220 of the present invention is formed with a fitting hole 221 to which the center plate 210 is coupled, the outer circumferential surface of the outer plate 220, the gear portion to be engaged with the sun gear and the internal gear 222 ) Is formed.

Since the outer plate 220 is configured to be in direct physical engagement with the sun gear and the internal gear, in order to realize the main object of the present invention, the outer plate 220 is made of a material having a higher rigidity than that of the center plate 210. It is desirable to configure it to have a higher durability against physical engagement.

That is, the material of the center plate 210 and the outer plate 220 is composed of a binary material, the center plate 210 has a relatively soft compared to the outer plate to improve the efficiency of the thickness control The outer circumferential plate 220 is composed of a material having a higher strength or stiffness than the center plate 210.

According to an embodiment for realizing this purpose, the central plate 210 is made of epoxy glass, and the outer plate 220 is sus, sus DLC, or the It is preferable to configure the metal material with higher strength than the central plate 210.

Meanwhile, according to the exemplary embodiment, a plurality of protrusions 213 may be formed on an outer circumferential surface of the center plate 210, and a groove part corresponding to the protrusion 213 may be formed in the fitting hole 221 of the outer circumferential plate 220. 223 may be formed.

The protruding portion 213 of the center plate 210 and the groove portion 223 of the outer plate 220 are formed in a shape corresponding to each other to be fitted to each other to form a combination of the center plate 210 and the outer plate 220. Further facilitating, and performs a function for effectively transmitting the rotational driving force of the outer plate 220 to the center plate (210).

The protrusion 213 and the groove 223 may be formed in various numbers according to the embodiment or the working environment, as well as showing a preferred embodiment of the present invention for effective transmission of the coupling and rotational movement between each other As shown in FIG. 8, the protruding portion 213 and the groove portion 223 may be formed in a tooth coupling type formed in a shape corresponding to each other.

When the carrier is formed by the combination of the binary plates as described above, there is a need to secure an effective rotation radius of the wafer mounted on the center plate in relation to the flatness or thickness control of the wafer. Likewise, the distance "D" from the outer circumferential surface of the outer circumferential plate 220 to the fitting hole is preferably configured not to exceed 40 mm including an error range.

In addition, as described above, the outer circumferential plate 220 is physically coupled to the sun gear and the internal gear to perform a function of transmitting the rotational movement to the inner center plate 210, so that the rigidity due to physical friction In order to effectively implement the function in the maintained state, the "D" is preferably configured to be 10 mm or more in consideration of an error range.

In order to realize a carrier or plate structure according to a more preferred embodiment of the present invention, as shown in FIGS. 5 and 7, the protrusion 213 of the center plate 210 and the groove portion 223 of the outer plate 220 are formed. It may be formed in a stepped shape corresponding to each other.

In the case of configuring the protrusion 213 and the groove 223 in the stepped shape corresponding to each other as described above, it is possible to induce more effective coupling between the center plate 210 and the outer circumferential plate 220, as well as the Even if an external factor such as vibration or shaking due to driving occurs, it is possible to maintain a more stable state.

As shown in FIG. 7, when the thickness of the convex portion protruding from the protrusion 213 of the center plate 210 to the step is b and the thickness of the concave portion is c, the groove 223 of the outer circumferential plate 213 is formed. In addition, the thickness of the concave portion of the stepped portion b and the thickness of the convex portion of the stepped portion c correspond to each other so that the thickness of the central plate 210 and the thickness of the outer plate 220 are equal to a. desirable.

As shown in FIG. 9 through the carrier 200 of the present invention as described above, the wafer 100 to be polished is mounted on the center plate 210 and accommodated by fitting the center plate 210. The outer circumferential plate 220 is engaged with the sun gear 140 and the internal gear 120 to be rotated, thereby driving the double-sided polishing.

Although the present invention has been described above by means of limited embodiments and drawings, the present invention is not limited thereto and will be described below by the person skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of the claims.

The following drawings, which are attached to this specification, illustrate exemplary embodiments of the present invention, and together with the detailed description of the present invention serve to further understand the technical spirit of the present invention, the present invention includes matters described in such drawings. It should not be construed as limited to.

1 is an exploded perspective view showing the configuration of a double-side polishing apparatus;

2 is a plan view of the double-side polishing apparatus,

3 is a cross-sectional view taken along line AA ′ of FIG. 2;

4 is a view showing a crack generated in a carrier to which a conventional single material is applied;

5 is an exploded view of a carrier for a double-side polishing apparatus according to a preferred embodiment of the present invention,

6 is a plan view of a carrier for a double-side polishing apparatus according to a preferred embodiment of the present invention,

7 is a cross-sectional view taken along line BB ′ of FIG. 6;

8 is a plan view of a carrier for a double-side polishing apparatus according to another preferred embodiment of the present invention,

9 is a view showing the configuration of a double-side polishing apparatus to which a carrier according to the present invention is applied.

Claims (13)

In the carrier for the double-side polishing device is installed between the upper and lower plates of the double-side polishing device rotated by a sun gear and an internal gear, A center plate having at least one mounting hole for mounting a wafer and having a plurality of protrusions formed on an outer circumferential surface thereof; And A fitting hole through which the center plate is fitted is formed on the center, and an outer circumferential surface thereof includes a gear part engaged with the sun gear and the internal gear, and includes an outer circumferential plate made of a material having a higher strength than that of the center plate. The groove of the outer circumferential plate is formed with a groove corresponding to the protrusion so as to be fitted with the protrusion, the protrusion and the groove is a carrier for a double-side polishing apparatus, characterized in that formed in the step corresponding to each other. The method of claim 1, wherein the central plate, Carrier for a two-side polishing device, characterized in that formed by containing an epoxy glass (Epoxy glass) material. The method of claim 2, wherein the outer peripheral plate, Carrier for a two-side polishing apparatus, characterized in that formed by including at least one of Sus, Sus DLC or a metal material. delete delete The method of claim 1, wherein the outer peripheral plate, Carrier for a double-side polishing apparatus, characterized in that the distance from the outer peripheral surface of the outer plate to the fitting hole is 10mm to 40mm. In the disk-shaped plate that is installed between the upper and lower plates of the double-side polishing apparatus rotated by the sun gear and the internal gear, Fitting hole to which the center plate is fitted with one or more mounting holes for mounting the wafer: And It is formed on the outer circumferential surface and includes a gear portion engaged with the sun gear and the internal gear, The fitting hole has a groove portion corresponding to the protrusion to be fitted with a plurality of protrusions formed on the outer circumferential surface of the center plate, the protrusion and the groove portion is formed with a step corresponding to each other, and is relatively higher than the material of the center plate A disk-shaped plate characterized in that the material is made of strength. The method of claim 7, wherein the central plate, Disk-shaped plate, characterized in that formed by containing epoxy glass (Epoxy glass) material. The disk-shaped plate of claim 8, Disc-shaped plate characterized in that formed by including one or more of Sus, Sus DLC (Sus DLC) or a metal material. delete delete The method of claim 7, wherein A disk-shaped plate, characterized in that the difference between the outer diameter on the outer peripheral surface and the inner diameter on the fitting hole is 10mm to 40mm. A double-side polishing apparatus comprising the carrier for a double-side polishing apparatus according to any one of claims 1 to 3 and 6.

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