JP2015058501A - Polishing device for workpiece and method of manufacturing workpiece - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing device capable of manufacturing a workpiece small in thickness irregularity.SOLUTION: A polishing device comprises carriers 12, a first polishing pad 21, a second polishing pad 22 and a drive mechanism 14. The carriers 12 have holes 12b. A workpiece 2 is rotatably inserted in the hole 12b. The first polishing pad 21 abuts against one main surface 2a of the workpiece 2. The second polishing pad 22 abuts against the other main surface 2b of the workpiece 2. The drive mechanism 14 rotates the carriers 12 around central axes C2 and revolves the same around a revolution axis C1 lying outside the carriers 12. The first polishing pad 21 is so provided as to generate a period in which the one main surface 2a of the workpiece 2 has a portion abutting against the first polishing pad 21 and a portion not abutting against the first polishing pad 21 when the carriers 12 are driven by the drive mechanism 14.

Description

  The present invention relates to a workpiece polishing apparatus and a workpiece manufacturing method.

  A workpiece such as a glass plate used as a support substrate when polishing a semiconductor member is required to have small thickness unevenness. Patent Document 1 proposes a workpiece polishing apparatus that can reduce unevenness in workpiece thickness.

JP 2011-67905 A

  There is a need for a polishing apparatus that can produce a workpiece with less uneven thickness.

  A main object of the present invention is to provide a polishing apparatus capable of manufacturing a work with small thickness unevenness and a method of manufacturing a work using the polishing apparatus.

  A workpiece polishing apparatus according to the present invention includes a carrier, a first polishing pad, a second polishing pad, and a drive mechanism. The carrier has a hole. A workpiece is rotatably inserted into the hole. The first polishing pad is disposed on one side of the carrier. One main surface of the work contacts the first polishing pad. The second polishing pad is disposed on the other side of the carrier. The other main surface of the work comes into contact with the second polishing pad. The drive mechanism revolves around the revolution axis located outside the carrier while rotating the carrier around the center axis of the carrier. The first polishing pad has a period in which one main surface of the workpiece has a portion that contacts the first polishing pad and a portion that does not contact the first polishing pad when the carrier is driven by the drive mechanism. Is provided to occur.

  The first polishing pad may be provided inside the outer end of the work when the work is farthest from the revolution axis.

  The first polishing pad may be provided outside the inner end of the work when the work is closest to the revolution axis.

  The center of the hole is preferably provided at a position away from the central axis.

  It is preferable that the first polishing pad is located on the upper side in the vertical direction of the carrier.

  The first polishing pad is preferably provided so that the work rotates as the carrier rotates and revolves.

  The drive mechanism includes a sun gear arranged around the revolution axis, an internal gear arranged around the revolution gear around the revolution axis, and a power source for rotating at least one of the sun gear and the internal gear around the revolution axis. The carrier has a carrier gear on the outer periphery, and is provided between the sun gear and the internal gear. The carrier gear may mesh with the sun gear and the internal gear.

  The radius of the first polishing pad is greater than (sungear radius + carrier radius + distance between carrier center axis and hole center), and (sungear radius + carrier radius + carrier center axis and hole). It is preferable that the distance is less than the distance between the outer edges of the two.

  The first polishing pad has an annular shape, and the radius of the inner periphery of the first polishing pad is larger than (the radius of the sun gear + the radius of the carrier−the distance between the center axis of the carrier and the outer end of the hole). , (The radius of the sun gear + the radius of the carrier−the distance between the center axis of the carrier and the center of the hole).

  In the workpiece manufacturing method according to the present invention, both surfaces of the workpiece are polished using the workpiece polishing apparatus.

  ADVANTAGE OF THE INVENTION According to this invention, the grinding | polishing apparatus which can manufacture a workpiece | work with small thickness nonuniformity can be provided.

It is a typical top view of the important section of the polish device of the work concerning a 1st embodiment. It is typical sectional drawing of the line II-II part of FIG. It is a typical top view of the principal part of the polish device of the work concerning a 2nd embodiment. FIG. 4 is a schematic cross-sectional view taken along line IV-IV in FIG. 3.

  Hereinafter, an example of the preferable form which implemented this invention is demonstrated. However, the following embodiment is merely an example. The present invention is not limited to the following embodiments.

  Moreover, in each drawing referred in embodiment etc., the member which has a substantially the same function shall be referred with the same code | symbol. The drawings referred to in the embodiments and the like are schematically described. A ratio of dimensions of an object drawn in a drawing may be different from a ratio of dimensions of an actual object. The dimensional ratio of the object may be different between the drawings. The specific dimensional ratio of the object should be determined in consideration of the following description.

(First embodiment)
FIG. 1 is a schematic plan view of a main part of the workpiece polishing apparatus according to the first embodiment. 2 is a schematic cross-sectional view taken along line II-II in FIG.

  As shown in FIGS. 1 and 2, the workpiece polishing apparatus 1 is for polishing, for example, both surfaces of a workpiece 2 used as a support substrate when polishing a semiconductor member to produce a workpiece 2 with small thickness unevenness. It is a device.

  The material of the workpiece 2 is not particularly limited. The workpiece 2 may be made of, for example, glass, ceramic, resin, or the like.

  The polishing apparatus 1 has a sun gear 10 that is arranged around the revolution axis C1. Around the sun gear 10, an internal gear 11 is arranged around the revolution axis C1. The internal gear 11 and the sun gear 10 are provided concentrically.

  A carrier 12 is provided between the internal gear 11 and the sun gear 10. Specifically, in the present embodiment, the carrier 12 has a disk shape, and a plurality of carriers 12 are arranged at equal intervals along the circumferential direction between the internal gear 11 and the sun gear 10. Each carrier 12 has a carrier gear 12a on the outer periphery. The carrier gear 12a meshes with both the internal gear 11 and the sun gear 10. Each carrier 12 has a central axis C2.

  The polishing apparatus 1 has a power source 13 (see FIG. 2) configured by a motor or the like. The power source 13, the sun gear 10, and the internal gear 11 constitute a drive mechanism 14.

  The power source 13 drives at least one of the internal gear 11 and the sun gear 10 to rotate about the revolution axis C1. Thereby, the carrier 12 revolves around the revolution axis C <b> 1 positioned outside the carrier 12 while rotating around the center axis C <b> 2 of the carrier 12.

  The carrier 12 has at least one hole 12b. Specifically, in the present embodiment, the carrier 12 has a plurality of holes 12b arranged at equal intervals along the circumferential direction. The center of the hole 12b is provided at a position away from the central axis C2. The distance between the center of each hole 12b and the central axis C2 is substantially equal. The workpiece 2 is rotatably inserted into each hole 12b. The shape dimensions of the hole 12b and the workpiece 2 are not particularly limited as long as the workpiece 2 can rotate in the hole 12b. The hole 12b and the workpiece 2 are preferably circular, for example. The inner diameter of the hole 12b is preferably equal to the outer diameter of the workpiece 2. When the inner diameter of the hole 12b is larger than the outer diameter of the work 2, it is preferable that (the inner diameter of the hole 12b) − (the outer diameter of the work 2) ≦ 10 mm.

  The carrier 12 is thinner than the work 2. The workpiece 2 is inserted into the carrier 12 so that the workpiece 2 protrudes from the carrier 12 to both sides in the thickness direction of the carrier 12.

  A first polishing pad 21 is disposed on one side of the carrier 12. The first polishing pad 21 comes into contact with one main surface 2 a of the work 2 inserted into the carrier 12. As the carrier 12 rotates and revolves by the drive mechanism 14, the main surface 2 a of the workpiece 2 is polished by the first polishing pad 21.

  A second polishing pad 22 is disposed on the other side of the carrier 12. The second polishing pad 22 comes into contact with the other main surface 2 b of the workpiece 2 inserted into the carrier 12. As the carrier 12 rotates and revolves by the drive mechanism 14, the main surface 2 b of the workpiece 2 is polished by the second polishing pad 22.

  Note that at least one of the first and second polishing pads 21 and 22 may be rotationally driven by the power source 13.

  By the way, normally, the first polishing pad is provided so as to always contact the entire main surface of the workpiece. The second polishing pad is provided so as to always contact the entire main surface of the workpiece. However, when configured in this way, the thickness unevenness of the workpiece after polishing sometimes increases. In addition, when the workpiece is preferably rotated about the central axis of the workpiece, the thickness unevenness of the workpiece after polishing is reduced, but when the workpiece is not properly rotated, the thickness unevenness of the workpiece after polishing is reduced. Found that it will grow.

  Therefore, in the present embodiment, the first polishing pad 21 is such that the carrier 12 is driven by the drive mechanism 14 and the main surface 2a of the workpiece 2 is the first polishing pad when rotating and revolving. It is provided such that a period having a portion that abuts against the first polishing pad 21 and a portion that does not abut against the first polishing pad 21 occurs. Specifically, in the polishing apparatus 1, the first polishing pad 21 is provided on the inner side of the outer end of the work 2 when the work 2 is at a position farthest from the revolution axis C <b> 1. For this reason, when the work 2 is at the position farthest from the revolution axis C1, a part of the main surface 2a of the work 2 is in contact with the first polishing pad 21, but a part of the main surface 2a is , Does not contact the first polishing pad 21. For this reason, there is a difference in frictional force between a portion where the work 2 is in contact with the first polishing pad 21 and a portion where the work 2 is not in contact with the first polishing pad 21. Due to this difference in frictional force, the workpiece 2 rotates around the central axis C3 of the workpiece 2. Therefore, in the polishing apparatus 1, the work 2 is reliably rotated. Therefore, the occurrence of uneven polishing can be suppressed. As a result, it is possible to obtain a workpiece 2 with small thickness unevenness.

  From the viewpoint of rotating the workpiece 2 more preferably, the main surface 2a has a main surface with respect to the diameter of the workpiece 2 when the area of the main surface 2a of the workpiece 2 that is not in contact with the first polishing pad 21 is the largest. Ratio of length in the diameter direction of a portion of the surface 2a not in contact with the first polishing pad 21 ((length in a diameter direction of a portion of the main surface 2a not in contact with the first polishing pad 21) / (The diameter of the workpiece 2)) is preferably 0.05 to 0.50, and more preferably 0.1 to 0.3.

  The radius of the first polishing pad 21 is larger than (the radius of the sun gear 10 + the radius of the carrier 12 + the distance between the center axis of the carrier 12 and the center of the hole 12b), and (the radius of the sun gear 10 + the radius of the carrier 12). The distance between the central axis of the carrier 12 and the outer end of the hole 12b is preferably less than +.

  In the present embodiment, the example in which the first polishing pad 21 is provided so that a period in which a part of one main surface 2a of the workpiece 2 does not contact the first polishing pad 21 has been described. However, the present invention is not limited to this configuration. For example, the second polishing pad 22 may be provided so that a period in which a part of the other main surface 2b of the work 2 does not contact the second polishing pad 22 occurs. For example, the first polishing pad 21 is provided so that a period in which a part of one main surface 2a of the work 2 does not contact the first polishing pad 21 is generated, and the other of the work 2 is provided on the second polishing pad 22. The second polishing pad 22 may be provided so that a period in which a part of the main surface 2b does not contact is generated.

  For example, the first polishing pad 21 and the second polishing pad 22 may face each other in the horizontal direction. However, from the viewpoint of making the thickness unevenness of the workpiece 2 after polishing smaller and making the abrasive uniform, the second polishing pad 22 is arranged on the lower side in the vertical direction of the workpiece 2, and the first polishing is performed. The pad 21 is arranged on the upper side in the vertical direction of the work 2, and the first polishing pad 21 is provided so that a period in which a part of one main surface 2 a of the work 2 does not contact the first polishing pad 21 occurs. Is preferred.

  In the first embodiment, the example in which the first polishing pad 21 is provided on the inner side than the outer side of the work 2 when the work 2 is farthest from the revolution axis C1 has been described. However, the present invention is not limited to this configuration. For example, as in the polishing apparatus 1a shown in FIGS. 3 and 4, the first polishing pad 21 has an annular shape, and the work 2 is located outside the work 2 when it is closest to the revolution axis C1. It may be provided.

  In that case, when the workpiece 2 is closest to the revolution axis C1, the inner portion of the main surface 2a of the workpiece 2 is not in contact with the first polishing pad 21, while the outer portion is not in contact with the first polishing pad 21. Abut.

  From the viewpoint of more preferably rotating the workpiece 2, the area of the portion of the main surface 2a of the workpiece 2 that is not in contact with the first polishing pad 21 is the largest when the area of the workpiece 2 is the largest. Ratio of length in the diameter direction of a portion of one main surface 2a not in contact with the first polishing pad 21 ((length in a diameter direction of a portion of one main surface 2a not in contact with the first polishing pad 21 ) / (Diameter of the workpiece 2)) is preferably 0.05 to 0.50, and more preferably 0.1 to 0.3.

  The radius of the inner periphery of the first polishing pad 21 is larger than (the radius of the sun gear 10 + the radius of the carrier 12−the distance between the center axis of the carrier 12 and the outer end of the hole 12b), and the radius of the sun gear 10+ The radius of the carrier 12 is preferably less than the distance between the central axis of the carrier 12 and the center of the hole 12b.

  For example, the first polishing pad 21 is provided inside the outside of the workpiece 2 when the workpiece 2 is farthest from the revolution axis C1, and the workpiece when the workpiece 2 is closest to the revolution axis C1. 2 may be provided outside the inside of 2.

  In 1st Embodiment, the hole 12b demonstrated the example provided in the position away from the central axis C2. However, the present invention is not limited to this configuration. For example, as long as the central axis of the hole 12b does not coincide with the central axis C2, the hole 12b may be provided at a position including the central axis C2.

1, 1a: Polishing device 2: Work 2a: One main surface 2b of work: Other main surface 10 of work: Sun gear 11: Internal gear 12: Carrier 12a: Carrier gear 12b: Hall 13: Power source 14: Drive mechanism 21: First polishing pad 22: Second polishing pad C1: Revolving axes C2, C3: Center axis

Claims (10)

A carrier having a hole into which the workpiece is rotatably inserted;
A first polishing pad disposed on one side of the carrier, with which one main surface of the workpiece abuts;
A second polishing pad disposed on the other side of the carrier and in contact with the other main surface of the workpiece;
A drive mechanism that revolves around a revolution axis located outside the carrier while rotating the carrier around the center axis of the carrier;
With
In the first polishing pad, when the carrier is driven by the drive mechanism, one main surface of the workpiece contacts the portion that contacts the first polishing pad and the first polishing pad. An apparatus for polishing a workpiece, which is provided so that a period having a non-contact portion is generated.   The workpiece polishing apparatus according to claim 1, wherein the first polishing pad is provided on an inner side than an outer end of the workpiece when the workpiece is farthest from the revolution axis.   The workpiece polishing apparatus according to claim 1, wherein the first polishing pad is provided on an outer side than an inner end of the workpiece when the workpiece is closest to the revolution axis.   The workpiece polishing apparatus according to claim 1, wherein a center of the hole is provided at a position away from the central axis.   5. The workpiece polishing apparatus according to claim 1, wherein the first polishing pad is positioned on an upper side in a vertical direction of the carrier.   The work polishing apparatus according to claim 1, wherein the first polishing pad is provided so that the work rotates as the carrier rotates and revolves. The drive mechanism is
Sun gear arranged around the revolution axis;
An internal gear arranged around the revolution axis around the sun gear;
A power source for rotating at least one of the sun gear and the internal gear about the revolution axis;
With
The carrier has a carrier gear on the outer periphery,
The carrier is provided between the sun gear and the internal gear,
The workpiece polishing apparatus according to claim 1, wherein the carrier gear meshes with the sun gear and the internal gear.   The radius of the first polishing pad is larger than (the radius of the sun gear + the radius of the carrier + the distance between the center axis of the carrier and the center of the hole), and the radius of the sun gear + the radius of the carrier. The workpiece polishing apparatus according to claim 7, wherein the distance is less than a distance between a central axis of the carrier and an outer end of the hole.   The first polishing pad has an annular shape, and the radius of the inner periphery of the first polishing pad is (the radius of the sun gear + the radius of the carrier−the central axis of the carrier and the outer end of the hole). 9. The workpiece polishing apparatus according to claim 7, wherein the workpiece polishing apparatus is greater than (distance between) and less than (the radius of the sun gear + the radius of the carrier−the distance between the center axis of the carrier and the center of the hole). .   The manufacturing method of a workpiece | work provided with the process of grind | polishing both surfaces of a workpiece | work using the grinding | polishing apparatus of the workpiece | work as described in any one of Claims 1-9.

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