CN113352228B - Wafer grinding device - Google Patents

Wafer grinding device Download PDF

Info

Publication number
CN113352228B
CN113352228B CN202110805056.4A CN202110805056A CN113352228B CN 113352228 B CN113352228 B CN 113352228B CN 202110805056 A CN202110805056 A CN 202110805056A CN 113352228 B CN113352228 B CN 113352228B
Authority
CN
China
Prior art keywords
grinding
wafer
gasket
disc
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202110805056.4A
Other languages
Chinese (zh)
Other versions
CN113352228A (en
Inventor
徐全
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xian Eswin Silicon Wafer Technology Co Ltd
Xian Eswin Material Technology Co Ltd
Original Assignee
Xian Eswin Silicon Wafer Technology Co Ltd
Xian Eswin Material Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xian Eswin Silicon Wafer Technology Co Ltd, Xian Eswin Material Technology Co Ltd filed Critical Xian Eswin Silicon Wafer Technology Co Ltd
Priority to CN202110805056.4A priority Critical patent/CN113352228B/en
Publication of CN113352228A publication Critical patent/CN113352228A/en
Application granted granted Critical
Publication of CN113352228B publication Critical patent/CN113352228B/en
Priority to TW111125441A priority patent/TWI801282B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Abstract

The invention provides a wafer grinding device which comprises an upper grinding disc, a lower grinding disc and a carrier disc, wherein the upper grinding disc and the lower grinding disc are oppositely arranged, and first grinding pads are respectively arranged on the opposite surfaces of the upper grinding disc and the lower grinding disc; the carrier disc is arranged between the upper grinding disc and the lower grinding disc, and is provided with a containing hole for containing a wafer to be ground; the grinding equipment further comprises a gasket and a second grinding pad, the gasket is arranged in the accommodating hole and is annular, and the outer wall of the gasket is abutted against the inner wall of the accommodating hole; the second grinding pad is annular, and the second grinding pad sets up in the accommodation hole, and the outer wall of second grinding pad and the inner wall butt of packing ring. According to the embodiment of the invention, the gasket and the second grinding pad are arranged on the carrying disc, so that the wafer positioned in the accommodating hole is prevented from directly contacting the carrying disc through the gasket and the second grinding pad, and meanwhile, a certain buffering effect can be achieved, the wafer is protected, and the possibility of wafer damage is reduced.

Description

Wafer grinding device
Technical Field
The invention relates to the field of semiconductor processing, in particular to wafer grinding equipment.
Background
The surface of the wafer is usually ground in the processing process so as to improve the flatness of the surface, remove the damage on the surface and meet the subsequent processing requirements. The grinding of the wafer mainly comprises two processes of double-side grinding and edge grinding, wherein the double-side grinding refers to the simultaneous grinding of the upper surface and the lower surface of a thin cylindrical wafer, and the edge grinding refers to the grinding of the side surface of the wafer to form a chamfer with a specific shape. In the double-sided grinding process, the wafer needs to be arranged on the carrying disc, and then the carrying disc is arranged between the grinding discs which are oppositely arranged, so that the carrying disc rotates relative to the grinding disc, and the wafer is ground by the grinding pad arranged on the grinding disc. The carrier plate is usually made of metal and has high hardness, so that the wafer can be damaged due to uneven stress during grinding.
Disclosure of Invention
The embodiment of the invention provides a wafer grinding device, which aims to solve the problem that a wafer is possibly damaged due to uneven stress in the grinding process.
The embodiment of the invention provides wafer grinding equipment which comprises an upper grinding disc, a lower grinding disc and a carrier disc, wherein the upper grinding disc and the lower grinding disc are oppositely arranged, and the opposite surfaces of the upper grinding disc and the lower grinding disc are respectively provided with a first grinding pad; the carrier disc is arranged between the upper grinding disc and the lower grinding disc, and a containing hole for containing a wafer to be ground is formed in the carrier disc;
the grinding equipment further comprises a gasket and a second grinding pad, the gasket is arranged in the accommodating hole and is annular, and the outer wall of the gasket is abutted against the inner wall of the accommodating hole;
the second grinding pad is annular, the second grinding pad is arranged in the accommodating hole, and the outer wall of the second grinding pad is abutted to the inner wall of the gasket.
In some embodiments, the inner wall of the second polishing pad includes a first portion that is arcuate, a second portion between the first portion and the upper surface of the second polishing pad, and a third portion between the first portion and the lower surface of the second polishing pad, the second portion and the third portion each connecting to the first portion in a direction tangential to the first portion.
In some embodiments, the second polishing pad includes a first portion having a straight line shape, a second portion located between the first portion and an upper surface of the second polishing pad, and a third portion located between the first portion and a lower surface of the second polishing pad, the first portion extending in a thickness direction of the second polishing pad, the first portion and the second portion being connected by a chamfer structure, and the first portion and the third portion being connected by a chamfer structure.
In some embodiments, the second portion and the third portion each extend along a straight line; or
The second part and the third part are both arc-shaped, and the centers of circles of the second part and the third part are both positioned on one side far away from the grinding pad.
In some embodiments, the shape of the inner wall of the gasket is the same as the shape of the inner wall of the second polishing pad.
In some embodiments, the carrier plate further includes a limiting member, the limiting member has at least a first operating position and a second operating position, in the first operating position, the limiting member abuts against the outer wall of the gasket or the outer wall of the second polishing pad to limit the rotation of the wafer to be polished, and in the second operating position, the limiting member is separated from both the outer wall of the gasket and the outer wall of the second polishing pad.
In some embodiments, the outer part of the carrier disc is provided with an outer gear which is meshed with the planet gears and an inner gear, wherein the inner gear is arranged on the lower grinding disc;
the external gear comprises a position avoiding part, and one end of the limiting part, which is far away from the gasket, is arranged at the position avoiding part;
the internal gear comprises a driving piece corresponding to the position avoiding position, the driving piece at least comprises a third working position and a fourth working position, when the driving piece is located at the third working position, the carrying disc is separated from the driving piece in the rotating process, and when the driving piece is located at the fourth working position, the carrying disc is in the rotating process, the driving piece is in contact with the limiting piece so that the limiting piece moves to the first working position.
In some embodiments, a limiting groove is formed in an inner wall of the accommodating hole, the outer wall of the gasket includes a limiting portion matched with the limiting groove in shape, and the limiting portion is matched with the limiting groove to enable the gasket to be fixedly connected with the carrying disc.
In some embodiments, the gasket has a width of 3.5 to 4 millimeters.
In some embodiments, the gasket includes a first surface facing the upper abrasive disk and a second surface facing the lower abrasive disk, a first stiffening ring is disposed on the first surface, a second stiffening ring is disposed on the second surface, a distance between the first stiffening ring and the second stiffening ring is less than or equal to a thickness of the carrier disk, and a width of each of the first stiffening ring and the second stiffening ring is less than a width of the gasket.
According to the embodiment of the invention, the gasket and the second grinding pad are arranged on the carrying disc, so that the wafer positioned in the accommodating hole is prevented from directly contacting with the carrying disc through the gasket and the second grinding pad, meanwhile, a certain buffering effect can be achieved, the wafer is protected, the possibility of damage of the wafer is reduced, meanwhile, the edge of the wafer can be pre-ground simultaneously in the process of grinding the surface of the wafer through the arrangement of the second grinding pad, a part of materials positioned at the edge of the wafer are removed, the time required by subsequent edge grinding is saved, and the production efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a schematic view of a wafer polishing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a boat in an embodiment of the present invention;
FIG. 3 is a schematic view of another embodiment of a boat of the present invention;
FIG. 4 is a schematic view of a washer according to an embodiment of the present invention;
FIG. 5 is a schematic view of a second polishing pad according to an embodiment of the present invention;
FIG. 6 is a schematic view of a second polishing pad according to an embodiment of the present invention;
FIG. 7 is a schematic view of a second polishing pad according to an embodiment of the present invention;
FIG. 8 is a schematic view of the engagement of the boat and the driving member in one embodiment of the present invention;
FIG. 9 is a schematic view of the engagement of the boat and the driving member in one embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. Without conflict, the embodiments described below and features of the embodiments may be combined with each other. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a wafer grinding device which is used for double-side grinding of wafers.
As shown in fig. 1, in one embodiment, the wafer polishing apparatus includes an upper polishing disk 10, a lower polishing disk 20 and a carrier disk 30, wherein the upper polishing disk 10 and the lower polishing disk 20 are disposed opposite to each other, and first polishing pads 11 are disposed on opposite surfaces of the upper polishing disk 10 and the lower polishing disk 20, respectively; the carrier plate 30 is disposed between the upper polishing plate 10 and the lower polishing plate 20, and as shown in fig. 2 and 3, the carrier plate 30 has a receiving hole 31 for receiving a wafer to be polished.
With reference to fig. 1, the wafer polishing apparatus further includes a sun gear 21, a gear is disposed outside the sun gear 21, as shown in fig. 2, an external gear 32 is disposed on the outer circumference of the carrier plate 30, as shown in fig. 1, an internal gear 22 is disposed on the lower polishing plate 20, and the external gear 32 of the carrier plate 30 is engaged with both the sun gear 21 and the internal gear 22 of the lower polishing plate 20.
When the sun gear 21 rotates, the carrier plate 30 can be driven to rotate around the sun gear 21, the carrier plate 30 can rotate around the axis of the carrier plate 30 while revolving around the sun gear 21, and meanwhile, the upper grinding plate 10 can also rotate around the axis of the carrier plate, so that the upper surface of a wafer in the carrier plate 30 can be ground through the first grinding pad 11 fixed on the upper grinding plate 10, and the lower surface of the wafer can be ground through the first grinding pad 11 fixed on the lower grinding plate 20, thereby realizing the double-side grinding process of the wafer.
The polishing apparatus further comprises a gasket 33 and a second polishing pad 34. The gasket 33 is disposed in the receiving hole 31, the gasket 33 is annular, and an outer wall of the gasket 33 abuts against an inner wall of the receiving hole 31.
The washer 33 is made of a material having a hardness close to that of a silicon wafer, for example, PVDF (polyvinylidene fluoride), etc., it should be understood that the carrier plate 30 is generally made of a metal material, and the hardness of the metal material is high, so that if the carrier plate 30 directly contacts with a wafer, the wafer may crack due to local stress concentration, and by providing the washer 33, the wafer can be prevented from directly contacting with the carrier plate 30, thereby improving the protection effect on the wafer and contributing to improving the flatness of the wafer.
The wafer polishing apparatus of the present embodiment further includes a second polishing pad 34, the second polishing pad 34 is annular, the second polishing pad 34 is disposed in the accommodating hole 31, and an outer wall of the second polishing pad 34 abuts against an inner wall of the gasket 33.
As shown in fig. 3, the second polishing pad 34 has substantially the same shape as the gasket 33, the second polishing pad 34 has a substantially annular shape, and the size of the second polishing pad 34 is slightly smaller than that of the gasket 33, so that the second polishing pad 34 can be accommodated in the annular gasket 33.
It should be noted that in the related art, edge grinding is usually performed by using a polishing drum rather than a polishing pad, in this embodiment, the first polishing pad 11 mainly uses the upper and lower surfaces thereof to grind the surface of the wafer, and the second polishing pad 34 uses the inner wall thereof to perform edge grinding on the edge of the wafer.
In the present embodiment, the second polishing pad 34 is used for pre-polishing the edge of the wafer, and the inventors of the present application have found through research that, during the double-side polishing process, the wafer may also rotate to a certain degree with respect to the carrier plate 30 along with the rotation of the carrier plate 30, and by providing the second polishing pad 34, the material at the edge portion of the wafer can be reduced to a certain extent, the process time of the double-side polishing is fully utilized, so that the amount of material to be reduced during the subsequent edge polishing is reduced, and the time required for the edge polishing is shortened.
According to the embodiment of the invention, the gasket 33 and the second grinding pad 34 are arranged on the carrier disc 30, so that the wafer in the accommodating hole 31 is prevented from directly contacting the carrier disc 30 through the gasket 33 and the second grinding pad 34, meanwhile, a certain buffering effect can be achieved, the wafer is protected, the possibility of damage of the wafer is reduced, meanwhile, the edge of the wafer can be pre-ground simultaneously in the process of grinding the surface of the wafer through the second grinding pad 34, a part of materials on the edge of the wafer are removed, the time required by subsequent edge grinding is saved, and the production efficiency is improved.
As shown in fig. 5, in some embodiments, the wafer to be manufactured is an R-type chamfered wafer, the inner wall of the second polishing pad 34 includes a first portion 341 having an arc shape, a second portion 342 located between the first portion 341 and the upper surface of the second polishing pad 34, and a third portion 343 located between the first portion 341 and the lower surface of the second polishing pad 34, and the second portion 342 and the third portion 343 are connected to the first portion 341 along a direction tangential to the first portion 341.
The inner wall of the second polishing pad 34 refers to a side surface of the second polishing pad 34 near the center of the ring structure, the upper surface refers to a side surface facing the upper polishing disk 10, and the lower surface refers to a side surface facing the lower polishing disk 20.
For a wafer with an R-shaped chamfer, the edge of the wafer is generally arc-shaped, and accordingly, the second polishing pad 34 includes the first portion 341 with arc-shaped, so that the wafer can be pre-polished by the second polishing pad 34 to have a side surface with generally arc-shaped, thereby reducing the time of the subsequent edge polishing process.
As shown in fig. 6, in other embodiments, the wafer to be manufactured is a T-chamfered wafer, the second polishing pad 34 includes a first portion 341 having a straight line shape, a second portion 342 located between the first portion 341 and the upper surface of the second polishing pad 34, and a third portion 343 located between the first portion 341 and the lower surface of the second polishing pad 34, the first portion 341 extends along the thickness direction of the second polishing pad 34, the first portion 341 and the second portion 342 are connected by a chamfer structure, and the first portion 341 and the third portion 343 are connected by a chamfer structure.
Different from the embodiment shown in fig. 5, the second polishing pad 34 of the present embodiment is directed to a wafer with a T-shaped chamfer, and a part of the edge of the wafer with the T-shaped chamfer extends substantially along the thickness direction of the wafer, so that by providing the first portion 341 in a linear shape, the edge of the wafer obtained by polishing can substantially conform to the shape of the T-shaped chamfer, so as to improve the efficiency of subsequent edge polishing and reduce the process time.
Thus, the embodiment of the invention can meet the requirement of manufacturing wafers with chamfers of different shapes by setting the shape of the inner wall of the second polishing pad 34, and improves the applicability and the universality.
Referring to fig. 5 and 7, in some embodiments, as shown in fig. 5, the second portion 342 and the third portion 343 may extend along a straight line, so that the edge shape of the wafer obtained by grinding is substantially the same as the edge shape of the wafer to be manufactured, and further, the wafer can be manufactured by edge grinding with higher precision. In other embodiments, as shown in fig. 7, the second portion and the third portion are arc-shaped, and the centers of the second portion and the third portion are located at the side away from the polishing pad. According to the embodiment, more allowance can be reserved for the edge so as to remove possible damage, so that the accuracy of subsequent edge grinding is improved, and the quality of the wafer is improved.
The inner wall of the gasket 33 refers to a side surface of the gasket 33 facing the second polishing pad 34. In some embodiments, the shape of the inner wall of the gasket 33 is the same as that of the inner wall of the second polishing pad 34, and accordingly, the shape of the side surface of the second polishing pad 34 facing the gasket 33 (or the outer wall of the second polishing pad 34) is the same, so that the matching effect of the second polishing pad 34 and the gasket 33 can be improved, and at the same time, when the process is needed, the second polishing pad 34 can be removed and only the gasket 33 is remained, so that the protection effect on the wafer can be improved by the inner wall of the gasket 33 having the specific shape.
In other embodiments, for convenience of processing, the outer wall of the second polishing pad 34 may be a plane, that is, the outer wall of the second polishing pad 34 extends in a direction perpendicular to the surface of the carrier plate 30, and the bonding layer may fill between the second polishing pad 34 and the gasket 33, and at the same time, the fixed connection between the second polishing pad 34 and the gasket 33 can be achieved.
As shown in fig. 3, in some embodiments, the inner wall of the accommodating hole 31 is provided with a limiting groove 311, the outer wall of the washer 33 includes a limiting portion 331 with a shape matching with the limiting groove 311, and the washer 33 can be fixedly connected to the carrier disc 30 by arranging the limiting portion 331 to match with the limiting groove 311, so as to prevent the relative rotation between the washer 33 and the carrier disc 30 when the carrier disc 30 rotates.
In some embodiments, the width of the washer 33 is 3.5 to 4 mm, and by controlling the width of the washer 33, the dispersion effect of the washer 33 on the transmission of the force can be improved, and the wafer damage caused by the over-concentrated force from the carrier plate 30 acting on a certain local position can be avoided.
In some embodiments, the washer 33 comprises a first surface facing the upper abrasive disk 10 on which a first stiffening ring is provided and a second surface facing the lower abrasive disk 20 on which a second stiffening ring is provided, the width of each of the first and second stiffening rings being smaller than the width of the washer 33.
It should be understood that the double-side grinding process usually needs to be continued for a long time, and the carrier plate 30 needs to be continuously moved between the upper grinding plate 10 and the lower grinding plate 20, which is equivalent to the continuous polishing process for the upper and lower surfaces of the carrier plate 30, so that, in order to avoid the damage of the gasket 33, a first reinforcing ring and a second reinforcing ring are further provided in the present embodiment, and the first reinforcing ring and the second reinforcing ring may be made of metal and have a substantially annular shape, so as to protect both surfaces of the gasket 33 during the double-side grinding process for the wafer.
Further, the distance between the first reinforcement ring and the second reinforcement ring is smaller than or equal to the thickness of the boat 30, where the distance between the first reinforcement ring and the second reinforcement ring refers to the distance between the upper surface of the first reinforcement ring and the lower surface of the second reinforcement ring, and may also be understood as the thickness of the washer 33 to which the first reinforcement ring and the second reinforcement ring are attached. By controlling the thickness of the gasket 33 to be less than or equal to the thickness of the carrier disc 30, the pressure and friction between the gasket 33 and the polishing pad during double-sided polishing can be reduced, thereby achieving the effect of reducing the abrasion of the gasket 33.
As shown in fig. 8 and 9, in some embodiments, the carrier plate 30 further includes a limiting member 35, and the limiting member 35 has at least a first working position and a second working position, as shown in fig. 9, in the first working position, the limiting member 35 abuts against the outer wall of the gasket 33 or the outer wall of the second polishing pad 34 to limit the rotation of the wafer to be polished, as shown in fig. 8, in the second working position, the limiting member 35 is separated from both the outer wall of the gasket 33 and the outer wall of the second polishing pad 34, and it can also be understood that the limiting member 35 does not apply a pushing force to the gasket 33 or the second polishing pad 34.
It should be understood that the duration of the double-side grinding is usually long, and may be several hours or even longer, in the process, if the grinding is continuously performed on the edge of the double-side grinding, the grinding may be excessive, and therefore, a limit member 35 is further provided in the present embodiment.
As shown in fig. 8, in the second working position, the limiting member 35 is separated from both the outer wall of the gasket 33 and the outer wall of the second polishing pad 34, and at this time, the limiting member 35 does not affect the wafer.
As shown in fig. 9, when the limiting member 35 moves to the first working position, the limiting member 35 presses the washer 33 or the second polishing pad 34 from the outside, which is equivalent to applying a pressure along the normal direction of the wafer, and due to the existence of the pressure, the pressure between the wafer and the second polishing pad 34 increases, which further increases the friction between the wafer and the second polishing pad 34 to limit the wafer from continuing to rotate, and at this time, the wafer and the second polishing pad 34 do not rotate, which is equivalent to terminating the edge polishing of the wafer.
Referring to fig. 8 and 9, in some embodiments, the carrier plate 30 is provided with an external gear 32 on the outside, and the external gear 32 is engaged with the planet gears and the internal gear 22, wherein the internal gear 22 is arranged on the lower grinding plate 20.
It will be appreciated that in actual operation, the inner and outer gears 22, 32 should mesh, and that in figures 8 and 9 the inner and outer gears 22, 32 are shown only in a spaced apart relationship to more clearly illustrate the position of the stop member 35 and the drive member 221.
The external gear 32 comprises a position avoiding part 321, and one end of the limiting part 35, which is far away from the washer 33, is arranged on the position avoiding part 321; the internal gear 22 includes a driving member 221 corresponding to the position of the avoiding portion 321, and the driving member 221 has at least a third operating position and a fourth operating position.
As shown in fig. 8, when the driving member 221 is located at the third working position, the carrier plate 30 is separated from the driving member 221 during the rotation process, as shown in fig. 9, when the driving member 221 is located at the fourth working position, the driving member 221 contacts the position-limiting member 35 during the rotation process of the carrier plate 30, so that the position-limiting member 35 moves to the first working position.
It should be understood that the double-side polishing of the wafer needs to be continuously performed, and in order to avoid interference with the double-side polishing process, the position-limiting member 35 is disposed inside the carrier plate 30 in the present embodiment.
In order to drive the boat 30 to rotate, an external gear 32 is provided outside the boat 30, and in order to avoid interference with the rotation of the boat 30, a relief portion 321 is further provided at the external gear 32 in the present embodiment.
As shown in fig. 8 and 9, in an embodiment, the avoiding portion 321 is a notch located at the center of the thickness direction of the carrier plate 30, and the upper and lower sides of the notch can still achieve the functions required by the gear without affecting the normal transmission effect.
The stopper 35 is substantially rod-shaped, and has one end facing the outer wall of the washer 33 and the other end located at the stopper 321. When the limiting member 35 is pressed from the outside, the limiting member moves to a side close to the gasket 33, presses the gasket 33 or the second polishing pad 34 and is fixed at the first working position, so that the limiting effect on the wafer is realized, and after polishing is finished, the limiting member can be manually reset to the second working position by a worker.
It should be understood that the distance between the upper grinding disk 10 and the lower grinding disk 20 is small, and the grinding process is not stopped or interrupted in the middle, and a driving member 221 is further provided to drive the limiting member 35 to move to the second working position.
In one embodiment, the inner gear 22 of the lower polishing disk 20 is provided with a position-avoiding opening 222 corresponding to the position of the position-avoiding portion 321 of the inner gear 22, the driving member 221 is substantially arc-shaped and distributed along the position-avoiding opening 222, the length of the driving member 221 is greater than the circumference of the carrier disk 30, so that, during the rotation of the carrier disk 30, the driving member 221 is inevitably brought into contact with the position-limiting member 35, so as to drive the position-limiting member 35 to move to the second working position through the driving member 221.
In use, the driving member 221 is firstly located at a position far away from the avoiding opening 222, so that during the rotation of the carrier plate 30, the driving member 221 is separated from the limiting member 35, the limiting member 35 is not moved to the second working position, and a normal edge grinding function can be realized.
According to the embodiment of the invention, the gasket 33 and the second grinding pad 34 are arranged on the carrier disc 30, so that the wafer in the accommodating hole 31 is prevented from directly contacting the carrier disc 30 through the gasket 33 and the second grinding pad 34, meanwhile, a certain buffering effect can be achieved, the wafer is protected, the possibility of damage of the wafer is reduced, meanwhile, the edge of the wafer can be pre-ground simultaneously in the process of grinding the surface of the wafer through the second grinding pad 34, a part of materials on the edge of the wafer are removed, the time required by subsequent edge grinding is saved, and the production efficiency is improved.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (9)

1. The wafer grinding equipment is characterized by comprising an upper grinding disc, a lower grinding disc and a carrier disc, wherein the upper grinding disc and the lower grinding disc are oppositely arranged, and the opposite surfaces of the upper grinding disc and the lower grinding disc are respectively provided with a first grinding pad; the carrier disc is arranged between the upper grinding disc and the lower grinding disc, and a containing hole for containing a wafer to be ground is formed in the carrier disc;
the grinding equipment further comprises a gasket and a second grinding pad, the gasket is arranged in the accommodating hole and is annular, and the outer wall of the gasket is abutted against the inner wall of the accommodating hole;
the second grinding pad is annular and is arranged in the accommodating hole, and the outer wall of the second grinding pad is abutted against the inner wall of the gasket;
the carrier disc further comprises a limiting piece, the limiting piece is at least provided with a first working position and a second working position, the limiting piece abuts against the outer wall of the gasket or the outer wall of the second grinding pad to limit the rotation of the wafer to be ground, and the limiting piece is separated from the outer wall of the gasket and the outer wall of the second grinding pad at the second working position.
2. The wafer polishing apparatus of claim 1, wherein the inner wall of the second polishing pad includes a first portion having an arc shape, a second portion between the first portion and the upper surface of the second polishing pad, and a third portion between the first portion and the lower surface of the second polishing pad, the second portion and the third portion each being connected to the first portion in a direction tangential to the first portion.
3. The wafer polishing apparatus as set forth in claim 1 wherein the second polishing pad includes a first portion having a straight line shape, a second portion between the first portion and an upper surface of the second polishing pad, and a third portion between the first portion and a lower surface of the second polishing pad, the first portion extending in a thickness direction of the second polishing pad, the first portion and the second portion being connected by a chamfered structure, and the first portion and the third portion being connected by a chamfered structure.
4. The wafer polishing apparatus as set forth in claim 2 or 3 wherein the second portion and the third portion each extend in a straight line; or
The second part and the third part are both arc-shaped, and the centers of circles of the second part and the third part are both positioned on one side far away from the grinding pad.
5. The wafer polishing apparatus as set forth in claim 4 wherein the gasket has an inner wall of the same shape as an inner wall of the second polishing pad.
6. The wafer grinding apparatus according to claim 1, wherein the outer part of the carrier plate is provided with an external gear which meshes with a sun gear and an internal gear, wherein the internal gear is provided on the lower grinding plate;
the external gear comprises a position avoiding part, and one end of the limiting part, which is far away from the gasket, is arranged at the position avoiding part;
the internal gear comprises a driving piece corresponding to the position avoiding position, the driving piece at least comprises a third working position and a fourth working position, when the driving piece is located at the third working position, the carrying disc is separated from the driving piece in the rotating process, and when the driving piece is located at the fourth working position, the carrying disc is in the rotating process, the driving piece is in contact with the limiting piece so that the limiting piece moves to the first working position.
7. The wafer grinding device as claimed in claim 1, wherein a limiting groove is formed in an inner wall of the accommodating hole, the outer wall of the gasket includes a limiting portion matched with the limiting groove in shape, and the limiting portion is matched with the limiting groove to enable the gasket to be fixedly connected with the carrier disc.
8. The wafer polishing apparatus as set forth in claim 7 wherein the washer has a width of 3.5 to 4 mm.
9. The wafer grinding apparatus of claim 1, wherein the gasket includes a first surface facing the upper grinding disk and a second surface facing the lower grinding disk, a first reinforcing ring is disposed on the first surface, a second reinforcing ring is disposed on the second surface, a distance between an upper surface of the first reinforcing ring and a lower surface of the second reinforcing ring is less than or equal to a thickness of the carrier disk, and a width of each of the first reinforcing ring and the second reinforcing ring is less than a width of the gasket.
CN202110805056.4A 2021-07-16 2021-07-16 Wafer grinding device Active CN113352228B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202110805056.4A CN113352228B (en) 2021-07-16 2021-07-16 Wafer grinding device
TW111125441A TWI801282B (en) 2021-07-16 2022-07-07 A wafer grinding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110805056.4A CN113352228B (en) 2021-07-16 2021-07-16 Wafer grinding device

Publications (2)

Publication Number Publication Date
CN113352228A CN113352228A (en) 2021-09-07
CN113352228B true CN113352228B (en) 2022-06-24

Family

ID=77539819

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110805056.4A Active CN113352228B (en) 2021-07-16 2021-07-16 Wafer grinding device

Country Status (2)

Country Link
CN (1) CN113352228B (en)
TW (1) TWI801282B (en)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2605230B2 (en) * 1994-12-27 1997-04-30 弘至 川島 Wrapping device and method of manufacturing the same
JPH11138428A (en) * 1997-10-31 1999-05-25 Kashiwara Machine Mfg Co Ltd Wafer polishing device and carrier
JP2001138221A (en) * 1999-11-12 2001-05-22 Toshiba Ceramics Co Ltd Carrier for wrapping of semiconductor wafer
TW507260B (en) * 2000-08-08 2002-10-21 Memc Electronic Materials Spa Method and apparatus for a wafer carrier having an insert
TW200422138A (en) * 2003-03-20 2004-11-01 Shinetsu Handotai Kk Wafer-retaining carrier, double side-grinding device using the same, and double side-grinding method for wafer
CN1993206A (en) * 2004-08-02 2007-07-04 昭和电工株式会社 Method of manufacturing polishing carrier and silicon substrate for magnetic recording medium, and silicon substrate for magnetic recording medium
CN101905442B (en) * 2009-06-03 2014-12-24 不二越机械工业株式会社 Double-side polishing apparatus, method for polishing both sides of wafer and carrier of apparatus
CN110181355A (en) * 2019-06-27 2019-08-30 西安奕斯伟硅片技术有限公司 A kind of grinding device, grinding method and wafer
CN110871399A (en) * 2018-08-29 2020-03-10 东泰高科装备科技（北京）有限公司 Planetary wheel and polishing method
CN212062392U (en) * 2020-05-26 2020-12-01 长江存储科技有限责任公司 Measuring device
CN112454017A (en) * 2020-11-25 2021-03-09 西安奕斯伟硅片技术有限公司 Silicon wafer polishing method and silicon wafer polishing equipment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2891894B2 (en) * 1995-03-30 1999-05-17 大陽東洋酸素株式会社 Substrate rotating device
JP3379097B2 (en) * 1995-11-27 2003-02-17 信越半導体株式会社 Double-side polishing apparatus and method
JP2003305637A (en) * 2002-04-15 2003-10-28 Shirasaki Seisakusho:Kk Holder for polishing of brittle thin plate
KR100506814B1 (en) * 2003-01-15 2005-08-09 삼성전자주식회사 Apparatus for polishing a wafer
DE102007056628B4 (en) * 2007-03-19 2019-03-14 Siltronic Ag Method and apparatus for simultaneously grinding a plurality of semiconductor wafers

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2605230B2 (en) * 1994-12-27 1997-04-30 弘至 川島 Wrapping device and method of manufacturing the same
JPH11138428A (en) * 1997-10-31 1999-05-25 Kashiwara Machine Mfg Co Ltd Wafer polishing device and carrier
JP2001138221A (en) * 1999-11-12 2001-05-22 Toshiba Ceramics Co Ltd Carrier for wrapping of semiconductor wafer
TW507260B (en) * 2000-08-08 2002-10-21 Memc Electronic Materials Spa Method and apparatus for a wafer carrier having an insert
TW200422138A (en) * 2003-03-20 2004-11-01 Shinetsu Handotai Kk Wafer-retaining carrier, double side-grinding device using the same, and double side-grinding method for wafer
CN1993206A (en) * 2004-08-02 2007-07-04 昭和电工株式会社 Method of manufacturing polishing carrier and silicon substrate for magnetic recording medium, and silicon substrate for magnetic recording medium
CN101905442B (en) * 2009-06-03 2014-12-24 不二越机械工业株式会社 Double-side polishing apparatus, method for polishing both sides of wafer and carrier of apparatus
CN110871399A (en) * 2018-08-29 2020-03-10 东泰高科装备科技（北京）有限公司 Planetary wheel and polishing method
CN110181355A (en) * 2019-06-27 2019-08-30 西安奕斯伟硅片技术有限公司 A kind of grinding device, grinding method and wafer
CN212062392U (en) * 2020-05-26 2020-12-01 长江存储科技有限责任公司 Measuring device
CN112454017A (en) * 2020-11-25 2021-03-09 西安奕斯伟硅片技术有限公司 Silicon wafer polishing method and silicon wafer polishing equipment

Also Published As

Publication number Publication date
TWI801282B (en) 2023-05-01
TW202241643A (en) 2022-11-01
CN113352228A (en) 2021-09-07

Similar Documents

Publication Publication Date Title
TWI515783B (en) Processing method of semiconductor wafers
JP5233888B2 (en) Method for manufacturing carrier for double-side polishing apparatus, carrier for double-side polishing apparatus and double-side polishing method for wafer
EP2042267A1 (en) Carrier for double side polishing device, and double side polishing device and double side polishing method using the carrier
CN110181355B (en) Grinding device, grinding method and wafer
US20060128276A1 (en) Carrier for double side polishing
JP2013078808A (en) Polishing apparatus and polishing method
US11453098B2 (en) Carrier for double-side polishing apparatus, double-side polishing apparatus, and double-side polishing method
WO2005070619A1 (en) Method of grinding wafer and wafer
CN113352228B (en) Wafer grinding device
JP3613345B2 (en) Polishing apparatus and carrier for polishing apparatus
CN108349058B (en) Bearing ring, grinding device and grinding method
JP2014104522A (en) Single-side processing method of wafer and production method of wafer
CN210255700U (en) Grinding wheel with floating following compensation device
JP3872967B2 (en) Double-side polishing apparatus, double-side polishing method and double-side polishing support member
JPH11254303A (en) Lapping machine
JP2012183618A (en) Polishing device
JP2000015565A (en) Carrier
KR102150157B1 (en) Carrier for Wafer Lapping Device
KR101026574B1 (en) Carrier for double side polishing apparatus and plate used in the same and Apparatus for double side polishing
KR100901019B1 (en) Double side polishing and polishing method having the same
JP4290295B2 (en) Double-side polishing template and double-side polishing method using the same
JPH11333707A (en) Carrier
JP3587505B2 (en) Polishing carrier
TW201503283A (en) Semiconductor waver holding jig, semiconductor waver polishing apparatus, and work holding jig
JP4352909B2 (en) Polishing apparatus, carrier for polishing apparatus and polishing method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065

Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd.

Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd.

Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065

Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd.

Patentee before: Xi'an yisiwei Material Technology Co.,Ltd.