CN110181355A - A kind of grinding device, grinding method and wafer - Google Patents
A kind of grinding device, grinding method and wafer Download PDFInfo
- Publication number
- CN110181355A CN110181355A CN201910567467.7A CN201910567467A CN110181355A CN 110181355 A CN110181355 A CN 110181355A CN 201910567467 A CN201910567467 A CN 201910567467A CN 110181355 A CN110181355 A CN 110181355A
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- Prior art keywords
- ground
- fixed disk
- carrier
- guiding ring
- grinding
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
It includes: upper fixed disk that the present invention, which provides a kind of grinding device, grinding method and wafer, the device,；Lower fixed disk；Carrier is set between upper fixed disk and lower fixed disk, and carrier is equipped with multiple carrying disk hole, is carried in disk hole and is carried element to be ground；Driving mechanism, under driving mechanism driving, carrier revolves around own axes rotation, and around the center of lower fixed disk, is moved with opposite upper fixed disk, lower fixed disk, grinds element to be ground；Edge guiding ring is provided in carrying disk hole, element housing to be ground is set in edge guiding ring, and is arranged in carrying disk hole in such a way that opposite carrying disk hole can be move freely, so as to drive the movement of edge guiding ring when element to be ground moves during the grinding process.The mechanical damage collision of grinding device, grinding method and wafer of the invention, the edge for enabling to such as wafer to wait grinding element surface relatively fragile minimizes, and can also improve thus caused element to be ground and fracture and fraction defect incidence.
Description
Technical field
The present invention relates to semiconductor material manufacturing field more particularly to a kind of grinding devices, grinding method and wafer.
Background technique
As the material of semiconductor element manufacture, Silicon Wafer (Si wafer) is widely used.Silicon Wafer is in silicon face
Grow the wafer of silicon of the same race.Silicon Wafer is conducive to because it keeps the purity in semiconductor integrated region and crystallization property outstanding
The yield and element characteristic of semiconductor devices (device) and widely utilized.
In general, wafer manufacturing process can substantially be divided into slice (slicing), edge grind (edge grinding), grind
Grind (lapping), aggressive etch (caustic etching), double-side grinding (double side grinding), two-sided throwing
Light (double side polishing), edge polishing (edge polishing), final polishing (final polishing)
Etc. processes.Wherein, in slicing process, usually pass through Czochralski czochralski method using scroll saw (wire saw) etc.
The methods of (Czozhralski) the columnar silicon single crystal ingot of growth, is cut to wafer form, cut-off crystal column surface and
Periphery pattern can not be formed uniformly, and presentation is irregular, will therefore, it is necessary to be ground its outer peripheral surface by edge grind process
The round with predetermined diameter size is made in the global shape of wafer, while passing through the edge pattern (edge shape) of wafer
Processing impaired leads to fragmentation phenomenon preventing crystal round fringes in subsequent grinding process and the collision of grinding carrier.It is grinding
In process, in order to improve crystal column surface kerf generated in slicing process (saw mark) etc., and the flatness of wafer is improved,
And it is ground.In aggressive etch process later, implement chemical etching with alkaline etching liquid, in removal grinding engineering
Mechanical damage (damage).Then, again by the secondary engineering removal of edge grind (edge grinding) by grinding
(lapping) and when etching (etching) engineering it is not removed and the chipping (chip) at remaining crystal round fringes position, crackle
(crack) surface defect states such as, and by make the edge contour of wafer according to customer requirement rule it is declinable in a manner of processed.
Wherein, in the prior art, although carrying out edge grind (edge before grinding (lapping) process
Grinding operation before), but crystal round fringes (wafer edge) can still be touched with grinding (lapping) carrier (carrier)
It hits and wafer occurs and fractures the situation of (wafer broken).By analyzing in previous technique in grinding (lapping) process
The wafer fragmentation (wafer broken) and chipping (chip) type of generation, find the crystallization direction fragmentation (broken) of wafer
Ratio of defects accounts for larger proportion, and the marking damage of grinding (lapping) process cause is also presented in fragment (chip) defect
(damage), in this way, it can be determined that the reason of wafer fragmentation is, although being processed wafer before grinding (lapping) operation
Edge, but in grinding (lapping) operation process, wafer causes in the rotation and carrying disc spins for carrying out wafer itself
Revolution while, can carrying disk hole (carrier hole) in carry out wafer linear movement, cause still to carry
The direct collision friction (collision friction) of disk hole (lapping carrier hole) and wafer (wafer) produces
Raw damage (damage).Therefore, it in order to reduce the damage at crystal round fringes position, is inserted into the bore edges position of carrier
(insert) resin layer being fixed in carrying disk hole, so that the collision with crystal round fringes position minimizes.Although reducing in this way
Wafer in grinding (lapping) process fractures the generation of (wafer broken), fragment (chip) defect, still, resin
Layer be fixed on carrying disk hole in, wafer during the grinding process relative to carrying disk hole in resin layer can also occur it is upper and lower, left,
Right linear movement, the attrition process for still remaining the position crystal round fringes (wafer edge) damage more fragile phenomenon.
Summary of the invention
The purpose of the present invention is to provide a kind of grinding device, grinding method and wafer, such as wafer waiting is enabled to
The mechanical damage of the relatively fragile edge in grinding element surface, which is collided, to be minimized, and can also be improved thus caused wait grind
Mill element fractures and fraction defect incidence.
Technical solution provided by the present invention is as follows:
A kind of grinding device is ground for treating grinding element；Described device includes:
Upper fixed disk；
Lower fixed disk is oppositely arranged with the upper fixed disk；
Carrier is set between the upper fixed disk and the lower fixed disk, and the carrier is equipped with multiple carrying disk hole,
The element to be ground is carried in the carrying disk hole；
Driving mechanism, under driving mechanism driving, the carrier is around own axes rotation, and around the lower fixed disk
Center revolution, moved with the relatively described upper fixed disk, the lower fixed disk, grind the element to be ground；
Edge guiding ring is provided in the carrying disk hole, the element housing to be ground is set to the edge guiding ring
It is interior, and the edge guiding ring is arranged in the carrying disk hole in such a way that the relatively described carrying disk hole can be move freely, with
Make the element to be ground that the edge guiding ring be driven to move when moving during the grinding process.
Further, the edge guiding ring is cyclic structure made of resin material.
Further, the outer diameter of the edge guiding ring is less than the internal diameter of the carrying disk hole, so that the edge guiding
There is the first free gap between ring and the carrying disk hole.
Further, the difference of the outer diameter of the edge guiding ring and the internal diameter of the carrying disk hole is 0.2mm.
Further, the internal diameter of the edge guiding ring is greater than the outer diameter of the element to be ground, so that described to be ground
There is the second free gap between element and the edge guiding ring.
Further, the difference of the outer diameter of the internal diameter of the edge guiding ring and the element to be ground is 0.5~1mm.
Further, thickness of the edge guiding ring on the disk direction perpendicular to the carrier and the carrying
The thickness of disk is identical.
Further, the lower fixed disk is provided centrally with central gear, and the outer peripheral surface of the central gear has the gear teeth；
The circumferential edge of the lower fixed disk is provided with internal gear, and the inner peripheral surface of the internal gear has the gear teeth；Wherein, the carrier is nibbled
Together between the central gear and the internal gear, the driving mechanism is by driving the lower fixed disk, the central gear
It rotates with the internal gear, to drive the carrier around own axes rotation, and revolves around the center of the lower fixed disk.
A kind of grinding method is treated grinding element using grinding device as described above and is ground, which comprises
It is when the element to be ground is loaded into the carrying disk hole of the carrier, the edge guiding ring is same
When be loaded between the element to be ground and the carrier；
It drives the carrier around own axes rotation by driving mechanism, and revolves around the center of the lower fixed disk, with
Make the relatively described upper fixed disk of the carrier, lower fixed disk movement, grinds the element to be ground.
A kind of wafer is made of method as described above.
It is had the beneficial effect that brought by the present invention:
Above scheme, by the way that side is arranged between the edge and carrier bore edges of element to be ground (such as wafer)
Edge guide ring, and edge guiding ring itself not fixed in carrier hole (fixed type) is arranged, with being capable of phase
Free state (free status) setting that can be move freely to the carrying disk hole is carrying in disk hole, in this way, when to be ground
When element is moved relative to carrier during the grinding process, the edge guiding ring can be transported together with element to be ground
It is dynamic, so that the mechanical damage of the relatively fragile edge of element surface to be ground is collided and minimized, and can also improve
Thus element to be ground caused by fractures and fraction defect incidence.
Detailed description of the invention
Fig. 1 shows the structural schematic diagrams of grinding device provided in an embodiment of the present invention；
Fig. 2 indicates the top view of lower fixed disk in grinding device provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, those of ordinary skill in the art's acquired every other implementation without creative efforts
Example, shall fall within the protection scope of the present invention.
Aiming at the problem that easily mechanical damage occurs for the edge of wafer in the grinding process to wafer in the prior art,
A kind of grinding device is provided in the embodiment of the present invention, enables to the side that for example wafer waits grinding element surface relatively fragile
Edge position mechanical damage collide minimize, and can also improve thus caused by element to be ground fracture and fraction defect occur
Rate.
A kind of grinding device is provided in the embodiment of the present invention, which is ground for treating grinding element.
Wherein, the element to be ground can be various elements to be ground, for example, can be wafer, but be not limited merely to wafer.
Below just by taking the element to be ground is wafer as an example, grinding device provided in an embodiment of the present invention is carried out detailed
It describes in detail bright.
As depicted in figs. 1 and 2, grinding device provided in an embodiment of the present invention includes:
Upper fixed disk 100；
Lower fixed disk 200 is oppositely arranged with the upper fixed disk 100；
Carrier 300 is set between the upper fixed disk 100 and the lower fixed disk 200, and the carrier 300 is equipped with
Multiple carrying disk hole 310 carry element 10 to be ground in the carrying disk hole 310；
Driving mechanism, under driving mechanism driving, the carrier 300 is around own axes rotation, and under described
The center of price fixing 200 is revolved, and is moved with the relatively described upper fixed disk 100, the lower fixed disk 200, is ground the element 10 to be ground；
Edge guiding ring 400 is provided in the carrying disk hole 310, the element 10 to be ground is sheathed on the edge
In guide ring 400, and institute is arranged in such a way that the relatively described carrying disk hole 310 can be move freely in the edge guiding ring 400
It states in carrying disk hole 310, so that the element to be ground 10 drives the edge guiding ring when moving during the grinding process
400 movements.
Using the above scheme, element 10 to be ground can be loaded into carrying disk hole by grinding device provided in an embodiment of the present invention
When in 310, edge guiding ring 400 is loaded between element 10 and carrier 300 to be ground simultaneously, by element to be ground
Edge guiding ring 400, and edge guiding ring 400 are set between the edge and carrying 310 edge of disk hole of 10 (such as wafers)
Itself not fixed in carrier hole 310 (fixed type) setting, with can the relatively described carrying disk hole 310 can
Free state (free status) setting moveing freely is directed in the past in carrying disk hole 310 in grinding operation as a result,
Element 10 to be ground, such as wafer, in carrier 300 carry out Linear Rotation movement, and with spring steel (spring steel)
The problem of 300 direct collision of carrier of material, by being further arranged one between element 10 to be ground and carrying disk hole 310
Edge guiding ring 400, even if at the edge of element 10 to be ground and position edge (hole edge) of carrying disk hole 310
It collides, intermediate edge guiding ring 400 is partially due to be not fixed in carrying disk hole 310, by 10 edge of element to be ground
(wafer edge) linear speed, and moved together with element 10 to be ground, to play buffer function, grinding work can be mitigated
The direct collision friction of element to be ground 10 and carrier 300 in sequence, so that 10 surface of element to be ground is relatively fragile
The mechanical damage of edge, which is collided, to be minimized, and element 10 to be ground caused by can also improving thus fractures and fraction defect
Incidence.
Illustrate the exemplary embodiment of grinding device provided in an embodiment of the present invention below.
In a kind of exemplary embodiment, as depicted in figs. 1 and 2, the edge guiding ring 400 is by resin material system
At cyclic structure.
Using the above scheme, the edge guiding ring 400 is cyclic structure, and ring set is described except element 10 to be ground
When element 10 to be ground is loaded into carrying disk hole 310, which is located at element 10 to be ground and carrier 300
Between, which is made of resin material, can be played between element 10 to be ground and carrier 300 effectively
Shock absorbing effect.Of course, it should be understood that in practical applications, the specific material of the edge guiding ring 400 can also
To be not limited to resinous material.
In addition, as depicted in figs. 1 and 2, the outer diameter of the edge guiding ring 400 is small in a kind of exemplary embodiment
In the internal diameter of the carrying disk hole 310, so as to have first to live between the edge guiding ring 400 and the carrying disk hole 310
Dynamic gap.
Using the above scheme, the outer diameter of the edge guiding ring 400 be less than it is described carrying disk hole 310 internal diameter, and with institute
Stating between carrying disk hole 310 has the first free gap, this ensure that element 10 to be ground is relative to holding during the grinding process
When load plate 300 moves, the edge guiding ring 400 can move together with the element 10 to be ground.
Illustratively, the difference of the outer diameter of the edge guiding ring 400 and the internal diameter of the carrying disk hole 310 is 0.2mm.
Using the above scheme, the difference of the outer diameter of the edge guiding ring 400 and the internal diameter of the carrying disk hole 310 can basis
It the inner diameter size of element 10 to be ground and carries the inner diameter size of disk hole 310 and is selected, wherein in the edge guiding ring
When the difference of 400 outer diameter and the internal diameter of the carrying disk hole 310 is 0.2mm, shock absorbing effect is best.
In addition, illustrative, the internal diameter of the edge guiding ring 400 is greater than the outer diameter of the element 10 to be ground, so that
There is the second free gap between the element to be ground 10 and the edge guiding ring 400.
Using the above scheme, the internal diameter of the edge guiding ring 400 be greater than the element 10 to be ground internal diameter, and with institute
Stating has the second free gap between element 10 to be ground, this ensure that element 10 to be ground is relative to holding during the grinding process
When load plate 300 moves, the edge guiding ring 400 can move together with the element 10 to be ground.
Illustratively, the difference of the outer diameter of the internal diameter of the edge guiding ring 400 and the element to be ground 10 be 0.5~
1mm。
Using the above scheme, the difference of the outer diameter of the internal diameter of the edge guiding ring 400 and the element to be ground 10 can root
It is selected according to the inner diameter size of element 10 to be ground and the inner diameter size of carrying disk hole 310, wherein in the edge guiding
When the difference of the outer diameter of the internal diameter of ring 400 and the element to be ground 10 is 0.5~1mm, shock absorbing effect is best.
In addition, illustrative, thickness of the edge guiding ring 400 on the disk direction perpendicular to the carrier 300
It spends identical as the thickness of the carrier 300.In this way, can make during the grinding process, the edge guiding ring 400 will not be right
The ground flat of element 10 to be ground impacts.
In addition, in exemplary embodiment provided by the present invention, as depicted in figs. 1 and 2, the lower fixed disk 200
It is provided centrally with central gear 210, the outer peripheral surface of the central gear 210 has the gear teeth；The circumferential edge of the lower fixed disk 200
It is provided with internal gear 220, the inner peripheral surface of the internal gear 220 has the gear teeth；Wherein, the carrier 300 is engaged in described
Between heart gear 210 and the internal gear 220, the driving mechanism is by driving the lower fixed disk 200, the central gear
210 and the internal gear 220 rotate, to drive the carrier 300 around own axes rotation, and around the lower fixed disk 200
Center revolution.
Using the above scheme, it is equipped with central gear 210 at the center of lower fixed disk 200 (lower plate), in lower fixed disk
200 neighboring is equipped with internal gear 220 (internal gear), and carrier 300 is engaged on central gear 210 and internal gear
Between 220, as depicted in figs. 1 and 2, in a kind of exemplary embodiment, carrier 300 has 5, has on each carrier 300
There are 4 carrying disk hole 310, is mounted with an element 10 to be ground in each carrying disk hole 310, is filled altogether on 5 carriers 300
It is loaded with 20 elements 10 to be ground, the material of carrier 300 can be selected as Elastic Steel (spring steel), in bearing
The pressure of heart gear 210 (sun gear) and internal gear 220 (internal gear) cast iron quality, carrier 300 is equally by casting
Iron material texture at.
The grinding operation process of the grinding device provided in the above exemplary embodiments is as follows:
When element 10 to be ground is loaded into the carrying disk hole 310 of carrier 300, by the same fashionable dress of edge guiding ring 400
It is loaded between element 10 and carrier 300 to be ground, lower fixed disk 200, internal gear 220, central gear is rotated by driving mechanism
210 this 3 parts, the carrier 300 being meshed with internal gear 220 and center rotate, and pull and be loaded into carrying disk hole 310
Interior element to be ground 10, lower fixed disk 200 rotate and guide the rotation of element 10 to be ground itself, simultaneous grinding element to be ground
10 backside surfaces (wafer backside surface)；Upper fixed disk 100 (upper plate) does not rotate, but to be ground
10 front face surface of element (wafer front side surface) vertically declines, and applies certain pressure to element 10 to be ground
Power, in addition, lapping liquid passes through pipeline from other individually grinding liquid bath (slurry tank) of main grinding (main lapping) equipment
(line) it is fed into upper fixed disk 100.It is ground to investment lapping liquid (slurry) between upper fixed disk 100 and element to be ground 10
While agent, the grinding of element 10 to be ground is carried out.
By taking element 10 to be ground is wafer as an example, the state into wafer input by grinding process is that diameter is uniform just
Round wafer, while revolution caused by wafer carries out the rotation (rotation) of wafer itself at the same time and carrier 300 rotates,
The linear movement that wafer is carried out in disk hole 310 is carried, and edge guiding ring 400 is inserted in carrying disk hole 310 with free state,
Linear movement can be carried out with wafer, and reduce the direct collision between wafer and carrier 300, to reduce mechanical damage.
In addition, additionally providing a kind of grinding method in the embodiment of the present invention, filled using grinding provided in an embodiment of the present invention
It sets and treats grinding element 10 and ground, which comprises
When element 10 to be ground is loaded into the carrying disk hole 310 of carrier 300, by the same fashionable dress of edge guiding ring 400
It is loaded between element 10 and carrier 300 to be ground；
Drive the carrier 300 around own axes rotation by driving mechanism, and around the center of the lower fixed disk 200 public affairs
Turn, so that the relatively described upper fixed disk 100 of the carrier 300, the lower fixed disk 200 move, grinds the element 10 to be ground.
In addition, the embodiment of the present invention also provides a kind of wafer, it is made of method provided by the embodiment of the present invention.
More than, only a specific embodiment of the invention, but scope of protection of the present invention is not limited thereto, and it is any to be familiar with
Those skilled in the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all cover
Within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
Claims (10)
1. a kind of grinding device is ground for treating grinding element；Described device includes:
Upper fixed disk；
Lower fixed disk is oppositely arranged with the upper fixed disk；
Carrier is set between the upper fixed disk and the lower fixed disk, and the carrier is equipped with multiple carrying disk hole, described
The element to be ground is carried in carrying disk hole；
Driving mechanism, under driving mechanism driving, the carrier is around own axes rotation, and in the lower fixed disk
Heart revolution is moved with the relatively described upper fixed disk, the lower fixed disk, grinds the element to be ground；
It is characterized in that, being provided with edge guiding ring in the carrying disk hole, the element housing to be ground is set to the edge
In guide ring, and the carrying disk hole is arranged in such a way that the relatively described carrying disk hole can be move freely in the edge guiding ring
It is interior, so that the element to be ground drives the edge guiding ring to move when moving during the grinding process.
2. grinding device according to claim 1, which is characterized in that
The edge guiding ring is cyclic structure made of resin material.
3. grinding device according to claim 1, which is characterized in that
The outer diameter of the edge guiding ring is less than the internal diameter of the carrying disk hole, so that the edge guiding ring and the carrier
There is the first free gap between hole.
4. grinding device according to claim 3, which is characterized in that
The difference of the outer diameter of the edge guiding ring and the internal diameter of the carrying disk hole is 0.2mm.
5. grinding device according to claim 1, which is characterized in that
The internal diameter of the edge guiding ring is greater than the outer diameter of the element to be ground, so that the element to be ground and the edge
There is the second free gap between guide ring.
6. grinding device according to claim 5, which is characterized in that
The difference of the outer diameter of the internal diameter of the edge guiding ring and the element to be ground is 0.5mm~1mm.
7. grinding device according to claim 1, which is characterized in that
Thickness of the edge guiding ring on the disk direction perpendicular to the carrier is identical as the thickness of the carrier.
8. grinding device according to claim 1, which is characterized in that
The lower fixed disk is provided centrally with central gear, and the outer peripheral surface of the central gear has gear；
The circumferential edge of the lower fixed disk is provided with internal gear, and the inner peripheral surface of the internal gear has gear；
Wherein, the carrier is engaged between the central gear and the internal gear, and the driving mechanism passes through driving institute
Lower fixed disk, the central gear and internal gear rotation are stated, to drive the carrier around own axes rotation, and around described
It revolves at the center of lower fixed disk.
9. a kind of grinding method, which is characterized in that using grinding device as claimed in any one of claims 1 to 8 to be ground
Element is ground, which comprises
The element to be ground is loaded into the carrying disk hole of carrier, while the edge guiding ring is loaded into institute simultaneously
It states between element to be ground and the carrier；
It drives the carrier around own axes rotation by driving mechanism, and revolves around the center of the lower fixed disk, so that institute
The relatively described upper fixed disk of carrier, lower fixed disk movement are stated, the element to be ground is ground.
10. a kind of wafer, which is characterized in that be made of method as claimed in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910567467.7A CN110181355B (en) | 2019-06-27 | 2019-06-27 | Grinding device, grinding method and wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910567467.7A CN110181355B (en) | 2019-06-27 | 2019-06-27 | Grinding device, grinding method and wafer |
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| Publication Number | Publication Date |
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| CN110181355A true CN110181355A (en) | 2019-08-30 |
| CN110181355B CN110181355B (en) | 2021-08-17 |
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| CN201910567467.7A Active CN110181355B (en) | 2019-06-27 | 2019-06-27 | Grinding device, grinding method and wafer |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110744440A (en) * | 2019-10-22 | 2020-02-04 | 西安奕斯伟硅片技术有限公司 | Double-side grinding device and method |
| CN110774166A (en) * | 2019-10-29 | 2020-02-11 | 西安奕斯伟硅片技术有限公司 | Double-side grinding device and method |
| CN111002216A (en) * | 2019-10-15 | 2020-04-14 | 西安奕斯伟硅片技术有限公司 | Grinding equipment |
| CN112045524A (en) * | 2020-09-15 | 2020-12-08 | 惠州市宏达五金制品有限公司 | Equipment is got rid of to five metals stamping workpiece burr |
| CN113352228A (en) * | 2021-07-16 | 2021-09-07 | 西安奕斯伟硅片技术有限公司 | Wafer grinding device |
| CN113732851A (en) * | 2021-11-05 | 2021-12-03 | 四川明泰微电子有限公司 | Device for polishing back of semiconductor wafer |
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| CN111002216A (en) * | 2019-10-15 | 2020-04-14 | 西安奕斯伟硅片技术有限公司 | Grinding equipment |
| CN110744440A (en) * | 2019-10-22 | 2020-02-04 | 西安奕斯伟硅片技术有限公司 | Double-side grinding device and method |
| CN110774166A (en) * | 2019-10-29 | 2020-02-11 | 西安奕斯伟硅片技术有限公司 | Double-side grinding device and method |
| CN112045524A (en) * | 2020-09-15 | 2020-12-08 | 惠州市宏达五金制品有限公司 | Equipment is got rid of to five metals stamping workpiece burr |
| CN113352228A (en) * | 2021-07-16 | 2021-09-07 | 西安奕斯伟硅片技术有限公司 | Wafer grinding device |
| CN113352228B (en) * | 2021-07-16 | 2022-06-24 | 西安奕斯伟硅片技术有限公司 | Wafer grinding device |
| CN113732851A (en) * | 2021-11-05 | 2021-12-03 | 四川明泰微电子有限公司 | Device for polishing back of semiconductor wafer |
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