CN106965078A - Grinding positioning ring for chemical mechanical grinding process of semiconductor wafer - Google Patents
Grinding positioning ring for chemical mechanical grinding process of semiconductor wafer Download PDFInfo
- Publication number
- CN106965078A CN106965078A CN201610186338.XA CN201610186338A CN106965078A CN 106965078 A CN106965078 A CN 106965078A CN 201610186338 A CN201610186338 A CN 201610186338A CN 106965078 A CN106965078 A CN 106965078A
- Authority
- CN
- China
- Prior art keywords
- grinding
- positioning ring
- semiconductor wafer
- chemical mechanical
- cap end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 12
- 239000000126 substance Substances 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title abstract description 6
- 230000008569 process Effects 0.000 title abstract description 6
- 229920003023 plastic Polymers 0.000 claims abstract description 19
- 239000004033 plastic Substances 0.000 claims abstract description 19
- -1 polyethylene Polymers 0.000 claims description 23
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 12
- 229920002530 polyetherether ketone Polymers 0.000 claims description 12
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 12
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 12
- 239000004698 Polyethylene Substances 0.000 claims description 10
- 229920001903 high density polyethylene Polymers 0.000 claims description 10
- 239000004700 high-density polyethylene Substances 0.000 claims description 10
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 10
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 10
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 9
- 238000007517 polishing process Methods 0.000 claims description 9
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 9
- 229920000573 polyethylene Polymers 0.000 claims description 8
- 239000004697 Polyetherimide Substances 0.000 claims description 7
- 229920002480 polybenzimidazole Polymers 0.000 claims description 7
- 229920001601 polyetherimide Polymers 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000002033 PVDF binder Substances 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 6
- 239000004677 Nylon Substances 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 5
- 229920001778 nylon Polymers 0.000 claims description 5
- 229920006324 polyoxymethylene Polymers 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229920002873 Polyethylenimine Polymers 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 150000003949 imides Chemical class 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229920001748 polybutylene Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims 1
- 239000003925 fat Substances 0.000 claims 1
- 229920000915 polyvinyl chloride Polymers 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 23
- 230000009467 reduction Effects 0.000 abstract description 6
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 abstract description 2
- 230000005484 gravity Effects 0.000 abstract 1
- 239000013585 weight reducing agent Substances 0.000 abstract 1
- 239000004693 Polybenzimidazole Substances 0.000 description 4
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920002312 polyamide-imide Polymers 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 229920002521 macromolecule Polymers 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 3
- 239000004962 Polyamide-imide Substances 0.000 description 2
- MCOQHIWZJUDQIC-UHFFFAOYSA-N barban Chemical compound ClCC#CCOC(=O)NC1=CC=CC(Cl)=C1 MCOQHIWZJUDQIC-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000011112 process operation Methods 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to a grinding positioning ring for a semiconductor wafer chemical mechanical grinding process, which comprises a locking surface and a grinding surface which are sequentially overlapped and combined, wherein the locking surface is made of a plastic material and is selected from materials with the specific gravity of 0.9-1.8g/cm3The plastic material between, make this lock attach face structure select for use different because of the material for whole grinding holding ring has weight reduction, intensity is good, cost reduction, reduces progress characteristics such as process, reduction rust.
Description
Technical field
The present invention is on a kind of grinding positioning ring for semiconductor wafer chemical machinery, espespecially a kind of grinding positioning ring that grinding process operations are positioned for wafer.
Background technology
Press, the structure for the grinding positioning ring that general grinding wafer process operations are used, in the past with made by integrally formed material, after have consideration base portion ring body with grinding ring body respectively have its function, therefore have and develop heterogeneous (different material) as the construction of composite bed, the construction presented such as TaiWan, China new patent No. M347978 " structure-improved of grinding positioning ring ", one base portion, it is adopted as made by stainless steel or metal alloy, and in an annular aspect, the first side of the base portion is to be provided with positioning hole on a locking face, locking face；The second side of base portion is to be provided with engaging hole on a faying face, faying face, and the engaging hole, which can be used to connect, sets locking conjugative component.One grind section, it is adopted as made by macromolecule plastic material, and in an annular aspect, the first side of the grind section is to be provided with entrance hole on a faying face, faying face；The second side of grind section is then an abradant surface.
It is combined with each other and is constituted with the grinding ring body of a macromolecule material by the base portion ring body of metal, different effects is showed respectively.But the prior art " heterogeneous " that is showed using base material be the higher stainless steel or metal alloy of usual hardness, but grind section, then using the relatively low macromolecule plastic material of relative hardness.
Though the case emphasis is found expression in response to grinding positioning ring during attrition process, the violent rubbing action of continuation is produced between meeting and wafer and processing parts, reversal of stress produced by it, then can be to the integrated structure of the base portion ring body of grinding positioning ring and grinding ring body, produce destructive effects, and the base portion of prior art its adopt as made by stainless steel or metal alloy, its material is bought and manufacturing cost is higher, and heavier-weight and easy-to-rust, and the combination of metal material and plastic material using above easily cause peel off so that causing wafer scratch, the yield after grinding wafer is caused to reduce, and processing cost is significantly increased, and manufacturing procedure is complicated, the bond strength that metal material is combined with plastic material again is weaker, its toughness is also relatively low with compliance, easily cause the phenomenon of stripping, that is, the equivalent grinding positioning ring is scrapped.So as to the loss more seriously cost increase, and more difficult lifting crudy of material.
Although, also dealer uses plastics (such as PPS) to be formed in one for a base portion with a grind section, though production cost can be reduced without using metal, but due to being one, therefore when grind section is worn and consumed, even if the base portion is without attrition, but also must integrally it be changed in company with the grind section, but because plastics (PPS) expense is immeasurable, also fall within waste with it is uneconomical.
The content of the invention
The problem of in view of prior art, inventor appreciates that there should be a kind of improved construction to produce, a kind of grinding positioning ring for semiconductor wafer chemical mechanical polishing process is designed for this, including one locks face and an abradant surface, both sequentially fold and merge into combination, the two composite bed effect having concurrently.
The present invention takes this to lock face selected from proportion 0.9-1.8g/cm3Between PET and high density polyethylene (HDPE) (High-density polyethylene, HDPE), polyethylene (Polyethylene, PE), polyphenylene sulfide (polyphenylene
Sulfide, PPS), polybutylene terepthatlate (polybutylene
Terephthalate, PBT), carbon fill polyether-ether-ketone (carbin-filled
PEEK), PEI (polyetherimide, PEI), polyether-ether-ketone (polyether ether ketone, PEEK), polyethylene terephthalate (polyethylene terephthalate, PET), polytetrafluoroethylene (PTFE) (polytetrafluoroethylene, PTFE), polybenzimidazoles (polybenzimidazole, PBI), polyamine-acid imide (polyamide-imide, PAI), polyethylene terephalic acid fat (PETP), polyvinyl chloride (PVC), nylon (NYLON), polyacetals (POM), ABS, iron is not imperial (PTFE), the one of poly- vinylidene fluoride PVDF or more than two kind it is compound.Or more than two kinds of any plastics additive is combined.Only, take off the plastics additive before not limiting, it is all with it is of the invention before take off the plastic material for having equivalent effect and all belong to and include.
The present invention locks face using foregoing plastic material at this, this is locked face because material selection is different so that whole grinding positioning ring has the progressive features such as weight saving, intensity are good, cost is reduced, reduce process, reduction is got rusty.
And the present invention is divided into one and locks face and an abradant surface, therefore when the abradant surface is worn and when consuming, this locks face and need not integrally changed in company with the abradant surface, therefore can save consumption and reach reduction cost effectiveness.
Brief description of the drawings
Fig. 1 is the three-dimensional combination figure of first embodiment of the invention.
Fig. 2 is that the present invention locks the partial schematic diagram that face shows material.
Fig. 3-A are first angle decomposing state figures of the present invention.
Fig. 3-B are second angle decomposing state figures of the present invention.
Fig. 4-A figures of bonding state broken section one of the present invention.
Fig. 4-B figures of bonding state broken section two of the present invention.
Fig. 5-A engaging member tugs of the present invention turn one figure of signal.
Fig. 5-B present invention combines shape tug and turns two figures of signal.
Fig. 6 is the stereogram of second embodiment of the invention.
Figure number explanation：
1 is used for the grinding positioning ring of semiconductor wafer chemical mechanical polishing process
11 lock face
110 combine perforation
12 abradant surfaces
120 engagement grooves
120A strip groove portions
The wide portions of 120B
14 engaging members
141 bodies
142 cap ends
1A has the grinding positioning ring for semiconductor wafer chemical mechanical polishing process for setting groove.
Embodiment
Referring to Fig. 1, the present invention is on a kind of grinding positioning ring 1 for semiconductor wafer chemical mechanical polishing process, refer to shown in Fig. 3-A and Fig. 3-B, including one locks the abradant surface 12 of face 11 and one, both sequentially fold and merge into combination.
It please coordinate shown in Fig. 2, the present invention particularly locks face 11 selected from proportion 0.9-1.8g/cm at this3Between PET and high density polyethylene (HDPE) (High-density polyethylene, HDPE), polyethylene (Polyethylene, PE), polyphenylene sulfide (polyphenylene
Sulfide, PPS), polybutylene terepthatlate (polybutylene
Terephthalate, PBT), carbon fill polyether-ether-ketone (carbin-filled
PEEK), PEI (polyetherimide, PEI), polyether-ether-ketone (polyether ether ketone, PEEK), polyethylene terephthalate (polyethylene terephthalate, PET), polytetrafluoroethylene (PTFE) (polytetrafluoroethylene, PTFE), polybenzimidazoles (polybenzimidazole, PBI), polyamine-acid imide (polyamide-imide, PAI), polyethylene terephalic acid fat (PETP), polyvinyl chloride (PVC), nylon (NYLON), polyacetals (POM), ABS, iron is not imperial (PTFE), the one of poly- vinylidene fluoride PVDF or more than two kind it is compound.Or more than two kinds of any plastics additive is combined.Only, take off the plastics additive before not limiting, it is all with it is of the invention before take off the plastic material for having equivalent effect and all belong to and include.
The present invention can the abradant surface 12 it is also made with plastic material, due to the present invention this lock face 11 use foregoing plastic material, this is set to lock face because material selection is different, so that whole grinding positioning ring has good weight saving, intensity, cost reduction, reduces process, reduction and the progressive feature such as get rusty, and because the material of plastics has the advantage in toughness compared with metal.
Coordinate shown in Fig. 3-A and Fig. 3-B, the combined structure of the present invention, it is that the ring body for locking face 11 combines perforation 110 provided with plural number, and the abradant surface 12 is provided with plural number respectively to that should combine the engagement groove 120 of perforation 110, the engagement groove 120 includes a strip groove portion 120A, strip groove portion 120A re-extends a width portion 120B, plural engaging member 14 is set again, the engaging member 14 includes a body 141, the rear end of body 141 is provided with the larger cap end 142 of an external diameter, the width of the wide portion 120B is more than the external diameter at the cap end 142 and allows that the cap end 142 is included, strip groove portion 120A width is less than the external diameter at the cap end 142, coordinate shown in Fig. 4-A and Fig. 4-B and Fig. 5-A and Fig. 5-B, by sliding force tug then make the cap end 142 be located at strip groove portion 120A below and top by backstop.And the body 141 of the engaging member 14 combines perforation 110 with this and can combined for a kind of screw-in version, to form simple combine without disturbing the abradant surface 12.
Fig. 6 is the second embodiment stereogram for having the grinding positioning ring 1A for semiconductor wafer chemical mechanical polishing process for setting groove, is presently preferred embodiments of the present invention.
Claims (3)
1. a kind of grinding positioning ring for semiconductor wafer chemical mechanical polishing process, it is characterised in that lock face and an abradant surface including one, both sequentially fold and merge into combination, and wherein this locks face selected from proportion 0.9-1.8g/cm3Between PET and high density polyethylene (HDPE), polyethylene, polyphenylene sulfide, polybutylene terepthatlate, carbon fill polyether-ether-ketone, PEI, polyether-ether-ketone, polyethylene terephthalate, polytetrafluoroethylene (PTFE), polybenzimidazoles, polyamine-acid imide, polyethylene terephalic acid fat, polyvinyl chloride, nylon, polyacetals, ABS, iron it is not imperial, the one of poly- vinylidene fluoride PVDF or more than two kind it is compound, or more than two kinds of any plastics additive is compound.
2. it is used for the grinding positioning ring of semiconductor wafer chemical mechanical polishing process as claimed in claim 1, it is characterized in that, the combination, the ring body for locking face combines perforation provided with plural number, the abradant surface is provided with plural number respectively to that should combine the engagement groove of perforation, the engagement groove includes a strip groove portion, the strip groove portion re-extends a width portion, plural engaging member is set again, the engaging member includes a body, the body rear end is provided with the larger cap end of an external diameter, the width in the wide portion is more than the external diameter at the cap end and allows that the cap end is included, the width of the strip groove portion is less than the external diameter at the cap end, the cap end is made to be located at below the strip slot portion and by backstop by sliding.
3. it is used for the grinding positioning ring of semiconductor wafer chemical mechanical polishing process as claimed in claim 2, it is characterised in that the body is mutually to screw togather with combination perforation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105101145 | 2016-01-14 | ||
| TW105101145A TW201725092A (en) | 2016-01-14 | 2016-01-14 | Polishing retaining ring of chemical mechanical polishing process for semiconductor wafer having progressive features of weight reduction, good strength, cost reduction, process reduction, and reduction of rust |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106965078A true CN106965078A (en) | 2017-07-21 |
Family
ID=59334653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610186338.XA Pending CN106965078A (en) | 2016-01-14 | 2016-03-29 | Grinding positioning ring for chemical mechanical grinding process of semiconductor wafer |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2017126730A (en) |
| CN (1) | CN106965078A (en) |
| SG (1) | SG10201602683TA (en) |
| TW (1) | TW201725092A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110181355A (en) * | 2019-06-27 | 2019-08-30 | 西安奕斯伟硅片技术有限公司 | A kind of grinding device, grinding method and wafer |
| CN111975629A (en) * | 2020-08-26 | 2020-11-24 | 上海华虹宏力半导体制造有限公司 | Positioning ring and chemical mechanical polishing machine |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040065412A1 (en) * | 2002-10-02 | 2004-04-08 | Ensinger Kunststofftechnologie Gbr | Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| CN1663775A (en) * | 2005-02-01 | 2005-09-07 | 陈亦锋 | Multilayer co-extrusion transfusion film and manufacturing method thereof |
| CN201249404Y (en) * | 2008-07-25 | 2009-06-03 | 孙建忠 | Grinding positioning ring |
| CN201346740Y (en) * | 2008-11-10 | 2009-11-18 | 孙建忠 | Wafer grinding positioning ring |
| CN101820961A (en) * | 2007-10-12 | 2010-09-01 | 拓希机器人技术股份公司 | Boomerang |
| CN203266389U (en) * | 2013-04-03 | 2013-11-06 | 孙建忠 | Heterogeneous medium composite grinding locating ring |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001121411A (en) * | 1999-10-29 | 2001-05-08 | Applied Materials Inc | Wafer polisher |
| JP2002355753A (en) * | 2001-05-30 | 2002-12-10 | Sumitomo Osaka Cement Co Ltd | Retainer ring of high performance and long life, and polishing device comprising the same |
| KR200395968Y1 (en) * | 2005-06-16 | 2005-09-15 | 주식회사 윌비에스엔티 | Retainer ring of chemical mechanical polishing apparatus |
-
2016
- 2016-01-14 TW TW105101145A patent/TW201725092A/en unknown
- 2016-03-29 CN CN201610186338.XA patent/CN106965078A/en active Pending
- 2016-04-04 JP JP2016075271A patent/JP2017126730A/en active Pending
- 2016-04-06 SG SG10201602683TA patent/SG10201602683TA/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040065412A1 (en) * | 2002-10-02 | 2004-04-08 | Ensinger Kunststofftechnologie Gbr | Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus |
| CN1663775A (en) * | 2005-02-01 | 2005-09-07 | 陈亦锋 | Multilayer co-extrusion transfusion film and manufacturing method thereof |
| CN101820961A (en) * | 2007-10-12 | 2010-09-01 | 拓希机器人技术股份公司 | Boomerang |
| CN201249404Y (en) * | 2008-07-25 | 2009-06-03 | 孙建忠 | Grinding positioning ring |
| CN201346740Y (en) * | 2008-11-10 | 2009-11-18 | 孙建忠 | Wafer grinding positioning ring |
| CN203266389U (en) * | 2013-04-03 | 2013-11-06 | 孙建忠 | Heterogeneous medium composite grinding locating ring |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110181355A (en) * | 2019-06-27 | 2019-08-30 | 西安奕斯伟硅片技术有限公司 | A kind of grinding device, grinding method and wafer |
| CN111975629A (en) * | 2020-08-26 | 2020-11-24 | 上海华虹宏力半导体制造有限公司 | Positioning ring and chemical mechanical polishing machine |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201725092A (en) | 2017-07-16 |
| JP2017126730A (en) | 2017-07-20 |
| SG10201602683TA (en) | 2017-08-30 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170721 |