CN201346740Y - Wafer grinding positioning ring - Google Patents
Wafer grinding positioning ring Download PDFInfo
- Publication number
- CN201346740Y CN201346740Y CNU2008201763698U CN200820176369U CN201346740Y CN 201346740 Y CN201346740 Y CN 201346740Y CN U2008201763698 U CNU2008201763698 U CN U2008201763698U CN 200820176369 U CN200820176369 U CN 200820176369U CN 201346740 Y CN201346740 Y CN 201346740Y
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- CN
- China
- Prior art keywords
- grind section
- grinding
- base portion
- locating ring
- ring according
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- Expired - Lifetime
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Abstract
The utility model discloses a wafer grinding positioning ring, which mainly comprises a basal part and a grinding part. The basal part is made of metal or non-metal material and is provided with positioning holes which are arranged vertically in an annular shape; the lower part of the basal part is combined with the grinding part; and the lower part of the grinding part is provided with a grinding block. The basal part and the grinding part can be combined in the following ways: the connecting component at the lower part of the basal part is clamped in a dovetail groove of the grinding part; the basal part is glued with the surface of the grinding part; or the basal part and the outer edge of the grinding part form a corresponding dovetail groove and an insertion pin with a corresponding shape is inserted for connection. In addition, the grinding part can be provided with two or more than two grinding blocks connected with the bottom thereof for partial replacement when part of the grinding part is damaged, thereby realizing the effects of saving the time and material and prolonging the service life of the positioning ring.
Description
Technical field
The utility model in particular, refers in particular to a kind of grinding wafer locating ring that is used for the improvement of wafer location grinding operation about a kind of grinding locating ring.
Background technology
At present, general industry is used to grind the structure of the grinding locating ring of wafer operation, usually mutually combine by the grinding ring body of the base portion ring body of a metal and a macromolecule material and constitute, grind locating ring when using, the length in its life-span, abrasion speed except the grinding ring body that depends on this macromolecule material, the base portion ring body of metal and the fastness of grinding integrated structure between the ring body, it also is a key factor, this is because grind locating ring in the attrition process process, produce the violent rubbing action of continuation between meeting and wafer and the processing parts, the reversal of stress that it produced, then can be to base portion ring body that grinds locating ring and the integrated structure that grinds ring body, produce destructive effects, in case during the phenomenon that generation is loosening or disengagement is peeled off between base portion ring body and the grinding ring body, also promptly be equal to this grinding locating ring and scrap, and need change in addition.
The base portion ring body of existing grinding locating ring and the fixed form that combines of grinding ring body, roughly be adopt as " mode of following of cyrstal sphere grinding ring " of TaiWan, China patent announcement number No. 470690 as described in content, this patent is mainly carried out flame treatment earlier disclosing the commissure will grind locating ring, handle base portion ring body and the commissure wiping of grinding ring body clean again, and then it is fixing to utilize epoxy resin that the two is adhered, and the base portion ring body is reached with the grinding ring body combine fixing structure.
But, because aforementioned base portion ring body and the commissure that grinds ring body, be substantially a planar structure, therefore the reversal of stress that this combination by adhesion is produced in the time of also can't effectively overcoming grinding wafer, the vibrations or the high-temperature digestion that are produced during easily because of the grinding wafer, make epoxy resin lose bonding effectiveness, thereby the base portion ring body that causes grinding locating ring produces the phenomenon that comes off or peel off with the grinding ring body, therefore by this bonding mode, this base portion ring body and the bond strength of grinding between the ring body still have not enough situation.
The utility model content
In view of this, main purpose of the present utility model is to provide a kind of and can replaces fast, saves material, reduces cost, and the grinding wafer locating ring that increases the service life.
In order to achieve the above object, the technical solution of the utility model is achieved in that a kind of grinding wafer locating ring, and it comprises base portion and grind section; Wherein,
Described base portion is for having certain thickness circulus, the top of described base portion is formed with locking face, described locking face is provided with locating hole, and the below of described base portion is formed with faying face, and described faying face is provided with the conjugate foramen of establishing the locking conjugative component in order to connect;
Described grind section is for having certain thickness circulus, the top of described grind section is a faying face, described faying face is provided with entrance hole, described entrance hole outer rim is extended dovetail groove, described grind section connects the described conjugative component of the establishing location that links to each other by described entrance hole and described base portion, and the below of described grind section is an abradant surface.
Of the present utility model another implemented structure, promptly a kind of grinding wafer locating ring, and it comprises base portion and grind section; Wherein,
Described base portion is for having certain thickness circulus, and the outer rim below of described base portion is provided with circular row and runs through the dovetail groove of external diameter in the described base portion;
Described grind section is for having certain thickness circulus, the outer rim top of described grind section is provided with circular row and runs through the dovetail groove of external diameter in the described grind section, the described dovetail groove of described dovetail groove and described base portion outer rim below relative position forms two dovetail grooves, use shape to engage with the latch that two dovetail grooves conform to, the below of described grind section is an abradant surface.
The grinding block of grind section bottom can be offered the groove of several equidistant configurations, and this groove has certain depth, and the inside and outside footpath of running through grind section, or be engaged in grind section bottom by two or more grinding blocks is when being convenient to grind section and being partially damaged, carry out part and replace, save time and material.During grinding operation, the gap between the grinding block can make lapping liquid flow into and contact with wafer, and make and reduce temperature, and lubricated wafer, can yield rate be improved so as to outwards take the abrasion discarded object that grind section is produced out of in process of lapping again simultaneously.
Learn by above-mentioned, base portion and grind section can stretch into entrance hole by conjugative component, and the composition surface that slides onto the dovetail groove clip, uses sticker gummed base portion and grind section, or form two dovetail grooves at base portion and grind section outer rim relative position, the latch that utilizes shape to conform to again engages, connect base portion and grind section, and the grinding block of grind section bottom can partly be changed, time and material have more been saved, for human and material resources all is a saving greatly, and then effectively prolong service life of grinding wafer locating ring, reduce the cost of insider's grinding process technique.
Description of drawings
Fig. 1 is the schematic perspective view of grinding wafer locating ring in the utility model;
Fig. 2 A is the decomposing schematic representation () of first embodiment of grinding wafer locating ring in the utility model;
Fig. 2 B is the decomposing schematic representation (two) of first embodiment of grinding wafer locating ring in the utility model;
Fig. 3 A is the decomposition cross-sectional schematic () of second embodiment of grinding wafer locating ring in the utility model;
Fig. 3 B is the assembling cross-sectional schematic (two) of second embodiment of grinding wafer locating ring in the utility model;
Fig. 4 A is the exploded perspective schematic diagram () of the 3rd embodiment of grinding wafer locating ring in the utility model;
Fig. 4 B is the assembling schematic perspective view (two) of the 3rd embodiment of grinding wafer locating ring in the utility model;
Fig. 5 is provided with the schematic diagram of groove for the grind section of grinding wafer locating ring in the utility model;
Fig. 6 A is that schematic diagram () is changed in the combined type grind section loss of grinding wafer locating ring in the utility model;
Fig. 6 B is that schematic diagram (two) is changed in the combined type grind section loss of grinding wafer locating ring in the utility model.
Description of reference numerals
1 grinding wafer locating ring, 12 grind section
11 base portion 12A faying faces
The ring-like outer rim of 11B faying face 12C
Ring-like outer rim 121 dovetail grooves of 11C
Aperture, 111 location 122 flanges
112 grooves, 123 grooves
113 flanges, 124 entrance holes
114 conjugate foramens, 1241 dovetail grooves
115 conjugative components, 125 grooves
116 dovetail grooves, 126 grinding blocks
117 latches, 2 stickers
The specific embodiment
For reaching the aforesaid purpose of the utility model, now enumerate embodiment, and conjunction with figs. is described as follows, wish structure of the present utility model, feature and the effect reached are obtained more preferably to understand.
Please refer to shown in Figure 1ly, Fig. 1 is the schematic perspective view of grinding wafer locating ring in the utility model.
Grinding wafer locating ring 1 of the present utility model for having the circulus thing of certain thickness, diameter and function, consists predominantly of base portion 11 and grind section 12.Base portion 11 is for having certain thickness metal or nonmetal (class such as macromolecular material) circulus thing, make (for example: ejaculation, hot pressing, extrusion molding etc.) by forming technique, base portion 11 is provided with vertically equidistant annular locating hole 111, locating hole 111 can with chemical-mechanical grinding device (Chemical Mechanical Polishing; CMP) actuator on the grinding head (Polishing Head) engages, fiting chemical mechanical grinding device (Chemical Mechanical Polishing; CMP) action together, base portion 11 belows engage with grind section 12; Grind section 12 is for having certain thickness circulus thing, adopts high temperature resistant, abrasion performance and corrosion resistant macromolecule plastic material, for example polyphenylene sulfide (PolyphenyleneSulfide; PPS), polyethers diketone (Polyetheretherketone; PEEK) etc. material is made (for example: ejaculation, hot pressing, extrusion molding etc.) by forming technique.
Please refer to shown in Fig. 2 A, Fig. 2 B, Fig. 2 A is the decomposing schematic representation () of first embodiment of grinding wafer locating ring in the utility model, and Fig. 2 B is the decomposing schematic representation (two) of first embodiment of grinding wafer locating ring in the utility model.
This is first embodiment of grinding wafer locating ring in the utility model, the top of base portion 11 is ring-like locking face 11A, ring-like locking face 11A is provided with vertically equidistant annular locating hole 111, shown in Fig. 2 A, and can with chemical-mechanical grinding device (Chemical Mechanical Polishing; CMP) actuator on the grinding head (Polishing Head) engages, fiting chemical mechanical grinding device (Chemical MechanicalPolishing; CMP) action together, the below of base portion 11 is ring-like faying face 11B, shown in Fig. 2 B, offer groove 112 on the internal diameter of ring-like faying face 11B, flange 113 is set on the external diameter of ring-like composition surface 11B, groove 112 is provided with vertically equidistant annular conjugate foramen 114, conjugate foramen 114 can engage with conjugative component 115, wherein, this conjugative component 115 can be tack (Pancake head) screw or countersunk bolts etc., simultaneously, and when conjugative component 115 is locked on conjugate foramen 114, between the outer edge surface of the top of this conjugative component 115 and conjugate foramen 114, can form appropriate gap.
The top of grind section 12 is ring-like faying face 12A, shown in Fig. 2 A, the internal diameter of ring-like faying face 12A is a flange 122, the external diameter of ring-like faying face 12A is a groove 123, structure for the ring-like faying face 11B of corresponding base portion 11, the flange 122 of ring-like faying face 12A is provided with vertically equidistant annular entrance hole 124, and outer rim one side of entrance hole 124, extend to form out dovetail groove 1241 again, make it to utilize the top of conjugative component 115 and the mutual clip in gap between conjugate foramen 114 outer edge surfaces, thereby base portion 11 interosculates with grind section 12, and this entrance hole 124 engages with conjugative component 115 according to the contrary axle veer of grinding wafer locating ring 1, the below of grind section 12 is ring-like abradant surface 12B, in order to grinding wafer is processed.
Please refer to shown in Fig. 3 A, Fig. 3 B, Fig. 3 A be in the utility model the grinding wafer locating ring the decomposition cross-sectional schematic () of second embodiment, Fig. 3 B is the assembling cross-sectional schematic (two) of second embodiment of the present utility model.
This is second embodiment of grinding wafer locating ring in the utility model, learn by Fig. 3 A and Fig. 3 B, grinding wafer locating ring 1 combines with the ring-like faying face 12A of grind section 12 by the ring-like faying face 11B of the base portion 11 that macromolecular material is made, evenly be coated with sticker 2 (class such as epoxy resin) at the ring-like faying face 11B of base portion 11 and the ring-like faying face 12A of grind section 12, utilize the mode of appearance (groove 112 of the ring-like faying face 12A of the ring-like faying face 11B of base portion 11 and grind section 12 again, flange 113, flange 122, groove 123) location, shown in Fig. 2 A and 2B, base portion 11 and grind section 12 are glued together by sticker 2, shown in Fig. 3 A and Fig. 3 B, and then finish combining of base portion 11 and grind section 12.
Please refer to shown in Fig. 4 A, Fig. 4 B, Fig. 4 A is the exploded perspective schematic diagram () of the 3rd embodiment of grinding wafer locating ring in the utility model, and Fig. 4 B is the assembling schematic perspective view (two) of the 3rd embodiment of grinding wafer locating ring in the utility model.
This is the 3rd embodiment of grinding wafer locating ring in the utility model, learn by Fig. 4 A and Fig. 4 B, below the ring-like outer rim 11C of base portion 11, offer equidistant circular row and run through the dovetail groove 116 of external diameter in the base portion 11, and offer equidistant circular row with the ring-like outer rim 12C top of grind section 12 and run through the dovetail groove 121 of external diameters in the grind section 12, shown in Fig. 4 A, the dovetail groove 116 of the ring-like outer rim 11C below of base portion 11 forms two dovetail grooves with the dovetail groove 121 of the ring-like outer rim 12C top of grind section 12, the latch 117 that conforms to for shape inserts fixing, shown in Fig. 4 B, whereby in conjunction with base portion 11 and grind section 12.
Please refer to shown in Figure 5ly, Fig. 5 is provided with the schematic diagram of groove for the grind section of grinding wafer locating ring in the utility model.
As shown in Figure 5, in process of lapping, often follow process of lapping can produce many abrasion discarded objects, and these abrasion discarded objects for the grinding of wafer be have no to help in addition can influence yield rate, so annular abrasion face 12B in grind section 12, can offer several grooves that is radial and equidistant configuration 125, as shown in Figure 5, this groove 125 has certain depth, and run through grind section 12 in, external diameter, when making grinding operation, can help lapping liquid to flow into and contact, make temperature reduction and lubricated wafer with wafer, can yield rate be improved so as to outwards take the abrasion discarded object that grind section 12 is produced out of in process of lapping again simultaneously.
Please cooperate and consult Fig. 6 A, Fig. 6 B simultaneously, Fig. 6 A is the schematic diagram () that the combined type grind section loss of grinding wafer locating ring in the utility model is changed, and Fig. 6 B is the schematic diagram (two) that the combined type grind section loss of grinding wafer locating ring in the utility model is changed.
Learn by the above, grind section 12 belows are provided with two or more grinding block 126 and encircle and establish the abradant surface that forms, at process of lapping, or cause part grinding block 126 damaged of the annular abrasion face 12B of grind section 12 because of human negligence, as shown in Figure 6A, at this moment, all change very waste material, money and time, therefore the grinding block 126 that is partially damaged is utilized gummed or pin joint, new grinding block 126 in the replacement, shown in Fig. 6 B, saved material, money and time, grinding wafer locating ring 1 can continue to be engaged in grinding operation again, and then prolongs the Acceptable life of grinding wafer locating ring 1, thereby reduces the cost that insider's attrition process is made.
From the above, the utility model grinding wafer locating ring has following advantage:
1, can be engaged in the conjugate foramen 114 of base portion 11 by conjugative component 115 (flat head screw or countersunk bolts), between the outer edge surface of the top of conjugative component 115 and conjugate foramen 114, can form in the entrance hole 124 of appropriate gap importing grind section 12, and slide onto dovetail groove 1241 clips, use epoxy resin to make sticker 2, or, reach in conjunction with the purpose of base portion 11 with grind section 12 at the two dovetail grooves 116 and the 1241 embedding latches 117 of base portion 11 with grind section 12 outer rims.
2, the grind section 12 of grinding locating ring can offer several grooves that is radial and equidistant configuration 125, this groove 125 has certain depth, and the inside and outside footpath of running through grind section 12, when making grinding operation, can help lapping liquid to flow into and contact, make temperature reduce with wafer, and lubricated wafer, can yield rate be improved so as to outwards take the abrasion discarded object that grind section 12 is produced out of in process of lapping again simultaneously.
3, in process of lapping, or cause the part grinding block 126 of annular abrasion face 12B of grind section 12 impaired because of human negligence, at this moment, all change very waste material, money and time, the grinding block 126 that is partially damaged is replaced upward new grinding block 126, saved material, money and time, grinding wafer locating ring 1 can continue to be engaged in grinding operation again, and then the Acceptable life of prolongation grinding wafer locating ring 1, thereby reduce the cost that insider's attrition process is made.
The above is a preferred embodiment of the present utility model only, is not to be used for limiting to claim of the present utility model, and the equivalent structure that all utilization the utility model specifications and accompanying drawing content are done changes, and all in like manner is contained in the scope of the present utility model.
Claims (15)
1, a kind of grinding wafer locating ring is characterized in that, it comprises base portion and grind section; Wherein,
Described base portion is for having certain thickness circulus, the top of described base portion is formed with locking face, described locking face is provided with locating hole, and the below of described base portion is formed with faying face, and described faying face is provided with the conjugate foramen of establishing the locking conjugative component in order to connect;
Described grind section is for having certain thickness circulus, the top of described grind section is a faying face, described faying face is provided with entrance hole, described entrance hole outer rim is extended dovetail groove, described grind section connects the described conjugative component of the establishing location that links to each other by described entrance hole and described base portion, and the below of described grind section is an abradant surface.
2, grinding wafer locating ring according to claim 1, wherein, the described faying face of described base portion uses the described faying face location of sticker and described grind section.
3, grinding wafer locating ring according to claim 1, wherein, described base portion is a metal material, described grind section is nonmetallic materials.
4, grinding wafer locating ring according to claim 1, wherein, described base portion is nonmetallic materials, described grind section is nonmetallic materials.
5, grinding wafer locating ring according to claim 1, wherein, described grind section below is provided with to be encircled by two or more described grinding block establishes the abradant surface that forms.
6, grinding wafer locating ring according to claim 5, wherein, the described grinding block utilization gummed mode of described grind section below is positioned at described grind section surface below.
7, grinding wafer locating ring according to claim 5, wherein, the described grinding block of described grind section below utilizes the pin joint mode to be positioned at described grind section surface below.
8, grinding wafer locating ring according to claim 1, wherein, the described abradant surface of described grind section is offered groove, and described groove has certain depth and runs through the inside and outside footpath of described grind section.
9, a kind of grinding wafer locating ring is characterized in that, it comprises base portion and grind section; Wherein,
Described base portion is for having certain thickness circulus, and the outer rim below of described base portion is provided with circular row and runs through the dovetail groove of external diameter in the described base portion;
Described grind section is for having certain thickness circulus, the outer rim top of described grind section is provided with circular row and runs through the dovetail groove of external diameter in the described grind section, the described dovetail groove of described dovetail groove and described base portion outer rim below relative position forms two dovetail grooves, use shape to engage with the latch that two dovetail grooves conform to, the below of described grind section is an abradant surface.
10, grinding wafer locating ring according to claim 9, wherein, described base portion is a metal material, described grind section is nonmetallic materials.
11, grinding wafer locating ring according to claim 9, wherein, described base portion is nonmetallic materials, described grind section is nonmetallic materials.
12, grinding wafer locating ring according to claim 9, wherein, described grind section below is provided with to be encircled by two or more described grinding block establishes the abradant surface that forms.
13, grinding wafer locating ring according to claim 12, wherein, the described grinding block utilization gummed mode of described grind section below is positioned at described grind section surface below.
14, grinding wafer locating ring according to claim 12, wherein, the described grinding block of described grind section below utilizes the pin joint mode to be positioned at described grind section surface below.
15, grinding wafer locating ring according to claim 9, wherein, the described abradant surface of described grind section is offered groove, and described groove has certain depth and runs through the inside and outside footpath of described grind section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201763698U CN201346740Y (en) | 2008-11-10 | 2008-11-10 | Wafer grinding positioning ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201763698U CN201346740Y (en) | 2008-11-10 | 2008-11-10 | Wafer grinding positioning ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201346740Y true CN201346740Y (en) | 2009-11-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201763698U Expired - Lifetime CN201346740Y (en) | 2008-11-10 | 2008-11-10 | Wafer grinding positioning ring |
Country Status (1)
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| CN (1) | CN201346740Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103466106A (en) * | 2013-08-29 | 2013-12-25 | 北京兴华机械厂 | Tool and method for adjusting mounting accuracy of flexible pendulous accelerometer |
| CN103831711A (en) * | 2012-11-28 | 2014-06-04 | 苏州英达瑞机器人科技有限公司 | Quick release type grinding shoulder device |
| CN106965078A (en) * | 2016-01-14 | 2017-07-21 | 孙建忠 | Grinding positioning ring for chemical mechanical grinding process of semiconductor wafer |
| CN108568747A (en) * | 2018-05-23 | 2018-09-25 | 宁波江丰电子材料股份有限公司 | Limit connection component and polishing machine |
| CN112338796A (en) * | 2019-08-08 | 2021-02-09 | 力晶积成电子制造股份有限公司 | Fixing ring |
-
2008
- 2008-11-10 CN CNU2008201763698U patent/CN201346740Y/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103831711A (en) * | 2012-11-28 | 2014-06-04 | 苏州英达瑞机器人科技有限公司 | Quick release type grinding shoulder device |
| CN103831711B (en) * | 2012-11-28 | 2016-12-21 | 苏州英达瑞机器人科技有限公司 | A kind of fast disassembly type mill shoulder device |
| CN103466106A (en) * | 2013-08-29 | 2013-12-25 | 北京兴华机械厂 | Tool and method for adjusting mounting accuracy of flexible pendulous accelerometer |
| CN103466106B (en) * | 2013-08-29 | 2015-07-08 | 北京兴华机械厂 | Tool and method for adjusting mounting accuracy of flexible pendulous accelerometer |
| CN106965078A (en) * | 2016-01-14 | 2017-07-21 | 孙建忠 | Grinding positioning ring for chemical mechanical grinding process of semiconductor wafer |
| CN108568747A (en) * | 2018-05-23 | 2018-09-25 | 宁波江丰电子材料股份有限公司 | Limit connection component and polishing machine |
| CN112338796A (en) * | 2019-08-08 | 2021-02-09 | 力晶积成电子制造股份有限公司 | Fixing ring |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20091118 |
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| CX01 | Expiry of patent term |