CN201128105Y

CN201128105Y - Ring structure for grinding semiconductor chip

Info

Publication number: CN201128105Y
Application number: CNU2007201785692U
Authority: CN
Inventors: 陈世发
Original assignee: Individual
Current assignee: Individual
Priority date: 2007-09-18
Filing date: 2007-09-18
Publication date: 2008-10-08
Anticipated expiration: 2017-09-18

Abstract

The utility model discloses a wafer grinding ring structure to resolve the problem still existing deficiencies of bonding strength between a grinding ring body and a metal base material. The wafer grinding ring structure comprises an annular base material and the grinding ring body. The annular base material and the grinding ring body are correspondingly provided with a commissure, and are combined and fixed via an adhesive. The annular base body is provided with locating hole grooves which are arranged at intervals. The locating hole grooves of the annular base material are through holes. One end of the locating hole groove passes through the commissure of the annular base material. The adhesive is embedded in the corresponding part of the locating hole groove to form an embedded part, therefore, the bonding fixed-area of the adhesive is greatly increased so as to be at a firm bonding steady state. The total design of the wafer grinding ring structure enables the wafer grinding ring to perform better firm bonding location performance.

Description

The grinding wafer ring structure

Technical field

The utility model relates to cyrstal sphere grinding ring.

Background technology

Grinding wafer ring structure system usually grinds ring body in conjunction with constituting by an annular metal base material and macromolecule; And described metal base and the fixed form that combines of grinding ring body, please refer to the TaiWan, China patent gazette and number patent No. 470690, patent name is the then method of cyrstal sphere grinding ring, disclose the commissure that will grind ring body in this case and carry out flame treatment, handle metal base and the commissure wiping of grinding ring body clean again, and then it is fixing to utilize epoxy resin to be sticked together, thereby makes this metal base combine fixing with the grinding ring body.

On cyrstal sphere grinding ring uses, the length in its life-span, except the abrasion speed that depends on this grinding ring body, also depend on metal base and grind the fastness that combines between the ring body, because cyrstal sphere grinding ring is in carrying out the attrition process process, produce violent friction between meeting and the wafer workpiece, and its reaction force will produce destruction threat with the grinding ring body state that combines to the metal base of cyrstal sphere grinding ring, therefore, this metal base and grind between the ring body bonding state firmly whether, in process of lapping, will leak, in case and this metal base and grind and to produce the loosening mutually phenomenon of throwing off between the ring body just is equivalent to this cyrstal sphere grinding ring damage and scrap; Utilize epoxy resin to be sticked together fixing structure kenel between the metal base of reviewing existing cyrstal sphere grinding ring thus and the grinding ring body, because of its metal base and the commissure that grinds ring body are set as flat state usually, when its commissure is laminated, epoxy resin therebetween will outwards overflow in a large number and cause waste, and causes then that intensity is difficult to further lifting.

For improving the problems referred to above, there is the insider to be processed to form the ring chase at the commissure of this grinding ring body, obtain better in conjunction with fixed effect so that epoxy resin or other adhesive agent can embed in this ring chase, right this kind practice, only do reinforcement at grinding ring body part, and for metal base, still be to do bonding with grinding ring body with its smooth composition surface, make that still there is deficiency in the bonding strength between this grinding ring body and the metal base.

The utility model content

The utility model provides a kind of grinding wafer ring structure, makes the base material of cyrstal sphere grinding ring reach preferable with the combination fixing structure that grinds ring body and firmly combines positioning states and make simple and easy.

For achieving the above object, the utility model adopts following technical scheme: this grinding wafer ring structure comprises the ring-type base material and grinds ring body, this ring-type base material and the relative commissure that is provided with of grinding ring body, and it is fixing to combine by the solid material, and this ring-type base material is provided with spaced positioning hole groove; Positioning hole groove on this ring-type base material is a through hole, and described positioning hole groove one end connects the commissure of ring-type base material, and described solid material embeds corresponding positioning hole groove position, and forms Embedded Division.

By the described grinding wafer ring structure of technique scheme, the positioning hole groove that this ring-type base material is provided with originally is made as the through hole kenel, make the ring-type base material can embed corresponding each positioning hole groove formation Embedded Division with the solid material that grinds between the ring body, thereby the solid material that significantly increases in conjunction with fixed-area, reach more firm in conjunction with stationary state, and because the formation of described Embedded Division is to be re-established as the through hole kenel by the positioning hole groove that the ring-type base material is provided with originally, manufacturing cost need not increase, have preferable firm effect concurrently so the design of this use novel overall can make cyrstal sphere grinding ring reach, and reach favorable economic benefit in conjunction with polarization and manufacturing simplification.

The utility model also provides a kind of grinding wafer ring structure, makes the base material of cyrstal sphere grinding ring reach the preferable positioning states that firmly combines with the combination fixing structure that grinds ring body.

For achieving the above object, the utility model adopts following technical scheme: this grinding wafer ring structure comprises the ring-type base material and grinds ring body, this ring-type base material and the relative commissure that is provided with of grinding ring body, and it is fixing to combine by the solid material, and this ring-type base material is provided with spaced positioning hole groove; The commissure of this ring-type base material is provided with the indent hole slot, and described indent hole slot one end is the commissure that connects this ring-type base material, and described solid material embeds corresponding each positioning hole groove position, and forms Embedded Division.

By the described grinding wafer ring structure of technique scheme, commissure at the ring-type base material is provided with the indent hole slot, and indent hole slot one end connects the commissure of this ring-type base material, make ring-type base material and the solid material that grinds between the ring body can embed inward recess groove formation Embedded Division like this, thereby the solid material that significantly increases in conjunction with fixed-area, the design of this use novel overall reaches more firm, so can make cyrstal sphere grinding ring reach preferable firmly in conjunction with polarization in conjunction with stationary state.

Description of drawings

Fig. 1 is the combination stereogram of the utility model grinding wafer ring structure;

Fig. 2 is the exploded perspective view of the utility model grinding wafer ring structure;

Fig. 3 is the first step figure that the grinding ring body of the utility model grinding wafer ring structure combines with the ring-type base material;

Fig. 4 is second block diagram that the grinding ring body of the utility model grinding wafer ring structure combines with the ring-type base material;

Fig. 5 is the grinding ring body of the utility model grinding wafer ring structure and the cutaway view that the ring-type base material is finished bonding state;

Fig. 6 is the grinding ring body of the utility model grinding wafer ring structure and first figure of another embodiment of ring-type base material;

Fig. 7 is the grinding ring body of the utility model grinding wafer ring structure and second figure of another embodiment of ring-type base material.

The specific embodiment

Below in conjunction with accompanying drawing the utility model grinding wafer ring structure is described in detail.

Extremely shown in Figure 5 as Fig. 1, the preferred embodiment of the utility model grinding wafer ring structure, only these embodiment only for the usefulness of explanation, are not subjected to the restriction of this structure in patent application.

Described cyrstal sphere grinding ring A comprises ring-type base material 10 and grinds ring body 20, this ring-type base material 10 and the grinding ring body 20

relative commissures

11,21 that are provided with, and combine fixing by solid material 30, this ring-type base material 10 has spaced positioning hole groove 12, and the commissure 21 of this grinding ring body 20 is provided with solid Embedded Division 23; These ring-type base material 10 set positioning hole grooves 12 are the through hole kenel, constitute the commissure 11 that described positioning hole groove 12 1 ends connect this ring-type base material 10, so that solid material 30 corresponding each positioning hole groove 12 are to form Embedded Division 31.

Wherein, the abradant surface 22 of this grinding ring body 20 can be the chip area 24 that smooth abradant surface maybe can be provided with annular array.

Wherein, this solid Embedded Division 23 can be at least one annular concave ditch 231, is the radial elongate recesses 232 that is spaced and crosses over this each annular concave ditch.

Wherein, described solid material 30 formed Embedded Divisions 31, it embeds the degree of depth at each positioning hole groove 12 position, can organize in advance to go in the positioning hole groove 12 by a cock body 40, and by described cock body 40 inner 41 pairs of solid material, 30 formation block resistance restrictions, thereby form the degree of depth control effect of its Embedded Division 31, this cock body 40 can be bolt, and 12 of this positioning hole grooves are provided with internal thread 120 and screw togather for it.

Now be described as follows with regard to use start situation of the present utility model:

As shown in Figure 3, Figure 4, when described ring-type base material 10 and grind ring body 20 and desire to do when engaging, earlier with described cock body 40 and positioning hole groove 12 contraposition mutually, and by the screw lock mode with this cock body 40 and positioning hole groove 12 assembly combination mutually, after treating spiral shell group location, coat solid material 30 at the commissure 11 of this ring-type base material 10 with the commissure 21 that grinds ring body 20 again, this solid material 30 can evenly be covered with in solid Embedded Division 23 formed annular concave ditch 231 and the elongate recesses 232.

Coating solid material 30 at two

commissures

11,21 follows in the bonding process, owing to by the pressing mode part solid material 30 is clamp-oned Embedded Division 31 between this ring-type base material 10 and the grinding ring body 20, this Embedded Division 31 is organized mutually by cock body 40 and positioning hole groove 12 and is established back formation, wherein, these cock body 40 the inners 41 are a smooth blocking surface, make the solid material 30 that embeds can obtain a smooth cohesion face with inner 41 contact-making surfaces.

When this ring-type base material 10 and after grinding described grinding ring body 20 formed each Embedded Divisions 31 of solid material 30 whole embeddings of being smeared between the ring body 20, to grind each cock body 40 taking-ups on the ring body 20 by spiral shell evolution formula again, this cyrstal sphere grinding ring A just can all evenly be covered with solid material 30 with Embedded Division 31 by set solid Embedded Division 23 between ring-type base material 10 and the grinding ring body 20, and then makes that the bonding strength of cyrstal sphere grinding ring A is promoted.

As shown in Figure 6, be that this creates another preferred embodiment, the commissure 11 that lies in this ring-type base material 10 is provided with indent hole slot 32, and these indent hole slot 32 1 ends connect the commissure 11 of this ring-type base material 10.

As shown in Figure 7, when this ring-type base material 10 with grind ring body 20 and combine after, can making partly, solid material 30 embeds in these ring-type base material 10 set indent hole slots 32, make this ring-type base material 10 and grind 20 solid material 30 of smearing of ring body can evenly be covered with in solid Embedded Division 23, Embedded Division 31 and the indent hole slot 32, make cyrstal sphere grinding ring A can reach better bonding effect.

The above-mentioned technical scheme that positioning hole groove 12 is set to the through hole kenel and indent hole slot 32 is set can any one independent enforcement, also can implement in a grinding wafer ring structure two whiles, can reach better bonding effect.

The utility model effect is promoted as follows:

As Fig. 3, shown in Figure 4, be made as the through hole kenel by positioning hole groove 12 with this ring-type base material 10, make described cock body 40 be mounted in this positioning hole groove 12 again in the screw lock mode, and make the solid material 30 between ring-type base material 10 and the grinding ring body 20 can embed ring-type base material 10 commissures 11 set positioning hole grooves 12 to form Embedded Division 31, this ring-type base material 10 that makes in conjunction with fixed-area of solid material 30 of can significantly increasing reaches the more firm stationary state that combines with grinding between the ring body 20, and because the formation of described Embedded Division 31 is that the positioning hole groove 12 that ring-type base material 10 is provided with originally is re-established as the through hole kenel, therefore manufacturing cost need not increase, so the utility model global design can make cyrstal sphere grinding ring A reach preferable firmly in conjunction with polarization and the Practical Benefit of making simplification, and reaches favorable economic benefit.

The foregoing description only discloses specifying the utility model, though and see through specific term in the literary composition and describe, when not limiting claim of the present utility model with this; The personage who is familiar with this technical field be when can changing and revise it after understand the utility model spirit and principle, and reaches the purpose of equivalence, and these changes with revise, all should be covered by claims and define in the protection domain.

Claims

1, a kind of grinding wafer ring structure comprises the ring-type base material and grinds ring body, this ring-type base material and the relative commissure that is provided with of grinding ring body, and it is fixing to combine by the solid material, this ring-type base material is provided with spaced positioning hole groove; It is characterized in that:

Positioning hole groove on this ring-type base material is a through hole, and described positioning hole groove one end connects the commissure of ring-type base material, and described solid material embeds corresponding positioning hole groove position, and forms Embedded Division.

2, grinding wafer ring structure according to claim 1, it is characterized in that: corresponding each the formed Embedded Division in positioning hole groove position of described solid material, embed the degree of depth at each positioning hole groove position, organize in the positioning hole groove in advance by cock body, block resistance restriction solid material, and the degree of depth of control Embedded Division.

3, grinding wafer ring structure according to claim 2 is characterized in that: described cock body is a bolt, and positioning hole groove is provided with the internal thread with screw threaded.

4, according to the described grinding wafer ring structure of claim 1, it is characterized in that: the commissure of described grinding ring body is provided with the solid Embedded Division, and this solid Embedded Division is at least one annular concave ditch, is the radial elongate recesses that is spaced and crosses over each annular concave ditch.

5, a kind of grinding wafer ring structure comprises the ring-type base material and grinds ring body, this ring-type base material and the relative commissure that is provided with of grinding ring body, and it is fixing to combine by the solid material, this ring-type base material is provided with spaced positioning hole groove; It is characterized in that:

The commissure of this ring-type base material is provided with the indent hole slot, and described indent hole slot one end connects the commissure of this ring-type base material, and described solid material embeds corresponding each positioning hole groove position, and forms Embedded Division.

6, want 5 described grinding wafer ring structures according to right, it is characterized in that: the commissure of this grinding ring body is provided with the solid Embedded Division, and this solid Embedded Division is at least one annular concave ditch, is the radial elongate recesses that is spaced and crosses over this each annular concave ditch.