SG10201602683TA - Grinding ring set for semiconductor wafer in chemical and mechanical grinding process - Google Patents
Grinding ring set for semiconductor wafer in chemical and mechanical grinding processInfo
- Publication number
- SG10201602683TA SG10201602683TA SG10201602683TA SG10201602683TA SG10201602683TA SG 10201602683T A SG10201602683T A SG 10201602683TA SG 10201602683T A SG10201602683T A SG 10201602683TA SG 10201602683T A SG10201602683T A SG 10201602683TA SG 10201602683T A SG10201602683T A SG 10201602683TA
- Authority
- SG
- Singapore
- Prior art keywords
- chemical
- semiconductor wafer
- ring set
- grinding
- grinding process
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105101145A TW201725092A (en) | 2016-01-14 | 2016-01-14 | Polishing retaining ring of chemical mechanical polishing process for semiconductor wafer having progressive features of weight reduction, good strength, cost reduction, process reduction, and reduction of rust |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201602683TA true SG10201602683TA (en) | 2017-08-30 |
Family
ID=59334653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201602683TA SG10201602683TA (en) | 2016-01-14 | 2016-04-06 | Grinding ring set for semiconductor wafer in chemical and mechanical grinding process |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2017126730A (en) |
CN (1) | CN106965078A (en) |
SG (1) | SG10201602683TA (en) |
TW (1) | TW201725092A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110181355B (en) * | 2019-06-27 | 2021-08-17 | 西安奕斯伟硅片技术有限公司 | Grinding device, grinding method and wafer |
CN111975629B (en) * | 2020-08-26 | 2022-06-03 | 上海华虹宏力半导体制造有限公司 | Positioning ring and chemical mechanical polishing machine |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001121411A (en) * | 1999-10-29 | 2001-05-08 | Applied Materials Inc | Wafer polisher |
JP2002355753A (en) * | 2001-05-30 | 2002-12-10 | Sumitomo Osaka Cement Co Ltd | Retainer ring of high performance and long life, and polishing device comprising the same |
DE10247179A1 (en) * | 2002-10-02 | 2004-04-15 | Ensinger Kunststofftechnologie Gbr | Retaining ring for holding semiconductor wafers in a chemical mechanical polishing device |
CN100389948C (en) * | 2005-02-01 | 2008-05-28 | 陈亦锋 | Multilayer co-extrusion transfusion film and manufacturing method thereof |
KR200395968Y1 (en) * | 2005-06-16 | 2005-09-15 | 주식회사 윌비에스엔티 | Retainer ring of chemical mechanical polishing apparatus |
WO2009049329A1 (en) * | 2007-10-12 | 2009-04-16 | Tosy Robotics Joint Stock Company | Boomerang |
CN201249404Y (en) * | 2008-07-25 | 2009-06-03 | 孙建忠 | Grinding positioning ring |
CN201346740Y (en) * | 2008-11-10 | 2009-11-18 | 孙建忠 | Wafer grinding positioning ring |
CN203266389U (en) * | 2013-04-03 | 2013-11-06 | 孙建忠 | Heterogeneous medium composite grinding locating ring |
-
2016
- 2016-01-14 TW TW105101145A patent/TW201725092A/en unknown
- 2016-03-29 CN CN201610186338.XA patent/CN106965078A/en active Pending
- 2016-04-04 JP JP2016075271A patent/JP2017126730A/en active Pending
- 2016-04-06 SG SG10201602683TA patent/SG10201602683TA/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW201725092A (en) | 2017-07-16 |
CN106965078A (en) | 2017-07-21 |
JP2017126730A (en) | 2017-07-20 |
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