SG10201602683TA - Grinding ring set for semiconductor wafer in chemical and mechanical grinding process - Google Patents

Grinding ring set for semiconductor wafer in chemical and mechanical grinding process

Info

Publication number
SG10201602683TA
SG10201602683TA SG10201602683TA SG10201602683TA SG10201602683TA SG 10201602683T A SG10201602683T A SG 10201602683TA SG 10201602683T A SG10201602683T A SG 10201602683TA SG 10201602683T A SG10201602683T A SG 10201602683TA SG 10201602683T A SG10201602683T A SG 10201602683TA
Authority
SG
Singapore
Prior art keywords
chemical
semiconductor wafer
ring set
grinding
grinding process
Prior art date
Application number
SG10201602683TA
Inventor
Chien-Chung Sun
Original Assignee
Chien-Chung Sun
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chien-Chung Sun filed Critical Chien-Chung Sun
Publication of SG10201602683TA publication Critical patent/SG10201602683TA/en

Links

SG10201602683TA 2016-01-14 2016-04-06 Grinding ring set for semiconductor wafer in chemical and mechanical grinding process SG10201602683TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105101145A TW201725092A (en) 2016-01-14 2016-01-14 Polishing retaining ring of chemical mechanical polishing process for semiconductor wafer having progressive features of weight reduction, good strength, cost reduction, process reduction, and reduction of rust

Publications (1)

Publication Number Publication Date
SG10201602683TA true SG10201602683TA (en) 2017-08-30

Family

ID=59334653

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201602683TA SG10201602683TA (en) 2016-01-14 2016-04-06 Grinding ring set for semiconductor wafer in chemical and mechanical grinding process

Country Status (4)

Country Link
JP (1) JP2017126730A (en)
CN (1) CN106965078A (en)
SG (1) SG10201602683TA (en)
TW (1) TW201725092A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110181355B (en) * 2019-06-27 2021-08-17 西安奕斯伟硅片技术有限公司 Grinding device, grinding method and wafer
CN111975629B (en) * 2020-08-26 2022-06-03 上海华虹宏力半导体制造有限公司 Positioning ring and chemical mechanical polishing machine

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001121411A (en) * 1999-10-29 2001-05-08 Applied Materials Inc Wafer polisher
JP2002355753A (en) * 2001-05-30 2002-12-10 Sumitomo Osaka Cement Co Ltd Retainer ring of high performance and long life, and polishing device comprising the same
DE10247179A1 (en) * 2002-10-02 2004-04-15 Ensinger Kunststofftechnologie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing device
CN100389948C (en) * 2005-02-01 2008-05-28 陈亦锋 Multilayer co-extrusion transfusion film and manufacturing method thereof
KR200395968Y1 (en) * 2005-06-16 2005-09-15 주식회사 윌비에스엔티 Retainer ring of chemical mechanical polishing apparatus
WO2009049329A1 (en) * 2007-10-12 2009-04-16 Tosy Robotics Joint Stock Company Boomerang
CN201249404Y (en) * 2008-07-25 2009-06-03 孙建忠 Grinding positioning ring
CN201346740Y (en) * 2008-11-10 2009-11-18 孙建忠 Wafer grinding positioning ring
CN203266389U (en) * 2013-04-03 2013-11-06 孙建忠 Heterogeneous medium composite grinding locating ring

Also Published As

Publication number Publication date
TW201725092A (en) 2017-07-16
CN106965078A (en) 2017-07-21
JP2017126730A (en) 2017-07-20

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