JP2007130690A - Carrier for planetary gear type polishing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve stable working accuracy by preventing cracks and breaks of a work 15 occurring in the process of polishing the square work 15 in a planetary gear type polishing device. <P>SOLUTION: In this carrier, in order to polish a thinner work 15 while preventing cracks and breaks of the work 15 due to deformation of machining surfaces of an upper plate and a lower plate 11 occurring in the process of polishing, the shape of a work holding hole 16 of the carrier 14 is such that in the process of polishing, the work 15 draws a locus of a character 8-shaped to the upper plate 10 and the lower plate 11 by rotation and revolving motion of the carrier 14, whereby the shape of the work holding hole 16 is thus added to make the machined work 15 have higher accuracy and decrease cracks and breaks. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a carrier for a polishing apparatus for simultaneously polishing both surfaces of quartz, silicon, glass, metal and other various materials.

  Conventionally, according to a polishing method in an apparatus for polishing a silicon wafer, a crystal, a glass substrate, and the like, an upper and lower plate called a surface plate, a central gear and an internal gear are provided and placed on the lap plate. A gear holding a workpiece called a carrier meshed with the gear is held by the upper plate, and the upper and lower surfaces of the workpiece are polished by causing planetary motion to revolve while rotating.

  At the start of the machining operation, in order to attach the workpiece, which is a workpiece, to the carrier, the workpiece is set on the carrier by being moved upward by the upper plate lifting device installed above the upper plate. When the setting is finished, the upper plate is lowered, loaded onto the work held by the carrier placed on the lower plate, pressed against the work, and while supplying the abrasive, the entire upper and lower plates are covered with the workpiece. The internal gear and the central gear are rotated and the upper plate and the lower plate are rotated or the upper plate and the lower plate are rotated by a program set in advance so that a certain workpiece moves relatively. The work held by the carrier gripped by the upper and lower plates is pressed by the load adjustment mechanism of the upper plate, and appropriate rotation of the internal gear and the central gear in order to rotate and revolve the carrier while supplying abrasive. The ratio was selected and the work surface of the workpiece was polished.

  The workpiece holding hole of the carrier for holding the workpiece used in this polishing apparatus has a shape with a plus tolerance added to the workpiece dimension. Therefore, in principle, when the workpiece is circular, the holding hole is circular, and when it is rectangular, the holding hole is rectangular.

  When the workpiece is a quadrilateral, the conventional hole shape of the carrier is the same quadrilateral as the workpiece. In this conventional hole shape, since the work is fixed in the carrier, there is little decrease in thickness variation after the polishing process, and there is a problem that the thickness must be corrected by re-working.

  As a means for solving the problem, the workpiece holding hole of the carrier that holds the circular workpiece adds a plus tolerance to the workpiece dimension, and the workpiece being polished is further added to the rotation and revolution motion in the holding hole of the carrier. In addition, since the rotational motion which is the third motion is added, the motion miracle becomes complicated and good results are obtained.

  However, in the case of a quadrilateral workpiece, the shape of the workpiece holding hole of the carrier is limited to a shape obtained by adding a plus tolerance to the conventional workpiece dimensions, so the movement trajectory drawn on the plate polishing surface is limited, which is higher than after processing It was difficult to desire accuracy.

  In order to solve the above problems, the work must be imparted or provided with a more complex movement within the work holding hole of the carrier.

  The present invention has been made to solve the above-described problems. The shape of the workpiece holding hole of the carrier holding the quadrilateral workpiece is added to the conventional workpiece dimensions by adding a plus tolerance, and the workpiece is held at each side. Since the shape that gives more relief to the orthogonal parts of each side is provided, the work being polished is given a third movement added to the rotation and revolution movement in the carrier holding hole, so the movement locus drawn on the upper and lower plates Became complicated and good results were obtained.

  By holding the workpiece with the polishing apparatus and giving relief to the orthogonal parts of each side, the workpiece is given a third movement in addition to the rotation and revolution movement in the carrier holding hole during the polishing process. The movement trajectory drawn on the plate became more complicated, cracking after processing was reduced, accuracy was improved, and good results were obtained.

  In addition, the holding position of the carrier holding hole for holding the workpiece is a central portion of each side of the workpiece, and the others are escape portions, and a method of maintaining a high-accuracy plane after processing is adopted.

  As a means to solve the problem, the shape of the workpiece holding hole of the carrier that holds the quadrilateral workpiece is changed to the shape of holding the workpiece on all sides of each side by adding a plus tolerance to the conventional workpiece dimensions, and the center of each side Since the workpiece is held in position, the workpiece being polished is given a third movement added to the rotation and revolution movement in the carrier holding hole, so the movement miracle drawn on the upper and lower plates becomes more complicated. Good results were obtained.

  Since the shape of the workpiece holding hole of the carrier for processing the quadrilateral workpiece of the present invention with high accuracy is the shape that holds the workpiece at the center position of each side as described above, the workpiece being polished is held by the carrier. Since the third movement added to the rotation and revolution movements in the hole is provided, the movement trajectory drawn on the upper and lower plates becomes more complicated, and the plane of the plate can be maintained, so that the plane of the workpiece can be processed with high accuracy.

  Hereinafter, the carrier according to the present invention will be described with reference to the drawings.

  FIG. 1 is a plan view of the carrier of the present invention used in the planetary gear type polishing apparatus described above, and shows a state in which a workpiece is held in a workpiece holding hole.

  FIG. 2 is an apparatus cross-sectional view showing an embodiment of a planetary gear type polishing apparatus using the carrier of the present invention, in which 11 is a lower plate, and an upper plate 10 located above is omitted. A polishing jig 14 for holding the workpiece 15 held by the upper and lower plates is a carrier, which rotates while meshing with the central gear 13 and the internal gear 12 while holding the workpiece 15.

  Along with the start of processing, the workpiece 15 is supplied with an abrasive, and each axis starts driving. When the workpiece 15 held by the upper and lower plates 10 and 11 has increased frictional resistance between the processed surfaces of the upper and lower plates 10 and 11 and the processed surface of the workpiece 15, the workpiece 15 is placed in the workpiece holding hole 16 of the carrier. Slightly moves in the direction of decreasing frictional resistance to prevent cracking and chipping. The movement that eliminates this frictional resistance becomes an important factor for cracking of the workpiece 15 and accuracy after processing.

  FIG. 3 shows a carrier 14 corresponding to a quadrilateral workpiece according to a conventional processing method called a double carrier type. This method can rotate the work 15 360 degrees in order to reduce the frictional resistance generated during the polishing process, but is not suitable for polishing a thin work. This method called a double carrier is because the holder 17 must be made thinner in the thin work 15, and the holder 17 comes off from the carrier 14 during processing, and the work 15 often comes off.

  FIG. 4 shows a work carrier 14 conventionally used. The tolerance hole which is added to the dimension of the workpiece 15 is used as a workpiece holding hole, and the tolerance is reduced by preventing cracking.

It is the top view in which the carrier by the present invention held the work. It is an apparatus principal part top view which shows embodiment of the carrier used for the planetary gear type grinding | polishing apparatus in Example 1 by this invention. It is a double type carrier top view corresponding to the quadrilateral work conventionally used. It is a carrier top view corresponding to the quadrilateral work conventionally used.

Explanation of symbols

10 Upper plate
11 Lower plate
12 Internal gear
13 Central gear
14 Carrier
15 work
16 Workpiece holding hole
17 Holder

Claims (1)

A plurality of carriers holding the workpiece are arranged at equal intervals between the central gear and the internal gear incorporated in the horizontal plane, and the workpiece, which is the workpiece, is inserted, and then the upper lap plate is lowered. In a polishing machine that simultaneously performs a planetary movement that rotates and revolves the work carrier while supplying the abrasive while being sandwiched between the lower lap plate and a relative rotational movement of the upper and lower lap plates, However, the carrier for the planetary-type polishing apparatus holding the work hole having a shape in which the locus to the upper and lower lap plates draws a figure of 8.

Images