KR102481144B1 - Double surface polishing device - Google Patents

Abstract

A double-sided polishing device capable of suppressing deterioration in workability during dressing of a tabletop and holding the tabletop horizontally during dressing is provided.
In the double-sided polishing device 1 for polishing both sides of a workpiece by a lower surface plate 2 and an upper surface plate 3, a driving mechanism 10 that penetrates the lower surface plate 2 and rotates around an axis , A support mechanism (elevating actuator 9, alignment bearing 9b) for oscillating and rotatably suspending the upper table 3, and a hook provided around the central opening 3b of the upper table 3 20 and the groove portion 11 formed on the main surface of the drive mechanism 10 and into which the hook 20 can be inserted when the relative rotation angle of the upper table 3 and the drive mechanism 10 in the circumferential direction is a predetermined angle And, a contact area 12 formed on the upper surface 10c of the drive mechanism 10, and a protrusion 13 provided in the contact area 12 to which the hook 20 contacts.

Description

Double-sided polishing device {DOUBLE SURFACE POLISHING DEVICE}

The present invention relates to a double-sided polishing device for polishing both surfaces of a work disposed between a lower and upper table.

Conventionally, while the upper table is connected to the cylinder shaft installed on the upper part of the device through a universal joint or a pivot bearing, a first groove portion formed in the axial direction on the outer circumferential surface of the center drum, and the first groove portion A double-sided polishing device is known in which second grooves having different lengths are formed, hooks provided on the upper table are engaged with the first groove or the second groove, and the rotational force of the center drum is transmitted to the upper table (e.g., , see Patent Document 1).

Patent Document 1: Japanese Unexamined Patent Publication No. 2017-1151

In a conventional double-sided polishing machine, a hook formed on the upper table is inserted into the first groove portion in order to lower the upper table to the work polishing position when polishing the work. On the other hand, when washing or dressing (hereinafter referred to as "dressing") the polishing pad attached to the upper table, the hook is inserted into the second groove. Then, the hook is supported by a support surface formed in the second groove portion for supporting the hook from below, the upper table is stopped at a position above the work polishing position, and then the upper table is maintained in a horizontal state during dressing.

However, in this conventional double-sided polishing machine, the hook must be inserted into the groove either at the time of polishing the workpiece or at the time of dressing the polished surface. That is, even when dressing the tabletop, the relative rotational angles of the tabletop and the central drum must be adjusted so that the hook can be inserted into a desired groove, resulting in a problem of reduced workability during dressing.

In addition, in the conventional double-sided polishing machine, a pair of second grooves is formed, but when a difference occurs in the groove depth of the pair of second grooves due to a problem in machining accuracy, dressing At times, there is a possibility that the upper half of the table may tilt.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a double-sided polishing device capable of holding a floor table horizontally during dressing while suppressing a decrease in workability when dressing the floor table.

In order to achieve the above object, the present invention is a double-sided polishing device for polishing both sides of a workpiece by a lower and upper table, a drive mechanism, a support mechanism, a hook, a groove, a contact area, and a protrusion are equipped

The drive mechanism is rotatable about an axis while penetrating the lower table.

The support mechanism oscillates and rotatably suspends the upper table to support it.

The hook extends from the inner circumference of the tabletop toward the center.

The groove is formed on the main surface of the driving mechanism and extends in the axial direction of the driving mechanism, and the hook is inserted when the relative rotation angle between the upper table and the driving mechanism in the circumferential direction is a predetermined angle.

The contact area is formed on the upper surface of the driving mechanism.

The protrusion is provided in the contact area, and the hook contacts the contact area in a state where the hook is in contact with the contact area.

As a result, it is possible to suppress the decrease in workability when dressing the polished surface of the tabletop, while keeping the tabletop horizontal during dressing.

1 is a cross-sectional view schematically showing the overall configuration of a double-sided polishing device in Example 1. FIG.
Fig. 2 is a perspective view showing important parts of the double-sided polishing device of Example 1;
Fig. 3 is a plan view showing a drive mechanism of the double-sided polishing device of Example 1;
Fig. 4 is a plan view showing important parts of the upper surface plate of the double-sided polishing apparatus of Example 1;
Fig. 5 is a plan view of the double-sided polishing device of Example 1 during dressing.
6 is a cross-sectional view taken along AA in FIG. 5 .
Fig. 7 is a plan view at the time of polishing the work in the double-sided polishing apparatus of Example 1.
Fig. 8 is a cross-sectional view along BB in Fig. 7;
Fig. 9 is a perspective view showing important parts of a double-sided polishing device of another example.
10A is a plan view at the time of dressing in the double-sided polishing device of another example.
Fig. 10B is a sectional view taken along CC in Fig. 10A.
Fig. 11A is a plan view of workpiece polishing in a double-sided polishing device of another example.
Fig. 11B is a sectional view taken along DD in Fig. 11A.
Fig. 12 is an explanatory diagram showing a modified example of a hook and a projection.
Fig. 13 is an explanatory diagram showing a modified example of the drive mechanism.

Hereinafter, the mode for implementing the double-sided polishing device of the present invention will be described based on Example 1 shown in the drawings.

(Example 1)

First, the configuration will be described.

The double-sided polishing device 1 in Example 1 polishes both the front and back surfaces of a thin-plate-like workpiece WR such as a semiconductor wafer, a quartz wafer, a sapphire wafer, a glass wafer, or a ceramic wafer. is to do Hereinafter, the configuration of the double-sided polishing device 1 of Example 1 will be described by dividing it into "overall configuration", "detailed configuration of drive mechanism", and "detailed configuration of hook".

[Overall composition]

1 is a cross-sectional view schematically showing the overall configuration of a double-sided polishing device in Example 1. FIG. Hereinafter, the overall configuration of the double-sided polishing device of Example 1 will be described with reference to FIG. 1 .

As shown in FIG. 1, the double-sided polishing device 1 of Example 1 includes a lower surface plate 2 and an upper surface plate 3 arranged concentrically around the axis L1. , It has a sun gear (4) disposed in the center of the lower surface plate (2) and an internal gear (5) disposed so as to surround the outer circumference of the lower surface plate (2).

The sun gear 4, the lower surface plate 2, and the internal gear 5 are connected to a drive source (not shown) through drive shafts 6, 7, and 8, respectively, and are rotationally driven.

On the other hand, the upper table 3 is suspended from the rod 9c of the lift actuator 9 via the table suspension 9a attached to the upper surface of the upper table 3 and is supported. Here, an alignment bearing 9b such as a spherical bearing is interposed at the tip of the rod 9c. Due to this, the upper table 3 is swingably and rotatably suspended and supported by the actuator 9 for elevation. That is, a support mechanism for suspending and supporting the floor table 3 is constituted by the lifting actuator 9 and the alignment bearing 9b.

Further, below the upper table 3, a drive mechanism 10 penetrating the lower table 2 is provided. This drive mechanism 10 has a drive shaft 10a extending along the axis line L1 and a drive mechanism body 10b formed at the tip of the drive shaft 10a.

And, in this drive mechanism 10, the drive shaft 10a is connected to a drive source (not shown), and is rotatable around the axis line L1. In addition, a plurality of (four in this case) grooves 11 are formed on the main surface of the drive mechanism main body 10b. On the other hand, on the circumference (inner circumference) of the central opening 3b of the upper table 3, a plurality of hooks 20 (four in this case) extending toward the center O of the upper table 3 are is fitted

Then, when the workpiece WR is polished, the rod 9c protrudes from the lift actuator 9 and the upper table 3 is lowered, and the hook 20 is inserted into each groove 11 one by one. . Then, when the groove portion 11 and the hook 20 interfere in the circumferential direction, the rotational force of the drive mechanism 10 is transmitted to the upper table 3, and the upper table 3 is rotationally driven.

Polishing pads 2a and 3a are attached to mutually opposing surfaces of the lower surface plate 2 and the upper surface surface plate 3, respectively.

And in this double-sided polishing apparatus 1, the workpiece|work WR held by the carrier plate CA is arrange|positioned between the lower surface plate 2 and the upper surface plate 3. Here, the carrier plate CA is engaged with the sun gear 4 and the internal gear 5, as shown in FIG. 1, and rotates and rotates by the rotation of the sun gear 4 and the internal gear 5. orbiting Then, due to the rotation and revolution of the carrier plate CA, the workpiece WR held by the carrier plate CA is moved between the lower table 2 and the upper table 3, and both surfaces are polished.

[Detailed configuration of driving mechanism]

2 is a perspective view showing important parts of the double-sided polishing device of Example 1, and FIG. 3 is a plan view showing a drive mechanism of the double-sided polishing device of Example 1. Hereinafter, the detailed configuration of the driving mechanism of the first embodiment will be described based on FIGS. 2 and 3 .

As described above, the driving mechanism 10 is rotationally driven by a drive source not shown, and transmits a rotational force to the upper table 3 to drive the upper table 3 to rotate. As shown in FIG. 2, this drive mechanism 10 includes a drive shaft 10a connected to a drive source and arranged along an axis line L1, and a drive mechanism main body 10b formed at the tip of the drive shaft 10a. has

The drive shaft 10a passes through the central opening 2b of the lower table 2 and supports the drive mechanism main body 10b at a position protruding upward from the lower table 2 (see Fig. 1).

The driving mechanism main body 10b has a plurality of (four in this case) grooves 11 formed on the main surface, and a contact area 12 formed on the upper surface 10c facing the upper table 3, A plurality of (two in this case) projections 13 are formed in this contact area 12 .

As shown in Fig. 2, the groove portion 11 extends along the axis L1, that is, the axial direction of the drive mechanism 10, and opens in the radial direction and the vertical direction of the drive mechanism main body 10b. In addition, each groove width (溝幅, G1) of the four groove portions 11 is set to the same dimension in which the hook 20 can be inserted (see Fig. 3). In addition, "groove width G1" is the distance dimension of the inner side surface 11a of the drive mechanism main body 10b in the circumferential direction.

Furthermore, in the first embodiment, four grooves 11 are formed at every 90° along the circumferential direction of the drive mechanism main body 10b, and these grooves 11 are formed at the center of the upper table 3 ( O) (the point through which the axis L1 passes) is arranged at a point-symmetrical position with the symmetrical point.

The contact area 12 is an area where the contact surface 22a (see Fig. 6) of the front end portion 22 of the hook 20 can be contacted, and has a sufficiently larger area than the contact surface 22a. Here, as shown in Fig. 3, it is an area along the circumferential portion of the driving mechanism main body 10b. In addition, in this contact area 12, the groove part 11 overlaps, and the upper end of the groove part 11 is opened in this contact area 12.

The protruding portion 13 protrudes upward from the contact area 12 along the axial direction (axis L1) of the drive mechanism 10, and the front end portion of the hook 20 in contact with the contact area 12 ( 22) is contactable with the side surface 22b. Here, as shown in FIG. 3 , the projection 13 is curved along the circumferential direction of the drive mechanism main body 10b, but its circumferential dimension G2 is the It is set to a dimension sufficiently smaller than the gap dimension. That is, the upper end of the groove portion 11 is opened in the contact area 12 and the protrusion 13 is formed in the contact area 12, but this contact area 12 is ) is sufficiently secured.

In addition, the protrusion 13 may be formed separately from the drive mechanism body 10b and fixed to the drive mechanism body 10b by screws or welding not shown, or may be integrally formed with the drive mechanism body 10b. .

[Detailed composition of hook]

Fig. 4 is a plan view of the central portion of the upper table in Example 1; Hereinafter, the detailed configuration of the hook provided on the upper table of the first embodiment will be described with reference to FIGS. 2 and 4 .

The hook 20 is fixed to the circumference (inner circumference) of the central opening 3b of the tabletop 3, and extends toward the center O of the tabletop 3. As shown in FIG. 4, this hook 20 has one end fixed to the upper surface of the upper table 3 and the tip protruding inward of the central opening 3b of the upper table 3. Fixing portion 21 ), and a tip portion 22 formed at the tip of the fixing portion 21 and extending toward the lower table 2. Here, as shown in FIGS. 1 and 4, the fixing portion 21 extends until the front end portion 22 is located above the top surface 10c of the drive mechanism body 10b, and is flat. When viewed flat, the distal end 22 overlaps the upper surface 10c of the drive mechanism main body 10b.

In addition, this hook 20 has a hook width (hook 幅, W1) of the tip portion 22 that is slightly smaller than the groove width G1 of the groove portion 11, and when inserted into the groove portion 11, the side surface of the tip portion 22 (22b) of the first hook 20A contacting the inner side surface 11a of the groove portion 11 and the hook width W2 of the front end portion 22 are sufficiently smaller than the groove width G1 of the groove portion 11, so that the groove portion When inserted into (11), the side surface 22b of the front end portion 22 has a second hook 20B that does not come into contact with the inner side surface 11a of the groove portion 11. In addition, the "hook width" is the size of the tip of the hook in the circumferential direction of the upper table 3.

And two 1st hooks 20A and 2nd hooks 20B are respectively provided, and here, along the circumferential direction of the upper table 3, they are arrange|positioned alternately at every 90 degree. That is, as shown in FIG. 4 , the four hooks 20 are arranged at point-symmetric positions with the center O (the point through which the axis L1 passes) of the upper table 3 as a symmetrical point, and the first It is arrange|positioned so that 20 A of hooks may oppose each other, and 2nd hooks 20B may oppose each other.

Next, the action of the double-sided polishing device of Example 1 will be explained by dividing it into "supporting action of the floor table during dressing" and "supporting action of the floor table during polishing of the workpiece".

[Supporting action of the upper table during dressing]

5 and 6 show important parts when dressing the upper table in the double-sided polishing device 1 of the first embodiment. Hereinafter, based on Figs. 5 and 6, the supporting action of the upper surface plate during dressing in the double-sided polishing device 1 of Example 1 will be explained.

In the double-sided polishing device 1 of Example 1, when polishing a workpiece, the upper surface plate 3 is lowered, and the workpiece WR placed on the lower surface plate 2 is separated from the upper surface plate 3. It is inserted between the lower table (2).

Here, even if the thickness of the workpiece WR or the carrier plate CA holding the workpiece WR is uneven, in order to make the pressing force acting on the workpiece WR uniform, the rotation of the lower table 2 In order to make the upper table 3 follow the accompanying minute vertical vibration (swaying) of the lower table 2, the upper table 3 is suspended from the actuator 9 for elevating through the alignment bearing 9b and supported. There is, it is possible to allow a declination angle with respect to the horizontal direction.

On the other hand, polishing pads 2a and 3a are attached to the lower surface plate 2 and the upper surface plate 3, respectively, and the workpiece WR is formed by the lower surface plate 2 and the upper surface plate 3 and the carrier plate CA It is polished by rotation of the polishing pads 2a and 3a or a slurry supplied from a supply mechanism not shown. However, when the double-sided polishing device 1 is used for a long time, the polishing liquid or debris penetrates the polishing pads 2a, 3a, causing the polishing pads 2a, 3a to become clogged (glazing), and the polishing pads ( The surface of 2a, 3a) is also deformed. Because of this, since the polishing efficiency is remarkably lowered, the dressing of the polishing pads 2a and 3a proceeds.

Here, the dressing of the polishing pads 2a and 3a is performed by inserting a dressing member between the lower surface plate 2 and the upper surface plate 3, for example, while rotating the lower surface plate 2 and the upper surface plate 3, respectively. In addition, by pressing this dressing member against the polishing surfaces of the polishing pads 2a and 3a and reciprocating between the outer and inner peripheries of the lower surface plate 2 and the upper surface plate 3 proceeded by

At this time, since it is necessary to sandwich the dressing member between the lower surface plate 2 and the upper surface plate 3, the upper surface plate 3 is maintained at a distance from the lower surface plate 2. However, as described above, since the upper surface plate 3 is suspended and supported via the alignment bearing 9b, when the dressing member is pressed against the polishing pad 3a of the upper surface plate 3, the upper surface plate 3 The inclination of is changed, and the dressing member cannot be properly brought into contact with the polishing pad 3a of the upper table 3.

In contrast, in the double-sided polishing device 1 of Example 1, as shown in FIGS. 5 and 6 , when the upper table 3 is lowered by the lift actuator 9, the upper table 3 The contact surface 22a of the distal end 22 of the hook 20 is in contact with the contact area 12 formed on the upper surface 10c of the driving mechanism body 10b. Due to this, the upper table 3 is supported by the upper surface 10c of the drive mechanism 10 via the hook 20 .

As a result, even if the dressing member is pressed against the polishing pad 3a of the tabletop 3 when dressing the tabletop 3, the hook 20 interferes with the upper surface 10c of the drive mechanism 10. Shaking of the upper table 3 is prevented. Therefore, the upper table 3 can be held horizontally during dressing.

Further, the contact area 12 where the contact surface 22a of the distal end 22 of the hook 20 contacts is an area along the circumference of the driving mechanism main body 10b, as shown in FIG. 5 . In addition, in this contact area 12, the upper end of the groove 11 is opened and the protrusion 13 is formed, but the area where the contact surface 22a of the tip 22 of the hook 20 comes into contact is sufficient. It is secured. Therefore, when the upper table 3 is lowered without strictly adjusting the relative rotation angle of the upper table 3 and the drive mechanism 10 in the circumferential direction, the hook 20 moves to the upper surface of the drive mechanism main body 10b. It abuts on the contact area 12 formed in (10c). For this reason, the fall of workability|operativity at the time of dressing can be suppressed.

Further, in Example 1, a protruding portion ( 13) is formed, and this protrusion 13 can come into contact with the side surface 22b of the distal end 22 of the hook 20 that is in contact with the contact area 12.

Therefore, when the drive shaft 10a of the drive mechanism 10 rotates, the protrusion 13 abuts against the side surface 22b of the front end 22 of the hook 20, as shown in FIG. 5 . Due to this, the rotational force of the driving mechanism 10 is transmitted to the hook 20 and the tabletop 3 rotates.

That is, the rotational force of the drive mechanism 10 can be transmitted to the upper table 3 through the protrusion 13, and dressing can be performed by rotating the upper table 3. As a result, the dressing operation can proceed appropriately.

Moreover, in this Embodiment 1, two protrusions 13 are provided for four hooks 20 provided. That is, the number of protrusions 13 (two) is less than the number of hooks 20 (four). Therefore, as shown in FIG. 5, the hook 20 (Fig. In 5, the second hook 20B and the hook 20 (the first hook 20A in Fig. 5) do not contact the projection 13 and do not transmit rotational force.

For this reason, rotational force is not input to all hooks 20 at the time of dressing, and depending on the relative rotational angle of the upper table 3 and the driving mechanism 10 in the circumferential direction, the hook to which rotational force is input every time dressing is performed (20) can be different. Therefore, the load acting on each hook 20 can be dispersed. As a result, it is possible to make it difficult for the hook 20 to be damaged or defective.

In particular, as shown in FIG. 5, the hook width W1 of the front end portion 22 is slightly smaller than the groove width G1 of the groove portion 11 so that the side surface 22b is attached to the inner side surface 11a of the groove portion 11. The contacting first hook 20A does not contact the protruding portion 13, and the hook width W2 of the front end portion 22 is sufficiently smaller than the groove width G1 of the groove portion 11 so that the side surface 22b is formed by the groove portion 11 ) In the case where the second hook 20B, which does not contact the inner side surface 11a, contacts the protrusion 13, as will be described later, the rotational force from the drive mechanism 10 is the first hook when polishing the workpiece. It is transmitted only to 20A, and only to the second hook 20B at the time of dressing.

Therefore, the hooks 20 to which the rotational force is transmitted can be made different at the time of workpiece polishing and the time of dressing, and the load acting on each hook 20 can be further distributed. As a result, it is possible to make it difficult for the hook 20 to be damaged or defective.

Moreover, it is also possible to make the hook width W1 of the 1st hook 20A and the hook width W2 of the 2nd hook 20B the same hook width.

[Supporting action of the upper table during workpiece polishing]

7 and 8 show important parts when a workpiece is polished in the double-sided polishing device 1 of Example 1. Hereinafter, based on Figs. 7 and 8, the supporting action of the upper table during workpiece polishing in the double-sided polishing apparatus 1 of Example 1 will be explained.

As described above, in the double-side polishing device 1 of Example 1, the upper surface plate 3 is lowered, the upper surface plate 3 is placed on the lower surface plate 2, and the workpiece WR is polished. That is, in polishing the workpiece WR, first, the angle or drive of the rotational direction of the tabletop 3 is such that the relative rotational angle of the tabletop 3 and the driving mechanism 10 in the circumferential direction becomes a predetermined angle. The angle of the rotation direction of the mechanism 10 is adjusted. In addition, this "predetermined angle" is an angle at which the hook 20 provided in the upper table 3 and the groove part 11 formed in the drive mechanism 10 oppose each other in the vertical direction.

And, if the relative rotation angle of the upper table 3 and the driving mechanism 10 in the circumferential direction becomes a predetermined angle and the hook 20 and the groove 11 face each other in the vertical direction, the lifting actuator 9 loads 9c is protruded and the upper table 3 is lowered. And, as shown in FIGS. 7 and 8, four hooks 20 are inserted into the four grooves 11 as the upper table 3 is lowered, respectively, so that the hooks 20 are driven by the main body of the drive mechanism. The upper table 3 can be placed on the lower table 2 without interfering with (10b).

In this way, when the drive shaft 10a of the drive mechanism 10 rotates in a state where the hook 20 is inserted into the groove 11, as shown in FIG. 7, the inner side surface 11a of the groove 11 It abuts on the side surface 22b of this 1st hook 20A. Due to this, the rotational force of the drive mechanism 10 is transmitted to the first hook 20A, and the tabletop 3 rotates.

That is, the rotational force of the driving mechanism 10 can be transmitted to the upper table 3 through the groove portion 11, and the polishing of the workpiece WR can be performed by rotating the upper table 3. As a result, the workpiece polishing operation can be appropriately performed.

Further, in this first embodiment, as is clear from FIG. 7 , among the hooks 20, the hook width W1 of the tip portion 22 is slightly smaller than the groove width G1 of the groove portion 11, the first hook ( The side surface 22b of 20A) is in contact with the inner side surface 11a of the groove portion 11, and the hook width W2 of the tip portion 22 is sufficiently smaller than the groove width G1 of the groove portion 11. A second hook ( The side surface 22b of 20B) does not contact the inner side surface 11a of the groove 11.

Therefore, the rotational force from the drive mechanism 10 is transmitted only to the first hook 20A, and the rotational force does not act on the second hook 20B. At the time of workpiece polishing, four hooks 20 must be inserted into each of the four grooves 11, but for the second hook 20B, the dimensional accuracy required between the grooves 11 can be relaxed, and the four The hook 20 can be easily inserted into the groove 11.

In addition, as described above, the first hook 20A that comes into contact with the inner side surface 11a of the groove portion 11 during workpiece polishing has at least the contact surface 22a of the front end portion 22 in the contact area 12 during dressing. This abutting can support the upper table 3. In other words, this first hook 20A is a hook that advances while also serving as a rotational force transmission during workpiece polishing and supporting a tabletop during dressing.

And, in Example 1, the four hooks 20 and the four grooves 11 are each formed at 90° intervals along the circumferential direction, and all are formed at the center O (axis line ( The point L1) passes through) is arranged at a point-symmetrical position with the symmetry point.

Therefore, at the time of dressing, the floor table 3 can be supported in a well-balanced manner by the four hooks 20, regardless of the direction of action of the force on the floor table 3 during dressing. ) can be maintained in a horizontal state by suppressing the shaking of the On the other hand, when polishing the workpiece, each hook 20 can be inserted into the groove portion 11, so that the drive mechanism 10 does not hinder the descent of the upper table 3, and the workpiece WR can be properly polished. can

Next, the effect is explained.

In the double-sided polishing device 1 of Example 1, the effects listed below can be obtained.

(1) In a double-sided polishing device 1 for polishing both sides of a workpiece WR by a lower surface plate 2 and an upper surface plate 3,

A driving mechanism 10 that rotates around an axis while penetrating the lower surface plate 2;

A support mechanism (elevating actuator 9, alignment bearing 9b) for oscillating and rotatably suspending and supporting the upper table 3,

A hook 20 extending from the circumference of the central opening 3b of the upper table 3 toward the center O;

It is formed on the main surface of the driving mechanism 10 and extends in the axial direction of the driving mechanism 10, and the relative rotation angle between the upper table 3 and the driving mechanism 10 in the circumferential direction is a predetermined angle. A groove 11 into which the hook 20 can be inserted when

A contact area 12 formed on the upper surface 10c of the drive mechanism 10;

It is provided in the contact area 12 and has a configuration having a protrusion 13 with which the hook 20 contacts the contact area 12 in a state in which the hook 20 is in contact with the contact area 12 .

Accordingly, while reducing workability during dressing of the tabletop 3, the tabletop 3 can be held horizontally during dressing.

(2) A plurality (four) of the grooves 11 are formed on the main surface of the driving mechanism 10,

When the hook 20 is inserted into the groove portion 11, the first hook 20A contacts the inner side surface 11a of the groove portion 11, and the groove portion when inserted into the groove portion 11 ( It was set as the structure which has the 2nd hook 20B which does not contact the inner side surface 11a of 11).

For this reason, in addition to the effect of (1), the dimensional precision required between the second hook 20B and the groove portion 11 is relaxed, and a plurality of hooks 20 can be easily inserted into the groove portion 11. .

(3) A plurality of the hooks 20 and the grooves 11 are provided at point-symmetric positions with the center O of the upper table 3 as a symmetrical point.

For this reason, in addition to the effect of (1) or (2), the tabletop 3 can be supported in the circumferential direction well-balanced at the time of dressing.

(4) The number of protrusions 13 (two) is smaller than the number of hooks 20 (four).

Due to this, in addition to the optional effects of (1) to (3), it is possible to change the hook 20 to which the rotational force is transmitted each time the dressing is performed, and to distribute the load acting on each hook 20, (20) can make it difficult to cause damage or defective situations.

As mentioned above, the double-sided polishing device of the present invention has been described based on Example 1, but the specific configuration is not limited to this Example, and as long as it does not deviate from the gist of the invention according to each claim of the claims, Changes or additions to the design are permitted.

In Example 1, an example in which four grooves 11 and two protrusions 13 are formed on the drive mechanism body 10b and four hooks 20 are provided on the upper table 3 is presented. However, the number of grooves, protrusions, and hooks is not limited thereto, and each one or more may be provided. That is, for example, as shown in FIG. 9, three grooves 11 and three protrusions 13 are formed on the drive mechanism body 10b, and three hooks 20 are placed on the upper table 3 may be provided.

Also in this case, as shown in FIGS. 10A and 10B, at the time of dressing, the three hooks 20 come into contact with the contact area 12 formed on the upper surface 10c of the drive mechanism body 10b, respectively, (3) can be supported in a good balance in the circumferential direction.

In addition, at this time, the hook widths of the tips 22 of the three hooks 20 are set to the same size slightly smaller than the front groove width G1. Therefore, as shown in FIGS. 11A and 11B, when the hook 20 is inserted into the groove 11 at the time of work polishing, the side surface 22b of the front hook 20 is the inner side surface of the groove 11. Contact (11a). On the other hand, since the number of projections 13 (three) is equal to the number of hooks 20 (three), all hooks 20 contact the projections 13 during dressing.

Therefore, in any case at the time of dressing and grinding of the workpiece, the rotational force input from the drive mechanism 10 can be received by all the hooks 20, and the rotational force is input in a dispersed manner. Due to this, the rotational force acting on the hook 20 is not concentrated, so that the occurrence of breakage of the hook 20 can be prevented.

In Example 1, the first hook 20A in which the hook 20 contacts the inner side surface 11a of the groove portion 11 during work polishing and the inner side surface 11a of the groove portion 11 during work polishing do not contact. Although it was configured to have a second hook 20B, it is not limited thereto. For example, it is good also considering all the hook widths of the plurality (four) hooks 20 as the same dimension.

In this case, the rotational force input from the driving mechanism 10 during workpiece polishing can be received by all the hooks 20, and the rotational force is distributed and inputted. As a result, the force acting on the hook 20 is not concentrated, and the occurrence of breakage or the like of the hook 20 can be prevented.

In Example 1, the hook width W1 of the first hook 20A is slightly smaller than the groove width G1 of the groove portion 11, and the hook width W2 of the second hook 20B is set to the groove portion 11 1st hook 20A whose side surface 22b contacts the inner side surface 11a of the groove part 11 by making it sufficiently smaller than the groove width G1 of, and the side surface 22b is the inner side surface of the groove part 11 Although the 2nd hook 20B which does not contact 11a is formed, it is not limited to this. For example, by setting all the hook widths of the plurality of hooks 20 to the same dimension and appropriately different groove widths of the grooves 11, the side surface 22b is in contact with the inner side surface 11a of the groove portion 11 You may form the 1st hook 20A and the 2nd hook 20B whose side surface 22b does not contact the inner side surface 11a of the groove part 11.

In Example 1, an example in which the groove portion 11 formed on the main surface of the drive mechanism body 10b is open in the radial direction and the vertical direction of the drive mechanism body 10b is presented, but it is not limited thereto. This groove portion 11 opens at least upward to allow the hook 20 to be inserted, and allows the upper table 3 to be lowered until the upper table 3 is placed on the lower table 2 Since it is only necessary to have the groove length, it is not necessary to open downward.

In Example 1, an example in which the contact area 12 is an area along the circumferential portion of the drive mechanism body 10b is presented, but is not limited thereto. This contact area 12 should be formed at least on the top face 10c of the drive mechanism main body 10b so that the contact face 22a of the front end 22 of the hook 20 can come into contact with it. That is, for example, when the fixing portion 21 of the hook 20 is long, the contact area 12 may be provided in the central portion of the drive mechanism main body 10b.

In Example 1, an example is presented in which the protrusion 13 protruding from the contact area 12 toward the upper plate 3 contacts the side surface 22b of the front end 22 of the hook 20, but is limited to this It is not. For example, as shown in FIG. 12, a concave portion 23 open downward is formed at the front end portion 22 of the hook 20. Then, when the hook 20 comes into contact with the contact area 12, the hook 20 may be brought into contact with the projection 13 by fitting the projection 13 to the concave portion 23.

In Embodiment 1, the upper surface 10c of the drive mechanism body 10b is formed as a flat surface, but is not limited thereto. For example, as in the drive mechanism 10 shown in FIG. 13, a step surface 10d descending one step along the circumference is formed on the upper surface 10c of the drive mechanism main body 10b, and on this step surface 10d In addition to forming the contact area 12 and the protruding portion 13, the upper end of the groove portion 11 may be opened.

In addition, the hook provided on the upper table has a drive hook and a contact hook that is farther from the drive hook in the axial direction to the drive mechanism body, and the groove portion formed on the drive mechanism body has a drive groove and a retreat It may be what has a groove|channel for (退避).

In this case, at the time of dressing, the contact hook abuts on the contact area formed on the upper surface of the drive mechanism body, and the upper table is supported by the upper surface of the drive mechanism body. On the other hand, the driving hook is inserted into the driving groove, and the driving hook and the driving groove interfere with each other, so that the rotational driving force of the driving mechanism body is transmitted to the upper table.

During workpiece polishing, a driving hook is inserted into the driving groove as in the case of dressing, and the rotational driving force of the driving mechanism main body is transmitted to the upper table by the interference between the driving hook and the driving groove. At this time, the contact hook is inserted into the groove for evacuation. This makes it possible to lower the upper surface plate, and to place the upper surface plate on the lower surface plate to enable polishing of the workpiece.

1: double-sided polishing device
2: Lower half
2a: polishing pad
2b: center opening
3: Sangjeongban
3a: polishing pad
3b: center opening
9: Actuator for lifting (support mechanism)
9b: Care bearing (supporting mechanism)
10: driving mechanism
10a: drive shaft
10b: drive mechanism body
10c: trademark side
11: groove part
11a: inner side
12: contact area
13: protrusion
20: hook
20A: first hook
20B: second hook
21: fixing part
22: distal end

Claims (5)

In a double-sided polishing device for polishing both sides of a workpiece by a lower and upper table,
A driving mechanism that penetrates the lower surface plate and rotates around an axis;
A support mechanism for oscillating and rotatably suspending and supporting the upper table;
a hook extending from the inner circumference of the upper table toward the center;
The hook is formed on the main surface of the drive mechanism, extends in the axial direction of the drive mechanism, and is open at least upward of the drive mechanism, and the relative rotation angle between the upper table and the circumferential direction of the drive mechanism is a predetermined angle. A groove portion capable of inserting a
a contact area formed on the upper surface of the drive mechanism and having an open upper end of the groove;
It is provided in the contact area, protrudes upward from the upper surface of the drive mechanism, and has a protrusion for contacting the side surface of the front end of the hook in a state in which the hook is in contact with the contact area Double-sided polishing, characterized in that Device. According to claim 1,
The groove portion is formed in plurality on the main surface of the drive mechanism,
The hook has a first hook that contacts the inner side of the groove when inserted into the groove, and a second hook that does not contact the inner side of the groove when inserted into the groove. Double-sided polishing device, characterized in that . According to claim 1 or 2,
The double-sided polishing device according to claim 1, wherein a plurality of the hooks and the grooves are provided at point-symmetrical positions with the center of the upper table as a symmetrical point. According to claim 1 or 2,
The double-sided polishing device, characterized in that the number of projections is less than the number of hooks. According to claim 3,
The double-sided polishing device, characterized in that the number of projections is less than the number of hooks.

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