JP2000271843A - Polishing method and polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve a polishing accuracy so as not to transmit a deflection of a driving plate to an upper surface plate. SOLUTION: This polishing device is provided with a lower surface plate having a buff 14 and an upper surface plate 13 having the buff 14. Plural carriers formed with plural holding holes for loading a work are disposed on the lower surface plate. Each carrier is engaged with a planetary gear and an internal gear, both sides of the work being polished by rotating the planetary gear and the internal gear. A driving plate 28 is connected to an upper surface plate driving shaft 13a through a connecting mechanism 27. The upper surface plate 13 is supported with respect to the driving plate 28 through a holder 41. A deflection of the driving plate 28 is not transmitted to the upper surface plate 13 because the holder 41 has a roller supported by an extension provided to the driving plate 28.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a polishing technique for polishing a plate-like work such as a magnetic disk substrate.

[0002]

2. Description of the Related Art As a polishing apparatus for simultaneously polishing both surfaces of a plurality of magnetic disk substrates, a lower platen having an annular lower grindstone provided on an upper surface and an annular upper grindstone provided on a lower surface serve as a lower grindstone. Some have an upper surface plate provided so as to be opposed to the upper surface plate. The magnetic disk substrate, which is a work, is held in the holding holes of a plurality of carriers arranged on the lower grindstone, and each carrier is rotatably provided at the center of rotation of the lower platen. In addition to meshing with the sun gear provided, it also meshes with an internal gear provided outside the lower platen.

When the upper and lower platens are rotated while rotating the sun gear and rotating the carrier around the sun gear while revolving, the work held by the carrier becomes:
Both surfaces are simultaneously polished under a state in which a predetermined pressing force is applied by the upper and lower whetstones. An example of such a polishing apparatus for a magnetic disk substrate is disclosed in Japanese Patent No. 2535089.

As described above, in a polishing apparatus of a type in which a work is revolved while rotating along a grindstone by using a carrier, the upper platen is driven to rotate.
An upper platen drive shaft having a vertical center of rotation is provided on a column arranged vertically movable above the lower platen, and the upper platen is fixed to a drive plate connected to the upper platen drive shaft. ing.

[0005]

Since this type of polishing apparatus can process a plurality of workpieces at the same time,
There is an advantage that a magnetic disk substrate can be efficiently manufactured. For example, 100 workpieces can be polished at the same time. When a large number of workpieces are polished at the same time as described above, it is an important issue in this polishing apparatus to reduce the processing error of each workpiece and reduce the variation in the processing error between the workpieces. .

The upper platen and the drive plate are fixed to each other by a plurality of screws which are screwed to the upper platen at predetermined intervals in the circumferential direction of the upper platen so as to be positioned at the center of gravity in the radial direction of the upper platen. Uses bolts. By this, even if a pressing force is applied from the upper surface plate toward the lower surface plate through the work, it should be possible to eliminate the bending deformation of the upper surface plate. It turned out that the bending deformation of itself was transmitted to the upper surface plate.

An object of the present invention is to improve the polishing accuracy by preventing the bending deformation of the driving plate from being transmitted to the upper surface plate.

[0008]

According to the polishing method of the present invention, a workpiece is held in a plurality of holding holes of a plurality of carriers arranged on a lower surface plate provided with a lower polishing tool, and each of the carriers is provided with a plurality of carriers. In a state where the meshing sun gear and the internal gear arranged outside the sun gear and meshing with the carrier are relatively rotated, the lower surface plate and the upper surface plate are provided opposite to the lower surface plate. A polishing method for polishing both surfaces of the work by rotating the upper polishing tool, wherein a bending deformation of a drive plate for transmitting rotation of a platen drive shaft to the upper platen is transmitted to the upper platen. The feature is that it is not performed.

A polishing apparatus according to the present invention comprises a sun gear meshing with a plurality of carriers having a plurality of holding holes for holding a work, and an internal gear disposed outside the sun gear and meshing with each of the carriers. And a lower platen having a lower polishing tool contacting the lower surface of the work, and an annular upper platen having an upper polishing tool contacting the upper surface of the work, wherein the sun gear A drive plate connected to an upper surface plate drive shaft having a center of rotation concentric with the center axis of the drive plate, and a drive plate parallel to the upper surface plate, and a fixture is provided at a lower end portion and a receiving piece is provided at an upper end portion, A plurality of holders fixed to the upper platen by the fixing bracket at predetermined intervals in the circumferential direction of the upper platen, provided on the drive plate, contacting the receiving piece of the upper platen Multiple under load A projecting portion, having a plurality of driving force transmitting members fixed to the driving plate and in contact with the upper surface plate to transmit a rotational driving force of the driving plate to the upper surface plate; The bending deformation is not transmitted to the upper surface plate. The receiving piece may be a roller rotatably mounted on the holder, and the driving force transmitting member may be fixed to the driving plate so as to sandwich a cylindrical member attached to the fixing bracket from both sides.

According to the present invention, it is possible to prevent the upper platen from being bent due to the bending deformation of the drive plate, and to improve the polishing accuracy of the work.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a sectional view showing an upper platen of a polishing apparatus according to an embodiment of the present invention, FIG. 2 is a sectional view showing an upper platen and a lower platen, and FIG. It is a perspective view which shows the shown lower surface plate.

As shown in FIGS. 2 and 3, the polishing apparatus 10 has a lower platen 11 which rotates in a horizontal plane, and a buff 12 as a lower polishing tool is annularly mounted on the upper surface of the lower platen 11. Have been. Above the lower platen 11, an upper platen 13 rotating opposite thereto is disposed, and on this upper platen 13, an annular buff 14 corresponding to the buff 12 is attached as an upper polishing tool. Have been. The upper stool 13 is movable in the vertical direction so as to approach and move away from the lower stool 11. In this polishing apparatus, lapping or polishing of a disk substrate as a work is performed by buffs 12 and 14 as polishing tools.

The outer surface of the lower platen 11 has a buff 1
A sun gear 15 having a diameter slightly smaller than the inner diameter of No. 2 is rotatably provided. Outside the buff 12, an annular internal gear 16 having a diameter slightly larger than the outer diameter is provided on the lower platen 11.
The internal gear 16 is rotationally driven by the rotating body 17.

As shown in FIG. 3, ten carriers 18 are arranged on the upper surface of the buff 12 provided on the lower stool 11, and formed on the outer periphery of each carrier 18. The external gear portion meshes with the sun gear 15 and the internal gear 16. Each carrier 18 has a circular holding hole 19 for holding the workpiece W.
The thickness of the carrier 18 is smaller than the thickness of the work W. This polishing device 1
In the case of No. 0, since ten carriers 18 each having ten holding holes 19 are arranged, 100 workpieces W can be processed at the same time.

In the illustrated polishing apparatus, ten carriers 18 are provided. However, the present invention is not limited to this. For example, an arbitrary number of eight or five carriers 18 may be provided. Can be. Similarly, 1
The number of holding holes 19 formed in one carrier 18 is ten in the illustrated case, but may be five or eight, and may be an arbitrary number.

The sun gear 15 is driven to rotate by a drive shaft 15a, the lower platen 11 is driven to rotate by a hollow drive shaft 11a through which the drive shaft 15a passes, and the upper platen 13 is driven to rotate by an upper platen drive shaft 13a. Further, the internal gear 16 is driven to rotate by a rotating body 17.

When each of the carriers 18 is rotated with the sun gear 15 and the internal gear 16 while being engaged with the sun gear 15 and the internal gear 16, each carrier 18 rotates around the sun gear 15 while rotating. The work W revolves, and the work W moves in the horizontal direction while drawing a cycloid curve or a trochoid curve while contacting the upper and lower buffs 14 and 12 in the horizontal plane by the carrier 18. As described above, each work W moves from the inner peripheral portion of the upper and lower buffs 12 and 14 to the outer peripheral portion thereof by the carrier 18 and also moves in the circumferential direction along the buffs 12 and 14. Axis 11
Even if there is an inclination in a, all the work W
Can be averaged to process with higher accuracy than the device accuracy.

The upper surface plate driving shaft 13a is
1 and rotatably mounted on the sleeve 2
Numeral 1 is mounted on a column 22 movably up and down above the lower platen 11 so as to be vertically movable. Upper surface plate drive shaft 13
A gear 23 is fixed to a, and a driving gear (not shown) meshing with the gear 23 is provided on the column 22, and the driving gear is driven by a motor (not shown). The column 22 is provided with a pneumatic cylinder 24 for applying a pressing force to the upper platen drive shaft 13a, and a piston rod 25 of the pneumatic cylinder 24 is connected to the upper platen drive shaft 13a via a connection block 26. I have.

The upper platen drive shaft 13a is connected to a drive plate 28 via a connection mechanism 27, as shown in FIG. The coupling mechanism 27 includes a driving body 31 fixed to the lower end surface of the upper platen driving shaft 13a, a small-diameter annular body 32 disposed outside the driving body 31, and a large-sized driving body 28 disposed outside the driving body 31 to which the driving plate 28 is fixed. And an annular body 33 having a diameter. The large-diameter annular body 33 and the small-diameter annular body 32 are connected by two connecting shafts 34, and the small-diameter annular body 32 and the driving body 31 are connected.
Are connected by a connecting shaft 35 oriented at right angles to the connecting shaft 34. In this way, even if the angle formed between the rotation center of the upper platen drive shaft 13a and the drive plate 28 changes, the coupling mechanism 27
The rotational force a can be smoothly transmitted to the drive plate 28.

In order to transmit the rotation of the drive plate 28 to the upper platen 13, the drive plate 28 and the upper platen 13 are not fixed directly but are connected via a holder 41 by a floating structure. I have.

FIG. 4 is a plan view showing the drive plate 28 and the upper platen 13, which are connected by a total of ten holders 41 provided at intervals of 36 degrees in the circumferential direction. However, the number of the holders 41 can be any number as long as it is three or more according to the size of the upper surface plate 13.

FIGS. 5 to 8 show one of the ten holders 41 shown in FIG. 4. Each of the holders 41 has a base portion 41a and two branch portions projecting upward from the base portion 41a. 41b, and the upper surface plate 1 is provided on the base 41a.
A screw member 42 serving as a fixing member screw-connected to 3 is screw-connected. The position where the screw member 42 is screwed to the upper surface plate 13 is the radial center of gravity of the upper surface plate 13. A horizontal pin 43 is fixed to the branch portion 41b, and a roller 44 composed of a needle bearing, a roller bearing, or the like is rotatably provided as a receiving piece on the horizontal pin 43.

On the lower surface of the drive plate 28, a holder 41 is provided.
The support block 45 is fixed by bolts 46 in correspondence with the above. The support block 45 has a projection 47 projecting from the outer peripheral surface of the drive plate 28 toward the holder 41. When the roller 44 comes into contact with the upper surface of the projection 47, the holder 41 is supported by the support block 45 at a position close to the line contact at the roller 44. However, the horizontal pin 43 may be brought into direct contact with the projection 47, in which case the horizontal pin 43 functions as a receiving piece.

In the polishing apparatus 10, even if the upper platen 13 is heated during the polishing process, and the upper platen 13 and the driving plate 28 are different in the amount of thermal expansion and contraction in the radial direction, the difference is obtained. The upper platen 13 can be prevented from being bent due to the difference in thermal expansion. Thereby, even if the upper platen 13 is made of steel and the drive plate 28 is made of aluminum, it is possible to prevent the upper platen 13 from being bent and deformed due to a difference in thermal expansion therebetween. Further, when the upper platen 13 is raised via the drive plate 28 or a pressing force is applied to the upper platen 13, as shown in FIG. 2, the drive plate 28 is exaggerated by a two-dot chain line. Even if it is flexed, the drive plate 28 and the holder 41 are floatingly supported via the rollers 44, so that the flexure of the drive plate 28 can be prevented from being transmitted to the upper surface plate 13.

When a pressing force is applied to the upper platen 13 via the driving plate 28, the projection 4
The lower surface of 7 comes into contact with the holder 41, and a roller may be provided in a portion of the holder 41 where the lower surface of the projection 47 contacts, or an arc surface may be formed.

A cylindrical member 49 is fixed to the screw member 42 by a stop pin 48. A support block 45 is used to transmit the rotational driving force of the drive plate 28 to the upper platen 13.
A plate-like driving force transmission member 51 is fixed to both sides in the circumferential direction by bolts 52. Each driving force transmitting member 51 has a protruding portion 53 that sandwiches the cylindrical member 49 from both sides. Therefore, no matter which direction the drive plate 28 is driven to rotate, one drive force transmitting member 51 comes into contact with the outer peripheral surface of the cylindrical member 49 in a state close to linear contact, and the rotational force of the drive plate 28 is determined. It will be transmitted to the board 13.

However, without fixing the driving force transmitting member 51 to the driving plate 28 via the support block 45,
The driving force transmitting member 51 may be fixed to the driving plate 28 away from the support block 45. In this case, the cylindrical member 49 is attached to the upper surface plate 13 separately from the screw member 42.

In this polishing apparatus 10, the holder 41 is supported by the roller 44 by the projection 47 provided on the drive plate 28, and the upper platen 13 is floatingly supported on the drive plate 28. As a result, the bending deformation of the drive plate 28 is not transmitted to the upper surface plate 13 and the bending deformation of the upper surface plate 13 can be greatly reduced. It is possible to reduce the machining error between the workpieces.

The polishing process of the magnetic disk substrate includes:
There are lapping processing to adjust the dimensional error of the work and to improve the surface finish state, polishing processing to form a high mirror surface on the work surface, etc. Although the present invention is applied to the polishing process used, that is, the lapping process and the polishing process, according to the polishing technique of the present invention, the grinding process can also be performed by using a grindstone as a polishing tool.

The present invention is not limited to the above embodiment, and it goes without saying that various changes can be made without departing from the spirit of the present invention.

For example, in the illustrated embodiment, the support block 45 is fixed to the drive plate 28, and the holder 41 is supported by the projection 47 provided on the support block 45. 28
The driving plate 2 is formed integrally with the
Alternatively, the holder 41 may be directly supported on the holder 8.

[0033]

According to the present invention, since the bending deformation of the driving plate for rotatingly driving the upper plate is not transmitted to the upper plate, the bending of the upper plate caused by the bending deformation of the driving plate is prevented. Deformation can be prevented, and polishing accuracy of the workpiece can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an upper surface plate of a polishing apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view showing an upper stool and a lower stool.

FIG. 3 is a perspective view showing a lower stool shown in FIG. 2;

FIG. 4 is a plan view showing a drive plate and an upper surface plate.

FIG. 5 is a sectional view showing a holder.

FIG. 6 is a sectional view taken along line AA in FIG.

FIG. 7 is a sectional view taken along the line BB in FIG. 6;

FIG. 8 is an exploded perspective view showing a holder and a support block.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Lower surface plate 12 Lower grindstone 13 Upper surface plate 13a Upper surface plate drive shaft 14 Buff 15 Sun gear 16 Internal gear 18 Carrier 19 Holding hole 27 Connection mechanism 28 Drive plate 41 Holder 42 Screw member (fixing metal) 44 Roller (receiving) Piece) 45 support block 47 projecting part 49 cylindrical member 51 driving force transmitting member 53 projecting part

[Procedure amendment]

[Submission date] February 17, 2000 (2000.2.1
7)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claim 1

[Correction method] Change

[Correction contents]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] Claim 2

[Correction method] Change

[Correction contents]

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] Claim 4

[Correction method] Change

[Correction contents]

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction contents]

[0008]

According to the polishing method of the present invention, a workpiece is held in a plurality of holding holes of a plurality of carriers arranged on a lower surface plate provided with a lower polishing tool, and each of the carriers is provided with a plurality of carriers. In a state where the meshing sun gear and the internal gear arranged outside the sun gear and meshing with the carrier are relatively rotated, the lower surface plate and the upper surface plate are provided opposite to the lower surface plate. A polishing method for polishing both surfaces of the work by rotating the upper polishing tool, wherein a driving plate connected to an upper surface plate driving shaft having a rotation center concentric with the center axis of the sun gear. A plurality of projections provided at predetermined intervals in the circumferential direction, and the upper platen via a plurality of holders provided with a receiving piece contacting the projections and fixed to the upper platen, Supported by drive plate, front Bending deformation of the drive plate is characterized in that so as to rotate the upper surface plate while not transmitted to the upper plate.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction contents]

A polishing apparatus according to the present invention comprises a sun gear meshing with a plurality of carriers having a plurality of holding holes for holding a work, and an internal gear disposed outside the sun gear and meshing with each of the carriers. And a lower stool having a lower polishing tool that contacts the lower surface of the work, and an upper stool having an upper polishing tool that contacts the upper surface of the work, wherein the center of the sun gear A drive plate connected to an upper surface plate drive shaft having a rotation center concentric with the shaft, a plurality of drive plates provided above the upper surface plate, and a plurality of drive plates provided at predetermined intervals circumferentially on the drive plate; A projection and a receiving piece contacting the projection are provided, and a plurality of holders are fixed to the upper surface plate, so that bending deformation of the drive plate is not transmitted to the upper surface plate. It is characterized by. The receiving piece may be a roller rotatably mounted on the holder. Further, a driving force transmitting member may be provided on the driving plate so as to sandwich the holder from both sides, and the rotation of the driving plate may be transmitted to the upper surface plate via the holder.

[Procedure amendment 6]

[Document name to be amended] Drawing

[Correction target item name] Fig. 1

[Correction method] Change

[Correction contents]

FIG.

[Procedure amendment 7]

[Document name to be amended] Drawing

[Correction target item name] Figure 2

[Correction method] Change

[Correction contents]

FIG. 2

Claims (4)

[Claims] 1. A work is held in a plurality of holding holes of a plurality of carriers arranged on a lower surface plate provided with a lower polishing tool,
Under a state where the sun gear meshing with each of the carriers and the internal gear arranged outside the sun gear and meshing with the carrier are relatively rotated, the lower platen and the upper surface facing the lower plate are rotated. A polishing method for polishing both surfaces of the work by rotating an upper polishing tool provided on a surface plate, wherein the bending deformation of a drive plate that transmits rotation of a surface plate drive shaft to the upper surface plate is performed. A polishing method characterized in that it is not transmitted to the upper surface plate. 2. A sun gear meshing with a plurality of carriers formed with a plurality of holding holes for holding a work, an internal gear arranged outside the sun gear and meshing with each of the carriers, A polishing apparatus having a lower surface plate having a lower polishing tool in contact with a lower surface and an upper surface plate having an upper polishing tool in contact with the upper surface of the work, wherein the polishing machine is concentric with a center axis of the sun gear. A drive plate connected to an upper surface plate drive shaft having a center of rotation, and a drive plate provided above the upper surface plate; and a fixing bracket provided at a lower end and a receiving piece provided at an upper end, respectively. A plurality of holders fixed to the upper platen by the fixing bracket at predetermined intervals in the circumferential direction; and a plurality of holders provided on the drive plate and contacting the receiving piece to receive the load of the upper platen. Of the projection, A plurality of driving force transmitting members fixed to the driving plate and in contact with the upper surface plate, and transmitting a rotational driving force of the driving plate to the upper surface plate, wherein the bending deformation of the driving plate is A polishing apparatus characterized in that it is not transmitted to an upper surface plate. 3. The polishing apparatus according to claim 2, wherein said receiving piece is a roller rotatably mounted on said holder. 4. The polishing apparatus according to claim 2, wherein the driving force transmitting member is fixed to the driving plate such that the cylindrical member attached to the fixing bracket is sandwiched from both sides. .