JPH0222213Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a flat surface polishing device for precision processing both the front and back surfaces of a workpiece at the same time, such as wrapping, polishing, and grinding.

Prior Art A conventional polishing device of this type has a carrier meshed between a rotating internal gear and a sun gear, and a workpiece held by the carrier is processed by upper and lower surface plates. is known, but
Since such a polishing device uses a carrier to hold the workpiece, it requires not only the carrier but also an internal gear, a sun gear, and related members to drive it, resulting in a complex and large structure. At the same time, there was a drawback that loading and unloading of workpieces was complicated and required a great deal of effort. Furthermore, thinner carriers are required for processing aluminum thin plates used as disk memory boards for electronic computers, but such thinner carriers can easily break or damage gears, making them difficult to manage. It was troublesome.

Problems to be Solved by the Invention It is an object of the present invention to provide a polishing device with a simple structure that does not require a carrier.

Means for Solving the Problems In order to solve the above problems, the surface polishing apparatus of the present invention consists of a large number of circularly arranged horizontally arranged circular plates at regular intervals, which are arranged to be forcibly rotated by a drive source. Annular upper and lower surface plates are used to hold and process a workpiece in an offset position protruding from the machining surface, and the surface plate is arranged to be eccentrically rotatable about the center of the surface plate, and the side surface of the workpiece is A guide ring that supports the surface plate from inside the surface plate, and guide rollers that are rotatably arranged around the surface plate at regular intervals and that support the side surface of the workpiece from the outside of the surface plate. That is.

Effect When the upper and lower surface plates are rotated at the same speed and in the same direction while holding a workpiece, the rotational direction of the surface plate will change because the workpiece is held in an offset position by the surface plates. The workpiece is rotated at a fixed position while being supported by the guide ring and the guide roller and processed. At this time, the guide ring and guide roller also rotate following the workpiece, but since the guide ring rotates eccentrically around the center of the surface plate, the workpiece reciprocates in the radial direction of the surface plate, and the workpiece and the surface plate The flatness of the surface plate is maintained by changing the contact area with the surface plate.

Effects Since the workpiece is directly supported by the guide ring and guide roller, not only can the carrier be omitted, but also the internal gear and sun gear for driving the carrier, and their related drive source can be omitted. It is possible to omit a power transmission mechanism, etc., and by using the annular upper and lower surface plates to hold and process the workpiece in an offset position protruding from the machining surface, the machining force can be utilized. This allows the workpiece to rotate naturally.
There is no need to forcibly rotate the workpiece using a guide ring or guide roller, and therefore a drive mechanism for these guide rings or guide rollers is also unnecessary. In comparison, it can be extremely simplified and at the same time can be made smaller. In addition, by making the guide ring eccentrically rotatable, it gives a swinging motion to the workpiece, so the workpiece and the surface plate slide evenly, preventing uneven wear of the surface plate, and improving flatness. Can be maintained well. Furthermore, by eliminating the need for a carrier, it is only necessary to carry in and out the workpiece without using the carrier when exchanging the workpiece, which greatly simplifies the exchanging work and facilitates automation.

Embodiments Hereinafter, embodiments of the present invention will be described in detail based on the drawings. In FIGS. 1 and 2, 1,
1, . . . are a large number of disk-shaped workpieces arranged circumferentially and horizontally at regular intervals; 2, 3 are annular upper and lower surface plates for simultaneously processing both sides of the workpieces 1; , these surface plates 2 and 3 are connected to a drive source (not shown) through drive shafts 4 and 5 located concentrically, and are forced to rotate at arbitrary speeds and directions by the drive source. It's getting old,
The width W of the machining surfaces 2a, 3a on the surface plates 2, 3 is formed to be smaller than the radius of the workpiece 1, and when the workpiece 1 is shifted to one side, both machining surfaces 2a, 3a are formed to be smaller than the radius of the workpiece 1.
The workpiece 1 is held in a state where it protrudes between the workpieces 1 and 1, and the workpiece 1 is processed in that state.

Inside the surface plates 2 and 3, there is a guide ring 6 that abuts against and supports the side surface of the workpiece 1, and the guide ring 6 is rotatable at a position offset from the center of the workpiece 1 via a bearing 7 on the drive shaft 5 of the lower surface plate 3. By supporting the above-mentioned surface plates 2 and 3, the surface plates 2 and 3 are arranged so as to be eccentrically rotatable about the centers of rotation, while around the surface plates 2 and 3,
A large number of guide rollers 8, 8, . . . , which support the side surfaces of the workpiece 1 from the outside of the surface plate, are rotatably supported on vertical shafts 10, 10, . They are arranged in a circumferential manner. The upper surfaces 8a of these guide rollers 8 are tapered outward in order to reduce the contact area with the workpiece 1, and each guide roller 8,
The arrangement interval of the rollers 8, . . . is set to such a size that the workpiece 1 does not come into contact with two adjacent guide rollers 8, 8 at the same time during machining. Therefore, the workpiece 1 is supported during machining by the guide ring 6.
and a guide roller 8 located on the rotational direction side of the surface plates 2 and 3.

In the figure, 11 is a nozzle for supplying powder, and 12 is a support mechanism for rotatably supporting the drive shaft 5 on the table 9.

In the surface polishing apparatus having the above configuration, the first
If the upper surface plate 2 is lowered from the state shown in the figure, and the workpiece 1 is held between the upper and lower surface plates 2 and 3, these surface plates are rotated at a constant speed in the direction shown by arrow a in FIG. 2. Since each workpiece 1 is held in an offset position by the surface plates 2 and 3, rotation in the direction typically shown by arrow b is applied to the workpiece 1.
is in contact with the guide ring 6 and the guide roller 8 located on the rotational direction side of the surface plates 2 and 3, and both surfaces thereof are simultaneously processed while rotating in a fixed position.
At this time, the workpiece 1 is pressed against the lower surface plate 3 by the upper surface plate 2, but if the workpiece 1 is lightweight such as a thin aluminum plate, its weight can be almost ignored. It is considered that substantially equal machining pressure is applied to both sides of the workpiece 1, and therefore both sides of the workpiece 1 are machined under substantially the same conditions.

Further, the guide ring 6 and the guide roller 8 also rotate following the workpiece 1, but since the guide ring 6 rotates eccentrically around the centers of the surface plates 2 and 3, the workpiece 1 also reciprocates in the direction of arrow c. As a result, the contact area between the workpiece 1 and the machined surfaces 2a and 3a of the surface plates 2 and 3 changes, preventing uneven wear of the machined surfaces and improving its flatness. maintained.

When the machining of workpiece 1 is completed, upper surface plate 2 is moved to the first
It rises to the position shown in the figure, and each workpiece 1 is taken out. This removal and loading of the workpiece 1 can be performed manually or automatically by a robot.

Incidentally, the above-mentioned surface plates 2 and 3 can also be rotated in the opposite direction to the case shown in FIG. 2, and such reversal of the surface plates allows dressing of pads to be performed at the same time, especially when performing polishing. Therefore, it is valid.

[Brief explanation of the drawing]

1 and 2 are a longitudinal sectional view and a partial plan view showing an embodiment of the present invention. 1... Workpiece, 2, 3... Surface plate, 2a, 3a...
...Machining surface, 6...Guide ring, 8...Guide roller.

Claims (1)

[Claims for Utility Model Registration] A large number of disc-shaped workpieces arranged so as to be forcibly rotated by a driving source and arranged circumferentially and horizontally at regular intervals, protruding from the machining surface in an offset position. Annular upper and lower surface plates for clamping and processing; a guide ring that is arranged to be eccentrically rotatable about the center of the surface plate and supports the side surface of the work from the inside of the surface plate; Rotatably arranged at regular intervals around the
A surface polishing device comprising: a guide roller that supports the side surface of the workpiece from the outside of the surface plate;