JPS6210778B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a device for modifying the lap surface of a lap plate in a wrapping machine.

Conventionally, two lap plates that are mutually rotatable about a common axis are disposed at an axial distance from each other, and the annular lap surfaces of each lap plate are faced to each other. Various types of lapping machines, commonly referred to as lapping machines, have a generally flat workpiece connected and arranged between lapping surfaces so that both sides of the workpiece can be polished while the lapping plates are rotated relative to each other. These machines are widely known and actually used. However, in this type of conventional lapping machine, the annular lapping surfaces of the lapping plate wear irregularly as the workpiece is polished, so these lapping surfaces are periodically ground to create a smooth surface. must be corrected.

One of the typical methods known in the art for modifying the lap surfaces of lap plates includes at least three annular lap surfaces of two lap plates having an outer diameter at least equal to the width of the lap surfaces. Place the wrap correction ring in contact with the above 2
A method is known in which the ring is rotated while revolving around the axis of rotation of the lap plates while the two lap plates are being rotated.

However, in the above correction method, the outer diameter of the lap correction ring used for this is equal to or larger than the width of the lap surface and is heavy, so this correction ring is installed between the lap surfaces. The drawback is that it requires a great deal of effort to operate and remove, and is extremely difficult to handle. In addition, in the above correction method, while the two lap plates are being rotated in opposite directions, when the lap correction ring rotates while revolving around the rotation axis of the lap plate, the upper lap plate and When the relative speed of the lower lap plate to the revolution of the lap correction ring is made approximately equal, the greater the rotation speed of the lap correction ring, the greater the difference in relative speed of a point on the ring that is forced to rotate with respect to the upper and lower lap plates. As a result, the polishing of the lap surface by the lap correction ring becomes uneven, making it difficult to obtain a more uniform lap surface.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an improved lap surface modification apparatus that does not have the disadvantages and drawbacks of the conventional lap surface modification methods described above.

Another object of the present invention is to provide a lapping machine with an improved repairing device which allows for easy handling of the lap repair ring or plate used for modifying the lap surface and allows for a more uniform modification of the lap surface in a short period of time.・The purpose is to provide machines.

Still another object of the present invention is to provide a repairing device which allows the state of the repair of the lap surface to be easily checked during the repair operation of the lap surface.

Following the above objectives and explanations,
To achieve still another object which will become clearer, the present invention provides a device capable of independently rotating about a common axis and arranged oppositely in parallel and axially spaced from each other. two lap plates with annular lap surfaces; a sun gear non-eccentrically disposed between the two lap plates at the center and outer periphery of the annular lap plates; and an internal gear, at least three carriers having gears on their outer peripheries that mesh with both gears; having an outer diameter smaller than the width of the annular lap surface and having abrasive surfaces on both sides; a plurality of wrap correction rings or plates disposed in contact between the wrap surfaces, the carrier having holes therein for receiving the wrap correction rings or plates when the carrier rotates about its axis; The object of the present invention is to provide a lap surface modifying device for a wrapping machine in which a lap modifying ring or plate is formed at an eccentric position capable of reciprocating across the width of the annular wrap plate.

The apparatus of the present invention will be explained in detail below based on the accompanying drawings.

First, Fig. 1 shows an annular lap plate 1,
FIG. 2 shows a schematic configuration of essential parts of an embodiment of the device according to the present invention, which is equipped with a device according to the present invention, and FIG. Annular upper lap plate 1 and lower lap plate 2
Although not shown in the drawings, they are designed to be able to rotate independently around a common rotation axis x. A sun gear 3 is disposed at the center of the pair of annular lap plates 1 and 2, and an internal gear 4 is disposed outside the lap plates, not shown in the drawing. However, both of these gears are also configured to be able to rotate independently around the rotation axis x. In addition, above 1
Pair of annular lap plates 1, 2, sun gear 3
The rotational movement of each of the internal gears 4 and 4 can be performed by a rotation transmission mechanism of a conventionally known four-way wrapping machine of this type, and the details of this rotation transmission mechanism are well known in the art. Since this is easily understood by engineers, it will be omitted.

Between the above two lap plates 1 and 2,
Four lap correction rings 5 are arranged in contact, each of these rings 5 being placed in a hole 7 provided in the carrier 6. A gear 8 is formed around the outer periphery of each of the carriers 6, and this gear 8 meshes with the sun gear 3 and the internal gear 4.

According to the present invention, the wrap correction ring 5 has an outer diameter D1 smaller than the width d2 of the wrap surface, while an inner diameter d3 of the hole 7 provided in the carrier 6 is larger than d1; As a result, the lap correction ring 5 is not fixed to the carrier 6, but is free to move within the hole 7. Further, the hole 7 of the carrier is provided at an eccentric position, and when this carrier meshes with the sun gear 3 and internal gear 4 and revolves around the rotation axis x of the lap plates 1 and 2, Since the ring 5 accommodated in the hole 7 is rotated in the direction of the width of the wrap surface, the outer diameter d1 of the ring 5 is smaller than the width d2 of the wrap surface. It should be understood that grinding can be carried out over the entire width of the lap surface.

Preferably, a plurality of grooves 9 are carved on both sides of the lap correction ring 5 in the present invention.
These grooves are extremely effective in removing from the lap surface the abrasive slurry supplied to the lap surface during the lap surface modification process as well as the grinding debris on the lap surface.

3 and 4 illustrate another embodiment of the apparatus according to the present invention, in which a carrier 16 corresponding to the carrier 6 of the apparatus shown in FIGS. 1 and 2, 3 holes each 17
are provided, and a lap correction plate 15 is accommodated in each hole.

1 to 4 each show an embodiment of the wrapping machine in a state in which the wrapping surface is modified, but normally the upper and lower wraps are modified in the same manner as in conventional wrapping machines of this type.
A large number of workpieces such as silicon wafers are placed between the plates along with workpiece carriers or holders, and the workpieces are polished by applying rotational motion to the upper and lower lap plates, sun gear, and internal gear. It should be understood that work is done.

According to the invention, the lap surface is modified as follows. That is, the workpiece carrier or holder placed between the upper and lower lap plates during the workpiece polishing operation is
Prior to the correction operation, the carrier 6 or 16 for the lap correction ring 5 or the plate 15 is replaced, but the carrier can also be used as a workpiece carrier or holder. Therefore, the carrier 6 or 16 can revolve around the common axis x and rotate on its own axis in the same manner as during the workpiece wrapping process.

The carrier 6 or 16 then accommodates a lap correction ring 5 or plate 15, but since the outer diameter of these rings or plates is smaller than the inner diameter of the holes 7, 17 in the carrier, it is possible to The lap correction ring or plate does not rotate with the carrier, rather it rotates very little and revolves with the carrier,
During the revolution, it moves in the width direction of the lap surface. The upper and lower surfaces of the lap correction ring 5 or plate 15 are in contact with the lap surfaces of the lap plates 1, 2 or 11, 12, and each ring 5 or plate 15
The heights of the carriers 6 and 16 are respectively the same and are greater than the height of the carriers 6 or 16.

It is desirable that the revolution speed and direction of the lap correction ring 5 or the plate 15 be changed arbitrarily depending on the rate of correction of the lap surface.

As described above, attach the lap correction ring 5 or plate 15 to the lap plate 1, 2 or 1.
When the carriers 6, 16 are revolved around the axis of rotation x by placing the upper and lower lap plates in contact with each other in accordance with conventionally known methods, the The ring 5 or plate 15 moves in the width direction of the lap surface while rotating together with the carriers 6, 16 about the axis of rotation x. What is important in the invention is that the lap correction ring 5 or the plate 15 is not fixed to the carrier 6 or 16 and therefore rotates with the carrier around the axis of rotation x, but does not rotate together with the carrier. , rather, it hardly rotates on its axis, which has a significant effect on the modification effect of the lap surface. That is, the conventionally known lap surface correction uses a lap correction ring having an outer diameter equal to or larger than the width of the lap surface, and the lap correction ring is forced while rotating around the rotation axis of the lap plate. In contrast, in accordance with the present invention, a lap correction ring or plate having an outer diameter smaller than the width of the lap surface is used, and this ring or plate is rotated on the lap plate. When the lap is moved in the width direction of the lap surface while revolving around the rotation axis, the correction effect is surprisingly improved, although the reason is not clear. In other words, compared to the case of modifying the lap surface according to the conventionally known method described above, according to the present invention, the same modification effect can be obtained in a shorter working time.

Furthermore, since the present invention uses a lap correction ring or plate with a relatively small outer diameter, it is easy and convenient to install the lap correction ring or plate between the lap surfaces prior to modifying the lap surface. This can be done quickly, and the removal of the lap correction ring or plate after correction can also be done efficiently. As shown in FIGS. 3 and 4, when using the wrap correction plate 15 having a relatively small outer diameter, the carrier 16 may be the workpiece carrier used during the normal wrapping operation or Since the holder can be used as a carrier for the lap correction plate,
In such cases, the lap correction ring or plate may be easier to handle.

Furthermore, since the present invention uses a lap correction ring or plate with a relatively small outer diameter, its thickness can be easily measured, and the flatness of the lap surface can be determined by accurately checking the thickness dimension. This provides the advantage that the degree of modification can be easily known.

Although the preferred embodiments of the present invention have been illustrated and described above, it should be understood that the present invention is not limited to these but can be embodied and implemented in various ways within the scope of the claims set forth above. It is.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view of essential parts of an embodiment of the apparatus of the present invention, and FIG. 2 is a plan view taken along the line - in FIG. 1. FIG. 3 is a schematic cross-sectional view of essential parts of another embodiment of the device of the present invention, and FIG. 4 is a plan view taken along the line - in FIG. 3. 1, 11... upper lap plate, 2, 12...
...Lower lap plate, 3,13...Sun gear, 4,14...Internal gear, 5,15
...correction ring or plate, 6,16...carrier, 7,17...hole, 8,18...gear,
9,19...groove.

Claims (1)

[Scope of Claims] 1 (a) having annular lap surfaces independently rotatable about a common axis and arranged axially spaced and parallel to each other; 2;
(b) a sun gear and an internal gear disposed non-eccentrically at the center and outer periphery of the annular wrap plate, respectively, between the two wrap plates; (c) at least three carriers disposed between the carriers and having gears on their outer peripheries meshing with the gears; a number of lap correction rings or plates disposed in contact between the surfaces; (d) said carrier having holes therein for receiving said lap correction rings or plates in rotation of said carrier; A lap surface modification device for a wrapping machine, characterized in that the lap modification ring or plate is formed at an eccentric position capable of reciprocating across the width of the annular wrap plate. 2. A lap surface modification device for a wrapping machine as claimed in claim 1, wherein each carrier is provided with a plurality of holes for receiving a lap modification ring or plate. 3. A lapping surface correction device for a lapping machine according to claim 1, wherein the lapping correction ring or plate has a plurality of grooves or grid-like grooves extending radially on the polishing surface.