JP4425240B2 - Moving device and plane polishing machine using planetary gear mechanism - Google Patents

Description

  The present invention relates to a moving device and a plane polishing machine using a planetary gear mechanism, and more particularly to a moving device capable of generating a movement of a quadrangular locus and a plane polishing machine equipped with the moving device.

  Generally, in order to move an object through a quadrilateral trajectory, an X, Y biaxial slide mechanism or a double cam is used. However, when the former is used, the cost is high, and when the latter is used, an accurate quadrilateral locus is difficult to obtain.

  In addition, a single cam having a group of rollers on the peripheral surface and a driven body having a rectangular inner peripheral surface that is inscribed through the roller group, and the driven body moves through a square locus by the rotation of the cam. A motion mechanism (Patent Document 1) having a structure is known.

JP 2002-168316 A

  Further, as a conventional surface polishing machine, there is a Hopmann type as shown in FIGS. FIG. 8 is a perspective view thereof, and FIG. 9 is a plan view thereof. In these drawings, 37 is a sun gear rotated around the rotation drive shaft 101, and 39 is arranged concentrically with the sun gear 37 and is stationary. The internal gear 38, which is maintained in the state, is four planetary gears meshed with the sun gear 37 and the internal gear 39. Each planetary gear 38 is formed with a square hole 40 into which the square work 33 is inserted. Reference numeral 41 denotes a lower lapping machine that rotates around the rotation drive shaft 102 while supporting the lower surface of the work 33 inserted into the square hole 40, and 42 denotes an upper surface of the work 33 inserted into the square hole 40. This is an upper lapping machine that is rotated around the rotation drive shaft 103 under the state of pressing. The upper lapping machine 42 can be moved up and down to supply the work 33 to the planetary gear 38 and to take out the work 33 from the planetary gear 38.

  When machining the workpiece 33, the upper lapping machine 42 is raised and the workpiece 33 is supplied into the square holes 40 of the planetary gears 38, and then the upper lapping machine 42 is lowered so that the upper surface of each workpiece 33 is appropriately adjusted. Press with pressure. At this time, the lower surface of each work 33 is pressed by the lower lapping machine 41 with the same pressing force. Thereafter, the sun gear 37 is rotated at an appropriate speed. At this time, the upper lapping machine 42 and the lower lapping machine 41 are rotated in an appropriate direction and at an appropriate speed depending on the processing situation. As a result, each workpiece 33 is moved in the same body as the planetary gears 38 according to their rotational and revolving displacements, and the upper and lower surfaces are simultaneously polished by the upper and lower lapping machines 42 and 41.

  This processing machine escapes the difference of the total movement distance due to the difference in the distance from the center of each of the two lap machines 41 and 42 of the workpiece 33 by simultaneously performing the rotation displacement and the revolution displacement. Therefore, high-quality polishing is performed by making the total movement distances of all the points in each workpiece 33 the same.

  However, the Hopman method has the following drawbacks.

  FIG. 10 shows two arbitrary points of one workpiece w when the upper and lower lapping machines 42 and 41 are stationary and only the sun gear 37 is rotated 180 degrees in a Hopman type plane polishing machine, that is, the corresponding planetary gears. The total movement trajectory of each point P not matching the point Q matching the rotation center 38 is shown. As is apparent from this figure, the movement trajectories of these two points P and Q do not coincide with each other and are different. That is, in this surface polishing machine, the moving distance of each point of each workpiece 33 is not the same. This difference in the movement distance of each point can be ignored in practice if the workpiece 33 is small, but cannot be ignored as the workpiece 33 becomes larger. That is, this difference is a difference in the polishing amount of the processed surface that is the upper and lower surfaces of the workpiece 33, and it becomes difficult to finish the processed surface into a flat shape, and uneven wear of the polishing surfaces of the upper and lower lapping machines 42 and 41 is also difficult. Is also generated.

  Each planetary gear 38 is in contact with the lower lap disk 41 and rotates about the rotation drive shaft 101, so that the rotation about the rotation drive shaft 101 and the rotation drive shaft 102 of the lower lap disk 41 are centered. The movement distances of the inner and outer points in the radial direction of the lower lapping machine 41 are variously different in relation to the rotation direction relative to the rotating direction. The amount of abrasion gradually increases toward the outer radius direction of the polishing plane, or conversely decreases, and the lower surface of each workpiece 33 cannot be properly polished.

  Further, the flatness of the polishing plane of the lower lapping machine 41 is important for high-quality polishing, and it is necessary to correct the polishing plane whose wear amount gradually changes as described above with a jig. Become. However, this modification is not only skillful but also difficult to complete. Such a problem related to the relative rotation between the planetary gear 38 and the lower lap machine 41 becomes more important in large workpieces.

  As a surface polishing machine using a moving device using a planetary gear mechanism that eliminates the disadvantages of the Hopman method, those shown in FIGS. 11 to 13 have been proposed.

  The plane polishing machine includes a bed 43. A lower lap machine 35 is fixed horizontally on the bed 43, and a carrier plate 29 is disposed in the vicinity of the upper lap machine 35, as shown in FIG. The follower 3 is arranged on the right side of the carrier plate 29. Further, the drive motor 104 is fixed to the bed 43, and the planetary gear mechanism 1 having the sun gear 37 driven by the output shaft of the drive motor 104 is provided at the lower position of the follower 3.

  A wrapping agent distribution tank 51 and an air cylinder 49 are arranged above the bed 43, and the upper wrapping machine 36 is fixed to the lower end of the slide head 52 connected to the output shaft of the air cylinder 49 via a universal joint 109. .

  As shown in FIGS. 14 and 15, the planetary gear mechanism 1 includes a sun gear 37 that is rotated by a drive motor 104, and an internal gear 39 that is arranged concentrically with the sun gear 37 and is held stationary. Three planetary gears 38 arranged 120 ° apart from each other in the circumferential direction so as to mesh with each other in a space formed between the sun gear 37 and the internal gear 39, In one planetary gear mechanism, the number of teeth of the gears meshed with each other is a number corresponding to the diameter of the gear. Therefore, for example, the number of teeth A corresponding to the diameter of the sun gear 37 is set to 40, and the number of teeth B corresponding to the diameter of the internal gear 39 is set to twice the number of teeth A of the sun gear, that is, 80. The number of teeth C corresponding to the diameter of 38 is set to 1/4 of the number of teeth B of the internal gear 39, that is, 20.

  16 and 17, the carrier plate 29 is formed of a relatively large horizontal square frame plate. The carrier plate 29 is formed with a square hole 29a, and a plurality of workpieces 33 are formed in the square hole 29a. The work pin 32 is fitted to the driven body 3, and one side of the carrier plate 29 is coupled to the driven body 3, and a drive pin is provided in the hole formed in the driven body 3 so as to protrude from the planetary gear 38. 2 and the driven body 3 are held by the parallelogram link mechanism 4 so that the carrier plate 29 and the driven body 3 can move in the XY directions in a horizontal plane.

  In the above-structured surface polishing machine, when the sun gear 37 of the planetary gear mechanism 1 is rotated at a constant speed by the drive motor 104, the planetary gear 38 revolves around the sun gear 37 once as shown in FIG. In the meantime, the drive pin 2 eccentrically provided on the planetary gear 38 because it rotates four times has a substantially quadrangular locus 6 different from the circular locus 5 of the rotation center of the planetary gear 38.

  According to such a surface polishing machine, it is possible to perform high-precision surface polishing by moving the workpiece through a substantially quadrangular locus with a very simple configuration, and also increasing the diameter of the planetary gear mechanism to increase the quadrangular locus. If the length of one side is increased, surface polishing of a large workpiece can be performed, and further, efficient surface polishing can be performed by moving the workpiece at a high speed.

  However, in such a surface polishing machine, the substantially quadrangular locus 6 does not change every time the sun gear 37 rotates.

  As a result, there is a drawback that traces appear on the workpiece 33 to be polished along the substantially quadrangular trace 6. The present invention is designed to eliminate such drawbacks.

  The moving device using the planetary gear mechanism of the present invention comprises a planetary gear mechanism and moving means driven by the planetary gear mechanism, and the planetary gear mechanism is arranged concentrically with the sun gear. A plurality of planetary gears disposed in a circumferential direction so as to mesh with each other in a space formed between the sun gear and the internal gear, An arbitrary one of the planetary gears is composed of a drive pin protruding at a position eccentric from the rotation center axis, and the number of teeth A corresponding to the diameter of the sun gear is a tooth corresponding to the diameter of the internal gear. The number of teeth C corresponding to the diameter of the planetary gear is (1/4) +1 of the number of teeth B of the internal gear. 4 revolutions while the planetary gear revolves once around the sun gear 18 ° is to be rotating, the moving means engages with the drive pin, along a trajectory substantially quadrilateral, characterized in that it is driven.

  The planar polishing machine of the present invention comprises a planetary gear mechanism, a moving means for a workpiece to be polished driven by the planetary gear mechanism, and a planar polishing means. The planetary gear mechanism includes a sun gear, The internal gear arranged concentrically with the sun gear and held in a stationary state, and spaced apart from each other in the circumferential direction so as to engage with each other in a space formed between the sun gear and the internal gear. A plurality of planetary gears and an arbitrary one of the planetary gears and a drive pin projecting at a position eccentric from the rotation center axis thereof, the number of teeth A corresponding to the diameter of the sun gear is the internal tooth (1/2) -2 of the number of teeth B corresponding to the diameter of the gear, and the number of teeth C corresponding to the diameter of the planetary gear is (1/4) +1 of the number of teeth B of the internal gear, The planetary gear moves around the sun gear by the rotation of the sun gear. Is to be 4 rotated -18 ° rotation during the times revolution, the moving means engages with the drive pin, along a trajectory substantially quadrilateral, characterized in that it is driven.

  Further, the flat polishing machine of the present invention comprises the carrier plate for holding the work to be polished by the flat polishing means, and an upper lapping machine and a lower lapping machine for sandwiching the work from its upper and lower surfaces, and the moving means. Is means for moving the carrier plate and the lower lapping machine relative to each other via a link mechanism.

  Further, in the planar polishing machine of the present invention, the link mechanism includes a link fixing node pivotally supported at one end on the machine base, a link follower pivotally supported on the carrier plate, and one end It is composed of a link link pivotally supported on the lower lapping machine, and the relative speed is changed between the carrier plate and the lower lapping machine according to the link ratio of the link mechanism.

  According to the surface polishing machine of the present invention, it is possible to perform highly accurate surface polishing by moving the workpiece through the quadrilateral locus with a very simple configuration, and the quadrilateral locus is centered on the rotation center of the sun gear. As it comes to gradually. In addition, the upper and lower surfaces of the workpiece can be simultaneously polished at the same or different speed.

  Embodiments of the present invention will be described below with reference to the drawings.

  In an embodiment of the present invention, when the number of teeth B of the internal gear 39 is 80, for example, the number of teeth C of the planetary gear 38 is (1/4) +1 of the number of teeth B of the internal gear 39, That is, the number of teeth A of the sun gear 37 is set to (1/2) -2, that is, 38 of the number of teeth B of the internal gear 39.

  According to this embodiment, the planetary gear 38 revolves around the sun gear 37 once by the rotation of the sun gear 37, and rotates by 80/21 rotations, that is, 4 rotations to -18 °. As shown in FIG. 1, the substantially quadrangular locus 6 gradually shifts counterclockwise by 18 ° for each rotation of the sun gear 37, and the substantially quadrangular locus 6 is the first time when the sun gear 37 rotates 20 times. Since the position returns to the position shown in FIG. 18 again, the trace of the trajectory hardly appears on the work 33.

  The above relationship is similarly established when the number of teeth B of the internal gear 39 is 60, 100, 120, 140, 160, or the like.

  In another embodiment of the present invention, as shown in FIGS. 2 to 7, a link mechanism 10 composed of a link fixing joint 7, a link follower 8, and a link original joint 9 is arranged on both sides of the lower lapping machine 35. The link fixing joint 7 of each of the link mechanisms 10 is pivotally supported on the machine base 11 and the link original joint 9 is pivotally supported on the side of the lower lap board 35 so that the link follower is supported. 8 is pivotally supported in a pin hole 12 provided in the carrier plate 29, and the drive pin 2 protruding from the planetary gear 38 is fitted into a hole formed in the driven body 3 connected to the side of the carrier plate 29. The sun gear 37 of the planetary gear mechanism 1 is rotated at a constant speed by the drive motor 104.

  As a result, the lower lapping machine 35 swings along a substantially quadrilateral trajectory, and the carrier plate 29 also has a carrier plate 29 according to the link ratio of the link mechanism 10, for example, when the link ratio is 1: 2. Moves relative to the lower lapping machine 35 at half speed, the lower surface of the work 33 attached to the carrier plate 29 is polished by the lower lapping machine 35, and the upper surface of the work 33 is fixed by the fixed upper lapping machine 36. Polishing is performed at the same speed as the lower surface of the workpiece 33.

  When the link ratio is other than 1: 2, the lower surface and the upper surface of the work 33 are polished at different rates.

  According to this embodiment, it becomes easy to obtain flatness and parallelism by polishing the workpiece 33. Since the power system is one system, the polishing machine can be made compact, and low cost and resource saving can be achieved.

  As described above, according to the surface polishing machine of the present invention, it is possible to perform highly accurate surface polishing by moving the workpiece through the quadrilateral locus with a very simple configuration, and the diameter of the planetary gear mechanism is increased. If the length of one side of the substantially quadrangular locus is increased, it is possible to perform surface polishing of a large workpiece, and further, it is possible to perform efficient surface polishing by moving the workpiece at a high speed.

It is explanatory drawing of the grinding | polishing locus | trajectory in the Example of this invention. It is a front view of the plane grinding machine in other examples of the present invention. FIG. 3 is a plan view of the surface polishing machine shown in FIG. 2. FIG. 3 is a side view of the flat polishing machine shown in FIG. 2. It is operation | movement explanatory drawing of the plane polishing machine shown in FIG. It is operation | movement explanatory drawing of the plane polishing machine shown in FIG. It is explanatory drawing of the link mechanism of the surface polisher shown in FIG. It is a perspective view which shows the surface polishing machine of the Hopman system of a prior art example. It is a top view which shows the surface polishing machine shown in FIG. It is explanatory drawing which shows the total moving distance of the 2 points | pieces of the workpiece | work in the grinding | polishing operation | movement by the plane grinder shown in FIG. It is a front view of the other conventional plane polishing machine. It is a top view of the plane polishing machine shown in FIG. It is a side view of the plane polishing machine shown in FIG. It is a top view of the principal part of the drive means in the moving apparatus shown in FIG. It is a vertical front view of the drive means shown in FIG. It is a top view of the moving apparatus shown in FIG. It is a longitudinal cross-sectional view of the moving apparatus shown in FIG. It is operation | movement explanatory drawing of the drive means shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Planetary gear mechanism 2 Drive pin 3 Drive body 4 Parallelogram link mechanism 5 Circular locus 6 Quadrilateral locus 7 Link fixed node 8 Link follower 9 Link original link 10 Link mechanism 11 Machine base 12 Pin hole 29 Carrier plate 29a Square Hole 33 Work 35 Lower lapping machine 36 Upper lapping machine 37 Sun gear 38 Planetary gear 39 Internal gear 40 Square hole 41 Lower lapping machine 42 Upper lapping machine 43 Bed 49 Air cylinder 51 Distribution tank 52 Slide head 101 Rotation drive shaft 102 Rotation drive Shaft 103 Rotation drive shaft 104 Drive motor 109 Universal joint

Claims (4)

  A planetary gear mechanism and moving means driven by the planetary gear mechanism, wherein the planetary gear mechanism is arranged in a concentric manner with the sun gear and an internal gear held in a stationary state; A plurality of planetary gears arranged circumferentially apart from each other in a space formed between the sun gear and the internal gear and meshing with them, and any one of the planetary gears is rotated. A drive pin projecting at a position eccentric from the central axis, and the number of teeth A corresponding to the diameter of the sun gear is (1/2) -2 of the number of teeth B corresponding to the diameter of the internal gear; The number of teeth C corresponding to the diameter of the planetary gear is (1/4) +1 of the number of teeth B of the internal gear, and the rotation of the sun gear causes the planetary gear to revolve around the sun gear once. 4 rotations to 18 °, and the moving hand But the mobile device using a planetary gear mechanism, characterized in that engages the drive pin, is driven along a locus of substantially quadrilateral.   The stationary gear mechanism comprises a planetary gear mechanism, a moving means for a workpiece to be polished driven by the planetary gear mechanism, and a planar polishing means, and the planetary gear mechanism is arranged concentrically with the sun gear. An internal gear held in a state, a plurality of planetary gears arranged circumferentially apart from each other in a space formed between the sun gear and the internal gear, and the planetary gear Drive pin projecting at a position eccentric from the rotation center axis, and the number of teeth A corresponding to the diameter of the sun gear is the number of teeth B corresponding to the diameter of the internal gear. (1/2) -2, and the number of teeth C corresponding to the diameter of the planetary gear is (1/4) +1 of the number of teeth B of the internal gear, and the planetary gear is rotated by the rotation of the sun gear. 4 revolutions -18 during one revolution around the sun gear Are to be rotating, the moving means engages with the drive pin, surface grinding machine, characterized in that it is driven along a locus of substantially quadrilateral.   The plane polishing means comprises a carrier plate that holds a work to be polished, and an upper lap machine and a lower lap machine that sandwich the work from its upper and lower surfaces, and the moving means is connected to the carrier plate via a link mechanism. 3. The surface polishing machine according to claim 2, wherein the lower lapping machine is a means for moving the lower lapping machine relative to each other.   The link mechanism includes a link fixing joint pivotally supported at one end on the machine base, a link follower pivotally supported on the carrier plate, and an end pivotable on the lower lap board. 4. The surface polishing machine according to claim 2, wherein the surface polishing machine comprises a supporting link original section, and the relative speed is changed between the carrier plate and the lower lapping machine in accordance with the link ratio of the link mechanism.

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