TW201902620A - Double-sided grinding device - Google Patents

Abstract

Provided is a double-side polishing apparatus capable of maintaining an upper platen horizontally during dressing while suppressing deterioration of workability when dressing the upper platen. In the double-side polishing apparatus (1) that polishes both surfaces of a workpiece by a lower platen (2) and an upper platen (3), it is configured with a driver (10) penetrating the lower platen (2) and rotating around an axis, a support mechanism (an elevating actuator (9), an aligning bearing (9b)) for hangingly supporting the upper platen (3) in a swingable and rotatable manner, a hook (20) provided on a peripheral edge of a center opening (3b) of the upper platen (3), a groove portion (11) formed on a peripheral surface of the driver (10) and into which the hook (20) can be inserted when a circumferential relative rotation angle between the upper platen (3) and the driver (10) is a predetermined angle, an abutment region (12) formed on an upper surface (10c) of the driver (10), and a projection portion (13) formed on the abutment region (12) and in contact with the hook (20).

Description

Double-side grinding device

The present invention relates to a double-side polishing device for polishing both sides of a workpiece disposed between an upper platen and a lower platen.

In the past, it has been known that the upper fixed plate is connected to a cylinder shaft provided on the upper part of the device through a universal joint and a counter bearing, and a first groove formed in the axial direction is formed on the outer peripheral surface of the center drum and the length is different In the second groove of the first groove, the hook provided on the upper plate is engaged with the first groove or the second groove, so that the rotation force of the center drum is transmitted to the double-side grinding device of the upper plate (for example, refer to the patent Literature 1).

[Prior Art Document] [Patent Document] Patent Document 1: Japanese Patent Laid-Open No. 2017-1151

[Problems to be Solved by the Invention] In the conventional double-side polishing apparatus, a hook formed on the upper platen is inserted into the first groove in order to lower the upper platen to the workpiece grinding position when grinding the workpiece. On the other hand, when cleaning or dressing (hereinafter, simply referred to as "dressing") is attached to the polishing pad of the upper platen, the hook is inserted into the second groove. Furthermore, the hook is supported by a supporting surface supporting the hook formed in the second groove from below, so that the upper platen stops at a position above the workpiece grinding position, thereby maintaining the horizontal state of the upper platen during the trimming.

However, in this conventional double-side polishing apparatus, it is necessary to insert the hook into the groove regardless of whether the workpiece is being polished or the polishing surface is being trimmed. That is, even when trimming the upper plate, the relative rotation angle between the upper plate and the center drum needs to be adjusted so that the hook can be inserted into the required groove, thereby causing a problem in that the workability during trimming is reduced.

Further, in the conventional double-side polishing apparatus, although a pair of second grooves are formed, if the depth of the grooves of the pair of second grooves is different due to the problem of machining accuracy, the upper plate may be inclined during trimming. Concerns.

The present invention has been made focusing on the above-mentioned problems. Therefore, an object of the present invention is to provide a double-side polishing device that can suppress a decrease in workability when trimming an upper platen, and can maintain the upper platen at a level during the trimming process.

In order to achieve the above object, the present invention provides a double-side grinding device for grinding both sides of a workpiece by using a lower platen and an upper platen, which include a driving member, a supporting mechanism, a hook, a groove portion, a contact area, and a protruding portion.

The driving member penetrates the lower fixed plate and can rotate around the shaft.

The support mechanism can swing and rotatably suspend and support the upper platen.

The hook extends from the inner periphery of the upper plate toward the center.

The groove is formed on the circumferential surface of the driving member and extends toward the axial direction of the driving member. When the relative rotation angle of the upper plate and the circumferential direction of the driving member is a predetermined angle, the hook can be inserted.

The contact area is formed on an upper surface of the driving member.

The protruding portion is provided in the contact area and is in contact with the hook in a state where the hook contacts the contact area.

[Effects of the Invention] As a result, it is possible to suppress a decrease in workability when trimming the polished surface of the upper platen, and to maintain the upper platen at a level during the dressing process.

[Embodiment] Hereinafter, an embodiment of the double-side polishing apparatus of the present invention will be described based on Example 1 shown in the drawings.

(Example 1)

First, the structure will be described.

The double-side polishing device 1 of Example 1 is a device for polishing the front and back surfaces of a thin plate-shaped workpiece WR such as a semiconductor wafer, a crystal wafer, a sapphire wafer, a glass wafer, or a ceramic wafer. Hereinafter, the structure of the double-side polishing apparatus 1 of Example 1 is divided into "the overall structure", "the detailed structure of a driver", and "the detailed structure of a hook", and it demonstrates.

[the whole frame]

FIG. 1 is a schematic cross-sectional view showing the overall structure of a double-side polishing apparatus of Example 1. FIG. Hereinafter, the overall structure of the double-side polishing apparatus of Example 1 will be described based on FIG. 1.

As shown in FIG. 1, the double-side polishing apparatus 1 of the embodiment 1 has a lower platen 2, an upper platen 3, a sun gear 4 provided in the center of the lower platen 2, and a lower platen 2 concentrically disposed around the axis L1 as a center. Internal gear 5 arranged in a peripheral manner.

The sun gear 4, the lower fixed plate 2, and the internal gear 5 are respectively connected to a driving source (not shown) through drive shafts 6, 7, and 8 and are rotationally driven.

On the other hand, the upper platen 3 is hung and supported on a lever 9c of the lifting actuator 9 by a platen hanger 9a mounted on the upper surface of the upper platen 3. Here, an alignment bearing 9b such as a spherical bearing is inserted at the front end of the rod 9c. Therefore, the upper platen 3 is supported by the lifting actuator 9 so as to be swingable and rotatable. That is, the support mechanism for hanging and supporting the upper platen 3 is constituted by the lifting actuator 9 and the registration bearing 9b.

In addition, a driving member 10 penetrating the lower platen 2 is provided below the upper platen 3. The driver 10 has a driver shaft 10a extending along the axis L1, and a driver body 10b formed at the front end of the driver shaft 10a.

Furthermore, in the driving member 10, the driving shaft 10a is connected to a driving source (not shown) and can be rotated about the axis L1. Further, a plurality of (here, four) groove portions 11 are formed on the circumferential surface of the driver body 10b. On the other hand, a plurality of (here, four) hooks 20 extending toward the center O of the upper plate 3 are attached to the periphery (inner periphery) of the center opening 3 b of the upper plate 3.

Furthermore, when the workpiece WR is being ground, the lever 9c protrudes from the lifting actuator 9, and while the upper platen 3 is lowered, the hooks 20 are inserted into the respective groove portions 11 one by one. Then, the groove portion 11 and the hook 20 interfere in the circumferential direction, so that the rotational force of the driver 10 is transmitted to the upper platen 3, which is rotationally driven.

Polishing pads 2a and 3a are respectively adhered to the surfaces of the lower platen 2 and the upper platen 3 facing each other.

Further, in the double-side polishing apparatus 1, a workpiece WR held by a star wheel plate CA is provided between the lower platen 2 and the upper platen 3. Here, as shown in FIG. 1, the planetary gear plate CA meshes with the sun gear 4 and the internal gear 5, and rotates and revolves by the rotation of the sun gear 4 and the internal gear 5. Then, by the rotation and revolution of the star wheel plate CA, the workpiece WR held by the star wheel plate CA moves between the lower platen 2 and the upper platen 3, so that both sides are polished.

(Detailed structure of the driver)

FIG. 2 is a perspective view showing a main part of the double-side polishing apparatus according to the first embodiment, and FIG. 3 is a plan view showing a driving member according to the first embodiment. Hereinafter, the detailed structure of the driver in Embodiment 1 will be described based on FIGS. 2 and 3.

As described above, the driving member 10 is rotationally driven by a driving source (not shown), and transmits the rotational force to the upper platen 3 so that the upper platen 3 is rotationally driven. As shown in FIG. 2, the driving member 10 includes a driving shaft 10 a connected to a driving source and disposed along the axis L1, and a driving member body 10 b formed at a front end of the driving shaft 10 a.

The drive shaft 10a passes through the central opening 2b of the lower platen 2 and supports the driver body 10b at a position protruding upward from the lower platen 2 (see FIG. 1).

A plurality of (four in this case) groove portions 11 are formed on the peripheral surface of the driver body 10b, and a contact area 12 is formed on the upper surface 10c of the upper fixed plate 3, and a plurality of contact areas 12 (here, 2 pieces) of protruding portion 13.

As shown in FIG. 2, the groove portion 11 extends along the axis L1, that is, the axial direction of the driver 10, and is opened in the radial direction and the vertical direction of the driver body 10 b. In addition, the respective groove widths G1 of the four groove portions 11 are set to the same size in which the hook 20 can be inserted (see FIG. 3). In addition, the "groove width G1" is an interval dimension in the circumferential direction of the inner side surface 11a of the driver body 10b.

Further, in this embodiment 1, four groove portions 11 are formed at intervals of 90 ° in the circumferential direction of the driver body 10b, and these groove portions 11 are provided at the center O (the point where the axis L1 passes) of the above-mentioned fixed plate 3 as The point of symmetry is in a symmetrical position.

The contact area 12 is an area where the contact surface 22 a of the front end portion 22 of the hook 20 can contact, and has an area sufficiently wider than the contact surface 22 a. Here, as shown in FIG. 3, the contact region 12 is a region along the peripheral edge portion of the driver body 10 b. In addition, a groove portion 11 is repeatedly formed in the contact area 12, and an upper end of the groove portion 11 is opened in the contact area 12.

The protruding portion 13 protrudes upward from the contact area 12 along the axial direction (axis line L1) of the driver 10, and can contact the side surface 22b of the front end portion 22 of the hook 20, and the hook 20 is in contact with the contact area 12. Here, as shown in FIG. 3, although the protruding portion 13 is bent along the circumferential direction of the driver body 10 b, its circumferential dimension G2 is set to be sufficiently smaller than the interval size between the groove portions 11. That is, although the upper end of the groove portion 11 is open in the contact area 12 and the protrusion portion 13 is formed on the contact area 12, the contact area 12 sufficiently ensures the area contacted by the contact surface 22 a of the end portion 22 before the hook 20.

In addition, the protruding portion 13 may be formed separately from the driver main body 10b, and fixed to the driver main body 10b by screws or welding not shown, or may be formed integrally with the driver main body 10b.

(Detailed structure of the hook)

Fig. 4 is a plan view showing the central portion of the upper plate in the first embodiment. Hereinafter, the detailed structure of the hook provided on the fixing plate of the first embodiment will be described based on FIG. 2 and FIG. 4.

The hook 20 is fixed to the peripheral edge portion (inner peripheral edge) of the center opening 3 b of the upper platen 3 and extends toward the center O of the upper platen 3. As shown in FIG. 4, the hook 20 has: a fixing portion 21 whose one end is fixed to the upper surface of the upper platen 3 and whose front end protrudes toward the inner side of the central opening 3 b of the upper platen 3; a front end portion 22 which is formed on The front end of the fixing portion 21 extends toward the lower fixed plate 2. Here, as shown in FIGS. 1 and 4, the fixing portion 21 extends until the front end portion 22 is located above the upper surface 10 c of the driver body 10 b. In a plan view, the front end portion 22 is opposite to the upper surface 10 c of the driver body 10 b. repeat.

In addition, the hook 20 has a first hook 20A, the hook width W1 of the front end portion 22 is slightly smaller than the groove width G1 of the groove portion 11, and the side surface 22b of the front end portion 22 contacts the inner side surface of the groove portion 11 when inserted into the groove portion 11. 11a; and the second hook 20B, the hook width W2 of the front end portion 22 is sufficiently smaller than the groove width G1 of the groove portion 11, and the side surface 22b of the front end portion 22 does not contact the inner side surface 11a of the groove portion 11 when inserted into the groove portion 11. The “hook width” refers to the size of the front end portion of the hook in the circumferential direction of the upper plate 3.

Furthermore, two first hooks 20A and two second hooks 20B are respectively provided, and here, they are alternately arranged every 90 ° along the circumferential direction of the upper platen 3. That is, as shown in FIG. 4, the four hooks 20 are disposed at a point symmetrical position where the center O (the point where the axis L1 passes) of the above fixed plate 3 is a point of symmetry, and are disposed between the first hooks 20A, The second hooks 20B are in opposite positions.

Next, the functions of the double-side polishing apparatus of Example 1 are divided into "upper plate support operation during dressing" and "upper plate support operation during workpiece grinding".

[Support function of upper plate during dressing]

5 and 6 show the main parts when the upper platen is trimmed using the double-side polishing apparatus of the first embodiment. Hereinafter, the supporting action of the upper platen of the double-side polishing apparatus of Example 1 during dressing will be described based on FIGS. 5 and 6.

In the double-side polishing apparatus 1 of Example 1, when the workpiece is ground, the upper platen 3 is lowered, and the workpiece WR placed on the lower platen 2 is held between the upper platen 3 and the lower platen 2.

Here, even if the thickness of the work piece WR or the star wheel plate CA holding the work piece WR changes, in order to equalize the pressing force acting on the work piece WR, and to make the upper platen 3 track the lower platen 2 accompanying the rotation of the lower platen 2 The small upper and lower vibrations (swing), the upper fixed plate 3 is hung and supported on the lifting actuator 9 by the positioning bearing 9b, thereby allowing a deflection angle with respect to the horizontal direction.

On the other hand, the lower platen 2 and the upper platen 3 are respectively attached with polishing pads 2a, 3a. The workpiece WR is rotated by the lower platen 2, the upper platen 3, and the star wheel plate CA, and the polishing pads 2a, 3a or FIG. The slurry supplied from a supply mechanism not shown is ground. However, when the double-side polishing apparatus 1 is used for a long time, slurry or chip powder enters the polishing pads 2a, 3a, causing blockage of the polishing pads 2a, 3a or deformation of the surfaces of the polishing pads 2a, 3a. Therefore, the polishing pads 2a, 3a are trimmed due to a significant reduction in the polishing rate.

Here, the dressing of the polishing pads 2a and 3a is performed by, for example, inserting a dressing member between the lower platen 2 and the upper platen 3, and further rotating the lower platen 2 and the upper platen 3 while dressing the same The components are pressed against the polishing surfaces of the polishing pads 2a and 3a, so that they move back and forth between the outer peripheral portion and the inner peripheral portion of the lower platen 2 and the upper platen 3.

At this time, since the trimming member needs to be inserted between the lower platen 2 and the upper platen 3, the upper platen 3 is held with a gap relative to the lower platen 2. However, as described above, since the upper platen 3 is suspended and supported by the alignment bearing 9b, when the trimming member is pressed against the polishing pad 3a of the upper platen 3, the inclination of the upper platen 3 changes. The dressing member cannot be properly brought into contact with the polishing pad 3a of the upper platen 3.

In contrast, as shown in FIG. 5 and FIG. 6, in the double-side polishing apparatus 1 of the first embodiment, when the upper platen 3 is lowered by the lifting actuator 9, the hook 20 of the upper platen 3 is provided. The contact surface 22a of the front end portion 22 is in contact with the contact area 12 formed on the upper surface 10c of the driver body 10b. Therefore, the upper platen 3 is supported by the upper surface 10 c of the driving member 10 by the hook 20.

As a result, when trimming the upper platen 3, even if the trimming member is pressed against the polishing pad 3a of the upper platen 3, the upper surface 10c of the driver 10 interferes with the hook 20, thereby preventing the upper platen 3 from shaking. Therefore, the upper platen 3 can be maintained at a level during the trimming process.

In addition, as shown in FIG. 5, the contact area 12 contacted by the contact surface 22 a of the front end portion 22 of the hook 20 is an area along the peripheral edge portion of the driver body 10 b. In addition, although the upper end of the groove portion 11 is opened on the contact area 12 and a protruding portion 13 is formed, the area contacted by the contact surface 22 a of the front end portion 22 of the hook 20 is sufficiently ensured. Therefore, there is no need to strictly adjust the relative rotation angle of the upper platen 3 and the circumferential direction of the driving member 10 to lower the upper platen 3 and the hook 20 contacts the contact area 12 formed on the upper surface 10c of the driving member body 10b. Therefore, a decrease in workability during dressing can be suppressed.

Furthermore, in the first embodiment, the contact area 12 formed on the upper surface 10c of the driver body 10b is formed with a protrusion 13 protruding upward in the axial direction (axis L1) of the driver 10, and the protrusion 13 can It is in contact with the side surface 22b of the front end portion 22 of the hook 20 in contact with the contact area 12.

Therefore, when the driving shaft 10 a of the driving member 10 rotates, as shown in FIG. 5, the protruding portion 13 contacts the side surface 22 b of the front end portion 22 of the hook 20. Therefore, the rotational force of the driving member 10 is transmitted to the hook 20, and the upper platen 3 is rotated.

That is, by the protrusion 13, the rotational force of the driver 10 can be transmitted to the upper platen 3 and the upper platen 3 can be rotated, so that the trimming can be performed. As a result, a trimming operation can be performed appropriately.

In addition, in the first embodiment, two protruding portions 13 are provided with respect to the four hooks 20 provided. That is, the number of protrusions 13 (two) is smaller than the number of hooks 20 (four). Therefore, as shown in FIG. 5, not all the hooks 20 are in contact with the protruding portion 13, so that a hook 20 (the second hook 20B in FIG. 5) that comes into contact with the protruding portion 13 and transmits the rotational force from the driving member 10 is generated, The hook 20 (the first hook 20A in FIG. 5) is not in contact with the protrusion 13 and does not transmit a rotational force.

Therefore, the rotational force is not input to all the hooks 20 during dressing. According to the relative rotation angles of the upper plate 3 and the driving member 10 in the circumferential direction, the hooks 20 that input the rotational force each time the dressing is performed may be different. Therefore, the load acting on each hook 20 can be distributed. Therefore, it is possible to suppress damage or occurrence of a defective state of the hook 20.

In particular, as shown in FIG. 5, the hook width W1 of the front end portion 22 is slightly smaller than the groove width G1 of the groove portion 11, and the first hook 20A in which the side surface 22 b is in contact with the inner side surface 11 a of the groove portion 11 does not contact the protruding portion 13. When the hook width W2 of the portion 22 is sufficiently smaller than the groove width G1 of the groove portion 11, and when the second hook 20B whose side surface 22b does not contact the inner side surface 11a of the groove portion 11 contacts the protruding portion 13, as described later, when grinding the workpiece, The rotational force from the driving member 10 is transmitted only to the first hook 20A, and only the second hook 20B is transmitted during the trimming.

Therefore, the hooks 20 that transmit the rotational force may be different during grinding of the workpiece and during dressing, so that the load acting on each of the hooks 20 can be further dispersed. Therefore, it is possible to suppress damage or occurrence of a defective state of the hook 20.

In addition, the hook width W1 of the first hook 20A and the hook width W2 of the second hook 20B may be set to the same hook width.

[Support function of upper platen when grinding workpiece]

FIG. 7 and FIG. 8 show the main parts when the workpiece is polished using the double-side polishing apparatus of the first embodiment. Hereinafter, based on FIG. 7 and FIG. 8, the supporting action of the upper platen when the double-side polishing apparatus of Example 1 is used for polishing a workpiece will be described.

As described above, in the double-side polishing apparatus 1 of Example 1, the upper platen 3 is lowered and the upper platen 3 is placed on the lower platen 2 to polish the workpiece WR. That is, when grinding the workpiece WR, first, adjust the angle of the rotation direction of the upper platen 3 or the angle of the rotation direction of the drive member 10 so that the relative rotation angle of the upper platen 3 and the circumferential direction of the drive member 10 becomes Established angle. The “predetermined angle” is an angle in which the hook 20 provided on the upper platen 3 and the groove portion 11 formed in the driver 10 face each other in the vertical direction.

In addition, when the relative rotation angle in the circumferential direction of the upper platen 3 and the driver 10 becomes a predetermined angle, and when the hook 20 and the groove portion 11 face each other in the vertical direction, the lever 9c protrudes from the lifting actuator 9 and is lowered.上 定 盘 3. Furthermore, as shown in FIG. 7 and FIG. 8, the four hooks 20 are inserted into the four groove portions 11 with the lowering of the upper platen 3, so that the upper platen 20 can be prevented from being interfered by the driver body 10b. 3 is placed on the lower platen 2.

Furthermore, since the hook 20 is inserted into the groove portion 11 in this way, when the driving shaft 10a of the driving member 10 rotates, as shown in FIG. 7, the inner side surface 11a of the groove portion 11 contacts the side surface 22b of the first hook 20A. Therefore, the rotational force of the driving member 10 is transmitted to the first hook 20A, and the upper platen 3 is rotated.

That is, the rotating force of the driving member 10 can be transmitted to the upper platen 3 through the groove portion 11 and the upper platen 3 can be rotated, so that the workpiece WR can be polished. As a result, the work grinding operation can be performed appropriately.

In addition, as can be seen from FIG. 7, in the first embodiment, among the hooks 20, the hook width W1 of the front end portion 22 is slightly smaller than the side surface 22 b of the first hook 20A of the groove width G1 of the groove portion 11 and contacts the inside of the groove portion 11. The side surface 11 a and the hook width W2 of the front end portion 22 are sufficiently smaller than the side surface 22 b of the second hook 20B of the groove width G1 of the groove portion 11 and do not contact the inner side surface 11 a of the groove portion 11. Therefore, the rotational force from the driving member 10 is transmitted only to the first hook 20A, and the rotational force does not act on the second hook 20B. When the workpiece is to be ground, although the four hooks 20 need to be inserted into the four groove portions 11 respectively, the second hook 20B can alleviate the dimensional accuracy required between the groove portions 11 and thus can make the four hooks 20 It is easily inserted into the groove portion 11.

In addition, as described above, the first hook 20A that is in contact with the inner side surface 11 a of the groove portion 11 when grinding the workpiece, at least the contact surface 22 a of the front end portion 22 contacts the contact area 12 during dressing, and can support the upper platen 3. In other words, the first hook 20A is a hook that also functions to transmit the rotational force when grinding the workpiece and support the upper plate during dressing.

Furthermore, in the first embodiment, the four hooks 20 and the four groove portions 11 are formed at intervals of 90 ° along the circumferential direction, and both of them are set at the center O (the point where the axis L1 passes) of the above-mentioned fixed plate 3. It is a point of symmetry at a point of symmetry.

Therefore, during trimming, the upper platen 3 can be supported by the four hooks 20 in a balanced manner, and regardless of the direction of the force applied to the upper platen 3 during the trimming process, the swing of the upper platen 3 can be suppressed and maintained. Horizontal state. On the other hand, when grinding a workpiece, each of the hooks 20 can be inserted into the groove portion 11, and the driver 10 does not hinder the lowering of the upper platen 3, and the grinding operation of the workpiece WR can be performed appropriately.

Next, effects will be described.

In the double-side polishing apparatus 1 of Example 1, the following effects can be obtained.

(1) The double-side grinding device 1 for grinding both sides of a workpiece WR by using the lower platen 2 and the upper platen 3 is configured as follows, including: a driving member 10 penetrating the lower platen 2 and rotating around an axis; a supporting mechanism (for lifting The actuator 9 and the registration bearing 9b) can swing and rotatably suspend and support the upper fixed plate 3; the hook 20 extends from the peripheral edge of the central opening 3b of the upper fixed plate 3 toward the center O; the groove portion 11 is formed On the circumferential surface of the driving member 10 and extending toward the axial direction of the driving member 10, when the relative rotation angle of the upper fixing plate 3 and the driving member 10 in the circumferential direction is a predetermined angle, the hook 20 can be inserted; A region 12 is formed on the upper surface 10c of the driving member 10; a protrusion 13 is provided on the contact region 12 and contacts the hook 20 in a state where the hook 20 contacts the contact region 12.

Therefore, it is possible to suppress a decrease in workability when trimming the upper platen 3 and to maintain the upper platen 3 at a level during the trimming process.

(2) A plurality (4) of the groove portions 11 are formed on the peripheral surface of the driving member 10, and the hook 20 is configured to have an inner side surface 11a that contacts the groove portion 11 when inserted into the groove portion 11. A first hook 20A; and a second hook 20B that does not contact the inner side surface 11a of the groove portion 11 when inserted into the groove portion 11.

Therefore, in addition to the effect of (1), the required dimensional accuracy between the second hook 20B and the groove portion 11 can be relaxed, so that a plurality of hooks 20 can be easily inserted into the groove portion 11.

(3) The plurality of hooks 20 and the groove portions 11 are arranged at a point symmetrical position with the center O (the point where the axis L1 passes) of the upper plate 3 as a symmetry point.

Therefore, in addition to the effects of (1) or (2), the fixing plate 3 can be evenly supported in the circumferential direction during trimming.

(4) The number of the protrusions 13 (two) is smaller than the number of the hooks 20 (four).

Therefore, in addition to any of the effects (1) to (3), each time the trimming is performed, the hooks 20 to which the rotational force is transmitted can be made different, and the load acting on each of the hooks 20 can be dispersed, thereby suppressing the damage of the hooks 20 Or the emergence of bad conditions.

Although the double-side polishing apparatus of the present invention has been described based on Embodiment 1, the specific structure is not limited to this embodiment, and it is allowed to design as long as it does not depart from the gist of the invention of each claim of the patent scope. Changes, additions, etc.

In the first embodiment, an example is shown in which the driver main body 10 b is formed with four groove portions 11 and two protruding portions 13, and the upper plate 3 is provided with four hooks 20. However, the number of grooves, protrusions, and hooks is not limited to this, and one or more of them may be set. That is, for example, as shown in FIG. 9, the driver body 10 b may be formed with three groove portions 11 and three protruding portions 13, and three hooks 20 may be provided on the upper platen 3.

Even in this case, as shown in FIGS. 10A and 10B, the three hooks 20 each contact the contact area 12 formed on the upper surface 10c of the driver body 10b during the trimming, and can be evenly supported in the circumferential direction. Fixed plate 3.

In addition, at this time, the hook widths of the front ends 22 of the three hooks 20 are all set to be the same size slightly smaller than the groove width G1. Therefore, as shown in FIGS. 11A and 11B, when the hooks 20 are inserted into the groove portions 11 when the workpiece is being ground, the side surfaces 22 b of all the hooks 20 will contact the inner side surfaces 11 a of the groove portions 11. On the other hand, since the number (3) of the protrusions 13 is the same as the number (3) of the hooks 20, all the hooks 20 contact the protrusions 13 during trimming.

Therefore, regardless of the situation during trimming or grinding of the workpiece, all the hooks 20 can receive the rotational force input from the driving member 10 to disperse the input rotational force. Therefore, the rotational force acting on the hook 20 is not concentrated, and damage to the hook 20 and the like can be prevented.

In the first embodiment, the hook 20 is configured to have a first hook 20A that contacts the inner side surface 11a of the groove portion 11 when the workpiece is ground, and a second hook 20A that does not contact the inner side surface 11a of the groove portion 11 when the workpiece is ground. The hook 20B is not limited thereto. For example, the hook widths of a plurality of (4) hooks 20 may all be the same size.

In this case, the rotational force input from the driving member 10 when the workpiece is ground can be received by all the hooks 20 to disperse the input rotational force. Therefore, the force acting on the hook 20 is not concentrated, so that breakage of the hook 20 and the like can be prevented.

In Embodiment 1, the hook width W1 of the first hook 20A is set to be slightly smaller than the groove width G1 of the groove portion 11, and the hook width W2 of the second hook 20B is set to be sufficiently smaller than the groove width G1 of the groove portion 11, so that The first hook 20A that the side surface 22b contacts the inner side surface 11a of the groove portion 11 and the side surface 22b do not contact the second hook 20B that is the inner side surface 11a of the groove portion 11, but it is not limited thereto. For example, the hook widths of the plurality of hooks 20 may be set to all the same size, and the groove width of the groove portion 11 may be appropriately changed, so that the first hook 20A and the side surface 22b that contact the inner side surface 11a of the groove portion 11 with the side surface 22b are formed. The second hook 20B that does not contact the inner side surface 11 a of the groove portion 11.

In the first embodiment, an example in which the groove portion 11 formed on the circumferential surface of the driver body 10b is opened in the radial and vertical directions of the driver body 10b is shown, but it is not limited to this. The groove portion 11 is opened at least upwardly so that the hook 20 can be inserted, and the groove length is such that the upper platen 3 can be lowered until the lower platen 2 is placed on the upper platen 3, and the lower portion need not be opened.

Although the example in which the contact area 12 is set as the area along the peripheral edge part of the driver main body 10b is shown in Embodiment 1, it is not limited to this. It suffices that the contact area 12 is formed on at least the upper surface 10c of the driver body 10b and the contact surface 22a of the front end portion 22 of the hook 20 can be contacted. That is, for example, when the fixing portion 21 of the hook 20 is long, a contact area may be provided at the center portion of the driver body 10b.

In the first embodiment, the example in which the protruding portion 13 protruding from the contact area 12 upwardly to the fixed plate 3 contacts the side surface 22 b of the front end portion 22 of the hook 20 is shown, but it is not limited to this. For example, as shown in FIG. 12, the end portion 22 forms a recess 23 which is open downward before the hook 20. Therefore, when the hook 20 is in contact with the contact area 12, the protruding portion 13 may also be fitted into the recessed portion 23, so that the hook 20 contacts the protruding portion 13.

In Embodiment 1, although the upper surface 10c of the driver body 10b is formed as a flat surface, it is not limited to this. For example, as in the driver 10 shown in FIG. 13, a stepped surface 10 d may be formed on the upper surface 10 c of the driver body 10 b along the peripheral edge, and a contact region 12 and a protrusion 13 may be formed on the stepped surface 10 d. The upper end of the groove portion 11 is opened.

Further, the hook provided on the upper plate may have a driving hook, and a contact hook having an axial distance from the driving member body longer than the driving hook may have a driving groove and a contraction formed in a groove portion of the driving member body. With trough.

In this case, during trimming, the contact hook contacts the contact area formed on the upper surface of the driver body, and the upper plate is supported by the upper surface of the driver body. On the other hand, the driving hook is inserted into the driving groove, and the rotational driving force of the driver body is transmitted to the upper platen by the interference between the driving hook and the driving groove.

When grinding a workpiece, the driving hook is inserted into the driving groove in the same manner as in the trimming, and the rotational driving force of the driver body is transmitted to the upper platen by the interference between the driving hook and the driving groove. At this time, the contact hook is inserted into the contraction groove. Therefore, it becomes possible to lower the upper platen, and the upper platen can be placed on the lower platen and the workpiece can be ground.

1‧‧‧ Double-side grinding device

2‧‧‧ lower order

2a‧‧‧ polishing pad

2b‧‧‧center opening

3‧‧‧on order

3a‧‧‧ polishing pad

3b‧‧‧center opening

4‧‧‧ sun gear

5‧‧‧ Internal gear

6‧‧‧Drive shaft

7‧‧‧Drive shaft

8‧‧‧Drive shaft

9‧‧‧ Lifting actuator (support mechanism)

9a‧‧‧ fixed plate hanger

9b‧‧‧Alignment bearing (supporting mechanism)

9c‧‧‧ par

10‧‧‧Driver

10a‧‧‧Drive shaft

10b‧‧‧Driver body

10c‧‧‧ Top surface

10d‧‧‧step difference surface

11‧‧‧Slot

11a‧‧‧ inside

12‧‧‧contact area

13‧‧‧ protrusion

20‧‧‧ hook

20A‧‧‧First hook

20B‧‧‧Second hook

21‧‧‧Fixed section

22‧‧‧ front end

22a‧‧‧contact surface

22b‧‧‧ (side of hook front end)

23‧‧‧ recess

CA‧‧‧Star Wheel CA

G1‧‧‧Slot width

G2‧‧‧ Circumferential dimension of protrusion

L1‧‧‧ axis

O‧‧‧Upper Order Center

WR‧‧‧Workpiece

W1‧‧‧ Hook width at the front end of the first hook

W2‧‧‧ Hook width at the front end of the second hook

FIG. 1 is a schematic cross-sectional view showing the overall structure of the double-sided polishing apparatus of Embodiment 1. FIG. 2 is a perspective view of a main part of the double-sided polishing apparatus of Embodiment 1. FIG. Top view of the driving part of the polishing device; Figure 4 is a top view of the main part of the fixed plate on the double-sided polishing device of Example 1; Figure 5 is a top view of the double-sided polishing device of Example 1 during dressing; Figure 6 Fig. 5 is a cross-sectional view of AA; Fig. 7 is a plan view of the double-sided grinding apparatus of Example 1 when grinding a workpiece; Fig. 8 is a cross-sectional view of BB of Fig. 7; Oblique view; Figure 10A is a top view of a double-sided polishing device of another example during dressing; Figure 10B is a cross-sectional view of CC of FIG. 10A; Figure 11A is a top view of a double-sided polishing device of another example when grinding a workpiece; 11A is a DD cross-sectional view; FIG. 12 is an explanatory diagram showing a modification example of the hook and the protrusion; and FIG. 13 is an explanatory diagram showing a modification example of the driving member.

Claims (5)

A double-side grinding device uses both a lower platen and an upper platen to grind both sides of a workpiece. The double-side grinding device includes: a driving member that penetrates the lower platen and rotates around an axis; a supporting mechanism that can swing and rotatably suspend The upper plate is hung and supported; the hook extends from the inner peripheral edge of the upper plate toward the center; the groove is formed on the circumferential surface of the driving member and extends toward the axial direction of the driving member. The driver can be inserted into the hook when the relative rotation angle in the circumferential direction of the driver is a predetermined angle; a contact area is formed on the upper surface of the driver; and a protrusion is provided on the contact area, where the hook contacts the contact area It is in contact with the hook in the state. The double-side polishing device according to item 1 of the scope of patent application, wherein the groove portion is formed in a plurality on a circumferential surface of the driving member, and the hook includes: when inserted into the groove portion, contacting an inner side surface of the groove portion A first hook; and a second hook that does not contact the inner side of the groove when inserted into the groove. According to the double-sided polishing device described in item 1 or 2 of the scope of the patent application, the hooks and the grooves are provided at a plurality of point-symmetrical positions with the center of the upper plate as a point of symmetry. The double-side polishing device according to item 1 or 2 of the scope of patent application, wherein the number of the protrusions is less than the number of the hooks. The double-side polishing device according to item 3 of the scope of patent application, wherein the number of the protrusions is less than the number of the hooks.