KR101871853B1 - Panel machining apparatus for flat type display - Google Patents

Abstract

The present invention relates to a substrate processing apparatus, and more particularly, to an apparatus and a method for processing a substrate by using a grinding wheel, The present invention relates to a substrate corner processing apparatus in which chipping phenomenon does not occur.
A substrate processing apparatus according to the present invention comprises: a table on which a substrate is horizontally placed; A rotary disk installed vertically on a side surface of the table; Driving means for rotating the rotating disk; And a ring-shaped side grinding wheel provided on the front surface of the rotary disk for vertically processing the side surface of the substrate.

Description

[0001] PANEL MACHINING APPARATUS FOR FLAT TYPE DISPLAY [0002]

The present invention relates to a substrate processing apparatus, and more particularly, to an apparatus and a method for processing a substrate by using a grinding wheel, The present invention relates to a substrate corner processing apparatus in which chipping phenomenon does not occur.

Normally, the original plate is cut to a required size for a glass substrate (hereinafter referred to as a "substrate") used for a flat panel display panel such as an LCD or an OLED.

Cutting in this manner produces sharp edges e1, e2 on the cut surface. These sharp edges e1, e2 are polished and polished to remove sharp edges e1, e2 since they are fragile during transport, transport or processing (see Fig. 1).

Instead of cutting the entire substrate by the panel unit, the entire substrate is processed first for each panel region of the upper panel 11 'and the lower panel 13', and the upper panel 11 'and the lower panel 13' A plurality of display panels can be formed by forming a disk panel 10 'having a plurality of display panel areas all at once through a combination of the plurality of display panel areas, and then cutting the panel panel into individual panel units as shown in FIG. 2 (b). In this case, as shown in FIG. 2A, the upper panel scribe line B and the lower panel scribe line C are mutually different in position, so that the side surface (SIDE) or edge (EDGE) (11) and the lower plate (13). In this case, it is necessary to polish the side surface SIDE at the same time in the state of the panel 10 having the upper and lower substrates so that the side surfaces of the upper plate and the lower plate form continuous surfaces as shown by the dotted line A.

2 is a perspective view showing a state in which a side surface of a panel 10 for a flat panel display in which an upper plate and a lower plate are combined is polished by a grinding wheel 30 in a conventional grinding apparatus, Side surface and a grinding wheel 30, respectively.

In this case, while the panel is placed on the table, the grinding wheel moves along the periphery of the panel relatively through the movement of the table in the y-axis direction and the movement of the grinding wheel in the x-axis direction.

In the conventional grinding apparatus, the grinding wheel 30 is made of a cylindrical grinding stone 31 having a large diameter and a grinding stone 33 having a small diameter. Here, the length in the up-and-down axial direction is shorter than the diameter of the cylinder, It may be called annular. The portion corresponding to the cylindrical side of the abrasive grinding wheel has to have a certain thickness as shown in Fig. 3, and the abrasive grinding stone should be replaced when a certain portion of the thickness is worn out.

The side surface of the cylindrical polishing grindstone, which rotates about the rotation axis while the polishing grindstone 30 extends around the panel in a state where the rotary shaft 20 and the side surface of the panel 10 are vertically aligned, Thereby polishing the side surface of the panel.

4, the thickness of the side surface of the panel 10 is much smaller than the axial length of the cylindrical polishing stone 31 mounted on the circular plate 21 of the rotary shaft. Normally, when the work is performed, The position of the side surface of the cylindrical polishing stone 31 is almost fixed, and the abrasive wheel is worn only at that position, so that a groove 32 is formed on the surface as shown in FIG. When the grinding stone is worn out, the position of the panel contact with the grinding wheel is changed, so that it is impossible to polish the side surface of the panel as precisely as necessary, and the abrasive characteristics can not be uniformed beyond the thickness range (D) It is possible. Accordingly, the position of the polishing grindstone to which the panel side is to be contacted is changed, so that the polishing of the side face of the panel proceeds.

However, in the case of using a polishing grinding stone of this type, there is a part which is not used at all between the portions where the grooves 32 are formed in the grinding stone, and there is a problem that the grinding stone must be replaced in a state where the grinding stone is not consumed evenly. In order to polish the panel precisely each time it is changed, it is necessary to adjust the position of the grinding wheel by the depth of the previous groove 32, It takes a lot of time and attention to enter.

Korean Patent Registration No. 10-1362242: substrate polishing apparatus and method Korean Patent Registration No. 10-1260953: substrate polishing apparatus and method Korean Patent Registration No. 10-1075954: substrate polishing apparatus and method

SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate processing apparatus capable of sequentially processing side surfaces and corners of a substrate.

Another object of the present invention is to provide a substrate processing apparatus capable of reducing the replacement cost by increasing the replacement period of the grinding wheel by using the entire area uniformly instead of using only a part of the grinding stone.

Another object of the present invention is to provide a substrate processing apparatus which does not cause a chipping phenomenon on a joint surface between an upper plate and a lower plate even when a substrate formed by joining an upper plate and a lower plate is processed.

According to an aspect of the present invention, there is provided a substrate processing apparatus comprising: a table on which a substrate is horizontally placed; A rotary disk installed vertically on a side surface of the table; Driving means for rotating the rotating disk; And a ring-shaped side grinding wheel provided on the front surface of the rotary disk for vertically processing the side surface of the substrate.

And a corner grinding wheel protruding in the shape of a hemisphere at the center of the front surface of the rotary disk to process the corner of the substrate into a predetermined shape.

Further, it is preferable that the corner grinding stone is formed more protruding than the side grinding stone.

In addition, it is preferable that a cylindrical projection protruding from the front face of the rotary disk is formed more than the side face processing grindstone, and the corner grinding wheel is provided on the front face of the projection.

According to the present invention, it is possible to process both side surfaces as well as corners of a substrate by using one machining apparatus, and in particular, it is possible to reduce the replacement cost by increasing the grinding wheel replacement period by uniformly using the grinding stone uniformly.

On the other hand, the processing pattern formed on the polished surface such as the side surface or the corner of the substrate after the processing by the processing apparatus according to the present invention is formed in the oblique direction, not in the horizontal direction. Therefore, even when a substrate (for example, a liquid crystal panel) bonded with a predetermined gap between the upper plate and the lower plate is used, it is used even over the entire area of the grinding wheel. That is, in the machining apparatus according to the present invention, the protrusion e3 of Fig. 3 is not formed in the grinding wheel.

Therefore, there is an effect that the chipping phenomenon that has occurred in the joining surface of the conventional upper plate and the lower plate is not caused.

1 and 2 are conceptual diagrams for explaining the necessity of polishing a conventional substrate and a panel,
3 and 4 are a perspective view and a bottom view showing a method of polishing a side surface of a panel using a conventional polishing apparatus,
FIG. 5 is a conceptual side view showing a problem in the case of using a conventional polishing apparatus and a polishing method,
6 and 7 are a perspective view and a side view showing a method of polishing a side surface of a panel using the polishing apparatus of the present invention,
8 and 9 are a plan view and a perspective view showing a state in which the side edge of the panel is polished by using the polishing apparatus of the present invention,
10 is a plan view conceptually showing an example of the order and operation of polishing the side surface of the panel in the polishing apparatus of the present invention,
Figs. 11 and 12 show images of the machined surface after machining with the conventional machining apparatus and the machining apparatus according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the structure and operation of an embodiment (1) according to the present invention will be described in detail with reference to the accompanying drawings.

6, the substrate processing apparatus according to the present invention includes a table 41, a rotating disk 121, a driving means 120, a side grinding stone 131, and a corner grinding stone 133 do.

The table 41 includes a pair of support portions for supporting the substrate 10 from below and variable means (not shown) for adjusting the separation distance between the support portions. The variable means is a known means for synchronously driving the pair of supporters to drive them to approach each other or to be spaced apart from each other. Further, a vacuum hole (not shown) is formed in the support part so that the substrate 10 can be adsorbed.

The driving means 120 is provided on a side surface of the table 41 and generates a rotational driving force. Particularly, in the present invention, it can be seen that the rotation axis of the driving means 120 is installed in the same horizontal direction as the substrate 10.

The rotating disk 121 is a disk provided at a front end of the driving unit 120 and connected to a rotating shaft to rotate. The rotating disk 121 is vertically installed.

The side grinding wheel 131 is a component for machining a side surface of the substrate 10 and is formed in a ring shape protruding in the circumferential direction on the front surface of the rotating disk 121. The side grinding wheel 131 is attached to the rotating disk 121 and formed into a cylindrical shape.

A corner machining grindstone 133 for machining a corner C of the substrate 10 in a round or chamfered shape (chamfer) is provided at the center of the rotary disk 121.

The corner grinding stone 133 is formed in a cylindrical shape at the center of the rotary disk 121 so that the cornering grinding stone 133 protrudes more toward the substrate than the side grinding stone 131 .

In this embodiment, a cylindrical protrusion 123 protruding more than the side grinding wheel 131 is formed at the center of the rotary disc 121, and a semi-spherical side grinding wheel (for example, 131). The protrusions 123 are formed to protrude more toward the substrate 10 than the side grinding wheel 131. In this embodiment, it is preferable that a radius (a circle) of the hemispherical shape of the corner grinding stone 133 is 0.1 to 20 mm.

Direction moving means (not shown) for moving the driving means 120 toward or away from the substrate, and a Z-direction moving means (not shown) for moving the driving means 120 upward or downward in the Z- Is provided.

Hereinafter, an operation state of the substrate processing apparatus according to the present invention will be described.

7 shows a process of processing the side surface of the substrate. The driving means 120 is moved in the direction of the substrate by using the X direction moving means so that the side grinding stone 131 is brought into close contact with the side surface of the substrate 10, ) To rotate the side surface of the substrate 10 vertically. At this time, the substrate 10 is processed while moving in the Y direction by the Y-direction moving means.

Next, a process of machining the corners of the substrate will be described.

8 and 9, in order to process the corner of the substrate, first, the driving means 120 is lowered by using the Z-direction moving means so that the cornering grindstone 133 is brought into close contact with the corner of the substrate. In this state, the driving means 120 is rotated to machine the corners of the substrate by using the corner grinding stone 133.

More specifically, the driving unit 120 is rotated while moving the driving unit 120 in the direction of the substrate to rotate the cornering grindstone 133.

At this time, when the substrate is rotated while moving in the Y direction using the Y-direction moving means and the rotating means (not shown), the corners of the substrate are processed into round or oblique lines having a predetermined curvature.

Next, the driving means is raised again to vertically process the other side surface of the substrate using the grinding wheel 131 for side working.

Referring to FIG. 10, the side surface of the long side is processed first by using the grinding wheel 131 for side working in a state where the substrate is placed on the table.

Next, the corner is machined by using the grinding wheel 133 for machining a corner.

After the long side and the corner are machined as described above, the distance between the supporting portions of the pair of tables 41 is spaced apart and the substrate 10 is repositioned in such a manner that the side surface of the short side can be machined.

The side surface and the corners of the substrate 10 are sequentially processed by the above method to complete the substrate processing.

7, when the substrate (see Fig. 2) is constituted by the upper plate and the lower plate, and a predetermined gap is formed between the upper plate and the lower plate due to injection of liquid crystal or the like, The grinding wheel 131 for side machining is uniformly uniformly worn as a whole.

9, when the corner C of the substrate is machined, the cylindrical grinding wheel 133 of the present invention is evenly and uniformly worn as a whole.

Therefore, the grooves 32 are not formed as in the prior art grindstone shown in Fig. The reason why the grooves 32 are not formed in this manner is that the grindstone is used evenly throughout.

This is also visually confirmed through Fig. 11 (a) is an image after corners of a substrate composed of a top plate and a bottom plate are processed by a conventional technique, and (b) is an image after corners of the substrate are processed by the present invention. In FIG. 11A, it can be seen that a chipping phenomenon occurs in the joint surface 24, and FIG. 11B shows that chipping phenomenon does not occur.

This is also related to the processing pattern formed after the processing of the substrate. When the substrate is processed by the conventional technique, the pattern f1 is formed in the horizontal direction as shown in Fig. 12 (a) A fringe pattern f2 is formed obliquely across the upper plate 21 and the lower plate 22 as shown in FIG. 12 (b). The formation of the fringe pattern f2 in the oblique direction as shown in Fig. 12 (b) can be clearly confirmed through Fig. 7 and Fig.

When the pattern is formed in the horizontal direction, the portion of the grinding wheel corresponding to the gap between the upper plate and the lower plate is not worn out, so that the projecting portion is inevitably formed. When the pattern is formed in the diagonal direction as in the present invention, Even if the substrate on which the gap between the lower plates is formed is machined, the machined portion of the grinding wheel is used uniformly and is worn away, so that the projections are not formed. Therefore, the chipping phenomenon does not occur at the joint surface of the upper plate and the lower plate, and the grinding stone can be used evenly and fully.

10: substrate
41: Table
120: driving means
121: rotating disk
123: projection
131: grinding wheel for side machining
133: Grinding wheel for corner processing

Claims (4)

A table on which the substrate is placed horizontally;
A rotary disk installed vertically on a side surface of the table;
Driving means for rotating the rotating disk; And a ring-shaped side grinding wheel provided on a front surface of the rotary disk to vertically process a side surface of the substrate; And
And a corner machining grille protruding in a hemispherical shape at the center of the front surface of the rotary disk to process the corner of the substrate into a predetermined shape,
Wherein the corner grinding stone is formed so as to protrude more than the side grinding stone.

delete delete The method according to claim 1,
Wherein a cylindrical projection protruding further than the side machining grindstone is formed in the front face of the rotary disk, and the corner machining grindstone is provided on a front face of the projection.

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