SG11201607263VA - Workpiece holding apparatus - Google Patents

Workpiece holding apparatus

Info

Publication number
SG11201607263VA
SG11201607263VA SG11201607263VA SG11201607263VA SG11201607263VA SG 11201607263V A SG11201607263V A SG 11201607263VA SG 11201607263V A SG11201607263V A SG 11201607263VA SG 11201607263V A SG11201607263V A SG 11201607263VA SG 11201607263V A SG11201607263V A SG 11201607263VA
Authority
SG
Singapore
Prior art keywords
holding apparatus
workpiece holding
workpiece
holding
Prior art date
Application number
SG11201607263VA
Inventor
Taichi Yasuda
Tatsuo Enomoto
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201607263VA publication Critical patent/SG11201607263VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/065—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum provided with separating means for releasing the gripped object after suction
    • B25J15/0658—Pneumatic type, e.g. air blast or overpressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/065—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum provided with separating means for releasing the gripped object after suction
    • B25J15/0666—Other types, e.g. pins or springs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
SG11201607263VA 2014-03-19 2015-02-17 Workpiece holding apparatus SG11201607263VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014056852A JP6032234B2 (en) 2014-03-19 2014-03-19 Work holding device
PCT/JP2015/000703 WO2015141122A1 (en) 2014-03-19 2015-02-17 Workpiece holding device

Publications (1)

Publication Number Publication Date
SG11201607263VA true SG11201607263VA (en) 2016-10-28

Family

ID=54144114

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201607263VA SG11201607263VA (en) 2014-03-19 2015-02-17 Workpiece holding apparatus

Country Status (8)

Country Link
US (1) US9728442B2 (en)
JP (1) JP6032234B2 (en)
KR (1) KR102136134B1 (en)
CN (1) CN106068555B (en)
DE (1) DE112015000945B4 (en)
SG (1) SG11201607263VA (en)
TW (1) TWI613750B (en)
WO (1) WO2015141122A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014212176A1 (en) * 2014-06-25 2015-12-31 Siemens Aktiengesellschaft Powder bed-based additive manufacturing process and apparatus for carrying out this process
US10724572B2 (en) * 2017-08-23 2020-07-28 Todd H. Becker Electronically-releasable suction cup assembly secured to an appliance
CN107871703A (en) * 2017-10-27 2018-04-03 德淮半导体有限公司 Wafer processing apparatus and its processing method
CN109037109A (en) * 2018-08-03 2018-12-18 德淮半导体有限公司 A kind of method of semiconductor equipment and cleaning wafer
JP7352168B2 (en) 2019-11-06 2023-09-28 三益半導体工業株式会社 Transport head and transport device

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3602543A (en) * 1968-12-18 1971-08-31 Munck Int As Arrangement in suction cup for vacuum lifting
FR2431635A1 (en) * 1978-07-20 1980-02-15 Sgn Soc Gen Tech Nouvelle SUCTION GRIP DEVICE
US4221356A (en) * 1978-11-09 1980-09-09 Fortune William S Vacuum operated holding fixture
JPS5864038A (en) * 1981-10-13 1983-04-16 Nec Corp Bonding plate
US4620738A (en) * 1985-08-19 1986-11-04 Varian Associates, Inc. Vacuum pick for semiconductor wafers
US4669915A (en) * 1985-11-19 1987-06-02 Shell Offshore Inc. Manipulator apparatus with flexible membrane for gripping submerged objects
US5423716A (en) * 1994-01-05 1995-06-13 Strasbaugh; Alan Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied
US5685513A (en) * 1995-05-17 1997-11-11 Nihon Biso Co., Ltd. Vacuum-suction attachment pad
JP3027551B2 (en) * 1997-07-03 2000-04-04 キヤノン株式会社 Substrate holding device, polishing method and polishing device using the substrate holding device
JP3398094B2 (en) 1999-07-16 2003-04-21 株式会社リブドゥコーポレーション Disposable pants
US7217175B2 (en) * 2001-05-29 2007-05-15 Ebara Corporation Polishing apparatus and polishing method
TWI368757B (en) * 2003-04-30 2012-07-21 Olympus Corp Device for floating a substrate
JP2005123485A (en) * 2003-10-17 2005-05-12 Ebara Corp Polishing device
NL1024965C2 (en) * 2003-12-08 2005-06-09 Goudsmit Magnetic Systems B V Gripping means and lifting device for gripping and lifting an object, in particular a plate.
DE102006031434B4 (en) * 2006-07-07 2019-11-14 Erich Thallner Handling device and handling method for wafers
JP5379589B2 (en) 2009-07-24 2013-12-25 東京エレクトロン株式会社 Vacuum suction pad, transfer arm and substrate transfer device
US9650726B2 (en) * 2010-02-26 2017-05-16 Applied Materials, Inc. Methods and apparatus for deposition processes
US9108319B2 (en) * 2011-02-01 2015-08-18 Delaware Capital Formation, Inc. Electric suction cup
JP2012204709A (en) * 2011-03-28 2012-10-22 Okamoto Machine Tool Works Ltd Semiconductor substrate holding pad, and method of transporting semiconductor substrate using the same
JP5692106B2 (en) * 2012-02-01 2015-04-01 東京エレクトロン株式会社 Edge exposure apparatus, edge exposure method, and storage medium
CN202643070U (en) 2012-05-25 2013-01-02 绍兴县力锐家具制造有限公司 Vacuum sucking disc device

Also Published As

Publication number Publication date
DE112015000945T5 (en) 2017-01-05
CN106068555B (en) 2018-11-20
TW201540629A (en) 2015-11-01
JP2015179754A (en) 2015-10-08
JP6032234B2 (en) 2016-11-24
DE112015000945B4 (en) 2022-07-28
WO2015141122A1 (en) 2015-09-24
KR102136134B1 (en) 2020-07-22
US20170069523A1 (en) 2017-03-09
KR20160134665A (en) 2016-11-23
CN106068555A (en) 2016-11-02
TWI613750B (en) 2018-02-01
US9728442B2 (en) 2017-08-08

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