SG11201703670PA - Machining apparatus for workpiece - Google Patents

Machining apparatus for workpiece

Info

Publication number
SG11201703670PA
SG11201703670PA SG11201703670PA SG11201703670PA SG11201703670PA SG 11201703670P A SG11201703670P A SG 11201703670PA SG 11201703670P A SG11201703670P A SG 11201703670PA SG 11201703670P A SG11201703670P A SG 11201703670PA SG 11201703670P A SG11201703670P A SG 11201703670PA
Authority
SG
Singapore
Prior art keywords
workpiece
machining apparatus
machining
Prior art date
Application number
SG11201703670PA
Inventor
Taichi Yasuda
Tatsuo Enomoto
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of SG11201703670PA publication Critical patent/SG11201703670PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
SG11201703670PA 2014-11-18 2015-10-21 Machining apparatus for workpiece SG11201703670PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014233585A JP6269450B2 (en) 2014-11-18 2014-11-18 Workpiece processing equipment
PCT/JP2015/005308 WO2016079923A1 (en) 2014-11-18 2015-10-21 Workpiece processing apparatus

Publications (1)

Publication Number Publication Date
SG11201703670PA true SG11201703670PA (en) 2017-06-29

Family

ID=56013503

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201703670PA SG11201703670PA (en) 2014-11-18 2015-10-21 Machining apparatus for workpiece

Country Status (8)

Country Link
US (1) US10166649B2 (en)
JP (1) JP6269450B2 (en)
KR (1) KR102283204B1 (en)
CN (1) CN107073683B (en)
DE (1) DE112015004875T5 (en)
SG (1) SG11201703670PA (en)
TW (1) TWI603394B (en)
WO (1) WO2016079923A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6707831B2 (en) * 2015-10-09 2020-06-10 株式会社Sumco Grinding device and grinding method
JP6443370B2 (en) * 2016-03-18 2018-12-26 信越半導体株式会社 Method for manufacturing carrier for double-side polishing apparatus and double-side polishing method for wafer
JP6589762B2 (en) * 2016-07-13 2019-10-16 株式会社Sumco Double-side polishing equipment
JP6829467B2 (en) * 2017-04-05 2021-02-10 スピードファム株式会社 Double-sided polishing device
CN108326727A (en) * 2018-04-12 2018-07-27 新乡日升数控轴承装备股份有限公司 Size Control system and safety grinding detection method for twin grinder
US11060605B2 (en) * 2018-07-09 2021-07-13 Textron Innovations Inc. Spherical mounted cylindrical roller bearing system
KR102248009B1 (en) * 2019-09-30 2021-05-03 에스케이실트론 주식회사 Wafer lapping device and controlling method thereof
KR102123938B1 (en) * 2019-12-31 2020-06-23 김병호 A double-sided polishing device that can prevent side scratch of the object to be polished
CN116372682B (en) * 2023-06-05 2023-08-11 成都新利精密刀具有限公司 Planetary gear train grinding device for double-sided grinding of circular blade

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0448925Y2 (en) * 1986-06-02 1992-11-18
JPH02106269A (en) * 1988-10-12 1990-04-18 Toshiba Mach Co Ltd Polishing machine having abnormal charging detector
TW467792B (en) * 1999-03-11 2001-12-11 Ebara Corp Polishing apparatus including attitude controller for turntable and/or wafer carrier
JP2001096455A (en) * 1999-09-28 2001-04-10 Ebara Corp Polishing device
KR100932741B1 (en) * 2002-03-28 2009-12-21 신에쯔 한도타이 가부시키가이샤 Wafer double side polishing device and double side polishing method
JP4492155B2 (en) 2004-02-27 2010-06-30 信越半導体株式会社 Semiconductor wafer carrier holding hole detection device and detection method, and semiconductor wafer polishing method
KR101214506B1 (en) * 2004-11-01 2012-12-27 가부시키가이샤 에바라 세이사꾸쇼 Polishing apparatus
CN100481341C (en) * 2005-02-25 2009-04-22 信越半导体股份有限公司 Carrier for double side polishing machine and double side polishing machine employing the same, and double side polishing method
JP4799313B2 (en) * 2006-08-09 2011-10-26 スピードファム株式会社 Double-side polishing apparatus and method for detecting overlap of workpiece and carrier in double-side polishing apparatus
TW201000693A (en) * 2008-06-05 2010-01-01 Sumco Corp Epitaxial silicon wafer and method for producing the same
JP5151800B2 (en) * 2008-08-20 2013-02-27 信越半導体株式会社 Carrier for double-side polishing apparatus, double-side polishing apparatus and double-side polishing method using the same
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
JP2012111001A (en) * 2010-11-25 2012-06-14 Nikon Corp Work carrier and polishing device having work carrier
JP5630414B2 (en) * 2011-10-04 2014-11-26 信越半導体株式会社 Wafer processing method
JP6015683B2 (en) * 2014-01-29 2016-10-26 信越半導体株式会社 Workpiece processing apparatus and workwork processing method

Also Published As

Publication number Publication date
WO2016079923A1 (en) 2016-05-26
KR102283204B1 (en) 2021-07-29
KR20170084084A (en) 2017-07-19
CN107073683B (en) 2018-10-30
CN107073683A (en) 2017-08-18
TW201626450A (en) 2016-07-16
DE112015004875T5 (en) 2017-07-27
JP6269450B2 (en) 2018-01-31
JP2016097450A (en) 2016-05-30
US20170312878A1 (en) 2017-11-02
US10166649B2 (en) 2019-01-01
TWI603394B (en) 2017-10-21

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