JP5379589B2 - Vacuum suction pad, transfer arm and substrate transfer device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vacuum chuck pad capable of vacuum chucking a wafer securely, which facilitates exchanging and does not adhere to the wafer even if used for vacuum chuck for a long period of time, when a substrate is transferred by vacuum chuck with a transfer arm. <P>SOLUTION: The substrate vacuum chuck pad 20 is provided which is arranged at a mounting hole 22 or a through-hole formed in a transfer arm 17 (19) of a substrate transfer apparatus 16 for vacuum chucking and transporting the substrate, and is connected to a vacuum chuck path 21 formed in the transfer arm 17 (19). The pad has an upper surface 41 with a first opening 44, and a side peripheral surface section 42 with a mounting section 46 to mount a sealing member 32 that counters the mounting hole 22 or the through-hole when mounted. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a vacuum suction pad that is attached to a transfer arm and vacuum-sucks a substrate, a transfer arm to which the vacuum suction pad is attached, and a substrate transfer device.

  In a semiconductor device manufacturing process, a substrate processing such as a film forming process or an etching process is performed in a vacuum atmosphere on a semiconductor wafer (hereinafter simply referred to as a substrate or a wafer) that is a substrate to be processed. Recently, from the viewpoint of improving the efficiency of such substrate processing, a substrate processing chamber for performing a plurality of substrate processings is connected to a transfer chamber held in a vacuum, and each substrate processing chamber is connected by a transfer device provided in the transfer chamber. A multi-chamber type substrate processing apparatus capable of transporting a wafer has attracted attention.

  On the other hand, in a multi-chamber type substrate processing apparatus, a load lock chamber is provided between a transfer chamber and a wafer cassette in order to transfer a wafer from a wafer cassette placed in the atmosphere to a transfer chamber held in a vacuum. The wafer is transferred through the load lock chamber.

  Among these, the transfer of the wafer between the wafer cassette and the load lock chamber is performed by a substrate transfer device provided in a wafer carry-in / out chamber between the wafer cassette and the load lock chamber. The substrate transfer apparatus has a multi-joint structure in order to be able to turn in a minimum necessary space and to transfer a wafer to a distant place, and has a transfer arm that can be extended and contracted. A transfer arm having a multi-joint structure has a pick for holding the wafer at the tip of the transfer arm. In order to transfer the wafer in the atmosphere, the substrate transfer device transfers the wafer by vacuum suction on a pick. Therefore, the pick is provided with a vacuum suction pad for vacuum-sucking the wafer.

  As an example in which a vacuum suction pad is used in the transfer arm of such a substrate transfer apparatus, a vacuum suction pad for vacuum-sucking and holding a wafer and a hand for transporting a wafer vacuum-sucked and held by the vacuum suction pad And an elastic member that forms a flow path for vacuum supply between the pad and the hand, the elastic member is an O-ring elastic member interposed between the pad and the hand, and the vacuum suction pad is removed from the hand An example is disclosed in which a drop-off is prevented by a drop-off prevention screw (see, for example, Patent Document 1).

  In addition, a vacuum suction part for holding the glass substrate is formed through the sheet member in contact with the glass substrate, an elastic member provided on the lower surface of the sheet member and joined to the sheet member and the arm, and the elastic member and the sheet member. When the glass substrate is transported, the elastic member is elastically deformed to bring the sheet member into contact with the glass substrate and surrounded by the glass substrate and the sheet member. An example is disclosed in which a space is evacuated from a vacuum suction hole, a vacuum pressure is applied to a glass substrate, and the glass substrate is held and transported (for example, see Patent Document 2).

JP-A-8-17896 JP 2003-191191 A

  However, when the wafer is vacuum-sucked and transported by the transport arm to which the vacuum suction pad is attached, there are the following cases.

  If the pick rigidity is high, a gap may be generated between the wafer and the vacuum suction pad, and vacuum suction may not be performed stably. In this case, in order to stably perform vacuum suction, it is necessary to make the shape of the vacuum suction pad thin and easy to deform, or to make the vacuum suction pad from a soft material such as rubber.

  However, when using a vacuum suction pad having a thin shape, in order to hold the vacuum suction pad, it must be adhered, and only the vacuum suction pad portion may not be exchanged.

  In addition, when using a vacuum suction pad made of a soft material such as rubber, the wafer sticks to the pick while the wafer is being attached to the wafer for a long time while the wafer is being sucked. May not peel off.

  The present invention has been made in view of the above points, and in the case of transporting a substrate by vacuum suction to a transport arm, it can be easily replaced and can be fixed to a wafer even if it is attracted for a long time. There is provided a vacuum suction pad that can stably vacuum-suck a wafer.

  In order to solve the above problems, the present invention is characterized by the following measures.

The present invention is a vacuum suction pad that is attached to a first mounting hole formed in a transfer arm of a substrate transfer apparatus, is connected to a vacuum suction path of the transfer arm, and vacuum-sucks a substrate to the transfer arm. And an inner pad having a first opening and an outer pad in which a second mounting hole to which the inner pad is attached is formed, and the inner pad has an upper surface on which the first opening is formed. A first side surface portion on which a first mounting portion on which a first seal member is disposed is formed, and a first leg portion that is in contact with the bottom surface of the second mounting hole. A second side peripheral surface portion on which a second mounting portion on which the second seal member is disposed is formed, and a second surface that abuts against the bottom surface of the first mounting hole. A second lower surface portion formed with a leg portion of the first side peripheral surface portion, The second seal is disposed in the second mounting hole via the first seal member disposed in the first mounting portion, and the second side peripheral surface portion is disposed in the second mounting portion. It is attached to the first attachment hole via a member .

  According to the present invention, when the substrate is vacuum-sucked and transported by the vacuum suction pad attached to the transport arm, the vacuum suction pad can be easily replaced, and can be fixed to the wafer even if it is suctioned for a long time. In this way, the wafer can be stably vacuum-sucked.

It is a top view which shows the structure of the substrate processing apparatus which concerns on 1st Embodiment. It is a schematic perspective view which shows the structure of the conveyance arm which concerns on 1st Embodiment. It is sectional drawing which shows typically the state by which the vacuum suction pad is attached to the attachment hole of the conveyance arm which concerns on 1st Embodiment. It is a perspective view which shows the vacuum suction pad which concerns on 1st Embodiment. It is sectional drawing which shows typically the state which the vacuum suction pad of the conveyance arm which concerns on 1st Embodiment vacuum-sucks the board | substrate which curved. It is sectional drawing which shows typically the state by which the vacuum suction pad is attached to the attachment hole of the conveyance arm which concerns on the 1st modification of 1st Embodiment. It is sectional drawing which shows typically the state which vacuum-sucks the board | substrate which the vacuum suction pad of the conveyance arm which concerns on the 1st modification of 1st Embodiment curved. It is sectional drawing which shows typically the state by which the vacuum suction pad is attached to the attachment hole of the conveyance arm which concerns on the 2nd modification of 1st Embodiment. It is sectional drawing which shows typically the state which vacuum-sucks the board | substrate which the vacuum suction pad of the conveyance arm which concerns on the 2nd modification of 1st Embodiment curved. It is sectional drawing which shows typically the state by which the vacuum suction pad is attached to the through-hole of the conveyance arm which concerns on 2nd Embodiment. It is a perspective view which shows the vacuum suction pad which concerns on 2nd Embodiment. It is sectional drawing which shows typically the state which the vacuum suction pad of the conveyance arm which concerns on 2nd Embodiment vacuum-sucks the board | substrate. It is sectional drawing which shows typically the state by which the vacuum suction pad is attached to the attachment hole of the conveyance arm which concerns on the modification of 2nd Embodiment. It is sectional drawing which shows typically the state by which the vacuum suction pad is attached to the 1st attachment hole of the conveyance arm which concerns on 3rd Embodiment. It is sectional drawing which shows typically the state by which the vacuum suction pad is attached to the 1st through-hole of the conveyance arm which concerns on 4th Embodiment. It is sectional drawing which shows typically the state by which the vacuum suction pad is attached to the through-hole of the conveyance arm which concerns on 5th Embodiment.

Next, a mode for carrying out the present invention will be described with reference to the drawings.
(First embodiment)
First, a substrate processing apparatus including a substrate transfer apparatus according to a first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a plan view showing the configuration of the substrate processing apparatus according to the present embodiment.

  The substrate processing apparatus 1 performs processing such as etching on a semiconductor wafer (hereinafter simply referred to as “wafer”) W as a substrate to be processed under a predetermined vacuum.

  The substrate processing apparatus 1 includes two processing units 2 and 3, and each processing unit 2 and 3 is configured so that the etching process of the wafer W can be performed independently. Load lock chambers 6 and 7 are connected to the processing units 2 and 3 via gate valves G1, respectively. A wafer loading / unloading chamber 8 that is a transfer chamber is provided on the opposite side of the load lock chambers 6 and 7 from the processing units 2 and 3, and on the opposite side of the wafer loading / unloading chamber 8 from the load lock chambers 6 and 7. Three connection ports 9, 10, and 11 for attaching a FOUP F that can accommodate the wafer W are provided.

  The two processing units 2 and 3 communicate with the load lock chambers 6 and 7 by opening each gate valve G1, and are disconnected from the load lock chambers 6 and 7 by closing each gate valve G1. Also, a gate valve G2 is provided at a portion of the load lock chambers 6 and 7 connected to the wafer loading / unloading chamber 8, and the load lock chambers 6 and 7 are loaded and unloaded by opening the gate valve G2. By communicating with the chamber 8 and closing them, the wafer loading / unloading chamber 8 is shut off.

  In the load lock chambers 6, 7, substrate transfer devices 4, 5 for carrying in / out the wafer W as the object to be processed are provided between the processing units 2, 3 and the wafer carry-in / out chamber 8, respectively. Yes.

  The three connection ports 9, 10, 11 for attaching the FOUP F in the wafer loading / unloading chamber 8 are each provided with a shutter, and the FOUP F containing the wafer W in the connection ports 9, 10, 11 or an empty FOUP F is directly attached, and when it is attached, the shutter is released to communicate with the wafer loading / unloading chamber 8 while preventing the intrusion of outside air. An alignment chamber 14 is provided on one side surface of the wafer carry-in / out chamber 8, and the alignment of the wafer W is performed there.

  In the wafer loading / unloading chamber 8, a substrate transfer device 16 is provided for loading / unloading the wafer W into / from the FOUP F and loading / unloading the wafer W into / from the load lock chambers 6 and 7. The substrate transfer device 16 can travel on the rail 18 along the direction in which the FOUPs F are arranged. Further, the substrate transfer device 16 has a multi-joint transfer arm 17 and transfers the wafer W on the transfer arm 17.

  In such a substrate processing apparatus 1, first, one wafer W is taken out from any one of the hoops F by the substrate transfer device 16 in the wafer carry-in / out chamber 8 held in a clean air atmosphere at atmospheric pressure of 1.3 Pa or higher. The wafer W is taken out and loaded into the alignment chamber 14, and the wafer W is aligned. Next, after the wafer W is loaded into one of the load lock chambers 6 and 7 and the inside of the load lock chambers 6 and 7 is evacuated, one of the load lock chambers 6 and 7 is selected by one of the substrate transfer apparatuses 4 and 5. The wafer W is carried into one of the processing units 2 and 3 to perform substrate processing. Thereafter, the wafer W is carried into one of the load lock chambers 6 and 7 by any one of the substrate transfer devices 4 and 5, and the inside thereof is returned to the atmospheric pressure, and then the substrate transfer device 16 in the wafer carry-in / out chamber 8. The wafers W in the load lock chambers 6 and 7 are taken out and stored in one of the FOUPs F. Such an operation is performed on the wafer W, and the processing for one lot is completed.

  Next, the configuration of the transfer arm will be described with reference to FIG. FIG. 2 is a schematic perspective view showing the configuration of the transfer arm according to the present embodiment.

The substrate transfer device 16 has a plurality of, for example, two transfer arms 17 having an articulated structure. Each transfer arm 17 has a pick 19 for holding the wafer W at the tip, and the wafer W is transferred on the pick 19 for transfer. The pick 19 is made of a ceramic material such as alumina (Al ₂ O ₃ ), for example, and a plurality of, for example, three vacuum suction pads 20 for holding the wafer W by vacuum suction are held on the holding surface for holding the wafer W. Installed. The vacuum suction pad 20 holds the wafer W so that the wafer W is not displaced or dropped from the pick 19 due to the suction force. The transport arm in the present invention includes the transport arm 17 and a pick 19 provided at the tip of the transport arm 17. Therefore, hereinafter, “pick 19” is referred to as “pick 19 (conveying arm 17)”.

  Next, with reference to FIG.3 and FIG.4, the vacuum suction pad attached to the attachment hole of a conveyance arm is demonstrated.

  FIG. 3 is a cross-sectional view schematically showing a state in which the vacuum suction pad is attached to the attachment hole of the transfer arm according to the present embodiment. FIG. 3A shows one example of the mounting hole, and FIG. 3B shows another example of the mounting hole. FIG. 4 is a perspective view showing a vacuum suction pad according to the present embodiment. FIG. 4A is a diagram viewed from diagonally above, and FIG. 4B is a diagram viewed from diagonally below.

  In the example shown in FIG. 3A, the pick 19 (conveying arm 17) according to the present embodiment has a vacuum suction path 21 and an attachment hole 22.

  The vacuum suction path 21 includes a suction path groove part 23, an attachment hole communication hole 24, and a suction path cover part 25. The suction path groove 23 is opposite to the side of the pick 19 (transport arm 17) that vacuum-sucks the wafer W, that is, the surface (lower surface) opposite to the holding surface (upper surface) 26 that holds the wafer W of the pick 19 (transport arm 17). ) 27 is a groove formed in a part of 27 from the base side of the pick 19 (conveying arm 17) to the lower side of the mounting hole 22. The attachment hole communication hole 24 is a communication hole that communicates the suction path groove portion 23 and the attachment hole 22 and can be formed, for example, two. The suction path cover part 25 covers and seals the suction path groove part 23 from the surface (lower surface) 27 opposite to the holding surface of the pick 19 (conveying arm 17). The suction path groove portion 23 and the attachment hole communication hole 24 are formed by cutting a pick 19 (conveying arm 17) made of, for example, a ceramic material. The suction path cover portion 25 is formed, for example, by pasting a metal plate on the surface (lower surface) 27 opposite to the holding surface of the pick 19 (conveying arm 17).

  The vacuum suction path 21 may not be formed on the opposite surface (lower surface) 27 of the holding surface of the pick 19 (conveying arm 17). For example, the pick 19 (as in a processing hole described later in the second embodiment) The transfer arm 17) may be formed by hollowing out substantially the middle between the holding surface (upper surface) 26 and the opposite surface (lower surface) 27.

  Further, the vacuum suction path 21 is connected to a vacuum exhaust mechanism (not shown) provided inside the substrate transfer apparatus 16 or the substrate processing apparatus 1 or outside the substrate processing apparatus 1, and through the mounting hole 22 and the vacuum suction pad 20. The wafer W is vacuum-sucked.

  The mounting hole 22 is formed in a holding surface (upper surface) 26 for holding the wafer W of the pick 19 (transfer arm 17), and from the holding surface (upper surface) 26 of the pick 19 (transfer arm 17) to the opposite surface (lower surface) 27. It is a hole that does not penetrate and is formed partway from the holding surface (upper surface) 26 to the opposite surface (lower surface) 27. The mounting hole 22 has an inner wall 29 and a bottom surface 30. An attachment hole communication hole 24 that connects the attachment hole 22 and the vacuum suction path 21 is opened on the bottom surface 30 of the attachment hole 22, and an opening 31 is formed. In the example shown in FIG. 3A, two attachment hole communication holes 24 are formed, and two openings 31 are also formed. Three or more openings 31 may be formed, or only one opening 31 may be formed. The opening 31 corresponds to the third opening in the present invention.

  In addition, the shape of the mounting hole 22 in a plan view (a shape viewed from above the holding surface) may be a substantially circular shape or various shapes such as a square other than a circular shape. In addition, a mounting groove for preventing displacement of the vacuum suction pad 20 may be formed on the inner wall 29 of the mounting hole 22 when the vacuum suction pad 20 is attached via the seal member 32.

  Further, when the distance between the holding surface (upper surface) 26 and the opposite surface (lower surface) 27 of the pick 19 (conveying arm 17), that is, the thickness is 3 mm, for example, and the mounting hole 22 is circular, the inner diameter is 17 mm. The depth can be 2 mm.

  The vacuum suction pad 20 according to the present embodiment has an upper surface portion 41, a side peripheral surface portion 42, and a lower surface portion 43.

  An opening 44 is formed in the upper surface portion 41. Two openings 44 are formed and are symmetric with respect to the center of the upper surface portion 41. Three or more openings 44 may be formed, or only one may be formed. The opening 44 corresponds to the first opening in the present invention. Further, a contact portion 45 that protrudes from the upper surface portion 41 so as to surround the opening 44 and contacts the surface of the wafer W is formed on the upper surface portion 41. Since the contact portion 45 is not made of a soft material such as rubber but is made of a highly rigid material (specifically described later), the contact portion 45 is not fixed even if it is in contact with the wafer W for a long time. The wafer W is prevented from being peeled off from the transfer arm 17).

  A mounting groove 46 (a mounting portion) for mounting the seal member 32 is formed in the side peripheral surface portion 42. The mounting groove 46 prevents the mounted sealing member 32 from shifting to the upper surface 41 side or the lower surface 43 side of the vacuum suction pad 20 and attaches the vacuum suction pad 20 to the mounting hole 22 in an airtight manner. In the present embodiment, the mounting portion is the mounting groove 46, but it is sufficient that the seal member 32 can be mounted without being displaced relative to the vacuum suction pad 20. A necessary frictional force may be obtained by processing, or a convex portion for preventing displacement may be provided around the mounting portion (the same applies hereinafter).

  A leg 47 that contacts the bottom surface 30 of the mounting hole 22 is formed on the lower surface 43. The leg portion 47 is formed at the center of the lower surface portion 43, and in the present embodiment, has a conical shape with the apex disposed below. Of course, the leg portion 47 is not limited to such a shape, and may be, for example, a rod shape, a conical shape that gradually decreases in diameter from the side peripheral surface portion 42 toward the lower side, or a hemispherical shape. It is possible to form a protrusion or other shape that contacts the bottom surface 30 with a smaller area than the lower surface portion 43. The leg portion 47 may be formed at a position other than the center of the lower surface portion 43.

  In addition, an opening 48 that communicates with the opening 44 is formed in the lower surface portion 43. Two openings 48 are formed and are symmetric with respect to the center of the upper surface portion 41. Three or more openings 48 may be formed corresponding to the openings 44, or one opening 48 may be formed. The opening 48 corresponds to the second opening in the present invention.

  In the vacuum suction pad 20, the side peripheral surface portion 42 is attached to the inner wall 29 of the attachment hole 22 through the seal member 32 attached to the attachment groove 46. The space surrounded by the lower surface portion 43 and the bottom surface 30 of the mounting hole 22 is airtightly held by the sealing member 32 by being attached so that the side peripheral surface portion 42 faces the mounting hole 22 via the seal member 32. . As a result, the wafer W is vacuum-sucked by the vacuum suction path 21 of the pick 19 (transfer arm 17) through the opening 44, the opening 48, and the opening 31.

  In the example shown in FIG. 4, the vacuum suction pad 20 has a substantially circular shape in plan view. However, the vacuum suction pad 20 may be attached to the inner wall 29 of the mounting hole 22 through the seal member 32 in an airtight manner. Various shapes such as a square may be used. Further, when the shape in plan view is substantially circular, the orientation of the vacuum suction pad 20 in the horizontal plane when the vacuum suction pad 20 is mounted on the pick 19 (conveying arm 17) is set to an arbitrary direction. Can do.

  Further, the vacuum suction pad 20 can be made of, for example, a fluororesin such as polytetrafluoroethylene (PTFE), perfluoroalkoxyalkane (PFA), or ethylenetetrafluoroethylene copolymer (ETFE).

  Further, when the thickness of the pick 19 (conveying arm 17) is 3 mm, the inner diameter of the mounting hole 22 is 16 mm, and the depth is 2 mm, the outer diameter of the vacuum suction pad 20 is 15 mm, from the upper surface portion 41 to the lower surface portion 43. The thickness of can be 1.5 mm.

  An annular elastic seal member can be used as the seal member 32. By using an annular elastic seal member, the vacuum suction pad 20 can be easily attached to the pick 19 (conveying arm 17). As shown in FIG. 4, when the shape of the vacuum suction pad 20 in a plan view is a substantially circular shape, a resin O-ring that allows elastic deformation can be used.

  In addition, you may make it the bottom face of an attachment hole be comprised by the suction path cover part. An example of such a mounting hole is shown in FIG.

  In the example shown in FIG. 3B, the vacuum suction path 21a does not have an attachment hole communication hole, and communicates directly with the attachment hole 22a. Accordingly, the suction channel groove 23a is also connected to the mounting hole 22a at the lower end of the mounting hole 22a. Further, the mounting hole 22a is formed so as to penetrate at least partly from the holding surface (upper surface) 26 to the opposite surface (lower surface) 27 of the pick 19a (conveying arm 17a), and the opened opening portion has a suction path lid portion 25a. Covered and sealed. Accordingly, the mounting hole 22a is the same as the example shown in FIG. 3A in that it has an inner wall 29a, but the bottom surface 30a is constituted by the suction path lid portion 25a. Moreover, the leg part 47 formed in the lower surface part 43 of the vacuum suction pad 20 is contact | abutted to the bottom face 30a comprised by the suction path cover part 25a.

  According to the example shown in FIG. 3B, the thickness of the pick 19a (conveying arm 17a) can be made thinner than the example shown in FIG.

  Next, with reference to FIG. 5, it will be described that the vacuum suction pad 20 according to the present embodiment can stably vacuum-suck the wafer W. FIG. 5 is a cross-sectional view schematically showing a state where the vacuum suction pad of the transfer arm according to the present embodiment is vacuum sucking the curved substrate W.

  In the vacuum suction pad 20 according to the present embodiment, the leg portion 47 abuts on the bottom surface 30 of the mounting hole 22, and the side peripheral surface portion 42 is attached to the inner wall 29 of the mounting hole 22 via the seal member 32. When the leg portion 47 abuts on the bottom surface 30 of the mounting hole 22, the movement in the downward direction from the state in which the leg portion 47 abuts on the bottom surface 30 of the mounting hole 22 is restricted. The On the other hand, the side peripheral surface portion 42 is hermetically attached to the inner wall 29 of the attachment hole 22, but the seal member 32 is an annular elastic seal member, so that the side peripheral surface portion 42 is minute in the vertical and horizontal directions as the seal member 32 is elastically deformed. Can move.

Therefore, as shown in FIG. 5, even when the wafer W is curved or when the surface of the wafer W is not parallel to the holding surface (upper surface) 26 of the pick 19 (transfer arm 17), the bottom surface of the mounting hole 22. The upper surface portion 41 can be tilted with the leg portion 47 in contact with 30 as a fulcrum. Further, it is possible to vacuum suction of the wafer W stably, with a simple structure and can prevent a phenomenon that subducting vacuum suction pad by atmospheric pressure during vacuum suction.

  Further, in the vacuum suction pad 20 according to the present embodiment, the side peripheral surface portion 42 is attached to the attachment hole 22 via the seal member 32, and the vacuum suction pad 20 is located at two positions symmetrical to the center of the upper surface portion 41. Two openings 44 are provided. Therefore, for example, two tips of a tool such as tweezers can be inserted and held in the two openings 44 and can be easily detached from the pick 19 (conveying arm 17), and the vacuum suction pad 20 can be replaced. Can be easily performed.

Further, when the leg portion 47 is formed at the center of the lower surface portion 43, the displacement of the upper surface portion 41 can be allowed to the maximum.
(First modification of the first embodiment)
Next, with reference to FIG.6 and FIG.7, the vacuum suction pad which concerns on the 1st modification of the 1st Embodiment of this invention is demonstrated.

  The vacuum suction pad 20a according to the present modification is different from the vacuum suction pad according to the first embodiment in that a thin portion 49 is provided on the side peripheral surface portion 42a side of the contact portion 45.

  FIG. 6 is a cross-sectional view schematically showing a state in which the vacuum suction pad is attached to the attachment hole of the transfer arm according to this modification. FIG. 7 is a cross-sectional view schematically showing a state where the vacuum suction pad of the transfer arm according to this modification is vacuum sucking the curved substrate. In the following text, the same reference numerals are given to the parts described above, and the description may be omitted (the same applies to the following modified examples and embodiments).

  The pick 19 (transfer arm 17) to which the vacuum suction pad 20a according to this modification is attached, and the substrate transfer apparatus 16 having the pick 19 (transfer arm 17) are the same as in the first embodiment.

  Similarly to the first embodiment, the vacuum suction pad 20a according to the present modification also has an upper surface portion 41, a side peripheral surface portion 42a, and a lower surface portion 43. However, between the contact portion 45 formed on the upper surface portion 41 and the side peripheral surface portion 42a, there is a thin portion 49 having a small thickness along the vertical direction, and the main body portion 50 including the upper surface portion 41 and the side The peripheral surface portion 42 a is connected via a thin portion 49.

  Two openings 44 are formed at positions symmetrical to each other with respect to the center of the upper surface portion 41, three or more openings 44 may be formed, or only one opening 44 may be formed. Similar to the first embodiment, the contact portion 45 corresponds to the first opening portion in the present invention, protrudes from the upper surface portion 41 and surrounds the opening portion 44.

  Further, the mounting groove 46 (mounting portion) for mounting the seal member 32 is formed in the side peripheral surface portion 42a, as in the first embodiment. However, the side peripheral surface portion 42a only needs to be fitted with the seal member 32. As shown in FIG. 6, the thickness dimension in the vertical direction is higher than that of the main body portion 50 so as to be substantially equal to the thickness dimension in the vertical direction of the seal member 32. It may be small.

  Further, a leg 47 that contacts the bottom surface 30 of the mounting hole 22 is formed at the center of the lower surface 43, and the leg 47 may be formed at a position that is not the center of the lower surface 43. It is the same as in the first embodiment that two communicating openings 48 are formed.

  Further, the vacuum suction pad 20 a is attached through the seal member 32 attached to the attachment groove 46 so that the side peripheral surface portion 42 a faces the attachment hole 22, and the lower surface portion 43 and the bottom surface 30 of the attachment hole 22 The enclosed space is kept airtight, and the wafer W is vacuum-sucked by the vacuum suction path 21 of the pick 19 (transfer arm 17) through the opening 44, the opening 48, and the opening 31. This is the same as in the first embodiment.

  Further, as in the first embodiment, an annular elastic seal member including an O-ring can be used as the seal member 32.

  On the other hand, in this modified example, the main body portion 50 including the upper surface portion 41 on which the contact portion 45 is formed and the side peripheral surface portion 42 a on which the mounting groove 46 for mounting the seal member 32 is formed are connected by the thin portion 49. Yes. The thin portion 49 is easily deformed because the upper and lower thickness dimensions are smaller than those of the main body 50 and the side peripheral surface portion 42a. Therefore, in addition to being able to finely move in the vertical direction and the horizontal direction as the seal member 32 is elastically deformed, it can be further moved in the vertical direction and in the horizontal direction as the thin portion 49 is elastically deformed.

  Therefore, as shown in FIG. 7, even when the wafer W is greatly curved or when the surface of the wafer W is not parallel to the holding surface of the pick 19 (transfer arm 17), the bottom surface 30 of the mounting hole 22 is abutted. The upper surface portion 41 can be inclined with the contacted leg portion 47 as a fulcrum. Therefore, the wafer W can be stably vacuum-sucked.

Note that the thin portion 49 may be made of the same material as that of the main body portion 50 and the side peripheral surface portion 42a, or may be made of a material different from that of the main body portion 50 and the side peripheral surface portion 42a. When the thin portion 49 is made of a material different from that of the main body portion 50 and the side peripheral surface portion 42a, the deformation in the thin portion 49 is further facilitated.
(Second modification of the first embodiment)
Next, a vacuum suction pad according to a second modification of the first embodiment of the present invention will be described with reference to FIGS.

  The vacuum suction pad 20b according to the present modification relates to the first embodiment in that the leg portion is not formed on the lower surface portion 43b and only one opening 44 is formed on the upper surface portion 41b. Different from vacuum suction pads.

  FIG. 8 is a cross-sectional view schematically showing a state in which the vacuum suction pad is attached to the attachment hole of the transfer arm according to this modification. FIG. 9 is a cross-sectional view schematically showing a state where the vacuum suction pad of the transfer arm according to this modification is vacuum suctioning the curved substrate.

  The substrate transfer apparatus 16 and the substrate processing apparatus 1 having the pick 19b (transfer arm 17b) to which the vacuum suction pad 20b according to this modification is attached are the same as those in the first embodiment.

  As shown in FIG. 8, the pick 19b (conveying arm 17b) according to the present modification has one mounting hole communication hole 24 that connects the mounting hole 22b and the vacuum suction path 21b on the bottom surface 30b of the mounting hole 22b. In addition, one opening 31 through which the attachment hole communication hole 24 is opened is also formed. Other configurations of the vacuum suction path 21b and the mounting hole 22b are the same as those in the first embodiment.

  Similarly to the first embodiment, the vacuum suction pad according to this modification also has an upper surface portion 41b, a side peripheral surface portion 42, and a lower surface portion 43b.

  An opening 44 is formed in the upper surface portion 41b. Only one opening 44 is formed at the center of the upper surface portion 41b. The opening 44 corresponds to the first opening in the present invention. Further, the contact part 45 is formed so as to protrude from the upper surface part 41 b and surround the opening 44, as in the first embodiment.

  In addition, the mounting groove 46 (mounting portion) for mounting the seal member 32 is formed on the side peripheral surface portion 42 as in the first embodiment.

  On the other hand, the leg part which contact | abuts to the bottom face 30b of the attachment hole 22b is not formed in the lower surface part 43b. Therefore, the vacuum suction pad 20b according to this modification is only attached to the attachment hole 22b of the pick 19b (conveyance arm 17b) via the seal member 32. One opening 48 communicating with the opening 44 is formed.

  Further, the vacuum suction pad 20b holds the space surrounded by the lower surface portion 43b and the bottom surface 30b of the mounting hole 22b in an airtight manner, and the wafer W passes through the opening 44, the opening 48, and the opening 31. The vacuum suction by the vacuum suction path 21b of the pick 19b (conveying arm 17b) is the same as in the first embodiment.

  Further, as in the first embodiment, an annular elastic seal member including an O-ring can be used as the seal member 32.

  The vacuum suction pad 20b according to the present modification has a simple configuration in which the lower surface portion 43b does not have a leg portion that contacts the mounting hole 22b, but has a simple configuration. A small movement in the direction is possible.

Therefore, as shown in FIG. 9, even when the wafer W is curved or when the surface of the wafer W is not parallel to the holding surface (upper surface) 26 of the pick 19b (transfer arm 17b), the elasticity of the seal member 32 is obtained. The upper surface portion 41b can be tilted with deformation. Therefore, the wafer W can be stably vacuum-sucked, and a displacement along the surface of the wafer W can be allowed with a simple configuration.
(Second Embodiment)
Next, a transfer arm and a vacuum suction pad according to a second embodiment of the present invention will be described with reference to FIGS.

  In the present embodiment, the through hole 22c is formed in the pick 19c (conveying arm 17c), and the side peripheral surface portion 42c of the vacuum suction pad 20c is attached to the through hole 22c via the sealing member 32c. This is different from the first embodiment.

  FIG. 10 is a cross-sectional view schematically showing a state in which the vacuum suction pad is attached to the through hole of the transfer arm according to the present embodiment. FIG. 11 is a perspective view showing a vacuum suction pad according to the present embodiment. FIG. 12 is a cross-sectional view schematically showing a state where the vacuum suction pad of the transfer arm according to the present embodiment is vacuum-sucking the curved substrate.

  The substrate transfer apparatus 16 and the substrate processing apparatus 1 having the pick 19c (transfer arm 17c) to which the vacuum suction pad 20c according to the present embodiment is attached are the same as those in the first embodiment.

  The pick 19c (conveying arm 17c) according to the present embodiment includes a vacuum suction path 21c and a through hole 22c.

  The vacuum suction path 21 c includes a suction path groove part 23, a through-hole communication hole 24 c, and a suction path cover part 25. The suction path groove portion 23 is a groove formed on a surface (lower surface) 27 opposite to the holding surface (upper surface) 26 of the pick 19c (conveying arm 17c), and the suction path cover portion 25 connects the suction path groove portion 23 to the pick 19c ( Covering and sealing from the opposite surface (lower surface) 27 of the holding surface (upper surface) of the transfer arm 17c) is the same as in the first embodiment. The vacuum suction path 21c is connected to a vacuum exhaust mechanism (not shown), and vacuum-sucks the wafer W through the through hole 22c and the vacuum suction pad 20c.

  The through hole 22c is a hole formed so as to penetrate from the holding surface (upper surface) 26 that holds the wafer W of the pick 19c (transfer arm 17c) to the opposite surface (lower surface) 27. On the inner wall 29c of the through hole 22c, a through hole communication hole 24c having an L shape that connects the through hole 22c and the vacuum suction path 21c is opened, and an opening 31c is formed. In the example shown in FIG. 10, one through hole communication hole 24c is formed, and one opening 31c is also formed. Two or more through-hole communication holes 24c and openings 31c may be formed. The opening 31c corresponds to the third opening in the present invention.

  Further, a horizontal hole 33 (a direction parallel to the holding surface (upper surface) 26 of the pick 19c (conveying arm 17c)) which is a portion extending in the horizontal direction of the L-shaped through hole communication hole 24c with the through hole 22c as a center. On the opposite side to the portion extending along the horizontal axis, a machining hole 34 extending in the horizontal direction substantially coaxially with the horizontal hole 33 is formed. The processing hole 34 is for forming a horizontal hole 33 communicating with the through hole 22c by drilling from the end surface 35 of the pick 19c (conveying arm 17c) with a drill or the like in the vicinity of the through hole 22c. Further, the processing hole 34 is sealed by the sealing portion 36 at the end face 35 of the pick 19c (conveying arm 17c).

  Further, the vertical hole 37 (the portion extending along the thickness direction of the pick 19c (conveying arm 17c)) that is a portion extending in the vertical direction of the through-hole communication hole 24c having an L-shape is the pick 19c ( Drilling or the like is performed from the holding surface (upper surface) 26 and the opposite surface (lower surface) 27 of the transfer arm 17c) so as to communicate with the horizontal hole 33.

  Note that the shape of the through hole 22c in plan view (the shape viewed from above the holding surface) may be a substantially circular shape, or may be various shapes such as a square other than a circular shape. Further, a mounting groove for preventing the displacement of the vacuum suction pad 20c may be formed on the inner wall 29c of the through hole 22c when the vacuum suction pad 20c is attached via the seal member 32c.

  Further, when the distance between the holding surface (upper surface) 26 and the opposite surface (lower surface) 27 of the pick 19c (conveying arm 17c), that is, the thickness is 3 mm, for example, and the cross-sectional shape of the through hole 22c is circular, The inner diameter of the hole 22c can be 17 mm.

  In FIG. 10, when the vacuum suction pad 20 c is attached to the through hole 22 c, the through hole 22 c prevents the protrusion 51 c described later of the vacuum suction pad 20 c from projecting downward from the opposite surface (lower surface) 27. An example in which a notch 39c is provided in the opening 38c on the opposite surface (lower surface) 27 side is shown. The opening 38c corresponds to the fourth opening in the present invention.

  The vacuum suction pad 20c according to the present embodiment has an upper surface portion 41c, a side peripheral surface portion 42c, and a lower surface portion 43c, and has a cylindrical shape as a whole.

  An opening 44c is formed in the upper surface portion 41c. One opening 44c is formed at the center of the upper surface portion 41c. Two or more openings 44c may be formed. The opening 44c corresponds to the first opening in the present invention. Further, a contact portion 45c is formed so as to protrude from the upper surface portion 41c and surround the opening 44c.

  A plurality of mounting grooves 46c (mounting portions) for mounting the seal member 32c are formed in the side peripheral surface portion 42c. In the example shown in FIG. 10, two mounting grooves 46c are formed.

  In addition, one opening portion 48c communicating with the opening portion 44c is formed in the side peripheral surface portion 42c. Two or more openings 48c may be formed corresponding to the openings 44c. The opening 48c corresponds to the second opening in the present invention.

  A protrusion 51c is formed on the lower surface portion 43c. As shown in FIG. 10, the protrusion 51c is formed on the opposite side of the pick 19c (transfer arm 17c) from the side where the wafer W is vacuum-sucked, that is, on the opposite side of the holding surface (upper surface) 26 of the pick 19c (transfer arm 17c). (Lower surface) 27 and is locked to an opening 38c forming the through hole 22c. The protrusion 51c has a larger cross-sectional shape than the cross-sectional shape of the through hole 22c. In addition, in this Embodiment, although the projection part 51c is formed over the perimeter of the lower surface part 43c, you may form in only one part. For example, when the outer diameter of the portion other than the protrusion 51c of the vacuum suction pad 20c is 15 mm and the inner diameter of the through hole 22c is 17 mm, the protrusion 51c can have an outer diameter of 20 mm, for example.

  The vacuum suction pad 20c is attached so that the side peripheral surface portion 42c faces the inner wall 29c of the through hole 22c through a seal member 32c mounted in the mounting groove 46c. Thereby, the space sandwiched between the side peripheral surface portion 42c and the inner wall 29c of the through hole 22c is airtightly held by the seal member 32c. As a result, the wafer W is vacuum-sucked by the vacuum suction path 21c of the pick 19c (transfer arm 17c) through the opening 44c, the opening 48c, and the opening 31c.

  In the example shown in FIG. 11, the vacuum suction pad 20c has a substantially circular shape (cylindrical shape) in plan view. However, if the vacuum suction pad 20c is airtightly attached to the inner wall 29c of the through hole 22c via the seal member 32c. In addition, various shapes such as a square other than a circle may be used. Further, when the shape in plan view is a substantially circular shape, the orientation of the vacuum suction pad 20c in the horizontal plane when the vacuum suction pad 20c is mounted on the pick 19c (conveying arm 17c) is set to an arbitrary direction. Can do.

  The materials of the vacuum suction pad 20c and the seal member 32c can be the same as those in the first embodiment.

  In the vacuum suction pad 20c according to the present embodiment, the protrusion 51c is locked to the opening 38c of the through hole 22c, so that the protrusion 51c is the opening 38c of the through hole 22c in the vertical movement. The movement in the further upward direction from the state of being locked to is restrained. On the other hand, the side peripheral surface portion 42c of the vacuum suction pad 20c and the inner wall 29c of the through hole 22c are opposed to each other while sandwiching the seal member 32c with a predetermined airtight space interposed therebetween. The suction pad 20c can be moved minutely in the vertical direction or in the horizontal direction.

  Therefore, as shown in FIG. 12, even when the wafer W is curved, or when the surface of the wafer W is not parallel to the holding surface (upper surface) 26 of the pick 19c (transfer arm 17c), the elasticity of the seal member 32c. The upper surface portion 41c can be tilted along with the deformation. Therefore, the wafer W can be stably vacuum-sucked.

  Furthermore, the vacuum suction pad 20c according to the present embodiment has a pick 19c (conveying arm) as shown in F1 and F2 of FIG. 12 when the vacuum suction path 21c vacuum-sucks the substrate through the vacuum suction pad 20c. 17c) receives the force by atmospheric pressure equally from both sides of the holding surface (upper surface) 26 side and the opposite surface (lower surface) 27 side of the holding surface. Therefore, since the pressure applied to the vacuum suction pad 20c is equally balanced both in the upper and lower directions, it is possible to prevent the vacuum suction pad 20c from being displaced in the vertical direction due to the change in the atmospheric pressure difference when the vacuum suction is turned on and off. Therefore, the wafer W can be stably vacuum-sucked.

Further, in the vacuum suction pad 20c according to the present embodiment, the side peripheral surface portion 42c is inserted into the through hole 22c via the seal member 32c in a state where the projection 51c is locked to the opening 38c on the lower surface side of the through hole 22c. Installed on. Therefore, for example, it can be easily detached from the lower surface side of the pick 19c (conveying arm 17c), and the vacuum suction pad 20c can be easily replaced.
(Modification of the second embodiment)
Next, a vacuum suction pad according to a modification of the second embodiment of the present invention will be described with reference to FIG.

  The vacuum suction pad 20d according to this modification is different from the vacuum suction pad according to the second embodiment in that a thin portion 49d is provided on the side peripheral surface portion 42d side of the contact portion 45d.

  FIG. 13 is a cross-sectional view schematically showing a state in which the vacuum suction pad is attached to the attachment hole of the transfer arm according to this modification.

  The pick 19d (transfer arm 17d) to which the vacuum suction pad 20d according to this modification is attached, the substrate transfer device 16 and the substrate processing apparatus 1 having the pick 19d (transfer arm 17d) are the same as in the second embodiment. is there.

  Similarly to the second embodiment, the vacuum suction pad 20d according to this modification also has an upper surface portion 41d, a side peripheral surface portion 42d, and a lower surface portion 43d. However, between the contact portion 45d formed on the upper surface portion 41d and the side peripheral surface portion 42d, there is a thin portion 49d having a small thickness along the vertical direction, and the main body portion 50d including the upper surface portion 41d and the side The peripheral surface portion 42d is connected via a thin portion 49d.

  One opening 44d is formed at the center of the upper surface portion 41d, and two or more openings 44d may be formed. The opening 44d corresponds to the first opening in the present invention. The contact portion 45d is formed so as to protrude from 41d and surround the opening 44d, as in the second embodiment.

  Further, the side peripheral surface portion 42d is provided at two upper and lower portions corresponding to the formation of two mounting grooves 46d (mounting portions) for mounting the seal member 32d. Accordingly, the thin-walled portion 49d also corresponds to the side peripheral surface portion 42d and is provided at two locations on the top and bottom. Further, since the side peripheral surface portion 42d only needs to be able to mount the seal member 32d, as shown in FIG. 13, the thickness dimension in the vertical direction may be small so as to be substantially equal to the thickness dimension in the vertical direction of the seal member 32d. .

  In addition, as in the second embodiment, one opening 48d communicating with the opening 44d is formed on the side peripheral surface 42d.

  The vacuum suction pad 20d is attached to the mounting hole 22d via the seal member 32d mounted in the mounting groove 46d, and the space surrounded by the lower surface 43d and the inner wall 29d of the through hole 22d. The wafer W is vacuum-sucked by the vacuum suction path 21d of the pick 19d (transfer arm 17d) through the opening 44d, the opening 48d, and the opening 31d in the second embodiment. It is the same as the form.

  Further, as in the first embodiment, an annular elastic seal member including an O-ring can be used as the seal member 32d.

  On the other hand, in this modification, the main body portion 50d including the upper surface portion 41d on which the contact portion 45d is formed and the side peripheral surface portion 42d on which the mounting groove 46d for mounting the sealing member 32d is formed are connected by the thin portion 49d. Yes. The thin portion 49d is easily deformed because its upper and lower thickness dimensions are smaller than those of the main body portion 50d and the side peripheral surface portion 42d. Therefore, in addition to being able to finely move in the vertical direction and the horizontal direction along with the elastic deformation of the sealing member 32d, it is possible to move further in the vertical direction and horizontal direction along with the elastic deformation of the thin portion 49d.

  Therefore, even when the wafer W is greatly curved, or when the surface of the wafer W is not parallel to the holding surface (upper surface) 26 of the pick 19d (transfer arm 17d), the upper surface portion 41d can be greatly inclined, W can be stably vacuum-adsorbed.

The thin-walled portion 49d may be made of the same material as the main body portion 50d and the side peripheral surface portion 42d, as in the first modification of the first embodiment, and the main body portion 50d and the side peripheral surface portion 42d. It may be made of a different material. When the thin portion 49d is made of a material different from that of the main body portion 50d and the side peripheral surface portion 42d, the deformation in the thin portion 49d is further facilitated.
(Third embodiment)
Next, a transfer arm and a vacuum suction pad according to a third embodiment of the present invention will be described with reference to FIG.

  In the present embodiment, a first attachment hole 22e is formed in the pick 19e (conveying arm 17e), a vacuum suction pad 100e is formed, and an inner pad 20e and a second attachment hole 122e to which the inner pad 20e is attached are formed. It differs from the vacuum suction pad 20 according to the first embodiment in that it has an outer pad 120e.

  FIG. 14 is a cross-sectional view schematically showing a state where the vacuum suction pad is attached to the first attachment hole of the transfer arm according to the present embodiment.

  The substrate transfer apparatus 16 and the substrate processing apparatus 1 having the pick 19e (transfer arm 17e) to which the vacuum suction pad 100e according to the present embodiment is attached are the same as in the first embodiment.

  In the present embodiment, the first mounting hole 22e is formed in the pick 19e (conveying arm 17e). The first mounting hole 22e is the same as the mounting hole 22 in the first embodiment. However, in the present embodiment, as shown in FIG. 14, one mounting hole communication path 24e that connects the vacuum suction path 21e and the first mounting hole 22e is formed. Accordingly, one opening 31e is formed in the bottom surface 30e of the first mounting hole 22e so that the mounting hole communication path 24e opens. The opening 31e corresponds to the fifth opening in the present invention.

  The vacuum suction pad 100e according to the present embodiment includes an inner pad 20e and an outer pad 120e.

  The inner pad 20e has an upper surface portion 41e, a first side peripheral surface portion 42e, and a first lower surface portion 43e.

  Two openings 44e are formed at positions symmetrical to each other with respect to the center of the upper surface portion 41e. Three or more openings 44e may be formed, or only one opening 44e may be formed. Similar to the first embodiment, the contact portion 45e corresponds to the first opening portion in the present invention, protrudes from the upper surface portion 41e, and surrounds the opening portion 44e.

  A first mounting groove 46e (mounting portion) for mounting the first seal member 32e is formed in the first side peripheral surface portion 42e. The first mounting groove 46e is the same as the mounting groove 46 in the first embodiment.

  The first lower surface portion 43e is formed with a first leg portion 47e that comes into contact with the bottom surface 130e of the second mounting hole 122e formed in the outer pad 120e. The first leg portion 47e may be formed at the center of the first lower surface portion 43e, or may be formed at a position other than the center of the first lower surface portion 43e. Further, an opening 48e communicating with the opening 44e is formed in the first lower surface portion 43e. Three or more openings 48e may be formed corresponding to the openings 44e, or one may be formed. The opening 44e corresponds to the second opening in the present invention.

  The inner side pad 20e is connected to the inner wall 129e of the second mounting hole 122e in which the first side peripheral surface portion 42e is formed in the outer side pad 120e through the first seal member 32e mounted in the first mounting groove 46e. It is installed so as to face each other. Thereby, the space surrounded by the first lower surface portion 43e and the bottom surface 130e of the second mounting hole 122e is airtightly held by the first seal member 32e.

  The outer pad 120e has a second attachment hole 122e, and has a second side peripheral surface portion 142e and a second lower surface portion 143e.

  The second mounting hole 122e is a recess formed on the holding surface (upper surface) 26 side for holding the wafer W of the outer pad 120e and formed partway without penetrating the outer pad 120e vertically. The second mounting hole 122e has an inner wall 129e and a bottom surface 130e. A through hole 124e that penetrates from the bottom surface 130e of the second mounting hole 122e to the second lower surface portion 143e is opened on the bottom surface 130e of the second mounting hole 122e, and an opening portion 144e is formed. In the example shown in FIG. 14, one through hole 124e and one opening 144e are formed. Two or more through holes 124e and openings 144e may be formed. The opening 144e corresponds to the third opening in the present invention. The shape of the second mounting hole 122e in plan view may be a substantially circular shape, or may be various shapes such as a square other than a circular shape.

  A second mounting groove 146e for mounting the second seal member 132e is formed in the second side peripheral surface portion 142e.

  The second lower surface portion 143e is formed with a second leg portion 147e that comes into contact with the bottom surface 30e of the first mounting hole 22e formed in the pick 19e (conveying arm 17e). The second leg 147e may be formed at the center of the second lower surface 143e, or may be formed at a position other than the center of the second lower surface 143e. In addition, an opening 148e communicating with the opening 144e is formed in the second lower surface part 143e. Two or more openings 148e may be formed corresponding to the openings 144e. The opening 148e corresponds to the fourth opening in the present invention.

  The outer pad 120e has a first mounting hole 22e in which a second side peripheral surface portion 142e is formed in the pick 19e (conveying arm 17e) via a second seal member 132e mounted in the second mounting groove 146e. It is attached to face the inner wall 29e. Thereby, the space surrounded by the second lower surface portion 143e and the bottom surface 30e of the first attachment hole 22e is airtightly held by the second seal member 132e.

  As a result, the wafer W is vacuum-sucked by the vacuum suction path 21e of the pick 19e (transfer arm 17e) through the opening 44e, the opening 48e, the opening 144e, the opening 148e, and the opening 31e.

  Further, as in the first embodiment, an annular elastic seal member including an O-ring can be used as the first seal member 32e and the second seal member 132e.

The vacuum suction pad 100e according to the present embodiment has a double structure including an inner pad 20e and an outer pad 120e. The inner pad 20e includes a first seal member 32e, an outer pad 120e, and a second seal. It is attached to the first attachment hole 22e via the member 132e. Accordingly, the inner pad 20e can move in the vertical direction and the horizontal direction by elastic deformation of the two sealing members of the first sealing member 32e and the second sealing member 132e. The pad can be displaced along the surface of the wafer.
(Fourth embodiment)
Next, a transport arm and a vacuum suction pad according to the fourth embodiment of the present invention will be described with reference to FIG.

  In the present embodiment, the first through hole 22f is formed in the pick 19f (conveying arm 17f), and the pick 19f (conveying arm 17f) is connected to the inner pad 20f and the second through hole 122f to which the inner pad 20f is attached. This is different from the vacuum suction pad 20c according to the second embodiment in that it has an outer pad 120f formed with a.

  FIG. 15 is a cross-sectional view schematically showing a state in which a vacuum suction pad is attached to the first through hole of the transfer arm according to the present embodiment.

  The substrate transfer apparatus 16 and the substrate processing apparatus 1 having the pick 19f (transfer arm 17f) to which the vacuum suction pad 100f according to the present embodiment is attached are the same as those in the first embodiment.

  In the present embodiment, a first through hole 22f is formed in the pick 19f (conveying arm 17f). The first through hole 22f is the same as the through hole 22c in the second embodiment. The opening 31f formed in the inner wall 29f of the first through hole 22f and through which the through hole communication path 24f opens is equivalent to the fifth opening in the present invention. Further, the through-hole communication path 24f is formed of a horizontal hole 33 and a vertical hole 37, has an L shape, and has a processed hole 34, as in the second embodiment.

  The vacuum suction pad 100f according to the present embodiment includes an inner pad 20f and an outer pad 120f.

  The inner pad 20f has an upper surface portion 41f, a first side peripheral surface portion 42f, and a first lower surface portion 43f.

  One opening 44f may be formed in the upper surface 41f at the center of the upper surface 41f, and two or more openings 44f may be formed. The opening 44f corresponds to the first opening in the present invention. Also, the contact portion 45f is formed so as to protrude from the upper surface portion 41f and surround the opening portion 44f, as in the first embodiment.

  Two first mounting grooves 46f (mounting portions) for mounting the first seal member 32f are formed on the first side peripheral surface portion 42f.

  In addition, one opening 48f communicating with the opening 44f is formed in the first side peripheral surface portion 42f. Two or more openings 48f may be formed corresponding to the openings 44f. The opening 48f corresponds to the second opening in the present invention.

  A first protrusion 51f is formed on the first lower surface portion 43f. As shown in FIG. 15, the first protruding portion 51f is formed on the holding surface (upper surface) 26 opposite to the holding surface (upper surface) 26 of the pick 19f (transfer arm 17f) (lower surface) 27 and formed on the outer pad 120f. The second through hole 122f to be formed is engaged with the notch 139f of the opening 138f. The first protrusion 51f has a larger cross-sectional shape than the cross-sectional shape of the second through hole 122f.

  The inner pad 20f is connected to the inner wall 129f of the second through-hole 122f in which the first side peripheral surface portion 42f is formed in the outer pad 120f via the first seal member 32f mounted in the first mounting groove 46f. It is installed so as to face each other. Thereby, the space sandwiched between the first side peripheral surface portion 42f and the inner wall 129f of the second through hole 122f is airtightly held by the first seal member 32f.

  The outer pad 120f has a second through-hole 122f at the center, and has a second side peripheral surface portion 142f and a second lower surface portion 143f.

  The second through hole 122f is a hole formed so as to penetrate from the holding surface (upper surface) 126 on the side of holding the wafer W of the outer pad 120f to the opposite surface (lower surface) 127. On the inner wall 129f of the second through hole 122f, a through hole 124f that connects the second through hole 122f and the first through hole 22f opens, and an opening 144f is formed. In the example shown in FIG. 15, one through hole 124f and one opening 144f are formed. Two or more through holes 124f and openings 144f may be formed. The opening 144f corresponds to the third opening in the present invention. Note that the shape of the second through-hole 122f in plan view may be substantially circular, or may be various shapes such as a square other than a circle.

  Two second mounting grooves 146f for mounting the second seal member 132f are formed in the second side peripheral surface portion 142f. In addition, one opening 148f that communicates with the opening 144f is formed in the second side peripheral surface 142f. Two or more openings 148f may be formed corresponding to the openings 144f. The opening 148f corresponds to the fourth opening in the present invention.

  A second projecting portion 151f is formed on the second lower surface portion 143f. As shown in FIG. 15, the second protrusion 151f is formed on the holding surface (upper surface) 126 opposite to the holding surface (upper surface) 126 of the outer pad 120f on the surface (lower surface) 127, and the pick 19f (transfer arm 17f). The first through hole 22f formed in the opening 38f is engaged with a notch 39f. The second protrusion 151f has a larger cross-sectional shape than the cross-sectional shape of the first through hole 22f.

  The outer pad 120f has a first through hole 22f in which a second side peripheral surface portion 142f is formed in the pick 19f (conveying arm 17f) via a second seal member 132f mounted in the second mounting groove 146f. It is attached to face the inner wall 29f. Thereby, the space sandwiched between the second side peripheral surface portion 142f and the inner wall 29f of the first through hole 22f is airtightly held by the second seal member 132f.

  As a result, the wafer W is vacuum-sucked by the vacuum suction path 21f of the pick 19f (transfer arm 17f) through the opening 44f, the opening 48f, the opening 144f, the opening 148f, and the opening 31f.

  As in the first embodiment, an annular elastic seal member including an O-ring can be used as the first seal member 32f and the second seal member 132f.

  Similarly to the third embodiment, the vacuum suction pad 100f according to the present embodiment has a double structure including an inner pad 20f and an outer pad 120f, and the inner pad 20f is a first seal member. 32f, the outer pad 120f, and the second seal member 132f are attached to the first attachment hole 22f. Therefore, the substrate suction pad can be displaced along the substrate surface with a relatively simple structure.

Further, as in the second embodiment, since atmospheric pressure acts from both the holding surface (upper surface) 26 side and the opposite surface (lower surface) 27 side, they are balanced and vacuum suction is performed during vacuum suction. The pad is difficult to displace.
(Fifth embodiment)
Next, a vacuum suction pad according to a fifth embodiment of the present invention will be described with reference to FIG.

  In this embodiment, the inner pad according to the third embodiment is attached to the through-hole of the transfer arm via the outer pad in which the attachment hole is formed.

  FIG. 16 is a cross-sectional view schematically showing a state in which the vacuum suction pad is attached to the through hole of the transfer arm according to the present embodiment.

  In the present embodiment, the substrate transfer apparatus 16 and the substrate processing apparatus 1 having the pick 19g (transfer arm 17g) to which the vacuum suction pad 100g is attached are the same as those in the first embodiment. The pick 19g (conveying arm 17g) to which the vacuum suction pad 100g is attached is the same as that in the fourth embodiment. The vacuum suction pad 100g has an inner pad 20g and an outer pad 120g, and the inner pad 20g is the same as the inner pad 20e according to the third embodiment.

  The outer pad 120g has a second attachment hole 122g at the center, and has a second side peripheral surface portion 142g and a second lower surface portion 143g.

  The second mounting hole 122g is formed in the holding surface (upper surface) 126 on the side of the outer pad 120g that holds the wafer W, and does not penetrate from the holding surface (upper surface) 126 of the outer pad 120g to the opposite surface (lower surface) 127. , A recess formed partway from the holding surface (upper surface) 126 to the opposite surface (lower surface) 127. On the inner wall 129g of the second mounting hole 122g, a through hole 124g penetrating from the second mounting hole 122g to the second side peripheral surface portion 142g is opened to form an opening 144g. In the example shown in FIG. 16, one through hole 124g and one opening 144g are formed. Two or more through holes 124g and openings 144g may be formed. The opening 144g corresponds to the third opening in the present invention.

  Two second mounting grooves 146g (mounting portions) for mounting the second seal member 132g are formed on the second side peripheral surface portion 142g. The second mounting groove 146g is the same as the second mounting groove 146f in the fourth embodiment.

  Further, one opening 148g communicating with the opening 144g is formed in the second side peripheral surface 142g. Two or more openings 148g may be formed corresponding to the openings 144g. The opening 148g corresponds to the fourth opening in the present invention.

  Further, a second protrusion 151g is formed on the second lower surface portion 143g, as in the fourth embodiment.

  Similarly to the third embodiment and the fourth embodiment, the vacuum suction pad 100g according to the present embodiment also has a double structure including the inner pad 20g and the outer pad 120g, and the inner pad 20g. Is attached to the first attachment hole 22g via the first seal member 32g, the outer pad 120g, and the second seal member 132g. Therefore, the substrate suction pad can be displaced along the surface of the wafer with a relatively simple structure.

  The preferred embodiments of the present invention have been described above, but the present invention is not limited to such specific embodiments, and various modifications can be made within the scope of the gist of the present invention described in the claims. Can be modified or changed.

  In addition, the substrate processing apparatus provided with the substrate transfer apparatus according to the present invention is not limited to the etching process as the substrate process, but a wide variety of substrates including a film forming process, a coating process, a developing process, and a cleaning process. The present invention is applicable to a substrate processing apparatus that performs processing.

  In each of the embodiments according to the present invention, the vacuum suction pad attached to the transfer arm that horizontally supports the wafer from below has been described, but the present invention is not limited to such a direction. That is, it may be a vacuum suction pad attached to a transfer arm that vacuum-sucks a wafer horizontally from above, or a vacuum suction pad attached to a transfer arm that vacuum-sucks a wafer vertically or obliquely rather than horizontally. May be.

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 16 Substrate transfer apparatus 17 Transfer arm 19 Pick 20 Vacuum suction pad 21 Vacuum suction path 22 Mounting hole 29 Inner wall 30 Bottom surface 32 Seal member 41 Upper surface part 42 Side peripheral surface part 43 Lower surface part 45 Contact part 46 Mounting groove 47 Leg part 49 Thin-walled part 50 Main-body part 51 Projection part

Claims (9)

A vacuum suction pad attached to a first mounting hole formed in a transfer arm of a substrate transfer device, connected to a vacuum suction path of the transfer arm, and vacuum-adsorbing a substrate to the transfer arm;
An inner pad provided with a first opening, and an outer pad formed with a second attachment hole to which the inner pad is attached;
The inner pad includes an upper surface portion on which the first opening is formed, a first side peripheral surface portion on which a first mounting portion for disposing a first seal member is formed, and the second mounting hole. A first lower surface portion formed with a first leg portion that contacts the bottom surface of
The outer pad has a second side peripheral surface portion on which a second mounting portion for disposing a second seal member is formed, and a second leg portion that contacts the bottom surface of the first mounting hole. A second lower surface portion,
The first side peripheral surface portion is attached to the second attachment hole via the first seal member disposed in the first mounting portion,
The second side peripheral surface portion is attached to the first attachment hole via the second seal member disposed in the second mounting portion.
A vacuum suction pad characterized by that. The first seal member ensures airtightness of a space sandwiched between the first lower surface portion and the bottom surface of the second mounting hole,
The second seal member ensures airtightness of a space sandwiched between the second lower surface portion and the bottom surface of the first attachment hole.
The vacuum suction pad according to claim 1 . The first lower surface portion has a second opening communicating with the first opening,
The second mounting hole has a third opening on the bottom surface of the second mounting hole,
The second lower surface portion has a fourth opening communicating with the third opening,
The first mounting hole has a fifth opening on the bottom surface of the first mounting hole;
The substrate in contact with the inner pad includes the second opening, the third opening, the fourth opening, and the communication between the first opening on the upper surface of the inner pad. The upper surface is vacuum-adsorbed through the fifth opening,
The vacuum suction pad according to claim 1 or 2 , characterized by the above. Said upper surface portion, the vacuum suction pad according to any one of claims 1 to 3 having a plurality of said first opening, and wherein the. It said first sealing member and / or the second seal member is an O-ring is elastically deformed, the vacuum suction pad according to any one of claims 1 to 4, characterized in that. The first mounting portion and / or the second mounting portion has a mounting groove, and the first sealing member or the second sealing member is mounted in the mounting groove. vacuum suction pad according to any one of claims 1 to 5. The conveyance arm which has a vacuum suction pad as described in any one of Claims 1 thru | or 6 . The mounting hole has a third opening on the bottom surface of the mounting hole;
The substrate in contact with the vacuum suction pad is vacuum-sucked through the second opening and the third opening.
The transfer arm according to claim 7 . A substrate transfer apparatus comprising the transfer arm according to claim 7 .

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