JP2011029388A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2011029388A5 JP2011029388A5 JP2009173195A JP2009173195A JP2011029388A5 JP 2011029388 A5 JP2011029388 A5 JP 2011029388A5 JP 2009173195 A JP2009173195 A JP 2009173195A JP 2009173195 A JP2009173195 A JP 2009173195A JP 2011029388 A5 JP2011029388 A5 JP 2011029388A5
- Authority
- JP
- Japan
- Prior art keywords
- vacuum suction
- opening
- suction pad
- surface portion
- seal member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Description
本発明は、基板搬送装置の搬送アームに形成された取付孔又は貫通孔に取り付けられ、前記搬送アームの真空吸引路に連結されて、基板を該搬送アームに真空吸着する真空吸着パッドであって、第１の開口部が形成された上面部と、前記第１の開口部と連通する第２の開口部が形成された下面部と、前記下面部に形成された脚部と、シール部材を配置する装着部が形成された側周面部と、を有し、前記側周面部は、前記装着部に配置した前記シール部材を介して、前記取付孔又は前記貫通孔の内壁に取り付けられる、ことを特徴とする。 The present invention is mounted et is the mounting holes or through-holes formed in the transfer arm board conveying device, is connected to a vacuum suction path of the transfer arm, a vacuum suction pad for vacuum-adsorbing the substrate to a transfer arm An upper surface formed with a first opening; a lower surface formed with a second opening communicating with the first opening; a leg formed on the lower surface; and a seal A side peripheral surface portion on which a mounting portion for disposing the member is formed, and the side peripheral surface portion is attached to the inner wall of the mounting hole or the through hole via the seal member disposed in the mounting portion. , characterized in that.
そのため、図５に示すように、ウェハＷが湾曲している場合、又はウェハＷの表面がピック１９（搬送アーム１７）の保持面（上面）２６に平行でない場合にも、取付孔２２の底面３０に当接した脚部４７を支点として上面部４１を傾けることができる。また、ウェハＷを安定して真空吸着することができ、単純な構造で、真空吸引時に大気圧によって真空吸着パッドが沈み込む現象を防止できる。 Therefore, as shown in FIG. 5, even when the wafer W is curved or when the surface of the wafer W is not parallel to the holding surface (upper surface) 26 of the pick 19 (transfer arm 17), the bottom surface of the mounting hole 22. The upper surface portion 41 can be tilted with the leg portion 47 in contact with 30 as a fulcrum. Further, it is possible to vacuum suction of the wafer W stably, with a simple structure and can prevent a phenomenon that subducting vacuum suction pad by atmospheric pressure during vacuum suction.
Claims (20)
第１の開口部が形成された上面部と、
前記第１の開口部と連通する第２の開口部が形成された下面部と、
前記下面部に形成された脚部と、
シール部材を配置する装着部が形成された側周面部と、
を有し、
前記側周面部は、前記装着部に配置した前記シール部材を介して、前記取付孔又は前記貫通孔の内壁に取り付けられる、
ことを特徴とする真空吸着パッド。 A vacuum suction pad that is attached to a mounting hole or a through-hole formed in a transfer arm of a substrate transfer device, is connected to a vacuum suction path of the transfer arm, and vacuum-adsorbs a substrate to the transfer arm,
An upper surface formed with a first opening;
A lower surface portion formed with a second opening communicating with the first opening;
Legs formed on the lower surface,
A side peripheral surface portion on which a mounting portion for arranging the seal member is formed;
Have
The side peripheral surface portion is attached to an inner wall of the attachment hole or the through hole via the seal member arranged in the mounting portion.
A vacuum suction pad characterized by that.
前記下面部は、複数の前記第１の開口部と夫々連通する複数の前記第２の開口部を有する、
ことを特徴とする請求項１乃至請求項４のいずれか一項に記載の真空吸着パッド。 The upper surface portion has a plurality of the first openings,
The lower surface portion has a plurality of second openings that respectively communicate with the plurality of first openings.
The vacuum suction pad according to any one of claims 1 to 4, wherein:
前記接触部は、前記第１の開口部を取り囲むように該上面部から突出し、真空吸着した前記基板の表面と接触する、
ことを特徴とする請求項１乃至請求項５のいずれか一項に記載の真空吸着パッド。 The upper surface portion further has a contact portion protruding from the upper surface portion,
The contact portion protrudes from the upper surface portion so as to surround the first opening, and comes into contact with the surface of the substrate that has been vacuum-adsorbed.
The vacuum suction pad according to any one of claims 1 to 5, wherein:
前記薄肉部は、前記側周面部と接続され、該薄肉部を弾性変形することで該上面部を移動する、
ことを特徴とする請求項６に記載の真空吸着パッド。 The upper surface part further has a thin part on the side peripheral surface part side of the contact part,
The thin part is connected to the side peripheral surface part, and moves the upper surface part by elastically deforming the thin part.
The vacuum suction pad according to claim 6.
前記シール部材は、前記下面部と前記取付孔の底面とで挟まれた空間の気密を確保する、
ことを特徴とする真空吸着パッド。 The vacuum suction pad according to any one of claims 1 to 7, comprising the sealing member.
The seal member ensures airtightness in a space sandwiched between the lower surface portion and the bottom surface of the mounting hole.
A vacuum suction pad characterized by that.
第１の開口部を備える内側パッドと、前記内側パッドが取り付けられる第２の取付孔が形成された外側パッドとを有し、
前記内側パッドは、前記第１の開口部が形成された上面部と、第１のシール部材を配置する第１の装着部が形成された第１の側周面部と、前記第２の取付孔の底面に当接する第１の脚部が形成された第１の下面部とを備え、
前記外側パッドは、第２のシール部材を配置する第２の装着部が形成された第２の側周面部と、前記第１の取付孔の底面に当接する第２の脚部が形成された第２の下面部とを備え、
前記第１の側周面部は、前記第１の装着部に配置した前記第１のシール部材を介して、前記第２の取付孔に取り付けられ、
前記第２の側周面部は、前記第２の装着部に配置した前記第２のシール部材を介して、前記第１の取付孔に取り付けられる、
ことを特徴とする真空吸着パッド。 A vacuum suction pad attached to a first mounting hole formed in a transfer arm of a substrate transfer device, connected to a vacuum suction path of the transfer arm, and vacuum-adsorbing a substrate to the transfer arm;
An inner pad provided with a first opening, and an outer pad formed with a second attachment hole to which the inner pad is attached;
The inner pad includes an upper surface portion on which the first opening is formed, a first side peripheral surface portion on which a first mounting portion for disposing a first seal member is formed, and the second mounting hole. A first lower surface portion formed with a first leg portion that contacts the bottom surface of
The outer pad has a second side peripheral surface portion on which a second mounting portion for disposing a second seal member is formed, and a second leg portion that contacts the bottom surface of the first mounting hole. A second lower surface portion,
The first side peripheral surface portion is attached to the second attachment hole via the first seal member disposed in the first mounting portion,
The second side peripheral surface portion is attached to the first attachment hole via the second seal member disposed in the second mounting portion.
A vacuum suction pad characterized by that.
前記第２のシール部材は、前記第２の下面部と前記第１の取付孔の底面とで挟まれた空間の気密を確保する、
ことを特徴とする請求項１２に記載の真空吸着パッド。 The first seal member ensures airtightness of a space sandwiched between the first lower surface portion and the bottom surface of the second mounting hole,
The second seal member ensures airtightness of a space sandwiched between the second lower surface portion and the bottom surface of the first attachment hole.
The vacuum suction pad according to claim 12.
前記第２の取付孔は、該第２の取付孔の底面に第３の開口部を有し、
前記第２の下面部は、前記第３の開口部と連通する第４の開口部を有し、
前記第１の取付孔は、該第１の取付孔の底面に第５の開口部を有し、
前記内側パッドに当接した前記基板は、該内側パッドの前記上面部の前記第１の開口部と連通する前記第２の開口部、前記第３の開口部、前記第４の開口部及び前記第５の開口部を介して、該上面部に真空吸着される、
ことを特徴とする請求項１２又は請求項１３に記載の真空吸着パッド。 The first lower surface portion has a second opening communicating with the first opening,
The second mounting hole has a third opening on the bottom surface of the second mounting hole,
The second lower surface portion has a fourth opening communicating with the third opening,
The first mounting hole has a fifth opening on the bottom surface of the first mounting hole;
The substrate in contact with the inner pad includes the second opening, the third opening, the fourth opening, and the communication between the first opening on the upper surface of the inner pad. The upper surface is vacuum-adsorbed through the fifth opening,
The vacuum suction pad according to claim 12 or 13, characterized by the above.
前記真空吸着パッドに当接した前記基板は、前記第２の開口部及び前記第３の開口部を介して、真空吸着される、
ことを特徴とする請求項１８に記載の搬送アーム。 The mounting hole has a third opening on the bottom surface of the mounting hole;
The substrate in contact with the vacuum suction pad is vacuum-sucked through the second opening and the third opening.
The transfer arm according to claim 18.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009173195A JP5379589B2 (en) | 2009-07-24 | 2009-07-24 | Vacuum suction pad, transfer arm and substrate transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009173195A JP5379589B2 (en) | 2009-07-24 | 2009-07-24 | Vacuum suction pad, transfer arm and substrate transfer device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011029388A JP2011029388A (en) | 2011-02-10 |
| JP2011029388A5 true JP2011029388A5 (en) | 2012-11-01 |
| JP5379589B2 JP5379589B2 (en) | 2013-12-25 |
Family
ID=43637800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009173195A Expired - Fee Related JP5379589B2 (en) | 2009-07-24 | 2009-07-24 | Vacuum suction pad, transfer arm and substrate transfer device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5379589B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5345167B2 (en) * | 2011-03-18 | 2013-11-20 | 東京エレクトロン株式会社 | Substrate holding device |
| JP6224437B2 (en) * | 2013-11-26 | 2017-11-01 | 東京エレクトロン株式会社 | Substrate transfer device |
| JP6032234B2 (en) | 2014-03-19 | 2016-11-24 | 信越半導体株式会社 | Work holding device |
| JP6298099B2 (en) | 2016-05-18 | 2018-03-20 | キヤノントッキ株式会社 | Substrate transfer device |
| JP6568986B1 (en) | 2018-06-28 | 2019-08-28 | 平田機工株式会社 | Alignment apparatus, semiconductor wafer processing apparatus, and alignment method |
| US11315823B2 (en) | 2019-12-27 | 2022-04-26 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate suction-holding structure and substrate transfer robot |
| TW202418470A (en) | 2022-06-06 | 2024-05-01 | 日商東京威力科創股份有限公司 | Mounting pad, mounting mechanism, and substrate transfer mechanism |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08143147A (en) * | 1994-11-18 | 1996-06-04 | Metsukusu:Kk | Sucking device for sheet-form work |
| JP3282787B2 (en) * | 1996-07-29 | 2002-05-20 | 東京エレクトロン株式会社 | Wafer transfer mechanism |
| JP3782523B2 (en) * | 1996-09-12 | 2006-06-07 | オリンパス株式会社 | Substrate adsorption member and apparatus |
| JP3408780B2 (en) * | 2000-06-05 | 2003-05-19 | 株式会社しなのエレクトロニクス | Vacuum gripper and IC test handler |
| JP3917528B2 (en) * | 2003-01-07 | 2007-05-23 | エスペック株式会社 | Suction pad |
| JP2006073946A (en) * | 2004-09-06 | 2006-03-16 | Fuji Mach Mfg Co Ltd | Glass substrate feeder |
| JP4790395B2 (en) * | 2005-12-02 | 2011-10-12 | オリンパス株式会社 | Substrate adsorption mechanism and substrate inspection device |
-
2009
- 2009-07-24 JP JP2009173195A patent/JP5379589B2/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2011029388A5 (en) | ||
| JP2012199282A5 (en) | ||
| JP2013540354A5 (en) | ||
| WO2005067047A3 (en) | An integral topside vaccum package | |
| JP2012146783A (en) | Substrate sucking device | |
| KR20040086365A (en) | Substrate sucking device | |
| JP2012141160A5 (en) | ||
| JP5379589B2 (en) | Vacuum suction pad, transfer arm and substrate transfer device | |
| JP2020516065A (en) | Silicon wafer adsorption device, silicon wafer transfer device, silicon wafer transfer system, and transfer method | |
| WO2009011428A1 (en) | Apparatus for attaching load port apparatus | |
| KR20100077523A (en) | A moving arm for wafer | |
| JP2014203967A (en) | Chuck table | |
| TWI776228B (en) | Substrate suction-holding structure and substrate transfer robot | |
| JP2011212761A (en) | Fixing device of workpiece | |
| JP2014038962A (en) | Suction head for semiconductor manufacturing apparatus and manufacturing method of the same, and semiconductor device sucking method | |
| KR101538099B1 (en) | Career jig for carrying PCB | |
| TW201712814A (en) | Ultra-low-height semiconductor device package and method of manufacturing an ultra-low-height semiconductor device package | |
| JP2018190815A (en) | Vacuum suction member | |
| TWI531804B (en) | Absorption testing device | |
| TW201702619A (en) | Lost motion gasket for semiconductor test, and associated systems and methods | |
| CN107180783B (en) | Bearing disc assembly and mechanical arm with same | |
| KR20140099582A (en) | Method of forming external terminals of a package and apparatus for performing the same | |
| TWI691034B (en) | Process to produce a microelectronic component arrangement and microelectronic component arrangement | |
| JPWO2019065355A1 (en) | Adsorption stage | |
| JP2014168336A (en) | Wiring board device |