JP7394821B2 - Substrate processing equipment - Google Patents

Description

The present invention relates to a substrate processing apparatus, and particularly to a substrate processing apparatus used for flattening a substrate such as a semiconductor wafer.

In recent years, as semiconductor devices have become more highly integrated, circuit wiring has become finer and the distance between wiring has become narrower. In the manufacture of semiconductor devices, many types of materials are repeatedly formed into films on a silicon wafer to form a layered structure. In order to form this laminated structure, a technique for flattening the surface of the wafer is important. As a means for flattening the surface of such a wafer, a polishing apparatus (also referred to as a chemical mechanical polishing apparatus) that performs chemical mechanical polishing (CMP) is widely used.

This chemical mechanical polishing (CMP) apparatus generally includes a polishing table to which a polishing pad is attached, a top ring that holds a wafer, and a nozzle that supplies polishing liquid onto the polishing pad. While supplying polishing liquid onto the polishing pad from the nozzle, the top ring presses the wafer against the polishing pad, and the top ring and polishing table are moved relative to each other to polish the wafer and flatten its surface.

In addition to such a CMP apparatus, a substrate processing apparatus is an apparatus having functions of cleaning and drying a wafer after polishing. In such a substrate processing apparatus, it is required to improve the throughput of substrate processing. Since a substrate processing apparatus has various processing sections that perform polishing, cleaning, etc., delays in processing at each processing section reduce the throughput of the entire substrate processing apparatus. For example, in the conventional substrate processing apparatus described in Patent Document 1, even if the polishing section has a plurality of polishing units, the cleaning section is provided with only one cleaning line, so the cleaning section has a plurality of polishing units. It was not possible to simultaneously clean and dry polished wafers.

Further, in a conventional substrate processing apparatus, when the polishing section has a first polishing unit and a second polishing unit, when polishing a wafer in the first polishing unit, the first polishing unit is The wafer is directly carried into the polishing unit, but when polishing the substrate in the second polishing unit, the wafer is carried from the load/unload section to the second polishing unit via the first polishing unit. Ta. Therefore, congestion occurs in the same delivery route of the first polishing unit and the second polishing unit, reducing throughput.

In addition, in conventional substrate processing equipment, a transfer robot placed in the loading/unloading section directly transports unpolished wafers from the loading/unloading section to the polishing section, and also transports cleaned wafers from the cleaning section. It was being transported to the loading and unloading department. A high level of cleanliness is required for the hand of the transfer robot that grips the wafer after cleaning, but there was a concern that the wafer could come into contact with the polishing environment and become contaminated when directly transporting the unpolished wafer to the polishing department. .

International Publication No. 2007/099976

The present invention has been made in consideration of the above points. An object of the present invention is to provide a substrate processing apparatus that can improve throughput.

The substrate processing apparatus according to the present invention includes:
a polishing section that polishes the substrate;
a transport unit that transports the substrate before polishing to the polishing unit;
a cleaning section that cleans the substrate after polishing;
Equipped with
The cleaning section includes a first cleaning unit and a second cleaning unit arranged in upper and lower stages,
The first cleaning unit and the second cleaning unit each include a plurality of cleaning modules arranged in series,
The transport section includes a slide stage that is disposed between the first cleaning unit and the second cleaning unit and transports the substrate to be polished along the arrangement direction of the plurality of cleaning modules.

According to the present invention, even when a plurality of substrates are continuously transported from the polishing section to the cleaning section, by distributing the substrates to the first cleaning unit and the second cleaning unit, the plurality of substrates can be can be washed in parallel. Therefore, the throughput of the entire process can be improved. Furthermore, since the substrate before polishing is transported to the polishing section by the slide stage of the transport section, it is possible to prevent the transport robot disposed in the loading/unloading section from coming into contact with the polishing environment and becoming contaminated. In addition, the first and second cleaning units are arranged in two stages, upper and lower, and the slide stage is located between the first and second cleaning units, which increases the overall footprint of the device. can be suppressed.

The substrate processing apparatus according to the present invention includes:
a transport unit that transports the substrate before polishing to the polishing unit;
a cleaning section that cleans the substrate after polishing;
Equipped with
The polishing section is
A first polishing unit and a second polishing unit,
a polishing unit transport mechanism disposed adjacent to the transport unit, the first polishing unit, and the second polishing unit, respectively;
has
The polishing unit conveyance mechanism includes:
a first transport unit that transports the substrate to the first polishing unit;
a second transport unit that transports the substrate to the second polishing unit;
a transport robot that is disposed between the first transport unit and the second transport unit and transfers substrates between the transport section and the first transport unit and the second transport unit;
has.

According to the present invention, the substrates transported from the transport section to the polishing section are distributed to the first transport unit and the second transport unit by the transport robot. Then, the substrate is transported from the first transport unit to the first polishing unit, and the substrate is transported from the second transport unit to the second polishing unit. In this way, since the first polishing unit and the second polishing unit do not share the substrate transport path, congestion when transporting substrates to the first polishing unit and the second polishing unit is eliminated. Thereby, the throughput of the entire process can be improved.

In the substrate processing apparatus according to the present invention,
The cleaning section is arranged adjacent to the transfer robot,
The transfer robot may transfer substrates between the first transfer unit, the second transfer unit, and the cleaning section.

The substrate processing apparatus according to the present invention includes:
further comprising a control unit that controls operations of the polishing unit and the cleaning unit,
The cleaning section includes a first cleaning unit and a second cleaning unit arranged in upper and lower stages,
The first cleaning unit includes a plurality of first cleaning modules and a first wafer station arranged in series, and a first cleaning section transport unit that transports the substrate between each of the first cleaning modules and the first wafer station. has a mechanism;
The second cleaning unit includes a plurality of second cleaning modules and a second wafer station arranged in series, and a second cleaning section transport unit that transports the substrate between each second cleaning module and the second wafer station. has a mechanism;
The control unit includes:
If an abnormality occurs in any of the plurality of first cleaning modules,
the first cleaning unit transport mechanism transports the substrate located in the first cleaning module to the first wafer station;
the transfer robot transfers the substrate from the first wafer station to the second wafer station;
The operations of the polishing section and the cleaning section may be controlled such that the second cleaning section transport mechanism transports the substrate from the second wafer station to the second cleaning module and performs cleaning.

According to this aspect, even if an abnormality occurs in any one of the plurality of first cleaning modules, the substrate located in the first cleaning module is transported to the second cleaning module and cleaned. By doing so, the substrate located within the first cleaning module can be rescued.

The substrate processing apparatus according to the present invention includes:
a polishing section that polishes the substrate;
a transport unit that transports the substrate before polishing to the polishing unit;
a cleaning section that cleans the substrate after polishing;
Equipped with
The polishing section is
N polishing devices (N is a natural number of 2 or more);
a transport unit that transports the substrate to each of the N polishing devices;
a transfer robot that transfers substrates between the transfer section and the transfer unit;
has
The transport unit is
N pushers that are arranged at N substrate transfer positions for each of the N polishing apparatuses and move up and down;
an exchanger having N stages arranged in upper and lower N stages and horizontally moving independently from each other between a standby position where substrates are delivered to and from the transfer robot and the N substrate transfer positions;
has.

According to the present invention, the transport unit can transport the substrate received from the transport robot to each of the N polishing devices. For example, the first stage of the exchanger receives the first substrate from the transfer robot and moves to the first substrate transfer position, and the first pusher rises to move the first substrate to the first substrate transfer position.
The first substrate is transferred from the stage to the first polishing device, and while the first substrate is being polished by the first polishing device, the second stage receives the second substrate from the transfer robot and moves to the second substrate transfer position. The second pusher moves up and transfers the second substrate from the second stage to the second polishing device, so that the second substrate can be polished by the second polishing device. By polishing two substrates in parallel in this manner, the throughput of the entire process can be improved. Further, after polishing the substrate in the first polishing device, the first pusher descends and transfers the substrate from the first polishing device to the second stage, the second stage moves to the second substrate transfer position, and the second stage moves to the second substrate transfer position. It is also possible for the second pusher to rise and transfer the substrate from the second stage to the second polishing device, and to further polish the substrate in the second polishing device.

In the substrate processing apparatus according to the present invention, the exchanger is arranged in multiple stages above and below the N stages, and is independent of the N stages between the standby position and the N substrate transfer positions. It may also have at least one further stage that moves horizontally.

According to such an embodiment, for example, while both the first stage and the second stage are used to transfer substrates to and from the first polishing device and the second polishing device, the third stage receives the next substrate. You can leave it on standby. As a result, the start timing of the polishing process for the next substrate can be made earlier, and the throughput can be further improved.

The substrate processing apparatus according to the present invention further includes a control section that controls the operation of the polishing section,
The control unit includes:
When polishing the substrate continuously using the first polishing device and the second polishing device,
a first stage receives a first substrate from the transfer robot and moves from the standby position to a first substrate transfer position;
a first pusher moves up to transfer the first substrate from the first stage to the first polishing device;
While the first polishing device is polishing the first substrate, the first stage returns to the standby position and receives a second substrate from the transfer robot;
When polishing in the first polishing device is completed, the first pusher descends to transfer the first substrate from the first polishing device to a second stage,
The polishing section is configured such that the first stage moves from the standby position to the first substrate transfer position at the same time as the second stage moves from the first substrate transfer position to the second substrate transfer position. The operation may be controlled.

According to this aspect, at the same time as the second stage holding the first substrate moves from the first substrate transfer position to the second substrate transfer position, the first stage holding the second substrate moves from the standby position. Since the substrate is moved to the first substrate transfer position, the throughput of the process is improved.

The substrate processing apparatus according to the present invention further includes a control section that controls the operation of the polishing section,
The control unit includes:
When polishing the substrate in parallel with the first polishing device and the second polishing device,
The first stage is used to receive the substrate from the first polishing device, but is not used to deliver the substrate to the second polishing device,
The operation of the polishing unit may be controlled so that the second stage is used to receive the substrate from the second polishing device, but not to deliver the substrate to the first polishing device.

According to this aspect, when the first polishing device and the second polishing device polish the substrates in parallel, the first stage and the second stage receive the substrates from the first polishing device and the second polishing device, respectively. Because it is dedicated, even if trouble occurs when receiving substrates from one polishing device, it is possible to continue transferring substrates to the other polishing device (deadlock can be avoided).

The substrate processing apparatus according to the present invention further includes a control section that controls the operation of the polishing section,
The control unit includes:
When polishing the first substrate and the second substrate in parallel with the first polishing device and the second polishing device,
a first stage receives the first substrate from the transfer robot and moves from the standby position to a first substrate transfer position;
a first pusher moves up to transfer the first substrate from the first stage to the first polishing device;
While the first polishing device is polishing the first substrate, the first stage returns from the first substrate transfer position to the standby position, receives the second substrate from the transfer robot, and returns from the standby position. moving to the second substrate transfer position;
the second pusher moves up to transfer the second substrate from the first stage to the second polishing device;
While the second polishing device is polishing the second substrate, the first stage returns from the second substrate transfer position to the standby position and receives a third substrate from the transfer robot;
If polishing in the first polishing device is completed before polishing in the second polishing device is completed, the first pusher descends to transfer the first substrate from the first polishing device to a second stage. ,
At the same time as the second stage moves from the first substrate transfer position to the standby position, the first stage moves from the standby position to the first substrate transfer position,
If polishing in the second polishing device is completed before polishing in the first polishing device is completed, the second pusher is lowered to transfer the second substrate from the second polishing device to a third stage. ,
The polishing section is operated such that the first stage moves from the standby position to the first substrate transfer position at the same time as the third stage moves from the second substrate transfer position to the standby position. May be controlled.

According to this aspect, when polishing the first substrate and the second substrate in parallel in the first polishing device and the second polishing device, the first polishing device and the second polishing device use the same first stage. Because the second and third stages are dedicated to receiving substrates from the first polishing device and the second polishing device, respectively, a problem occurred when receiving substrates from one polishing device. However, the substrate can be continuously transferred to the other polishing apparatus (occurrence of deadlock can be avoided).

The substrate processing apparatus according to the present invention includes:
a polishing section that polishes the substrate;
a transport unit that transports the substrate before polishing to the polishing unit;
a cleaning section that cleans the substrate after polishing;
Equipped with
The cleaning section includes a plurality of cleaning modules arranged in series, and a cleaning section transport mechanism that transports the substrate between each cleaning module,
The cleaning section transport mechanism is
a pair of arms that can be opened and closed to grip the board;
a vertical movement mechanism that moves the pair of arms up and down;
a rotation mechanism that rotates the pair of arms about a rotation axis parallel to the opening/closing direction;
an arm transport mechanism that moves the pair of arms linearly along the arrangement direction of the plurality of cleaning modules;
has.

According to the present invention, since the rotation mechanism can rotate the pair of arms so that the tips thereof face upward, even if the shutter of a specific cleaning module among a plurality of cleaning modules is closed, this cleaning module You can avoid (skip) and move the arm. Therefore, it is no longer necessary to wait for the shutter to open when moving the arm past this cleaning module, and the throughput of the entire process can be improved.

The substrate processing apparatus according to the present invention further includes a control section that controls the operation of the cleaning section, and when the rotation mechanism rotates the pair of arms so that the tips thereof face upward, The operation of the control unit may be controlled so that the vertical movement mechanism lowers the pair of arms.

According to this aspect, when the rotation mechanism rotates the pair of arms so that the tips thereof face upward, the vertical movement mechanism lowers the pair of arms, so that the space required above the pair of arms is reduced. can be reduced.

The substrate processing apparatus according to the present invention may have two sets each including the pair of arms, the vertical movement mechanism, and the rotation mechanism.

According to this aspect, the two sets of arms can be selectively used depending on the cleanliness of the substrate to be held. For example, by using one set of arms for the first half of the cleaning process in each cleaning module and using the other set of arms for the second half of the cleaning process, the substrates undergoing the second half of the cleaning process can be can be prevented from coming into contact with one set of arms and becoming contaminated.

In the substrate processing apparatus according to the present invention, the pair of arms may be provided with chuck pieces arranged in two stages, upper and lower, which can abut on the outer periphery of the substrate.

According to this aspect, the chuck pieces can be used properly depending on the cleanliness of the substrate to be held. For example, by using the lower chuck piece for the first half of the cleaning process in each cleaning module and using the upper chuck piece for the second half of the cleaning process, the substrate undergoing the latter half of the cleaning process can be moved to the lower chuck piece. This prevents contamination from coming into contact with the chuck piece.

In the substrate processing apparatus according to the present invention, a set consisting of the pair of arms, the vertical movement mechanism, and the rotation mechanism may be arranged in a suspended manner below the arm transport mechanism.

According to this aspect, the maintenance space for the pair of arms, the vertical movement mechanism, and the rotation mechanism can be expanded. Therefore, the time required for maintenance can be reduced.

In the substrate processing apparatus according to the present invention, the cleaning section further includes a pre-cleaning module that is arranged in the same line as the plurality of cleaning modules and that cleans the substrate before polishing, and the cleaning section transport mechanism is configured to move the pre-cleaning module The substrate may be transported between the cleaning module and each cleaning module.

According to this aspect, before polishing the unpolished substrate using the polishing apparatus, the surface of the substrate can be cleaned using the pre-cleaning module. This can reduce problems such as scratches caused by coarse particles being bitten during the polishing process of the substrate.

According to the present invention, throughput can be improved in a substrate processing apparatus.

FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a side view of the substrate processing apparatus shown in FIG. 1, viewed from the cleaning section side. FIG. 3 is an exploded perspective view showing the transport section of the substrate processing apparatus shown in FIG. 1. FIG. FIG. 4 is a perspective view schematically showing the first polishing device of the substrate processing apparatus shown in FIG. FIG. 5 is a side view of the transfer robot of the substrate processing apparatus shown in FIG. 1. FIG. 6 is a perspective view showing the first transport mechanism of the substrate processing apparatus shown in FIG. FIG. 7 is a longitudinal cross-sectional view showing the first pusher of the first transport mechanism shown in FIG. 6. FIG. 8 is a perspective view showing the first wafer station of the cleaning section shown in FIG. 2. FIG. FIG. 9 is an exploded perspective view showing the internal configuration of the first wafer station shown in FIG. 8. FIG. 10 is a perspective view showing the second wafer station of the cleaning section shown in FIG. 2. FIG. FIG. 11 is an exploded perspective view showing the internal configuration of the second wafer station shown in FIG. 10. FIG. 12 is a diagram showing a cleaning section transport mechanism of the first cleaning unit of the cleaning section shown in FIG. 2. FIG. FIG. 13A is a schematic diagram for explaining the operation of the second wafer gripping mechanism of the cleaning section transport mechanism shown in FIG. 12. FIG. 13B is a schematic diagram for explaining the operation of the second wafer gripping mechanism of the cleaning section transport mechanism shown in FIG. 12. FIG. 13C is a schematic diagram for explaining the operation of the second wafer gripping mechanism of the cleaning section transport mechanism shown in FIG. 12. FIG. 13D is a schematic diagram for explaining the operation of the second wafer gripping mechanism of the cleaning section transport mechanism shown in FIG. 12. FIG. 13E is a schematic diagram for explaining the operation of the second wafer gripping mechanism of the cleaning section transport mechanism shown in FIG. 12. FIG. 14 is a perspective view showing a state in which the second wafer gripping mechanism of the cleaning section transport mechanism shown in FIG. 12 grips a substrate with an upper chuck piece. FIG. 15 is a perspective view showing a state in which the second wafer gripping mechanism of the cleaning section transport mechanism shown in FIG. 12 grips a substrate with the lower chuck piece. FIG. 16A is a schematic diagram for explaining the operation of the transport section. FIG. 16B is a schematic diagram for explaining the operation of the transport section. FIG. 16C is a schematic diagram for explaining the operation of the transport section. FIG. 17A is a schematic diagram for explaining the operation of the transfer robot. FIG. 17B is a schematic diagram for explaining the operation of the transfer robot. FIG. 17C is a schematic diagram for explaining the operation of the transfer robot. FIG. 17D is a schematic diagram for explaining the operation of the transfer robot. FIG. 18A is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 18B is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 18C is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 18D is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 18E is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 18F is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 18G is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 18H is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 18I is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 18J is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 18K is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 18L is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 18M is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 18N is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 18O is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19A is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19B is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19C is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19D is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19E is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19F is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19G is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19H is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19I is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19J is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19K is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19L is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19M is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19N is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19O is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19P is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 20A is a schematic diagram for explaining the operation of the transfer robot with respect to the cleaning section. FIG. 20B is a schematic diagram for explaining the operation of the transfer robot with respect to the cleaning section. FIG. 20C is a schematic diagram for explaining the operation of the transfer robot with respect to the cleaning section. FIG. 21A is a schematic diagram for explaining the operation of the first cleaning unit. FIG. 21B is a schematic diagram for explaining the operation of the first cleaning unit. FIG. 21C is a schematic diagram for explaining the operation of the first cleaning unit. FIG. 21D is a schematic diagram for explaining the operation of the first cleaning unit. FIG. 21E is a schematic diagram for explaining the operation of the first cleaning unit. FIG. 21F is a schematic diagram for explaining the operation of the first cleaning unit. FIG. 22A is a schematic diagram for explaining the operation when an abnormality occurs in the first cleaning unit. FIG. 22B is a schematic diagram for explaining the operation when an abnormality occurs in the first cleaning unit. FIG. 22C is a schematic diagram for explaining the operation when an abnormality occurs in the first cleaning unit. FIG. 22D is a schematic diagram for explaining the operation when an abnormality occurs in the first cleaning unit. FIG. 22E is a schematic diagram for explaining the operation when an abnormality occurs in the first cleaning unit. FIG. 23 is a schematic diagram showing an example of a liquid leakage detection section of the substrate processing apparatus shown in FIG. 1. FIG. 24 is a schematic diagram showing a conventional liquid leakage detection section. FIG. 25 is a schematic diagram showing a modification of the leakage detection section of the substrate processing apparatus shown in FIG. 1. FIG. 26 is a schematic diagram showing a modification of the leakage detection section of the substrate processing apparatus shown in FIG. 1. FIG. 27 is a side view of a cleaning section with a pre-cleaning module. FIG. 28A is a schematic diagram for explaining the wafer transfer operation to the cleaning module of the cleaning section in FIG. 27. FIG. 28B is a schematic diagram for explaining the wafer transfer operation to the cleaning module of the cleaning section in FIG. 27. FIG. 28C is a schematic diagram for explaining the wafer transfer operation to the cleaning module of the cleaning section in FIG. 27. FIG. 28D is a schematic diagram for explaining the wafer transfer operation to the cleaning module of the cleaning section in FIG. 27. FIG. 28E is a schematic diagram for explaining the wafer transfer operation to the cleaning module of the cleaning section in FIG. 27. FIG. 29A is a schematic diagram for explaining an example of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 29B is a schematic diagram for explaining an example of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 29C is a schematic diagram for explaining an example of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 29D is a schematic diagram for explaining an example of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 29E is a schematic diagram for explaining an example of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 29F is a schematic diagram for explaining an example of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 29G is a schematic diagram for explaining an example of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 29H is a schematic diagram for explaining an example of the operation of the cleaning unit transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 29I is a schematic diagram for explaining an example of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 30A is a schematic diagram for explaining a modified example of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 30B is a schematic diagram for explaining a modification of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 30C is a schematic diagram for explaining a modification of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 30D is a schematic diagram for explaining a modification of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 30E is a schematic diagram for explaining a modification of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 30F is a schematic diagram for explaining a modification of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 30G is a schematic diagram for explaining a modification of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 30H is a schematic diagram for explaining a modification of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 30I is a schematic diagram for explaining a modification of the operation of the cleaning section transport mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 31 is a schematic diagram for explaining the occurrence of deadlock in parallel processing.

Embodiments of the present invention will be described below with reference to the drawings. Note that in the following explanation and the drawings used in the following explanation, the same reference numerals are used for parts that can be configured the same, and overlapping explanations are omitted.

FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a side view of the polishing apparatus shown in FIG. 1 viewed from the cleaning section side. As shown in FIGS. 1 and 2, the substrate processing apparatus 10 according to the present embodiment includes a housing that is substantially rectangular in plan view. It is divided into a section 13 and a transport section 14. The loading/unloading section 11, the polishing section 12, the cleaning section 13, and the conveying section 14 are each independently assembled and independently evacuated. Further, the substrate processing apparatus 10 is provided with a control section 15 (also referred to as a control panel) that controls the operations of the load/unload section 11, the polishing section 12, the cleaning section 13, and the transport section 14.

<Load/unload section>
The load/unload section 11 includes a plurality of (four in the illustrated example) front load sections 113 on which wafer cassettes storing a large number of wafers (substrates) W are placed. These front load sections 113 are arranged adjacent to each other in the width direction (direction perpendicular to the longitudinal direction) of the substrate processing apparatus 10 . The front load section 113 can be loaded with an open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod). Here, the SMIF and FOUP are airtight containers that house wafer cassettes inside and can maintain an environment independent of the external space by covering them with partition walls.

Further, in the loading/unloading section 11, a traveling mechanism 112 is installed along the arrangement direction of the front loading sections 113, and on this traveling mechanism 112, there is a conveyor that can move along the arrangement direction of the front loading sections 113. A robot 111 is installed. The transfer robot 111 can access the wafer cassette mounted on the front load section 113 by moving on the traveling mechanism 112. This transfer robot 111 is equipped with two hands on the upper and lower sides. For example, the upper hand is used when returning the wafer W to the wafer cassette, and the lower hand is used when transferring the wafer W before polishing. This allows you to use the upper and lower hands differently.
Note that instead of this, the wafer W may be transported using only a single hand.

Since the loading/unloading section 11 is the area that needs to be kept in the cleanest condition, the inside of the loading/unloading section 11 is higher than any of the outside of the device, the polishing section 12, the cleaning section 13, and the conveying section 14. High pressure is maintained at all times. Further, above the traveling mechanism 112 of the transfer robot 111, a filter fan unit (not shown) having a clean air filter such as a HEPA filter or a ULPA filter is provided. Clean air from which gas has been removed is constantly blown downward.

<Transport section>
The transport section 14 is a region for transporting a wafer before polishing from the load/unload section 11 to the polishing section 12, and is provided so as to extend along the longitudinal direction of the substrate processing apparatus 10. As shown in FIG. 1, the transport section 14 is arranged adjacent to both the load/unload section 11, which is the cleanest area, and the polishing section 12, which is the dirtiest area. Therefore, in order to prevent particles in the polishing section 12 from passing through the conveying section 14 and diffusing into the loading/unloading section 11, the polishing section is placed inside the conveying section 14 from the loading/unloading section 11 side, as described later. An air current flowing toward the 12 side is formed.

The structure of the transport section 14 will be explained in detail. FIG. 3 is an exploded perspective view showing the internal configuration of the transport section 14. As shown in FIG. As shown in FIG. 3, the transport unit 14 includes a cover 41 extending in the longitudinal direction, a slide stage 42 arranged inside the cover 41 and holding the wafer W, and a slide stage 42 that linearly moves the slide stage 42 along the longitudinal direction. It has a stage moving mechanism 43 and an exhaust duct 44 that exhausts the inside of the cover 41.

The cover 41 has a bottom plate, four side plates, and a top plate (not shown in FIG. 3). A carry-in port 41a communicating with the load/unload section 11 is formed on one side plate in the longitudinal direction. Furthermore, an outlet 41b communicating with the polishing section 12 is formed at the end of one side plate in the width direction on the opposite side to the inlet 41a. The loading port 41a and the loading port 41b can be opened and closed by shutters (not shown). The transport robot 111 of the loading/unloading section 11 can access the slide stage 42 inside the cover 41 from the carry-in port 41a, and the transport robot 23 of the polishing section 12 can access the slide stage 42 inside the cover 41 from the carry-in port 41b. The slide stage 42 is accessible.

As the stage moving mechanism 43, for example, a motor drive mechanism using a ball screw or an air cylinder is used. It is preferable to use a rodless cylinder as the stage moving mechanism 43 because dust generation from the sliding portion can be prevented. The slide stage 42 is fixed to a movable portion of a stage moving mechanism 43, and is linearly moved inside the cover 41 along the longitudinal direction by power applied from the stage moving mechanism 43.

Four pins are provided on the outer periphery of the slide stage 42 so as to protrude upward. The wafer W placed on the slide stage 42 by the transfer robot 111 of the load/unload section 11 is supported on the slide stage 42 with its outer periphery guided and positioned by four pins. It has become. These pins are made of resin such as polypropylene (PP), polychlorotrifluoroethylene (PCTFE), and polyetheretherketone (PEEK).

The exhaust duct 44 is provided on the other side plate of the cover 41 in the longitudinal direction (the side plate on the opposite side to the carry-in port 41a). By performing exhaust through the exhaust duct 44 with the loading port 41a open, an air current flowing from the loading port 41a side to the loading port 41b side is formed inside the cover 41. This prevents particles in the polishing section 12 from passing through the transport section 14 and diffusing into the load/unload section 11.

<Polishing section>
As shown in FIG. 1, the polishing section 12 is an area where wafers W are polished, and includes a first polishing unit 20a having a first polishing device 21a and a second polishing device 21b, and a third polishing device 21c. a second polishing unit 20b having a fourth polishing device 21d; and a polishing unit transport mechanism 22 disposed adjacent to the transport unit 14 and the first polishing unit 20a and second polishing unit 20b, respectively. ing. The polishing unit transport mechanism 22 is arranged between the cleaning unit 13 and the first polishing unit 20a and the second polishing unit 20b in the width direction of the substrate processing apparatus 10.

The first polishing device 21a, the second polishing device 21b, the third polishing device 21c, and the fourth polishing device 21d are arranged along the longitudinal direction of the substrate processing device 10. The second polishing device 21b, the third polishing device 21c, and the fourth polishing device 21d have the same configuration as the first polishing device 21a, so the first polishing device 21a will be described below.

FIG. 4 is a perspective view schematically showing the first polishing device 21a. The first polishing device 21a includes a polishing table 101a to which a polishing pad 102a having a polishing surface is attached, and a top ring for holding a wafer W and polishing the wafer W while pressing it against the polishing pad 102a on the polishing table 101a. 25a, a polishing liquid supply nozzle 104a for supplying a polishing liquid (also called slurry) and a dressing liquid (for example, pure water) to the polishing pad 102, and a dresser (not shown) for dressing the polishing surface of the polishing pad 102a. and an atomizer (not shown) that sprays a mixture of a liquid (for example, pure water) and a gas (for example, nitrogen gas) or a liquid (for example, pure water) into a mist onto the polishing surface.

Among these, the top ring 25a is supported by the top ring shaft 103a. A polishing pad 102a is attached to the top surface of the polishing table 101a, and the top surface of the polishing pad 102a constitutes a polishing surface for polishing the wafer W. Note that a fixed grindstone may be used instead of the polishing pad 102a. The top ring 25a and the polishing table 101a are configured to rotate around their axes, as shown by arrows in FIG. The wafer W is held on the lower surface of the top ring 25a by vacuum suction. During polishing, a polishing liquid is supplied from the polishing liquid supply nozzle 104a to the polishing surface of the polishing pad 102a, and the wafer W to be polished is pressed against the polishing surface by the top ring 25a and polished.

As can be seen from the fact that slurry is used during polishing, the polishing section 12 is the dirtiest area. Therefore, in this embodiment, each polishing table of the first polishing device 21a, the second polishing device 21b, the third polishing device 21c, and the fourth polishing device 21d is Exhaust is performed from the surrounding area, and by making the pressure inside the polishing section 12 more negative than that of the outside of the device, the surrounding cleaning section 13, the loading/unloading section 11, and the conveying section 14, scattering of particles is prevented. It is prevented. Additionally, an exhaust duct (not shown) is usually provided below the polishing table, and a filter (not shown) is provided above the polishing table, and purified air is blown out through these exhaust ducts and filters. , a downflow is formed.

As shown in FIG. 1, the top ring 25a of the first polishing device 21a moves between the polishing position and the first substrate transfer position TP1 by the swing motion of the top ring head, and transfers the wafer to the first polishing device 21a. The delivery is performed at the first substrate transfer position TP1. Similarly, the top ring 25b of the second polishing device 21b moves between the polishing position and the second substrate transfer position TP2 by the swinging motion of the top ring head, and the wafer is transferred to the second polishing device 21b at the second substrate transfer position TP2. The top ring 25c of the third polishing device 21c moves between the polishing position and the third substrate transfer position TP3 by the swing motion of the top ring head, and the top ring 25c of the third polishing device 21c moves between the polishing position and the third substrate transfer position TP3. The wafer is transferred at the third substrate transfer position TP3, and the top ring 25d of the fourth polishing device 21d moves between the polishing position and the fourth substrate transfer position TP4 by the swinging motion of the top ring head. The wafer is transferred to the fourth polishing device 21d at the fourth substrate transfer position TP4.

The polishing unit transport mechanism 22 includes a first transport unit 24a that transports the wafer W to the first polishing unit 20a, a second transport unit 24b that transports the wafer W to the second polishing unit 20b, and a first transport unit 24a and a second transport unit 24b that transport the wafer W to the second polishing unit 20b. The transfer robot 23 is disposed between the two transfer units 24b and transfers wafers between the transfer section 14 and the first transfer unit 24a and the second transfer unit 24b. In the illustrated example, the transfer robot 23 is arranged approximately at the center of the housing of the substrate processing apparatus 10.

FIG. 5 is a side view showing the transfer robot 23. As shown in FIG. 5, the transfer robot 23 includes a hand 231 that holds the wafer W, and an inversion mechanism 234 that inverts the hand 231 upside down.
The robot body 233 includes an extendable and retractable arm 232 that supports the hand W, and an arm vertical movement mechanism that moves the arm 232 up and down, and an arm rotation mechanism that rotates the arm 232 around a vertical axis. ing. The robot main body 233 is attached to a frame on the ceiling of the polishing section 14 so as to be suspended.

In this embodiment, the hand 231 can access the slide stage 42 from the exit 41b of the transport section 14. Further, the hand 231 can also access the first transport unit 24a and the second transport unit 24b of the polishing section 12. Therefore, the wafers W continuously transported from the transport section 14 to the polishing section 12 are distributed by the transport robot 23 to the first transport unit 24a and the second transport unit 24b.

The second transport unit 24b has the same configuration as the first transport unit 24a, so the first transport unit 24a will be described below. FIG. 6 is a perspective view showing the first transport unit 24a.

As shown in FIG. 6, the first transport unit 24a is arranged at a first substrate transport position TP1 with respect to the first polishing device 21a, and has a first pusher 51a that moves up and down, and a second substrate transport position with respect to the second polishing device 21b. A second pusher 51b that is arranged at TP2 and moves up and down, and a first stage 52a, second stage 52b, and third stage that move horizontally independently of each other between the first substrate transfer position TP1 and the second substrate transfer position TP2. 52c.

Among these, the first pusher 51a transfers the wafer W held on any of the first to third stages 52a to 52c to the top ring 25a of the first polishing device 21a, and also serves to The wafer W is transferred to any of the first to third stages 52a to 52c. Further, the second pusher 51b transfers the wafer W held on any of the first to third stages 52a to 52c to the top ring 25b of the second polishing device 21b, and also transfers the wafer W held by any one of the first to third stages 52a to 52c to the top ring 25b of the second polishing device 21b. The wafer W is transferred to any of the first to third stages 52a to 52c. In this way, the first pusher 51a and the second pusher 51b function as a delivery mechanism for delivering the wafer W between the exchanger 50 and each top ring. Since the second pusher 51b has the same structure as the first pusher 51a, only the first pusher 51a will be described in the following description.

FIG. 7 is a longitudinal sectional view showing the first pusher 51a. As shown in FIG. 7, the first pusher 51a includes a guide stage 331 for holding the top ring of the first polishing device 21a, and a push stage 333 for holding the wafer W. Four top ring guides 337 are installed on the outermost periphery of the guide stage 331. The upper stage part 338 of the top ring guide 337 is an access part of the top ring to the lower surface of a guide ring (not shown surrounding the outer periphery of the wafer W). A taper (preferably about 25° to 35°) is formed in the upper part 338 for introducing the top ring. When unloading the wafer, the wafer edge is directly received by the top ring guide 337.

A guide sleeve 340 having a waterproof function is installed on the back surface of the guide stage 331. A center sleeve 341 for waterproofing the pusher is installed inside the guide sleeve 340.

In order to provide the top ring guide 337 with a positioning mechanism, a linear way 346 is provided that moves in the horizontal X-axis and Y-axis directions to center the guide stage 331. The guide stage 331 is fixed to a linear way 346. This linear way 346 has a structure that can be returned to the center position by applying pressure. This structure realizes centering of the guide stage 331. Alternatively, the spring inside the linear way 346 alone can return it to the center position without applying pressure.

Further, the linear way 346 is fixed to a shaft 330, and this shaft 330 is connected to a cylinder 347 having a ball spline mechanism. The cylinder 347 is driven by a motor (not shown), and the guide stage 331 is moved up and down via the shaft 330.

The push stage 333 is arranged above the guide stage 331, and an electric actuator 349 is provided at the center of the push stage 333 to move the push stage 333 up and down with respect to the guide stage 331. The push stage 333 is moved up and down by an electric actuator 349 to load the wafer W onto the top ring. In this embodiment, the push stage 333 is driven by the electric actuator 349, so that the push stage 333 can be positioned at a desired height position. Thereby, when the push stage 333 receives the wafer W, the push stage 333 can be made to stand by directly below the wafer W as a preliminary operation, and the time required for the receiving operation can be shortened. A compression spring 351 for positioning is arranged at the end of the push stage 333.

Note that in order to prevent back contamination of the wafer from slurry adhering to the pusher, a cleaning nozzle for cleaning dirt is separately installed. A wafer presence/absence sensor may be separately installed to check the presence or absence of a wafer on the pusher.

As shown in FIG. 6, the exchanger 52a includes a first stage 52a, a second stage 52b, and a third stage 52c arranged in multiple stages above and below. In the illustrated example, the first stage 52a is arranged at the lower stage, the second stage 52b is arranged at the middle stage, and the third stage 52c is arranged at the upper stage. The first stage 52a, the second stage 52b, and the third stage 52c move on the same axis that passes through the first substrate transfer position TP1 and the second substrate transfer position TP2 in plan view, but the height at which they are installed is Because they are different, they can move freely without interfering with each other.

As shown in FIG. 6, the first stage 52a is provided with a first stage drive mechanism 54a that linearly moves the first stage 52a in a uniaxial direction, and the second stage 52b is provided with a first stage drive mechanism 54a that linearly moves the first stage 52a in a uniaxial direction. A second stage drive mechanism 54b that linearly moves in the uniaxial direction is provided, and a third stage drive mechanism 54c that linearly moves the third stage 52c in the uniaxial direction is provided on the third stage 52c. As the first to third stage drive mechanisms 54a to 54c, for example, an electric actuator or a motor drive mechanism using a ball screw is used. The first to third stages 52a to 52c are movable in different directions at different timings by receiving power from different first to third stage drive mechanisms 54a to 54c, respectively.

The second stage 52b and the third stage 52c have the same configuration as the first stage 52a, so the first stage 52a will be described below. FIG. 10 is a plan view showing the first stage 52a.

As shown in FIG. 6, the first stage 52a has a "U" shape in plan view with one side (the right rear side in FIG. 6) open in the direction of linear movement by the first stage drive mechanism 54a. Therefore, when the first stage 52a is placed at the first substrate transfer position TP1, the first pusher 51a can move up and down so as to pass inside the first stage 52a. Further, the first stage 52a is movable to the other side in the linear movement direction (to the left front side in FIG. 6) even when the first pusher 51a passes inside the first stage 52a.

Although not shown, four pins are provided on the first stage 52a so as to protrude upward. Therefore, the wafer placed on the first stage 52a is supported on the first stage 52a with its outer peripheral edge being guided and positioned by the four pins. These pins are made of resin such as polypropylene (PP), polychlorotrifluoroethylene (PCTFE), and polyetheretherketone (PEEK).

Next, an example of the operation of the first pusher 51a and the exchanger 50 configured as described above will be described.

First, during wafer loading, the wafer W is transported by the first stage 52a of the exchanger 50 above the first pusher 51a. When the top ring 25a of the first polishing device 21a is at the wafer load position (first substrate transfer position TP1) above the first pusher 51a and does not hold the wafer W, components around the guide stage 331 are removed from the cylinder 347. The set is going up. During the ascent, the guide stage 331 passes inside the first stage 52a. At this time, the guide stage 331 centers the wafer W by the taper of the top ring guide 337 at the same time as it passes, and the pattern surface (other than the edge) of the wafer W is held by the push stage 333.

While the push stage 333 holds the wafer W, the top ring guide 337 continues to rise without stopping, and the taper 338a of the top ring guide 337 draws in the guide ring. The guide stage 331 is centered on the top ring through positioning by a linear way 346 that can freely move in the X and Y directions, and the upward movement of the guide stage 331 is completed when the upper stage 338 of the top ring guide 337 comes into contact with the lower surface of the guide ring.

The guide stage 331 does not rise any further because the upper stage 338 of the top ring guide 337 contacts the lower surface of the guide ring and is fixed. At this time, the push stage 333 is further raised by the electric actuator 349. At this time, the push stage 333 holds the pattern surface (other than the edge) of the wafer W and transports the wafer W to the top ring. When the top ring completes adsorption of the wafer W, the first pusher 51a starts to descend, and the operation is completed when the descent is completed.

In this embodiment, since the first stage 52a has a U-shape in plan view with one side (the right back side in FIG. 6) open in the linear movement direction, the first pusher 51a is lowered. It is possible to move to the other side in the linear movement direction (front left side in FIG. 6) even before starting the movement. Therefore, it is no longer necessary to wait for the first pusher 51a to descend when moving the first stage 52a, improving process throughput.

Next, at the time of wafer unloading, the wafer W is transported by the top ring to the wafer unloading position above the first pusher 51a. When the first stage 52a of the exchanger 50 is above the first pusher 51a and no wafer is mounted, the cylinder 347 raises the entire set of components around the guide stage 331, and the taper of the top ring guide 337 moves the guide ring Attract. The guide stage 331 is centered on the top ring through alignment using the linear way 346, and the upward movement of the guide stage 331 is completed when the upper stage 338 of the top ring guide 337 comes into contact with the lower surface of the guide ring.

The push stage 333 is raised by the electric actuator 349, but at this time the push stage 333 does not rise to a higher position than the wafer holding portion of the top ring guide 337. When the electric actuator 349 finishes rising, the wafer W is released from the top ring. At this time, the wafer W is centered by the lower taper of the top ring guide 337, and the edge portion is held by the top ring guide 337. When the wafer W is held by the first pusher 51a, the first pusher 51a starts to descend. During the descent, the guide stage 331, which had been moving to the center position due to the centering of the top ring, is centered by the guide sleeve 340 and the center sleeve 341. During the descent, the edge portion of the wafer W is transferred from the first pusher 51a to the first stage 52a, and the operation is completed at the end of the descent.

<Cleaning section>
As shown in FIGS. 1 and 2, the cleaning section 13 is an area for cleaning wafers after polishing, and has a first cleaning unit 30a and a second cleaning unit 30b arranged in two stages, upper and lower. The transport section 14 described above is arranged between the first cleaning unit 30a and the second cleaning unit 30b. Since the first cleaning unit 30a, the transport section 14, and the second cleaning unit 30b are arranged so as to overlap in the vertical direction, an advantage of a small footprint can be obtained.

As shown in FIGS. 1 and 2, the first cleaning unit 30a includes a plurality of (four in the illustrated example) cleaning modules 311a, 312a, 313a, 314a, a wafer station 33a, and each cleaning module 311a to 314a. and a cleaning section transport mechanism 32a that transports the wafer W between the wafer station 33a and the wafer station 33a. The plurality of cleaning modules 311a to 314a and the wafer station 33a are arranged in series along the longitudinal direction of the substrate processing apparatus 10. A filter fan unit (not shown) having a clean air filter is provided at the top of each cleaning module 311a to 314a, and clean air from which particles have been removed is constantly blown downward by this filter fan unit. There is. Further, the inside of the first cleaning unit 30a is always maintained at a higher pressure than the polishing section 12 in order to prevent particles from flowing in from the polishing section 12.

Similarly, the second cleaning unit 30b includes a plurality of (four in the illustrated example) cleaning modules 311b, 312b, 313b, 314b, a wafer station 33b, and a space between each of the cleaning modules 311b to 314b and the wafer station 33b. The washing section transport mechanism 32b transports the wafer W at a cleaning section transport mechanism 32b. The plurality of cleaning modules 311b to 314b and the wafer station 33b are arranged in series along the longitudinal direction of the substrate processing apparatus 10. A filter fan unit (not shown) having a clean air filter is provided at the top of each cleaning module 311b to 314b, and clean air from which particles have been removed is constantly blown downward by this filter fan unit. There is. Further, the inside of the second cleaning unit 30b is constantly maintained at a higher pressure than the polishing section 12 in order to prevent particles from flowing in from the polishing section 12.

Note that, as will be described later (FIGS. 27, 28A to 28E, and related explanations), preliminary cleaning modules 39a and 39b may be added to the cleaning modules 311a to 314a and 311b to 314b, respectively.

FIG. 8 is a perspective view showing the wafer station 33a of the first cleaning unit 30a. FIG. 9 is an exploded perspective view showing the internal configuration of this wafer station 33a. As shown in FIGS. 8 and 9, the wafer station 33a includes a housing 71 having a substantially rectangular parallelepiped shape, a stage 72 disposed inside the housing 71 and holding a wafer W, and a drive that moves the stage 72 up and down. It has a mechanism 75.

Among these, the casing 71 has a bottom plate, four side plates, and a top plate. As shown in FIG. 9, a loading port 73 communicating with the polishing part 12 is formed at the lower end of the side plate facing the polishing part 12 among the four side plates. The loading port 73 can be opened and closed by a shutter (not shown). As shown in FIG. 9, the transport robot 23 of the polishing section 12 can access the inside of the casing 71 through the entrance 73.

Further, as shown in FIG. 8, the height of the remaining three side plates among the four side plates (i.e., the side plate facing the first cleaning unit transport mechanism 32a and the left and right side plates, which will be described later) is higher than the loading port 73. An arm passage opening 74 is formed at the height position to allow the arm of the cleaning unit transport mechanism 32a to pass therethrough. The wafer transfer opening 74 can be opened and closed by a shutter (not shown). As shown in FIGS. 12 and 13, the cleaning section transport mechanism 32a of the first cleaning unit 30a can access the inside of the casing 71 through the arm passage opening 74.

As the drive mechanism 75, for example, a motor drive mechanism using a ball screw or an air cylinder is used. The stage 72 is fixed to a movable part of a drive mechanism 75, and moves between a height position facing the loading port 73 and a height position facing the wafer transfer opening 74 by the power given from the drive mechanism 75. It is moved up and down (see Figure 9).

Four pins 76 are provided on the outer periphery of the stage 72 so as to protrude upward. Therefore, the wafer W placed on the stage 72 is supported on the stage 72 with its outer peripheral edge being guided and positioned by the four pins 76. These pins 76 are made of resin such as polypropylene (PP), polychlorotrifluoroethylene (PCTFE), and polyetheretherketone (PEEK).

FIG. 10 is a perspective view showing the wafer station 33b of the second cleaning unit 30b. FIG. 11 is an exploded perspective view showing the internal configuration of this wafer station 33b. As shown in FIGS. 10 and 11, the wafer station 33b includes a housing 81 having a substantially rectangular parallelepiped shape, a stage 82 disposed inside the housing 81 and holding a wafer W, and a drive for moving the stage 82 up and down. It has a mechanism 85.

Of these, the casing 81 has a bottom plate, four side plates, and a top plate. As shown in FIG. 11, a loading port 83 communicating with the polishing section 12 is formed at the upper end of the side panel facing the polishing section 12 among the four side plates. The entrance 83 can be opened and closed by a shutter (not shown). As shown in FIG. 11, the transport robot 23 of the polishing section 12 can access the inside of the casing 81 through the entrance 83.

Further, as shown in FIG. 10, the remaining three side plates among the four side plates (that is, the side plate on the opposite side of the polishing section 12 and the left and right side plates) are placed at a lower height position than the loading port 83. An arm passage opening 84 is formed through which the arm of the cleaning unit transport mechanism 32b passes. The arm passage opening 84 can be opened and closed by a shutter 87. As shown in FIG. 11, the cleaning section transport mechanism 32b of the second cleaning unit 30b can access the inside of the casing 81 through the arm passage opening 84.

As the drive mechanism 85, for example, a motor drive mechanism using a ball screw or an air cylinder is used. The stage 82 is fixed to a movable portion of a drive mechanism 85, and is moved between a height position facing the loading port 83 and a height position facing the wafer transfer opening 84 by the power given from the drive mechanism 85. It is moved up and down (see Figure 11).

Four pins 86 are provided on the outer periphery of the stage 82 so as to protrude upward. Therefore, the wafer placed on the stage 82 is supported on the stage 82 with its outer peripheral edge being guided and positioned by the four pins 86. These pins 86 are made of polypropylene (PP), polychlorotrifluoroethylene (PCTF).
E) and polyetheretherketone (PEEK).

The cleaning modules 311b to 314b of the second cleaning unit 30b have the same configuration as the cleaning modules 311a to 314a of the first cleaning unit 30a, so the cleaning modules 311a to 314a of the first cleaning unit 30a will be explained below. do.

As shown in FIGS. 1 and 2, four cleaning modules 311a to 314a (hereinafter sometimes referred to as primary to quaternary cleaning modules) are arranged in series in this order starting from the wafer station 33a. Each of the cleaning modules 311a to 314a includes a cleaning machine (not shown) and a housing 91 that covers the cleaning machine.

The cleaning machine for the primary cleaning module 311a and the secondary cleaning module 312a is, for example, a roll type that cleans the front and back surfaces of the wafer by rotating roll-shaped sponges arranged above and below and pressing them against the front and back surfaces of the wafer. A washing machine can be used. Further, as the cleaning machine for the tertiary cleaning module 313a, for example, a pencil-type cleaning machine that cleans the wafer by pressing a hemispherical sponge against the wafer while rotating it can be used. As the cleaning machine for the 4th cleaning module 314a, for example, the back side of the wafer can be rinsed, and the front side of the wafer can be cleaned by using a pencil type cleaning machine that cleans the wafer by rotating and pressing a hemispherical sponge against the wafer. can. The cleaning machine of the fourth cleaning module 314a includes a stage that rotates the chucked wafer at high speed, and has a function (spin dry function) of drying the cleaned wafer by rotating the wafer at high speed. Note that in the cleaning machines of each of the cleaning modules 311a to 314a, in addition to the roll type cleaning machine and pencil type cleaning machine described above, a megasonic type cleaning machine that cleans by applying ultrasonic waves to the cleaning liquid is additionally installed. You can.

The housing of each of the cleaning modules 311a to 314a has a bottom plate, four side plates, and a top plate, similar to the housing 71 of the wafer station 33a. Out of the four side plates, arm passage openings 94 for passing the arm of the cleaning unit conveyance mechanism 32a are formed in the side plate facing the cleaning unit conveyance mechanism 32a and the left and right side plates (FIGS. 13A to 13A). (See Figure 13E). The arm passage opening 94 can be opened and closed by a shutter 97. The arm passage opening 94 is formed at the same height as the arm passage opening 74 of the wafer station 33a. The cleaning unit transport mechanism 32a can access the inside of the casing 91 through this arm passage opening 94.

The cleaning unit transport mechanism 32b of the second cleaning unit 30b has the same configuration as the cleaning unit transport mechanism 32a of the first cleaning unit 30a, so the cleaning unit transport mechanism 32a of the first cleaning unit 30a will be described below. do.

FIG. 12 is a perspective view showing the cleaning section transport mechanism 32a of the first cleaning unit 30a. As shown in FIG. 12, the cleaning unit transport mechanism 32a includes a first wafer gripping mechanism 601 and a second wafer gripping mechanism 602 each gripping a wafer W, and a plurality of first wafer gripping mechanisms 601 and a plurality of second wafer gripping mechanisms 602. The arm transport mechanism 62 moves linearly along the arrangement direction of the cleaning modules 311a to 314a. That is, in this embodiment, the number of wafer gripping mechanisms 601 and 602 is smaller than the number of cleaning modules 311a to 314a.

In this embodiment, the first wafer gripping mechanism 601 and the second wafer gripping mechanism 602 can be used selectively depending on the cleanliness of the wafer W, for example. For example, among the primary to quaternary cleaning modules 311a to 314a, the first wafer gripping mechanism 601 is used in the primary cleaning module 311a and the secondary cleaning module 312a in the first half of the cleaning process, and the tertiary cleaning module 313a and the secondary cleaning module 313a in the latter half of the cleaning process By using the second wafer gripping mechanism 602 in the fourth cleaning module 314a, it is possible to prevent the wafer W in the latter half of the cleaning process from coming into contact with the first wafer gripping mechanism 601 and being contaminated.

More specifically, the first wafer gripping mechanism 601 includes a pair of openable and closable first arms 611 for gripping a wafer, a first vertical movement mechanism 641 for vertically moving the pair of first arms 611, and a pair of first arms 611 for vertically moving the pair of first arms 611. A first rotation mechanism 631 that rotates the first arm 611 about a rotation axis 631A parallel to the opening/closing direction, and a first opening/closing mechanism 661 that opens and closes the pair of first arms 611 in a direction toward each other or in a direction away from each other. have.

Similarly, the second wafer gripping mechanism 602 includes a pair of openable and closable second arms 612 that grip a wafer, a second vertical movement mechanism 642 that moves the pair of second arms 612 up and down, and a second vertical movement mechanism 642 that moves the pair of second arms 612 up and down. It has a second rotation mechanism 632 that rotates around a rotation axis 632A parallel to the opening/closing direction, and a second opening/closing mechanism 662 that opens and closes the pair of second arms 612 in a direction in which they approach each other or in a direction in which they move away from each other. are doing.

As the arm transport mechanism 62, for example, a motor drive mechanism using a ball screw is used. As shown in FIG. 12, the ball screw of the arm transport mechanism 62 is provided above the cleaning modules 311a to 314a so as to extend in the arrangement direction of the cleaning modules 311a to 314a.

A main frame 68 is attached to a ball screw of the arm transport mechanism 62. The main frame 68 is attached so as to hang downward from the ball screw of the arm transport mechanism 62, and faces the side surfaces of the cleaning modules 311a to 314a. By driving the motor connected to the ball screw of the arm transport mechanism 62, the main frame 68 is linearly moved along the arrangement direction of the cleaning modules 311a to 314a while facing the side surfaces of the cleaning modules 311a to 314a.

In the illustrated example, the main frame 68 has a depth direction movement mechanism 67 for adjusting the position in the depth direction (direction perpendicular to both the arrangement direction and the vertical direction of the cleaning modules 311a to 314a). There is. As the depth direction movement mechanism 67, for example, a motor drive mechanism using a rack and pinion is used. By driving the depth direction moving mechanism 67, the position of the main frame 68 in the depth direction is adjusted.

The first vertical movement mechanism 641 and the second vertical movement mechanism 642 are provided on the main frame 68. As the first vertical movement mechanism 641 and the second vertical movement mechanism 642, for example, a motor drive mechanism using a ball screw is used. As shown in FIG. 16, the ball screw of the first vertical movement mechanism 641 is attached to the left end of the main frame 68 so as to extend in the vertical direction, and the ball screw of the second vertical movement mechanism 642 is attached to the left end of the main frame 68. It is attached so as to extend in the vertical direction at the right end of the .

A first subframe 691 that supports the pair of first arms 611 is attached to the ball screw of the first vertical movement mechanism 641. The first subframe 691 is provided on the left side of the main frame 68 so as to be adjacent to the main frame 68, and faces the side surfaces of the cleaning modules 311a to 314a. The first sub-frame 691 is linearly moved in the vertical direction by driving a motor connected to a ball screw of the first vertical movement mechanism 641.

Similarly, a second subframe 692 that supports the pair of second arms 612 is attached to the ball screw of the second vertical movement mechanism 642. The second subframe 692 is provided on the right side of the main frame 68 so as to be adjacent to the main frame 68, and can face the side surfaces of the cleaning modules 311a to 314a. The second sub-frame 692 is linearly moved in the vertical direction by driving a motor connected to a ball screw of the second vertical movement mechanism 642.

Since the first subframe 691 and the second subframe 692 have substantially the same structure except that they are symmetrical with respect to the main frame 68, the second subframe 692 will be described below.

As shown in FIG. 12, the pair of second arms 612 are arranged parallel to each other, and the base ends of the second arms 612 are attached to a rotation shaft 632A rotatably provided on the second subframe 692. It is being Furthermore, a second rotation mechanism 632 is provided on the second subframe 692 to rotate the pair of second arms 612 about a rotation axis 632A. As the second rotation mechanism 632, for example, a motor drive mechanism is used. The rotation shaft of this second rotation mechanism 632 is connected to the rotation shaft 632A via a link member 632L. The rotational force of the second rotation mechanism 632 is transmitted to the rotation shaft 632A via the link member 632L, and the pair of second arms 612 are rotated about the rotation shaft 632A.

Further, a second opening/closing mechanism 662 is provided on the second subframe 692 to open and close the pair of second arms 612 in a direction in which they approach each other or in a direction in which they move away from each other. As the second opening/closing mechanism 662, for example, an air cylinder is used. By closing the pair of second arms 612 by the second opening/closing mechanism 662, the pair of second arms 612 sandwich and hold the peripheral edge of the wafer W.

As shown in FIGS. 14 and 15, the pair of second arms 612 are provided with chuck pieces 612a and 612b arranged in two stages, upper and lower, which can abut the outer circumference of the wafer W. For example, a wafer W with relatively high cleanliness is held by the upper chuck piece 612a, and a wafer with relatively low cleanliness is held by the lower chuck piece 612b, so that the lower chuck piece 612b is kept clean. It is possible to prevent the wafer W from coming into contact with a high-quality wafer W and being contaminated.

Next, an example of the operation of the pair of second arms 612 will be described with reference to FIGS. 13A to 13E. As described above, each cleaning module is partitioned by a housing 91 to prevent the fluid used from scattering to the outside during cleaning of the wafer W, and an arm passage opening 94 is formed in the side surface of the housing 91. . The arm passage opening 94 is provided with a shutter 97 that can be opened and closed.

When taking out the wafer W after cleaning from the housing 91, as shown in FIG. Moved to standby position. In this embodiment, even if the shutter 97 of the housing 91 is closed, the tips of the pair of second arms 612 are directed upward, so that the pair of second arms 612 can be placed in the standby position adjacent to the housing 91. can be moved to position. Therefore, the start timing of the wafer removal operation can be made earlier, and the throughput of the entire process can be improved.

Next, as shown in FIGS. 13B and 13C, the second rotation mechanism 632 is driven to rotate the pair of second arms 612 about the rotation shaft 632A. In the illustrated example, the pair of second arms 612 are rotated 90° clockwise about the rotation axis 632A when viewed from the side, and the tips of the pair of second arms 612 are oriented laterally.

Next, as shown in FIG. 13D, by driving the second vertical drive mechanism 642, the pair of second arms 612 is raised to the same height position as the arm passage opening 94. At this time, the shutter 97 is retracted and the arm passage opening 94 is opened.

Next, as shown in FIG. 13E, the second opening/closing mechanism 662 is driven to close the pair of second arms 612 in a direction toward each other, and the pair of second arms 612 are inserted into the housing 91 through the arm passage opening 94. , grips the wafer W inside the housing 91. Then, the pair of second arms 612 holding the wafer W are moved to the next cleaning module by the drive of the arm transport mechanism 62.

When carrying the wafer W before cleaning into the housing 91, the above-described operations shown in FIGS. 13A to 13E are performed in the reverse order. That is, as shown in FIG. 13E, the pair of second arms 612 holding the wafer W are moved inside the housing 91 through the arm passage opening 94 by the drive of the arm transport mechanism 62.

Next, as shown in FIG. 13D, by driving the second opening/closing mechanism 662, the pair of second arms 612 are opened in a direction away from each other, and are brought out of the housing 91 through the arm passage opening 94. It will be done.

Next, as shown in FIG. 13C, by driving the second vertical drive mechanism 642, the pair of second arms 612 is lowered to a height position lower than the arm passage opening 94. At this time, the arm passage opening 94 is opened by the shutter 97, and cleaning processing of the wafer W is started inside the housing 91.

Next, as shown in FIGS. 13B and 13A, the second rotation mechanism 632 is driven to rotate the pair of second arms 612 about the rotation shaft 632A. In the illustrated example, the pair of second arms 612 are rotated 90 degrees counterclockwise about the rotation axis 632A when viewed from the side, and the tips of the pair of second arms 612 are directed upward. Then, the pair of second arms 612 whose tips are directed upward are moved to the next cleaning module by the drive of the arm transport mechanism 62. In the present embodiment, when the second rotation mechanism 632 rotates the pair of second arms 612 so that the tips thereof face upward, the second vertical movement mechanism 642 lowers the pair of second arms 612. , the space required above the pair of second arms 612 can be reduced.

Each of the cleaning modules 311a to 314a and 311b to 314b can clean a plurality of wafers W in parallel. Referring to FIGS. 29A to 29I, the operation of the cleaning section transport mechanism 32a when a plurality of wafers W are cleaned in parallel in the primary to tertiary cleaning modules 311a to 313a of the first cleaning unit 30a is explained as an example. explain.

First, as shown in FIG. 29A, in the primary cleaning module 311a, the shutter 97 is closed and the first stage cleaning is performed on the second wafer W2, and in the secondary cleaning module 312a, the first stage cleaning is performed on the second wafer W2. Assume a situation in which the second stage cleaning for W1 has been completed and the arm passage opening 94 is open. In this case, the pair of first arms 611 are moved to a standby position relative to the secondary cleaning module 312a, and the tips of the pair of first arms 611 are turned sideways.

Then, as shown in FIG. 29B, the pair of first arms 611 are closed so as to approach each other, and the first wafer W1 in the secondary cleaning module 312a is held by the pair of first arms 611. Further, the shutter 97 of the tertiary cleaning module 313a is retracted and the arm passage opening 94 is opened.

Next, as shown in FIG. 29C, the first wafer W held by the pair of first arms 611
1 is moved from the secondary cleaning module 312a to the tertiary cleaning module 313a through the arm passage opening 94.

Then, as shown in FIG. 29D, the pair of first arms 611 are opened so as to be separated from each other, and are exposed to the left and right outer sides of the tertiary cleaning module 313a. In the secondary cleaning module 312a, the shutter 97 is closed to prevent drying.

Next, as shown in FIG. 29E, the shutter 97 of the tertiary cleaning module 313a is closed, and the third stage of cleaning is performed on the first wafer W1 in the tertiary cleaning module 313a.

Next, as shown in FIG. 29F, when the first stage cleaning of the second wafer W2 in the primary cleaning module 311a is completed, the shutter 97 of the primary cleaning module 311a is retracted and the arm passage opening 94 is opened. It will be done. At this time, the pair of first arms 611 are rotated by the rotation mechanism, and the tips of the pair of first arms 611 are directed upward.

Then, as shown in FIG. 29G, the pair of first arms 611 are moved to avoid (skip) the tertiary cleaning module 313a and the secondary cleaning module 312a whose shutters 97 are closed, and 311a to the standby position.

Next, as shown in FIG. 29H, the pair of first arms 611 are rotated by the rotation mechanism, and the tips of the pair of first arms 611 are directed sideways. Then, as shown in FIG. 29I, the pair of first arms 611 are closed so as to approach each other, and the second wafer W2 in the primary cleaning module 311a is held by the pair of first arms 611. Thereafter, the second wafer W2 held by the pair of first arms 611 is transferred to the secondary cleaning module 312a, where a second stage of cleaning is performed.

As described above, in this embodiment, a plurality of wafers W can be cleaned in parallel in each of the cleaning modules 311a to 314a and 311b to 314b, so that the throughput of the entire process can be improved.

Next, referring to FIGS. 30A to 30I, the operation of the cleaning section transport mechanism 32a when a plurality of wafers W are cleaned in parallel in the primary to tertiary cleaning modules 311a to 313a of the first cleaning unit 30a. A modification example will be explained.

First, as shown in FIG. 30A, in the primary cleaning module 311a, the shutter 97 is closed and the first stage cleaning is performed on the second wafer W2, and in the secondary cleaning module 312a, the first stage cleaning is performed on the second wafer W2. Assume a situation in which the second stage cleaning for W1 has been completed and the arm passage opening 94 is open. In this case, the pair of first arms 611 are moved to a standby position relative to the secondary cleaning module 312a, and the tips of the pair of first arms 611 are turned sideways.

Then, as shown in FIG. 30B, the pair of first arms 611 are closed so as to approach each other, and the first wafer W1 in the secondary cleaning module 312a is held by the pair of first arms 611. Further, the shutter 97 of the tertiary cleaning module 313a is retracted and the arm passage opening 94 is opened.

Next, as shown in FIG. 30C, the first wafer W1 held by the pair of first arms 611 is moved from the secondary cleaning module 312a to the tertiary cleaning module 313a through the arm passage opening 94. Ru.

Then, as shown in FIG. 30D, the pair of first arms 611 are opened so as to be separated from each other, and are exposed to the left and right outer sides of the tertiary cleaning module 313a. The shutter 97 of the secondary cleaning module 312 is closed.

Next, as shown in FIG. 30E, before the third cleaning module 313a starts the third stage cleaning for the first wafer W1, the first cleaning module 311a performs the first stage cleaning for the second wafer W2. When the cleaning is completed, the shutter 97 of the primary cleaning module 311a is retracted and the arm passage opening 94 is opened.

At this time, as shown in FIG. 30F, the pair of first arms 611 are raised to a height higher than the first wafer W1. Further, the shutter 97 of the secondary cleaning module 312a is retracted and the arm passage opening 94 is opened.

Then, as shown in FIG. 30G, the pair of first arms 611 are moved to pass through the arm passage openings 94 of the tertiary cleaning module 313a and the secondary cleaning module 312a, with their tips facing sideways, The primary cleaning module 311a is placed in a standby position.

Next, as shown in FIG. 30H, the pair of first arms 611 are lowered to the same height as the second wafer W2. On the other hand, in the tertiary cleaning module 313a, the shutter 97 is closed and the third stage of cleaning for the first wafer W1 is started. In the secondary cleaning module 312a, the shutter 97 is closed to prevent drying.

Then, as shown in FIG. 30I, the pair of first arms 611 are closed so as to approach each other, and the second wafer W2 in the primary cleaning module 311a is held by the pair of first arms 611. Thereafter, the second wafer W2 held by the pair of first arms 611 is transferred to the secondary cleaning module 312a, where a second stage of cleaning is performed.

According to the above modification, when moving the pair of first arms 611 from the tertiary cleaning module 313a to the primary cleaning module 311a, the operation of rotating the pair of first arms 611 can be omitted. Therefore, the throughput of the entire process can be further improved.

On the other hand, as in the example shown in FIGS. 29A to 29I, the pair of first arms 611 are rotated to avoid (skip) the tertiary cleaning module 313a and the secondary cleaning module 312a whose shutters 97 are closed. When the pair of first arms 611 are moved as shown in FIG. It can be prevented from adhering to the surface of W1. Further, the third stage cleaning of the first wafer W1 in the tertiary cleaning module 313a can be started earlier.

Each cleaning module 311a-314a and 311b-314b has a detector (not shown) for detecting a failure. When a failure occurs in any of the cleaning modules 311a to 314a and 311b to 314b, a detector detects this and sends a signal to the control unit 15. The control unit 15 selects a cleaning line that avoids the failed cleaning module, and switches the current cleaning line to the newly selected cleaning line.

More specifically, for example, as shown in FIG. 22A, when an abnormality occurs in the tertiary cleaning module 313a of the first cleaning unit 30a, the wafer W located in the secondary cleaning module 312a is transferred to the cleaning section transport mechanism 32a. It is gripped by the first arm 611 of. And Figure 2
2B, with the tip of the second arm 612 of the cleaning unit transport mechanism 32a facing upward, the wafer gripped by the first arm 611 is moved to the first wafer station 33a by driving the arm transport mechanism 62. transported to. At this time, even if the shutter 97 of the tertiary cleaning module 313a fails and remains closed, since the tip of the second arm 612 is directed upward, it will not interfere with the shutter 97 and the tertiary cleaning module You can move by avoiding (skipping) 313a.

Next, as shown in FIGS. 22C and 22D, the transfer robot 23 of the polishing section 12 takes out the wafer W from the first wafer station 33a and transfers it to the second wafer station 33b. The wafer W transferred to the second wafer station 33b is gripped by the first arm 611 of the cleaning section transport mechanism 32b. Then, as shown in FIG. 22E, by driving the arm transport mechanism 62, the wafer W held by the first arm 611 is transported to the primary cleaning module 311b and cleaned.

As described above, in this embodiment, even if an abnormality occurs in any of the plurality of first cleaning modules 311a to 314a, the wafer W located in the first cleaning module 311a to 314a can be cleaned during the second cleaning. By being transported to the modules 311b to 314b and cleaned, the wafers W located in the first cleaning modules 311a to 314a can be rescued. Similarly, even if an abnormality occurs in one of the plurality of second cleaning modules 311b to 314b, the wafer W located in the second cleaning module 311b to 314b is transferred to the first cleaning module 311a to 314a. By cleaning the wafers W located in the second cleaning modules 311b to 314b, it is possible to rescue the wafers W located within the second cleaning modules 311b to 314b.

As shown in FIG. 12, in this embodiment, a first wafer gripping mechanism 601 and a second wafer gripping mechanism 602 are arranged in a suspended manner below the arm transport mechanism 62. This expands the maintenance space for the first wafer gripping mechanism 601 and the second wafer gripping mechanism 602. Therefore, the time required for maintenance can be reduced.

<Pre-cleaning module>
As shown in FIG. 27, the first cleaning unit 30a of the cleaning section 13 further includes a pre-cleaning module 39a that is arranged in the same line as the plurality of cleaning modules 311a to 314a and that cleans the wafer W before polishing. The cleaning unit transport mechanism 32a may transport the wafer W between the preliminary cleaning module 39a and each of the cleaning modules 311a to 314a. In the illustrated example, the pre-cleaning module 39a is located adjacent to the first wafer station 33a on the opposite side of the first wafer station 33a from the cleaning modules 311a-314a.

Similarly, the second cleaning unit 30b further includes a preliminary cleaning module 39a that is arranged in the same line as the plurality of cleaning modules 311b to 314b and that cleans the wafer W before polishing. The wafer W may be transported between the cleaning module 39a and each of the cleaning modules 311a to 314a. In the illustrated example, the pre-cleaning module 39b is located adjacent to the second wafer station 33b on the opposite side of the second wafer station 33b from the cleaning modules 311b-314b.

Each of the preliminary cleaning modules 39a and 39b includes a cleaning machine (not shown) and a housing 91 that covers the cleaning machine. The cleaning machines for the pre-cleaning modules 39a and 39b include, for example, a wet etching device that removes a natural oxide film from the surface of the wafer W before polishing, or a device that removes coarse particles that cause scratches from the surface of the wafer W before polishing. A buffing device that can be used can be used.

The wafer transfer operation to the pre-cleaning module 39b of the second cleaning unit 30b is similar to the wafer transfer operation to the pre-cleaning module 39a of the first cleaning unit 30a. The wafer transfer operation will be explained.

First, as shown in FIG. 28A, the wafer W before polishing is transported along the longitudinal direction by the slide stage 42 of the transport section 14, and is stopped at a position that can be accessed by the transport robot 23 of the polishing section 12.

Next, as shown in FIG. 28B, the wafer W is taken out from the transport section 14 by the transport robot 23 of the polishing section 12. Then, as shown in FIG. 28C, the wafer W held by the transfer robot 23 is delivered to the wafer station 33a.

Next, as shown in FIG. 28D, the wafer W located in the wafer station 33a is held by the first arm 611 of the cleaning section transport mechanism 32a. Then, as shown in FIG. 28E, with the tip of the second arm 612 of the cleaning section transport mechanism 32a facing upward, the arm transport mechanism 62 is driven to move the wafer W held by the first arm 611 to the second arm 612. 1 wafer station 33a to the pre-cleaning module 39a and cleaned.

The wafer W cleaned in the preliminary cleaning module 39a is held again by the first arm 611 of the cleaning section transport mechanism 32a. Then, as shown in FIG. 28C, the wafer W held by the first arm 611 is transported from the pre-cleaning module 39a to the wafer station 33a by driving the arm transport mechanism 62. Then, as shown in FIG. 28B, the wafer W is taken out from the wafer station 33a by the transfer robot 23 of the polishing section 12, and transferred to the first polishing unit 20a or the second transfer unit 24a or the second transfer unit 24b. It is transported to the polishing unit 20b and polished.

More specifically, the pre-cleaning module 39a and the primary cleaning module 311a each move the wafer W and the buff pad relative to each other while bringing the buff pad into contact with the wafer W, and interpose slurry between the wafer W and the buff pad. The secondary cleaning module 312a includes a buffing device (for example, the device disclosed in FIG. 1 of JP-A No. 2016-43471) that polishes and/or scrubs the surface of the wafer W by A roll-type cleaning machine that cleans the front and back surfaces of the wafer W by rotating and pressing a roll-shaped sponge placed on the front and back surfaces of the wafer W (for example, disclosed in FIG. 32 of JP-A No. 2010-50436, etc.) The tertiary cleaning module 313a has a pencil-type cleaning machine (for example, as shown in FIG. 10 of Japanese Patent Laid-Open No. 2000-173966, etc. The quaternary cleaning module 314a has an IPA drying apparatus (for example, Japanese Patent Laid-Open No. 2010-50436) that sprays IPA (isopropyl alcohol) vapor onto the surface of the wafer W to dry it while rotating the wafer W. 33 to 39 of the above publication), the wafer W before polishing is buffed in the preliminary cleaning module 39a, and then transferred to the first polishing unit 20a or It is transported to the second polishing unit 20b and polished, then buffed in the primary cleaning module 311a, cleaned with a roll-shaped sponge in the secondary cleaning module 312a, and shaped like a pencil in the tertiary cleaning module 313a. It is cleaned with a sponge, dried with IPA steam in the fourth cleaning module 314a, and then taken out to the load/unload section 11.

Further, the preliminary cleaning module 39a has a buffing device, the primary cleaning module 311a and the secondary cleaning module 312a each have a roll type cleaning machine, the tertiary cleaning module 313a has a pencil type cleaning machine, and the tertiary cleaning module 313a has a pencil type cleaning machine. When the next cleaning module 314a has an IPA drying device, the wafer W before polishing is buffed in the preliminary cleaning module 39a and then transported to the first polishing unit 20a or the second polishing unit 20b. It is then washed with a roll-shaped sponge in the primary cleaning module 311a and the secondary cleaning module 312a, cleaned with a pencil-shaped sponge in the tertiary cleaning module 313a, and then washed with a pencil-shaped sponge in the tertiary cleaning module 313a. The IPA vapor is dried at 314a, and then taken out to the load/unload section 11.

Further, the preliminary cleaning module 39a, the primary cleaning module 311a, and the secondary cleaning module 312a each have a roll-type cleaning machine, the tertiary cleaning module 313a has a pencil-type cleaning machine, and the 4th cleaning module 314a has an IPA dryer. If the wafer W is equipped with a polishing device, the wafer W before polishing is cleaned with a roll-shaped sponge in the preliminary cleaning module 39a, and then transported to the first polishing unit 20a or the second polishing unit 20b for polishing. Next, the primary cleaning module 311a and the secondary cleaning module 312a are used for continuous cleaning with a rolled sponge, the tertiary cleaning module 313a is used for cleaning with a pencil sponge, and the 4th cleaning module 314a is for cleaning with IPA vapor. It is dried and then taken out to the load/unload section 11.

Further, the preliminary cleaning module 39a and the primary cleaning module 311a each have a roll type cleaning machine, the secondary cleaning module 312a has a pencil type cleaning machine, and the tertiary cleaning module 313a supplies cleaning liquid to the wafer W. A two-fluid jet cleaning machine that ejects gas at high speed to generate a two-fluid jet stream and sprays it at high speed to clean the wafer W (for example, the device disclosed in FIG. 4 of Japanese Patent Application Laid-Open No. 2010-238850) ), and when the fourth cleaning module 314a has an IPA drying device, the wafer W before polishing is cleaned with a rolled sponge in the preliminary cleaning module 39a, and then transferred to the first polishing unit. 20a or the second polishing unit 20b for polishing, then cleaning with a roll-shaped sponge in a primary cleaning module 311a, cleaning with a pencil-shaped sponge in a secondary cleaning module 312a, and tertiary cleaning. It is subjected to two-fluid jet cleaning in module 313a, IPA steam drying in quaternary cleaning module 314a, and then taken out to load/unload section 11.

<Leakage detection part>
FIG. 23 is a schematic diagram showing the liquid leakage detection section 1 provided at the lower part (near the base frame) of the substrate processing apparatus 10. As shown in FIG. 23, the liquid leak detection unit 1 includes a drain pot 2, a drain pan 6 having an inclined slope toward the drain pot 2, and a first installation type liquid leak installed on the bottom surface of the drain pot 2. It has a sensor 3a and a second installation type liquid leakage sensor 3b installed on the slope of the drain pan 6.

For example, photoelectric sensors are used as the first installed liquid leak sensor 3a and the second installed liquid leak sensor 3b. The first installation type liquid leakage sensor 3a and the second installation type liquid leakage sensor 3b each send a signal to the control unit 15 when detecting liquid leakage. The control unit 15 is configured to issue an alarm when receiving a signal from the first installation type liquid leakage sensor 3a, and to stop the operation of the substrate processing apparatus 10 when receiving a signal from the second installation type liquid leakage sensor 3b. It has become.

By the way, as shown in FIG. 24, in the conventional liquid leakage detection unit 200, in order to configure a two-stage detection type level sensor, a fixed type liquid leakage sensor 203a installed on the bottom surface of the drain pot 202, and a liquid leakage sensor 203a installed on the bottom of the drain pot 202, A float-type liquid leakage sensor 203b disposed inside was used. Due to its structure, the float type liquid leakage sensor 203b requires vertical movement in order to detect liquid leakage. Therefore, the drain pot 202 needs to have a certain depth, and the bottom surface of the drain pot 202 protrudes below the lower surface 205 of the base frame of the substrate processing apparatus. In this case, when moving the substrate processing equipment, the fork of the forklift may
There was a possibility that the drain pot 202 would be damaged by contacting the bottom surface of the drain pot 202 and trying to lift it.

Further, as shown in FIG. 24, in the conventional liquid leak detection section 200, the drain pot 202 is formed separately from the drain pan 206 so that it can be easily replaced if the drain pot 202 is damaged. Therefore, there was a possibility that liquid leakage would occur between the drain pot 202 and the drain pan 206.

On the other hand, as shown in FIG. 23, in this embodiment, a two-stage detection type level sensor is configured using two installed liquid leakage sensors 3a and 3b. Therefore, the depth of the drain pot 2 can be made shallow, and the bottom surface of the drain pot 2 can be arranged above the lower surface 5 of the base frame of the substrate processing apparatus 10. This prevents the drain pot 2 from being damaged by the fork of the forklift when the substrate processing apparatus 10 is moved.

Furthermore, in this embodiment, since the depth of the drain pot 2 can be made shallow, the drain pot 2 can be integrally molded with the drain pan 6. In this case, leakage from between the drain pot 2 and the drain pan 6 can be prevented.

FIG. 25 is a schematic diagram showing a modification of the liquid leakage detection section 1. In this modification, the center portion of the bottom surface of the drain pot 2 is raised one step higher, and the second installation type leakage sensor 3b is set in this one step higher portion. According to this embodiment, in addition to obtaining the same effects as the embodiment shown in FIG. 23, the bottom surface of the drain pot 2 is ring-shaped, so that the volume can be increased while reducing the depth of the drain pot 2. You can make it bigger.

In addition, as in the modification shown in FIG. 26, the bottom surface of the drain pot 2 is gradually raised in two steps toward the center, and a second liquid leakage sensor 3b is installed at a portion one step higher than the bottom surface. may be installed, and a third installation type liquid leakage sensor 3c may be installed in a part that is one step higher than that. According to this aspect, it is possible to detect liquid leakage at three levels. Similarly, the number of stages may be increased to four or more stages.

<Polishing process using substrate processing equipment>
Next, an example of a process of polishing a wafer W using the substrate processing apparatus 10 having such a configuration will be described. Note that the polishing process described below is performed by the control section 15 controlling the operations of the loading/unloading section 11, the polishing section 12, the cleaning section 13, and the transport section 14.

First, as shown in FIG. 16A, the wafer W before polishing is taken out from the wafer cassette of the front load section 113 by the transfer robot 111 of the load/unload section 11, and is placed at a position opposite to the loading port 41a of the transfer section 14. will be moved up to Next, as shown in FIG. 16B, after the carry-in port 41a of the transfer unit 14 is opened, the wafer W held by the transfer robot 111 is inserted into the cover 41 through the carry-in port 41a, and is placed on the slide stage 42. It is placed on and supported.

Next, as shown in FIG. 16C, the slide stage 42 holding the wafer W is moved along the longitudinal direction by power applied from the stage moving mechanism 43 to a position facing the outlet 41b. Then, the exit port 41b of the transport section 14 is opened. At this time, an air current flowing from the carry-in port 41a side to the carry-out port 41b side is formed inside the cover 41 of the transport section 14 by the exhaust duct 44. This prevents particles in the polishing section 12 from passing through the transport section 14 and diffusing into the load/unload section 11.

As shown in FIG. 17A, the arm 232 of the transfer robot 23 is extended while the hand 231 of the transfer robot 23 of the polishing section 12 is positioned at the same height as the outlet 41b of the transfer section 14. The hand 231 supported at the tip of the arm is inserted into the inside of the cover 41 through the outlet 41b, and is inserted below the wafer W held on the slide stage 42. Next, the hand 231 is raised, and the wafer W is transferred from the slide stage 42 to the hand 231. Then, by retracting the arm 232, the wafer W held on the hand 231 is taken out from the transport section 14 to the polishing section 12, as shown in FIG. 17B. Thereafter, as shown in FIG. 17C, the hand 231 is turned upside down together with the wafer W by the turning mechanism 234 of the transfer robot 23. Note that in the drawings, the wafer W painted in gray indicates a wafer that is upside down.

Next, as shown in FIG. 17D, the arm 232 is rotated around the axis of the robot body 233, and the hand 231 is directed toward the first transfer unit 24a. Then, the arm 232 is extended, and the wafer W held by the hand 231 is delivered to the first transport unit 24a, and is transported from the first transport unit 24a to the first polishing unit 20a. Note that when the first polishing unit 20a is crowded, the wafer W held by the hand 231 is transferred to the second transport unit 24b, and from the second transport unit 24b to the second polishing unit 20b. and the board may be carried in. In this embodiment, the wafer W transported from the transport section 14 to the polishing section 12 is sorted by the transport robot 23 to the first transport unit 24a and the second transport unit 24b, and from the first transport unit 24a to the first The wafer W is carried into the polishing unit 20a, and at the same time, the wafer W is carried into the second polishing unit 20b from the second transport unit 24b. Therefore, the first polishing unit 20a and the second polishing unit 20b do not share the carrying-in route, which eliminates congestion when carrying substrates into the first polishing unit 20a and the second polishing unit 20b. Therefore, the throughput of the entire process is improved.

Since the wafer transfer operation by the second transfer unit 24b is similar to the wafer transfer operation by the first transfer unit 24a, the wafer transfer operation by the first transfer unit 24a will be described below.

When one wafer is processed continuously (in series) in the first polishing device 21a and the second polishing device 21b, as shown in FIGS. 18A and 18B, the unpolished wafer held by the transfer robot 23 The first wafer W1 is transferred to the third stage 52c of the exchanger 50 located at the standby position L1. Then, as shown in FIG. 18C, the third stage 52c holding the first wafer W1 is moved from the standby position L1 to the first substrate transfer position TP1.

Next, as shown in FIG. 18D, the first pusher 51a rises and passes inside the third stage 52c, and the first wafer W1 on the third stage 52c is pushed up by the first pusher 51a and subjected to first polishing. It is delivered to the top ring 25a of the device 21a. After the first wafer W1 is attracted and held by the top ring 25a of the first polishing device 21a, the first pusher 51a is lowered to the initial height position, as shown in FIG. 18E. Thereafter, as shown in FIG. 18F, the first wafer W1 is polished at the polishing position of the first polishing device 21a (for more details, refer to FIG. 4, and the top ring 25a is placed on the polishing pad 102a (not shown). The polishing pad 102a is moved by a moving means and brought into contact with the first wafer W1 held by the top ring 25a by a lifting means (not shown), and the first wafer W is polished by the relative movement between the top ring 25a and the polishing table 101a. (Hereinafter, polishing of the wafer W at the polishing positions of other polishing apparatuses will be performed in the same manner.) At this time, the third stage 52c is moved from the first substrate transfer position TP1 to the standby position L1, and the second stage 52b is moved from the standby position L1 to the first substrate transfer position TP1. The transfer robot 23 holds the second wafer W2 before polishing.

After polishing of the first wafer W1 in the first polishing device 21a is completed, as shown in FIG. 18G, the first pusher 51a moves up and transfers the polished first wafer W1 to the top ring of the first polishing device 21a. Receive from 25a. Then, as shown in FIG. 18H, the first pusher 51a descends and passes the second stage 52b, and the first wafer W1 on the first pusher 51a is transferred to the second stage 52b. The first wafer W1 held on the second stage 52b is cleaned by a cleaning nozzle (not shown) at the first substrate transfer position TP1. Further, the unpolished second wafer W2 held by the transfer robot 23 is delivered to the third stage 52c located at the standby position L1.

Next, as shown in FIG. 18I, the second stage 52b holding the first wafer W1 is moved from the first substrate transfer position TP1 to the second transfer position TP2, and at the same time the second stage 52b holds the second wafer W2. The third stage 52c is moved from the standby position L1 to the first substrate transfer position TP1. In this way, the two stages 52b and 52c, which hold the wafers W1 and W2, respectively, can be moved to cross each other in opposite directions, thereby improving the throughput of the process.

Next, as shown in FIG. 18J, the second pusher 51b rises and passes inside the second stage 52b, and the first wafer W1 on the second stage 52b is pushed up by the second pusher 51b and subjected to second polishing. It is delivered to the top ring 25b of the device 21b. Further, the first pusher 51a rises and passes inside the third stage 52c, and the second wafer W2 on the third stage 52c is pushed up by the first pusher 51a and received by the top ring 25a of the first polishing device 21a. passed on. Then, as shown in FIG. 18K, after the first wafer W1 is attracted and held by the top ring 25b of the second polishing device 21b, the second pusher 51b is lowered to the initial height position. Further, after the second wafer W2 is attracted and held by the top ring 25a of the first polishing device 21a, the first pusher 51a is lowered to the initial height position.

Thereafter, as shown in FIG. 18L, the first wafer W1 is further polished by the second polishing device 21b, and the second wafer W2 is polished by the first polishing device 21a. At this time, the third stage 52c is moved from the first substrate transfer position TP1 to the standby position L1, and the second stage 52b is moved from the second substrate transfer position TP2 to the first substrate transfer position TP1. Further, the first stage 52a is moved from the standby position L1 to the second substrate transfer position TP2. The transfer robot 23 holds the third wafer W3 before polishing.

After the polishing of the first wafer W1 in the second polishing device 21b is completed, as shown in FIG. 18M, the second pusher 51b moves up and transfers the polished first wafer W1 to the top ring of the second polishing device 21b. Receive from 25b. Further, after polishing of the second wafer W2 in the first polishing device 21a is finished, the first pusher 51a moves up and receives the polished second wafer W2 from the top ring 25a of the first polishing device 21a.

Then, as shown in FIG. 18N, the second pusher 51b descends and passes the first stage 52a, and the first wafer W1 on the second pusher 51b is transferred to the first stage 52a. The first wafer W1 held on the first stage 52a is cleaned by a cleaning nozzle (not shown) at the second substrate transfer position TP2. Further, the first pusher 51a descends and passes the second stage 52b, and the second wafer W2 on the first pusher 51a is transferred to the second stage 52b. The second wafer W2 held on the second stage 52b is cleaned by a cleaning nozzle (not shown) at the first substrate transfer position TP1. The unpolished third wafer W3 held by the transfer robot 23 is transferred to the third stage 52c located at the standby position L1.

Next, as shown in FIG. 18O, the first stage 52a holding the first wafer W1 is moved to the second stage 52a.
The first wafer W1, which has been moved from the substrate transfer position TP2 to the standby position L1 and held on the first stage 52a, is taken out from above the first stage 52a by the transfer robot 23. On the other hand, the second stage 52b holding the second wafer W2 is moved from the first substrate transfer position TP1 to the second substrate transfer position TP2 for polishing processing in the second polishing device 21b. At the same time, the third stage 52c holding the third wafer W3 is moved from the standby position L1 to the first substrate transfer position TP1 for polishing processing in the first polishing device 21b.

When two wafers are processed in parallel by the first polishing device 21a and the second polishing device 21b, as shown in FIGS. 19A and 19B, the wafers before polishing held by the transfer robot 23 are The first wafer W1 is transferred to the third stage 52c of the exchanger 50 located at the standby position L1. Then, as shown in FIG. 19C, the third stage 52c holding the first wafer W1 is moved from the standby position L1 to the first substrate transfer position TP1.

Next, as shown in FIG. 19D, the first pusher 51a rises and passes inside the third stage 52c, and the first wafer W1 on the third stage 52c is pushed up by the first pusher 51a and subjected to first polishing. It is delivered to the top ring 25a of the device 21a. After the first wafer W1 is attracted and held by the top ring 25a of the first polishing device 21a, the first pusher 51a is lowered to the initial height position, as shown in FIG. 19E. The transfer robot 23 holds the second wafer W2 before polishing.

Thereafter, as shown in FIG. 19F, the first wafer W1 is polished by the first polishing device 21a. At this time, the third stage 52c is moved from the first substrate transfer position TP1 to the standby position L1, and the second stage 52b is moved from the standby position L1 to the first substrate transfer position TP1. The unpolished second wafer W2 held by the transport robot 23 is transferred to the third stage 52c located at the standby position L1. Then, as shown in FIG. 19G, the third stage 52c holding the second wafer W2 is moved from the standby position L1 to the second substrate transfer position TP2.

By the way, even when performing parallel processing in the first polishing device 21a and second polishing device 21b, the second stage 52b is It is also possible to use the same second stage 52b to receive wafers from the first polishing apparatus 21a, and to transfer wafers to the second polishing apparatus 21b using the same second stage 52b. However, in this case, as shown in FIG. 31, if a trouble occurs when receiving a wafer from the first polishing device 21a and the second stage 52b becomes unusable, this will drag the wafer to the second polishing device 21b. It becomes impossible to transfer the wafer (deadlock occurs).

On the other hand, in this embodiment, when polishing wafers in parallel in the first polishing device 21a and the second polishing device 21b, the same third stage 52c is used to polish the wafers in the first polishing device 21a and the second polishing device 21b. 21b, and the second stage 52b and first stage 52a are dedicated to receiving wafers from the first polishing device 21a and the second polishing device 21b, respectively. Even if a trouble occurs during wafer reception and the second stage 52b becomes unusable, it is possible to continue transferring wafers to the second polishing device 21b (no deadlock occurs).

Next, as shown in FIG. 19H, the second pusher 51b rises and passes inside the third stage 52c, and the second wafer W2 on the third stage 52c is pushed up by the second pusher 51b and subjected to second polishing. It is delivered to the top ring 25b of the device 21b. After the second wafer W2 is attracted and held by the top ring 25b of the second polishing device 21b, the second pusher 51b is lowered to the initial height position, as shown in FIG. 19I. The transfer robot 23 holds the third wafer W3 before polishing.

Thereafter, as shown in FIG. 19J, the second wafer W2 is polished by the second polishing device 21b. At this time, the third stage 52c is moved from the second substrate transfer position TP2 to the standby position L1, and the first stage 52a is moved from the standby position L1 to the second substrate transfer position TP2. The unpolished third wafer W3 held by the transfer robot 23 is transferred to the third stage 52c located at the standby position L1.

If the polishing in the first polishing device 21a is completed before the polishing in the second polishing device 21b is completed, the first pusher 51a is raised to move the polished first wafer W1 to the 1 is received from the top ring 25a of the polishing device 21a. Then, as shown in FIG. 19L, the first pusher 51a descends and passes the second stage 52b, and the first wafer W1 on the first pusher 51a is transferred to the second stage 52b. The first wafer W1 held on the second stage 52b is cleaned by a cleaning nozzle (not shown) at the first substrate transfer position TP1.

Next, as shown in FIG. 19M, the second stage 52b holding the first wafer W1 is moved from the first substrate transfer position TP1 to the standby position L1, and at the same time, the second stage 52b holding the third wafer W3 is moved from the first substrate transfer position TP1 to the standby position L1. The third stage 52c is moved from the standby position L1 to the first substrate transfer position TP1. The first wafer W1 held on the second stage 52b is taken out from above the second stage 52b by the transfer robot 23 at the standby position L1.

On the other hand, if the polishing in the second polishing device 21b is completed before the polishing in the first polishing device 21a is completed, the second pusher 51b is raised to remove the polished second wafer W2, as shown in FIG. 19N. is received from the top ring 25b of the second polishing device 21b. Then, as shown in FIG. 19O, the second pusher 51b descends and passes the first stage 52a, and the second wafer W2 on the second pusher 51b is transferred to the first stage 52a. The second wafer W2 held on the first stage 52a is cleaned by a cleaning nozzle (not shown) at the second substrate transfer position TP2.

Next, as shown in FIG. 19P, the first stage 52a holding the second wafer W2 is moved from the second substrate transfer position TP2 to the standby position L1, and at the same time, the first stage 52a holding the third wafer W3 is moved from the second substrate transfer position TP2 to the standby position L1. The third stage 52c is moved from the standby position L1 to the second substrate transfer position TP2. The second wafer W2 held on the first stage 52a is taken out from above the first stage 52a by the transfer robot 23 at the standby position L1.

To repeat what has been described above, as shown in FIG. 20A, the wafer W held on the first stage 52a is taken out from the first stage 52a by the hand 231 of the transfer robot 23. Thereafter, the hand 231 and the wafer W are turned upside down by the reversing mechanism 234 of the transfer robot 23.

Next, as shown in FIG. 20B, the arm 232 of the transfer robot 23 is rotated around the axis of the robot body 233, and the hand 231 is directed toward the first wafer station 33a of the first cleaning unit 30a of the cleaning section 13. . Then, as shown in FIG. 20C, the arm 232 is extended, and the wafer W held by the hand 231 is delivered to the first wafer station 33a. More specifically, with the hand 231 of the transfer robot 23 positioned at the same height as the loading port 73 of the first wafer station 33a, the arm 232 is extended, and the wafer W held by the hand 231 is The wafer is carried into the housing 71 through the carry-in port 73 of the first wafer station 33a, placed on the stage 72, and supported.

Note that when the first cleaning unit 30a is crowded, the wafer W held by the hand 231 may be transferred to the second wafer station 33b of the second cleaning unit 30a. In this embodiment, the wafer W transferred from the polishing section to the cleaning section is sorted by the transfer robot 23 to the first cleaning unit 30a and the second cleaning unit 30b. 30b in parallel. Therefore, the throughput of the entire process is improved.

Since the wafer cleaning process in the second cleaning unit 30b is similar to the wafer cleaning process in the first cleaning unit 30a, the wafer cleaning process in the first cleaning unit 30a will be described below.

As shown in FIG. 21A, first, with the tips of the pair of first arms 611 and the pair of second arms 612 facing upward, the first wafer gripping mechanism 601 and the second wafer gripping mechanism 612 are driven by the arm transport mechanism 62. The two-wafer gripping mechanism 602 is moved along the arrangement direction of the first cleaning modules 311a to 314a, and the pair of first arms 611 is stopped at a standby position adjacent to the first wafer station 33a. Then, by driving the first rotation mechanism 631, the pair of first arms 611 are rotated about the rotating shaft 631A, and the tips of the pair of first arms 611 are directed laterally. After the shutter of the first wafer station 33a is retracted and the arm passage opening 74 is opened, the pair of first arms 611 are inserted into the first wafer station 33a through the arm passage opening 74, and the stage 72 The wafer W held above is grasped. After the wafer W is gripped by the pair of first arms 611, the stage 72 is retracted downward.

Next, as shown in FIG. 21B, after the shutter 97 of the primary cleaning module 311a is retracted and the arm passage opening 94 is opened, the hand transport mechanism 62 is driven to move the first wafer gripping mechanism 601 and the second The wafer gripping mechanism 602 is moved along the arrangement direction of the cleaning modules 311a to 314a, and the wafer W gripped by the pair of first arms 611 is transported from the first wafer station 33a to the primary cleaning module 311a, and Next, it is delivered to the washing machine of the washing module 311a. Next, after the pair of first arms 611 are taken out to the outside of the housing 91 of the primary cleaning module 311a, the arm passage opening 94 is closed by the shutter 97, and the wafer W is removed by the cleaning machine of the primary cleaning module 311a. cleaning is performed.

After the cleaning process in the primary cleaning module 311a is completed, the shutter 97 is retracted and the arm passage opening 94 is opened. A pair of first arms 611 are inserted into the housing 91 of the primary cleaning module 311a through the arm passage opening 94, and grip the wafer W cleaned by the cleaning machine.

Next, as shown in FIG. 21C, after the shutter 97 of the secondary cleaning module 312a is retracted and the arm passage opening 94 is opened, the arm transport mechanism 62 is driven to move the first wafer gripping mechanism 601 and the second The wafer gripping mechanism 602 is moved along the arrangement direction of the cleaning modules 311a to 314a, and the wafer W gripped by the pair of first arms 611 is transported from the primary cleaning module 311a to the secondary cleaning module 312a, and Next, it is delivered to the washing machine of the washing module 312a. Next, after the pair of first arms 611 are taken out to the outside of the housing 91 of the secondary cleaning module 312a, the arm passage opening 94 is closed by the shutter 97, and the wafer W is removed by the cleaning machine of the secondary cleaning module 312a. cleaning is performed.

Next, as shown in FIG. 21D, by driving the first rotation mechanism 631, the pair of first arms 611 are rotated about the rotation axis 631A, and the tips of the pair of first arms 611 are directed upward. . Then, with the tips of the pair of first arms 611 and the pair of second arms 612 facing upward, the first wafer gripping mechanism 601 and the second wafer gripping mechanism 602 are driven by the arm transport mechanism 62. The second arms 612 are moved along the arrangement direction of the first cleaning modules 311a to 314a, and the pair of second arms 612 are stopped at a standby position adjacent to the second cleaning module 312a. By driving the second rotation mechanism 632, the pair of second arms 612 are rotated about the rotating shaft 632A, and the tips of the pair of second arms 612 are directed laterally.

After the cleaning process in the secondary cleaning module 312a is completed, the shutter 97 is retracted and the arm passage opening 94 is opened. A pair of second arms 612 are inserted into the housing 91 of the secondary cleaning module 312a through the arm passage opening 94, and grip the wafer W cleaned by the cleaning machine.

As described above, in this embodiment, the wafer W before cleaning in the secondary cleaning module 312a is held and transported by the pair of first arms 611, and the wafer W after cleaning in the secondary cleaning module 312a is conveyed by the pair of first arms 611. is held and transported by the second arm 612 of. That is, the arm is replaced in the secondary cleaning module 312a. This can prevent the pair of first arms 611 from coming into contact with the wafer W after cleaning in the secondary cleaning module 312a and contaminating the wafer W.

Next, as shown in FIG. 21E, after the shutter 97 of the tertiary cleaning module 313a is retracted and the arm passage opening 94 is opened, the arm transport mechanism 62 is driven to move the first wafer gripping mechanism 601 and the second The wafer gripping mechanism 602 is moved along the arrangement direction of the cleaning modules 311a to 314a, and the wafer W gripped by the pair of second arms 612 is transferred from the secondary cleaning module 312a to the tertiary cleaning module 313a. Next, it is delivered to the washing machine of the washing module 313a. Next, after the pair of second arms 612 are taken out of the housing 91 of the tertiary cleaning module 313a, the arm passage opening 94 is closed by the shutter 97, and the wafer W is removed by the cleaning machine of the tertiary cleaning module 313a. cleaning is performed.

After the cleaning process in the tertiary cleaning module 313a is completed, the shutter 97 is retracted and the arm passage opening 94 is opened. A pair of second arms 612 are inserted into the housing 91 of the tertiary cleaning module 313a through the arm passage opening 94, and grip the wafer W cleaned by the cleaning machine.

Next, as shown in FIG. 21F, after the shutter 97 of the quaternary cleaning module 314a is retracted and the arm passage opening 94 is opened, the arm transport mechanism 62 is driven to move the first wafer gripping mechanism 601 and the second The wafer gripping mechanism 602 is moved along the arrangement direction of the cleaning modules 311a to 314a, and the wafer W gripped by the pair of second arms 612 is transferred from the tertiary cleaning module 313a to the quaternary cleaning module 314a. Next, it is delivered to the washing machine of the washing module 314a. Next, after the pair of second arms 612 are taken out to the outside of the housing 91 of the quaternary cleaning module 314a, the arm passage opening 94 is closed by the shutter 97, and the wafer W is removed by the cleaning machine of the quaternary cleaning module 314a. are washed and dried.

After the cleaning and drying processing in the fourth cleaning module 314a is completed, the shutter 97 is retracted and the arm passage opening 94 is opened. The hand of the transfer robot 111 of the loading/unloading section 11 described above is inserted into the housing 91 of the quaternary cleaning module 314a through the arm passage opening 94, and is cleaned with a cleaning machine, and as the final step ( For example, a wafer W that has been subjected to a spin drying process is taken out to the load/unload section 11 .

According to the present embodiment as described above, since the cleaning section 13 has the first cleaning unit 30a and the second cleaning unit 30b arranged in upper and lower stages, a plurality of wafers W are continuously polished. Even when the wafers W are transported from the cleaning section 12 to the cleaning section 13, by distributing the wafers W to the first cleaning unit 30a and the second cleaning unit 30b, it is possible to clean a plurality of wafers W in parallel. can. Therefore, the throughput of the entire process can be improved.

Further, according to the present embodiment, since the wafer W before polishing is transported from the slide stage 42 of the transport section 14 to the polishing section 12, the transport robot 111 disposed in the loading/unloading section 11 is placed in the polishing environment. Prevents contact with contamination.

Further, according to the present embodiment, the first cleaning unit 30a and the second cleaning unit 30a are arranged in two stages, upper and lower, and the slide stage 42 is disposed between the first cleaning unit 30a and the second cleaning unit 30b. Because of this arrangement, it is possible to suppress an increase in the footprint of the entire device.

Further, according to the present embodiment, the polishing unit transport mechanism 22 is arranged adjacent to the transport unit 14 and each of the first polishing unit 20a and the second polishing unit 20b. The wafers W being transported are sorted by the transport robot 23 of the polishing section transport mechanism 22 to the first transport unit 24a and the second transport unit 24b. Then, the wafer W is carried from the first transport unit 24a to the first polishing unit 20a, and the wafer W is carried from the second transport unit 24b to the second polishing unit 20b. In this way, since the first polishing unit 20a and the second polishing unit 20b do not share the wafer loading route, congestion when loading wafers into the first polishing unit 20a and the second polishing unit 20b is eliminated. Thereby, the throughput of the entire process can be improved.

Further, according to the present embodiment, even if an abnormality occurs in any of the cleaning modules 311a to 314a of the first cleaning unit 30a, the wafer W located in the first cleaning unit 30a will be removed during the second cleaning. By being transported to the unit 30b and cleaned, the wafer W located in the first cleaning unit 30a can be rescued.

Further, according to the present embodiment, the first transport unit 24a of the polishing section 12 can transport the wafer W received from the transport robot 23 to each of the first polishing device 21a and the second polishing device 21b. Further, the second transport unit 24b of the polishing section 12 can transport the wafer W received from the transport robot 23 to each of the third polishing device 21c and the fourth polishing device 21d. For example, the first stage 52a of the first transfer unit 24a receives the first wafer from the transfer robot 23 and moves to the first substrate transfer position TP1, and the first pusher 51a rises to move the first wafer from the first stage 52a to the first polishing device. 21a, and while the first wafer is being polished by the first polishing device 21a, the second stage 52b receives the second wafer from the transfer robot 23 and moves to the second substrate transfer position TP2. However, the second pusher 51b rises to transfer the second wafer from the second stage 52b to the second polishing device 21b, and the second wafer can be polished by the second polishing device 21b. By polishing two wafers in parallel in this way, the throughput of the entire process can be improved. After polishing the wafer in the first polishing device 21a, the first pusher 51a descends and transfers the substrate from the first polishing device 21a to the second stage 52b, and the second stage 52b moves to the second substrate transfer position. It is also possible to move to TP2, raise the second pusher 51b, deliver the wafer from the second stage 52b to the second polishing device 21b, and further polish the wafer continuously in the second polishing device 21b. .

Further, according to the present embodiment, since the exchanger 50 of the polishing section 12 has three stages 52a to 52c, for example, both the first stage 52a and the second stage 52b are connected to the first polishing device 21a and the second stage 52b. While being used to transfer wafers to and from the second polishing device 21b, the third stage 52c can be placed on standby to receive the next wafer. This makes it possible to start the polishing process for the next wafer earlier, and to further improve throughput.

Further, according to the present embodiment, when polishing the first wafer W1 and the second wafer W2 in parallel in the first polishing device 21a and the second polishing device 21b, the same third stage 52c is used to transfer wafers to both the first polishing device 21a and the second polishing device 21b, and the second stage 52b and the first stage 52a are dedicated to receiving wafers from the first polishing device 21a and the second polishing device 21b, respectively. Therefore, even if trouble occurs when receiving wafers from one polishing apparatus 21a, wafers can be continuously transferred to the other polishing apparatus 21b (occurrence of deadlock can be avoided).

Further, according to the present embodiment, the cleaning section transport mechanism 32a that transports the wafer W between each of the cleaning modules 311a to 314a has a pair of arms 611 that can be opened and closed and a rotation mechanism 631. Since the moving mechanism 631 can rotate the pair of arms 611 so that the tips thereof face upward, even if the shutter 97 of a particular cleaning module among the plurality of cleaning modules 311a to 314a is closed, this cleaning module cannot be moved. The arm 611 can be moved by avoiding (skipping). Therefore, there is no need to wait for the shutter 97 to open when moving the arm 611 past this cleaning module, and the throughput of the entire process can be improved.

Further, according to the present embodiment, when the rotation mechanism 631 rotates the pair of arms 611 so that the tips thereof are directed upward, the vertical movement mechanism 641 lowers the pair of arms 611. The space required above 611 can be reduced.

Further, according to the present embodiment, since there are two sets consisting of a pair of arms 611, 612, vertical moving mechanisms 641, 642, and rotation mechanisms 631, 632, the cleanliness of the wafer to be held can be improved. Two sets of arms can be used depending on the situation. For example, by using one set of arms for the first half of the cleaning process in each cleaning module and using the other set of arms for the second half of the cleaning process, the wafer undergoing the second half of the cleaning process can be can be prevented from coming into contact with one set of arms and becoming contaminated.

Furthermore, according to the present embodiment, the pair of arms 611 are provided with chuck pieces 612a and 612b in two stages, upper and lower, which can contact the outer circumference of the wafer, so that the cleanliness of the wafer to be held can be improved. The chuck pieces 612a and 612b can be used differently depending on the situation. For example, by using the lower chuck piece 612b for the first half of the cleaning process in each cleaning module and using the upper chuck piece 612a for the second half of the cleaning process, the wafer undergoing the latter half of the cleaning process can be This can prevent the chuck piece 612b from coming into contact with the lower chuck piece 612b and becoming contaminated.

Further, according to the present embodiment, since the wafer gripping mechanism 601 having the pair of arms 611, the vertical movement mechanism 641, and the rotation mechanism 631 is disposed in a suspended manner below the arm transport mechanism 62, the wafer gripping mechanism 601 is The maintenance space for the mechanism 601 is expanded. Therefore, the time required for maintenance can be reduced.

Further, according to the present embodiment, before the unpolished wafer W is polished by the polishing apparatus 12, the surface of the wafer W can be cleaned by the preliminary cleaning module 39a. This can reduce problems such as scratches caused by coarse particles being bitten during the polishing process of the wafer W.

In the embodiment described above, the wafer W before cleaning in the secondary cleaning module 312a is held and transported by the pair of first arms 611, and the wafer W after cleaning in the secondary cleaning module 312a is conveyed by the pair of first arms 611. Although the second arm 612 gripped and transported, the present invention is not limited thereto. For example, a wafer W before cleaning in the primary cleaning module 311a is held and transported by a pair of first arms 611, and a wafer W after cleaning in the primary cleaning module 311a is held and transported by a pair of second arms 612. Alternatively, the wafer W before cleaning in the tertiary cleaning module 313a may be held and conveyed by the pair of first arms 611, and the wafer W after cleaning in the tertiary cleaning module 313a may be conveyed by the pair of first arms 611. It may also be held and transported by two arms 612.

Further, in the embodiment described above, the transport unit (for example, the first transport unit 24a) of the polishing section 12 carries the substrate at two locations for each of the two polishing apparatuses (the first polishing apparatus 21a and the second polishing apparatus 21b). Two pushers (a first pusher 51a and a second pusher 51b) are placed at transfer positions (first substrate transfer position TP1 and second substrate transfer position TP2) and move up and down, and a transfer robot is arranged in two stages, upper and lower. At least two stages (a first stage 52a and a second stage 52b) that move horizontally independently of each other between a standby position L1 where wafers W are transferred to and from the substrate transfer position L1 and two substrate transfer positions TP1 and TP2 are provided. However, the present invention is not limited to this, and the transfer unit of the polishing section 12 is placed at M substrate transfer positions for each of M polishing apparatuses (M is a natural number of 3 or more). M pushers are arranged and move up and down, and M pushers are arranged in M stages above and below and move horizontally independently of each other between a standby position L1 where wafers W are delivered to and from the transport robot 23 and M substrate transport positions. The exchanger 50 may include at least M stages. In this case, the exchanger 50 is arranged in multiple stages above and below the M stages, and at least one exchanger 50 horizontally moves between the standby position L1 and M substrate transfer positions independently of the M stages. It is preferable to have further stages.

In addition, although the above-mentioned embodiment was demonstrated using the polishing apparatus which polishes a wafer as an example, this invention is applicable not only to a polishing apparatus but also to other substrate processing apparatuses. For example, you can replace multiple polishing units with other substrate processing units (e.g., plating processing units, film formation processing units such as CVD units, wet etching units, dry etching units, etc.), and use substrate processing equipment that is separate from the polishing equipment. may be configured. Alternatively, a plurality of different substrate processing units may be combined and arranged side by side in a predetermined direction.

Although preferred embodiments of the present invention have been described so far, it goes without saying that the present invention is not limited to the above-described embodiments and may be implemented in various different forms within the scope of its technical idea.

10 Substrate processing apparatus 11 Load/unload section 12 Polishing section 13 Cleaning section 14 Transport section 15 Control section 20a First polishing unit 20b Second polishing unit 21a First polishing device 21b Second polishing device 21c Third polishing device 21d Fourth Polishing device 22 Polishing unit transport mechanism 23 Transport robot 231 Hand 232 Arm 233 Robot body 234 Reversing mechanism 24a First transport unit 24b Second transport unit 25a to 25d Top ring 311a to 314a Cleaning module 311b to 314b Cleaning module 32a Cleaning unit transport mechanism 32b Cleaning section transport mechanism 33a Wafer station 33b Wafer station 39a Pre-cleaning module 39b Pre-cleaning module 330 Shaft 331 Guide stage 333 Push stage 337 Top ring guide 338 Upper section 338a Taper 339a Receiving section 339b Spring 340 Guide sleeve 341 Center sleeve 346 Linear way 347 Cylinder 349 Electric actuator 351 Compression spring 41 Cover 41a Loading port 41b Loading port 42 Slide stage 43 Stage movement mechanism 44 Exhaust duct 50 Exchanger 51a First pusher 51b Second pusher 52a First stage 52a1 Pin 52b Second stage 52c Third Stage 601 First wafer gripping mechanism 602 Second wafer gripping mechanism 611 First arm 612 Second arm 612a, 612b Chuck piece 62 Arm transport mechanism 631 First rotation mechanism 631A Rotation shaft 632 Second rotation mechanism 632A Rotation shaft 632L Link Member 641 First vertical movement mechanism 642 Second vertical movement mechanism 661 First opening/closing mechanism 662 Second opening/closing mechanism 67 Depth direction movement mechanism 68 Main frame 691 First subframe 692 Second subframe 71 Housing 72 Stage 73 Inlet 74 Arm passage opening 75 Drive mechanism 76 Pin 81 Housing 82 Stage 83 Loading port 84 Arm passage opening 85 Drive mechanism 86 Pin 87 Shutter 91 Housing 94 Arm passage opening 97 Shutter 101 Polishing table 102 Polishing pad 103 Top ring shaft 104 Polishing liquid supply nozzle

Claims (4)

a polishing section that polishes the substrate;
a transport unit that transports the substrate before polishing to the polishing unit;
a cleaning section that cleans the substrate after polishing; a control section that controls the operation of the cleaning section;
Equipped with
The cleaning section includes a plurality of cleaning modules arranged in series, and a cleaning section transport mechanism that transports the substrate between each cleaning module,
The cleaning section transport mechanism is
a pair of arms that can be opened and closed to grip the board;
a vertical movement mechanism that moves the pair of arms up and down;
a rotation mechanism that rotates the pair of arms about a rotation axis parallel to the opening/closing direction;
an arm transport mechanism that moves the pair of arms linearly along the arrangement direction of the plurality of cleaning modules;
has
The control unit controls the operation of the control unit such that when the rotation mechanism rotates the pair of arms so that the tips thereof are directed upward, the vertical movement mechanism lowers the pair of arms. A substrate processing apparatus characterized by: a polishing section that polishes the substrate;
a transport unit that transports the substrate before polishing to the polishing unit;
a cleaning section that cleans the substrate after polishing;
Equipped with
The cleaning section includes a plurality of cleaning modules arranged in series, and a cleaning section transport mechanism that transports the substrate between each cleaning module,
The cleaning section transport mechanism is
a pair of arms that can be opened and closed to grip the board;
a vertical movement mechanism that moves the pair of arms up and down;
a rotation mechanism that rotates the pair of arms about a rotation axis parallel to the opening/closing direction;
an arm transport mechanism that moves the pair of arms linearly along the arrangement direction of the plurality of cleaning modules;
has
The substrate processing apparatus is characterized in that the cleaning section transport mechanism has two sets each including the pair of arms, the vertical movement mechanism, and the rotation mechanism. a polishing section that polishes the substrate;
a transport unit that transports the substrate before polishing to the polishing unit;
a cleaning section that cleans the substrate after polishing;
Equipped with
The cleaning section includes a plurality of cleaning modules arranged in series, and a cleaning section transport mechanism that transports the substrate between each cleaning module,
The cleaning section transport mechanism is
a pair of arms that can be opened and closed to grip the board;
a vertical movement mechanism that moves the pair of arms up and down;
a rotation mechanism that rotates the pair of arms about a rotation axis parallel to the opening/closing direction;
an arm transport mechanism that moves the pair of arms linearly along the arrangement direction of the plurality of cleaning modules;
has
A substrate processing apparatus characterized in that a set consisting of the pair of arms, the vertical movement mechanism, and the rotation mechanism is arranged in a suspended manner below the arm transport mechanism. a polishing section that polishes the substrate;
a transport unit that transports the substrate before polishing to the polishing unit;
a cleaning section that cleans the substrate after polishing;
Equipped with
The cleaning section includes a plurality of cleaning modules arranged in series, and a cleaning section transport mechanism that transports the substrate between each cleaning module,
The cleaning section transport mechanism is
a pair of arms that can be opened and closed to grip the board;
a vertical movement mechanism that moves the pair of arms up and down;
a rotation mechanism that rotates the pair of arms about a rotation axis parallel to the opening/closing direction;
an arm transport mechanism that moves the pair of arms linearly along the arrangement direction of the plurality of cleaning modules;
has
The cleaning unit further includes a pre-cleaning module that is arranged in the same row as the plurality of cleaning modules and that cleans the substrate before polishing,
The substrate processing apparatus is characterized in that the cleaning unit transport mechanism transports the substrate between the pre-cleaning module and each cleaning module.

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