JP7200345B2 - Substrate processing equipment - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus used for flatly polishing a substrate such as a semiconductor wafer.

2. Description of the Related Art In recent years, as semiconductor devices have become more highly integrated, circuit wiring has become finer and the distance between wirings has been becoming narrower. In the manufacture of semiconductor devices, many types of materials are repeatedly formed in film form on a silicon wafer to form a laminated structure. A technique for flattening the surface of the wafer is important for forming this laminated structure. As a means of flattening the surface of such wafers, a polishing apparatus (also referred to as a chemical mechanical polishing apparatus) that performs chemical mechanical polishing (CMP) is widely used.

This chemical mechanical polishing (CMP) apparatus generally includes a polishing table on which a polishing pad is attached, a top ring that holds a wafer, and a nozzle that supplies polishing liquid onto the polishing pad. While the polishing liquid is being supplied onto the polishing pad from the nozzle, the wafer is pressed against the polishing pad by the top ring, and the top ring and the polishing table are moved relative to each other to polish the wafer and flatten its surface.

In addition to such a CMP apparatus, the substrate processing apparatus is an apparatus having a function of cleaning and drying the wafer after polishing. Such a substrate processing apparatus is required to improve the throughput of substrate processing. Since the substrate processing apparatus has various processing units that perform polishing, cleaning, and the like, a delay in processing in each processing unit reduces the throughput of the entire substrate processing apparatus. For example, in the conventional substrate processing apparatus disclosed in Patent Document 1, even if the polishing section has a plurality of polishing units, the cleaning section is provided with only one cleaning line. Polished wafers could not be cleaned and dried at the same time.

Further, in the conventional substrate processing apparatus, when the polishing section has the first polishing unit and the second polishing unit, when polishing the wafer in the first polishing unit, the load/unload section shifts from the first polishing unit to the first polishing unit. A wafer is directly carried into the polishing unit, but when polishing the substrate in the second polishing unit, the wafer is carried from the load/unload section to the second polishing unit via the first polishing unit. rice field. As a result, the first polishing unit and the second polishing unit are congested in the same carry-in route, and the throughput is reduced.

In addition, in the conventional substrate processing apparatus, the transfer robot arranged in the loading/unloading section
Wafers before polishing are directly transferred from the load/unload section to the polishing section, and wafers after cleaning are transferred from the cleaning section to the load/unload section. A high degree of cleanliness is required for the hands of transfer robots that hold wafers after cleaning. .

WO2007/099976

The present invention has been made in consideration of the above points. An object of the present invention is to provide a substrate processing apparatus capable of improving throughput.

A substrate processing apparatus according to the present invention comprises:
a polishing unit that polishes the substrate;
a transport unit that transports the substrate before polishing to the polishing unit;
a cleaning unit that cleans the substrate after polishing;
with
The cleaning section has a first cleaning unit and a second cleaning unit arranged in two stages,
the first cleaning unit and the second cleaning unit each have a plurality of cleaning modules arranged in series;
The transport section is arranged between the first cleaning unit and the second cleaning unit, and has a slide stage that transports the substrate before polishing along the arrangement direction of the plurality of cleaning modules.

According to the present invention, even when a plurality of substrates are continuously transported from the polishing section to the cleaning section, the substrates are distributed to the first cleaning unit and the second cleaning unit so that the plurality of substrates can be cleaned. can be washed in parallel. Therefore, the throughput of the entire process can be improved. Further, since the substrate before polishing is transferred to the polishing section by the slide stage of the transfer section, it is possible to prevent the transfer robot arranged in the loading/unloading section from coming into contact with the polishing environment and being contaminated. In addition, the first cleaning unit and the second cleaning unit are arranged in two stages, one above the other, and the slide stage is arranged between the first cleaning unit and the second cleaning unit, increasing the footprint of the entire apparatus. can be suppressed.

A substrate processing apparatus according to the present invention comprises:
a transport unit that transports the substrate before polishing to the polishing unit;
a cleaning unit that cleans the substrate after polishing;
with
The polishing part is
a first polishing unit and a second polishing unit;
a polishing section transport mechanism arranged adjacent to each of the transport section and the first polishing unit and the second polishing unit;
has
The polishing section transport mechanism includes:
a first transfer unit that transfers the substrate to the first polishing unit;
a second transport unit that transports the substrate to the second polishing unit;
a transport robot disposed between the first transport unit and the second transport unit and configured to transfer substrates between the transport section and the first transport unit and the second transport unit;
have

According to the present invention, the substrates transported from the transport section to the polishing section are distributed to the first transport unit and the second transport unit by the transport robot. Then, the substrate is loaded from the first transport unit to the first polishing unit, and the substrate is loaded from the second transport unit to the second polishing unit. As described above, since the first polishing unit and the second polishing unit do not share the substrate loading path, congestion during loading of the substrate into the first polishing unit and the second polishing unit is eliminated. This can improve the throughput of the entire process.

In the substrate processing apparatus according to the present invention,
The cleaning unit is arranged adjacent to the transport robot,
The transport robot may transfer substrates between the first transport unit and the second transport unit and the cleaning section.

A substrate processing apparatus according to the present invention comprises:
further comprising a control unit that controls operations of the polishing unit and the cleaning unit;
The cleaning section has a first cleaning unit and a second cleaning unit arranged in two stages,
The first cleaning unit includes a plurality of first cleaning modules and a first wafer station arranged in series, and a first cleaning section transfer for transferring substrates between each first cleaning module and the first wafer station. having a mechanism;
The second cleaning unit includes a plurality of second cleaning modules and a second wafer station arranged in series, and a second cleaning section transfer for transferring substrates between each of the second cleaning modules and the second wafer station. having a mechanism;
The control unit
When an abnormality occurs in any of the plurality of first cleaning modules,
the first cleaning section transport mechanism transports the substrate positioned in the first cleaning module to the first wafer station;
the transfer robot transfers the substrate from the first wafer station to the second wafer station;
The operations of the polishing section and the cleaning section may be controlled such that the second cleaning section transport mechanism transports the substrate from the second wafer station to the second cleaning module for cleaning.

According to this aspect, even if an abnormality occurs in any one of the plurality of first cleaning modules, the substrate positioned in the first cleaning module is transported to the second cleaning module and cleaned. Thus, the substrate positioned inside the first cleaning module can be rescued.

A substrate processing apparatus according to the present invention comprises:
a polishing unit that polishes the substrate;
a transport unit that transports the substrate before polishing to the polishing unit;
a cleaning unit that cleans the substrate after polishing;
with
The polishing part is
N polishing apparatuses (N is a natural number of 2 or more);
a transport unit that transports the substrate to each of the N polishing apparatuses;
a transport robot that transfers substrates between the transport unit and the transport unit;
has
The transport unit is
N substrate transfer positions arranged at N substrate transfer positions for each of the N polishing apparatuses and moving up and down
a pusher on the platform;
an exchanger having N stages arranged in upper and lower N stages and independently horizontally moving between a standby position for transferring a substrate to the transfer robot and the N substrate transfer positions;
have

According to the present invention, the transfer unit can transfer the substrate received from the transfer robot to each of the N polishing apparatuses. For example, the first stage of the exchanger receives the first substrate from the transfer robot and moves to the first substrate transfer position, the first pusher rises and the first
While the first substrate is transferred from the stage to the first polishing device, and the first substrate is being polished by the first polishing device, the second stage receives the second substrate from the transfer robot and moves to the second substrate transfer position. As the second pusher moves, the second pusher rises to transfer the second substrate from the second stage to the second polishing device, and the second substrate can be polished by the second polishing device. By polishing two substrates in parallel in this manner, the throughput of the entire process can be improved. After the substrate is polished by the first polishing device, the first pusher descends to transfer the substrate from the first polishing device to the second stage, the second stage moves to the second substrate transfer position, and the second stage moves to the second substrate transfer position. It is also possible that the second pusher is raised to transfer the substrate from the second stage to the second polishing device, and the substrate is further polished by the second polishing device.

In the substrate processing apparatus according to the present invention, the exchangers are arranged in multiple stages above and below the N stages, and the exchangers are arranged between the standby position and the N substrate transfer positions independently of the N stages. It may have at least one further stage for horizontal movement to.

According to this aspect, for example, while both the first stage and the second stage are used for transferring substrates to and from the first polishing apparatus and the second polishing apparatus, the third stage receives the next substrate. You can put it on standby. As a result, the start timing of the polishing process for the next substrate can be advanced, and the throughput can be further improved.

The substrate processing apparatus according to the present invention further comprises a control section for controlling the operation of the polishing section,
The control unit
When polishing substrates continuously by the first polishing device and the second polishing device,
the first stage receives the first substrate from the transfer robot and moves from the standby position to the first substrate transfer position;
a first pusher ascends to transfer the first substrate from the first stage to the first polishing apparatus;
While the first polishing apparatus is polishing the first substrate, the first stage returns to the standby position to receive the second substrate from the transfer robot;
When the polishing by the first polishing device is finished, the first pusher descends to transfer the first substrate from the first polishing device to the second stage;
At the same time when the second stage moves from the first substrate transfer position to the second substrate transfer position, the polishing section moves so that the first stage moves from the standby position to the first substrate transfer position. You can control the action.

According to this aspect, at the same time when the second stage holding the first substrate moves from the first substrate transfer position to the second substrate transfer position, the first stage holding the second substrate moves from the standby position. Since the substrate is moved to the first substrate transfer position, the throughput of the process is improved.

The substrate processing apparatus according to the present invention further comprises a control section for controlling the operation of the polishing section,
The control unit
When polishing the substrate in parallel with the first polishing device and the second polishing device,
using the first stage to receive the substrate from the first polishing apparatus, but not to transfer the substrate to the second polishing apparatus;
The operation of the polishing section may be controlled so that the second stage is used for receiving the substrate from the second polishing apparatus, but is not used for transferring the substrate to the first polishing apparatus.

According to this aspect, when substrates are polished in parallel by the first polishing device and the second polishing device, the first stage and the second stage receive substrates from the first polishing device and the second polishing device, respectively. Since it is dedicated, even if a problem occurs when receiving a substrate from one of the polishing apparatuses, the transfer of the substrate to the other polishing apparatus can be continued (occurrence of deadlock can be avoided).

The substrate processing apparatus according to the present invention further comprises a control section for controlling the operation of the polishing section,
The control unit
When polishing the first substrate and the second substrate in parallel with the first polishing device and the second polishing device,
a first stage receives the first substrate from the transfer robot and moves from the standby position to the first substrate transfer position;
a first pusher ascends to transfer the first substrate from the first stage to the first polishing apparatus;
While the first polishing apparatus is polishing the first substrate, the first stage returns from the first substrate transfer position to the standby position, receives the second substrate from the transfer robot, and leaves the standby position. moving to the second substrate transfer position;
the second pusher rises to transfer the second substrate from the first stage to the second polishing apparatus;
While the second polishing apparatus is polishing the second substrate, the first stage returns from the second substrate transfer position to the standby position to receive the third substrate from the transfer robot;
If polishing with the first polishing device is finished before polishing with the second polishing device is finished,
the first pusher descends to transfer the first substrate from the first polishing device to a second stage;
Simultaneously with the movement of the second stage from the first substrate transfer position to the standby position, the first stage moves from the standby position to the first substrate transfer position;
If polishing with the second polishing device is finished before polishing with the first polishing device is finished,
the second pusher descends to transfer the second substrate from the second polishing device to a third stage;
At the same time when the third stage moves from the second substrate transfer position to the standby position, the polishing section is operated such that the first stage moves from the standby position to the first substrate transfer position. may be controlled.

According to this aspect, when polishing the first substrate and the second substrate in parallel with the first polishing device and the second polishing device, the same first stage is used for the first polishing device and the second polishing device. and the second stage and the third stage are dedicated to receiving substrates from the first and second polishing apparatuses, respectively. However, the transfer of the substrate to the other polishing apparatus can be continued (occurrence of deadlock can be avoided).

A substrate processing apparatus according to the present invention comprises:
a polishing unit that polishes the substrate;
a transport unit that transports the substrate before polishing to the polishing unit;
a cleaning unit that cleans the substrate after polishing;
with
The cleaning unit has a plurality of cleaning modules arranged in series and a cleaning unit transport mechanism for transporting the substrate between the cleaning modules,
The cleaning unit transport mechanism includes:
a pair of openable and closable arms that hold the substrate;
a vertical movement mechanism for vertically moving the pair of arms;
a rotating mechanism for rotating the pair of arms around a rotating shaft parallel to the opening/closing direction;
an arm transfer mechanism that linearly moves the pair of arms along the direction in which the plurality of cleaning modules are arranged;
have

According to the present invention, since the rotating mechanism can rotate the pair of arms so that the tip faces upward, even if the shutter of a specific cleaning module among the plurality of cleaning modules is closed, the cleaning module can be rotated. You can avoid (skip) and move the arm. Therefore, there is no need to wait for the shutter to open when moving the arm past this cleaning module, which improves the throughput of the overall process.

The substrate processing apparatus according to the present invention further comprises a control section for controlling the operation of the cleaning section,
The control unit controls the operation of the control unit so that the vertical movement mechanism lowers the pair of arms when the rotation mechanism rotates the pair of arms so that the tips thereof are directed upward. may

According to this aspect, since the vertical movement mechanism lowers the pair of arms when the rotation mechanism rotates the pair of arms so that the tips thereof face upward, the space required above the pair of arms is required. can be reduced.

The substrate processing apparatus according to the present invention may have two sets of the pair of arms, the vertical movement mechanism, and the rotation mechanism.

According to this aspect, two sets of arms can be used according to the cleanliness of the substrate to be held. For example, one set of arms is used in the first half of the cleaning process in each cleaning module, and the other set of arms is used in the second half of the cleaning process. can be prevented from contacting one set of arms and being contaminated.

In the substrate processing apparatus according to the present invention, the pair of arms may be provided with upper and lower chuck pieces capable of coming into contact with the outer peripheral portion of the substrate.

According to this aspect, the chuck piece can be used properly according to the cleanliness of the substrate to be held. For example, the first half of the cleaning process in each cleaning module uses the lower chucking piece, and the second half of the cleaning process uses the upper chucking piece. It is possible to prevent contamination due to contact with the chuck piece.

In the substrate processing apparatus according to the present invention, the pair of arms, the vertical movement mechanism, and the rotation mechanism may be suspended below the arm transport mechanism.

According to such an aspect, the maintenance space for the group consisting of the pair of arms, the vertical movement mechanism, and the rotation mechanism can be enlarged. Therefore, the time required for maintenance can be shortened.

In the substrate processing apparatus according to the present invention, the cleaning section further includes a pre-cleaning module that is arranged in line with the plurality of cleaning modules and that cleans the substrate before polishing, and the cleaning section transport mechanism includes the pre-cleaning module. and each cleaning module.

According to this aspect, the surface of the substrate to be polished can be cleaned by the pre-cleaning module before the substrate is polished by the polishing apparatus. As a result, it is possible to reduce troubles such as the generation of scratches due to the inclusion of coarse particles during the polishing process of the substrate.

According to the present invention, throughput can be improved in a substrate processing apparatus.

FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to one embodiment of the present invention. FIG. 2 is a side view of the substrate processing apparatus shown in FIG. 1 as seen from the cleaning section side. FIG. 3 is an exploded perspective view showing a transfer section of the substrate processing apparatus shown in FIG. 1. FIG. 4 is a perspective view schematically showing a first polishing device of the substrate processing apparatus shown in FIG. 1. FIG. 5 is a side view of the transfer robot of the substrate processing apparatus shown in FIG. 1. FIG. 6 is a perspective view showing a first transport mechanism of the substrate processing apparatus shown in FIG. 1. FIG. 7 is a longitudinal sectional view showing the first pusher of the first transport mechanism shown in FIG. 6. FIG. 8 is a perspective view showing a first wafer station of the cleaning section shown in FIG. 2; FIG. 9 is an exploded perspective view showing the internal configuration of the first wafer station shown in FIG. 8. FIG. 10 is a perspective view showing a second wafer station of the cleaning section shown in FIG. 2; FIG. 11 is an exploded perspective view showing the internal configuration of the second wafer station shown in FIG. 10. FIG. 12 is a diagram showing a cleaning section transport mechanism of the first cleaning unit of the cleaning section shown in FIG. 2. FIG. 13A is a schematic diagram for explaining the operation of the second wafer gripping mechanism of the cleaning section transfer mechanism shown in FIG. 12. FIG. 13B is a schematic diagram for explaining the operation of the second wafer gripping mechanism of the cleaning section transfer mechanism shown in FIG. 12. FIG. 13C is a schematic diagram for explaining the operation of the second wafer gripping mechanism of the cleaning section transfer mechanism shown in FIG. 12. FIG. 13D is a schematic diagram for explaining the operation of the second wafer gripping mechanism of the cleaning section transfer mechanism shown in FIG. 12. FIG. 13E is a schematic diagram for explaining the operation of the second wafer gripping mechanism of the cleaning section transfer mechanism shown in FIG. 12. FIG. 14 is a perspective view showing a state in which the second wafer gripping mechanism of the cleaning section transport mechanism shown in FIG. 12 grips the substrate with the upper chuck piece. FIG. 15 is a perspective view showing a state in which the second wafer gripping mechanism of the cleaning section transport mechanism shown in FIG. 12 grips the substrate with the lower chuck piece. FIG. 16A is a schematic diagram for explaining the operation of the transport unit; FIG. 16B is a schematic diagram for explaining the operation of the transport unit; FIG. 16C is a schematic diagram for explaining the operation of the transport unit; FIG. 17A is a schematic diagram for explaining the operation of the transport robot. FIG. 17B is a schematic diagram for explaining the operation of the transport robot. FIG. 17C is a schematic diagram for explaining the operation of the transport robot. FIG. 17D is a schematic diagram for explaining the operation of the transport robot. FIG. 18A is a schematic diagram for explaining the operation of the first transport mechanism; 18B is a schematic diagram for explaining the operation of the first transport mechanism; FIG. 18C is a schematic diagram for explaining the operation of the first transport mechanism; FIG. FIG. 18D is a schematic diagram for explaining the operation of the first transport mechanism; 18E is a schematic diagram for explaining the operation of the first transport mechanism; FIG. FIG. 18F is a schematic diagram for explaining the operation of the first transport mechanism; 18G is a schematic diagram for explaining the operation of the first transport mechanism; FIG. 18H is a schematic diagram for explaining the operation of the first transport mechanism; FIG. FIG. 18I is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 18J is a schematic diagram for explaining the operation of the first transport mechanism. 18K is a schematic diagram for explaining the operation of the first transport mechanism; FIG. FIG. 18L is a schematic diagram for explaining the operation of the first transport mechanism; 18M is a schematic diagram for explaining the operation of the first transport mechanism; FIG. 18N is a schematic diagram for explaining the operation of the first transport mechanism; FIG. FIG. 18O is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19A is a schematic diagram for explaining the operation of the first transport mechanism; 19B is a schematic diagram for explaining the operation of the first transport mechanism; FIG. FIG. 19C is a schematic diagram for explaining the operation of the first transport mechanism; FIG. 19D is a schematic diagram for explaining the operation of the first transport mechanism; FIG. 19E is a schematic diagram for explaining the operation of the first transport mechanism; FIG. 19F is a schematic diagram for explaining the operation of the first transport mechanism; FIG. 19G is a schematic diagram for explaining the operation of the first transport mechanism. 19H is a schematic diagram for explaining the operation of the first transport mechanism; FIG. FIG. 19I is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19J is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19K is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19L is a schematic diagram for explaining the operation of the first transport mechanism; 19M is a schematic diagram for explaining the operation of the first transport mechanism; FIG. 19N is a schematic diagram for explaining the operation of the first transport mechanism; FIG. FIG. 19O is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 19P is a schematic diagram for explaining the operation of the first transport mechanism. FIG. 20A is a schematic diagram for explaining the movement of the transport robot with respect to the cleaning unit; FIG. 20B is a schematic diagram for explaining the movement of the transport robot with respect to the cleaning section. FIG. 20C is a schematic diagram for explaining the movement of the transport robot with respect to the cleaning section; FIG. 21A is a schematic diagram for explaining the operation of the first cleaning unit. FIG. 21B is a schematic diagram for explaining the operation of the first cleaning unit. FIG. 21C is a schematic diagram for explaining the operation of the first cleaning unit. FIG. 21D is a schematic diagram for explaining the operation of the first cleaning unit. FIG. 21E is a schematic diagram for explaining the operation of the first cleaning unit. FIG. 21F is a schematic diagram for explaining the operation of the first cleaning unit. FIG. 22A is a schematic diagram for explaining the operation when an abnormality occurs in the first cleaning unit. FIG. 22B is a schematic diagram for explaining the operation when an abnormality occurs in the first cleaning unit. FIG. 22C is a schematic diagram for explaining the operation when an abnormality occurs in the first cleaning unit. FIG. 22D is a schematic diagram for explaining the operation when an abnormality occurs in the first cleaning unit. FIG. 22E is a schematic diagram for explaining the operation when an abnormality occurs in the first cleaning unit. FIG. 23 is a schematic diagram showing an example of a liquid leakage detector of the substrate processing apparatus shown in FIG. FIG. 24 is a schematic diagram showing a conventional liquid leakage detector. FIG. 25 is a schematic diagram showing a modification of the liquid leakage detector of the substrate processing apparatus shown in FIG. FIG. 26 is a schematic diagram showing a modification of the liquid leakage detector of the substrate processing apparatus shown in FIG. FIG. 27 is a side view of a wash station with a prewash module. 28A is a schematic diagram for explaining the wafer transfer operation to the cleaning module of the cleaning section of FIG. 27; FIG. 28B is a schematic diagram for explaining the wafer transfer operation to the cleaning module of the cleaning section of FIG. 27. FIG. 28C is a schematic diagram for explaining the wafer transfer operation to the cleaning module of the cleaning section of FIG. 27; FIG. 28D is a schematic diagram for explaining the wafer transfer operation to the cleaning module of the cleaning section of FIG. 27; FIG. 28E is a schematic diagram for explaining the wafer transfer operation to the cleaning module of the cleaning section of FIG. 27; FIG. FIG. 29A is a schematic diagram for explaining an example of the operation of the cleaning section transfer mechanism when multiple wafers are cleaned in parallel in each cleaning module. FIG. 29B is a schematic diagram for explaining an example of the operation of the cleaning section transfer mechanism when cleaning a plurality of wafers in each cleaning module in parallel. FIG. 29C is a schematic diagram for explaining an example of the operation of the cleaning section transport mechanism when cleaning a plurality of wafers in each cleaning module in parallel. FIG. 29D is a schematic diagram for explaining an example of the operation of the cleaning section transport mechanism when cleaning a plurality of wafers in each cleaning module in parallel. FIG. 29E is a schematic diagram for explaining an example of the operation of the cleaning section transfer mechanism when cleaning a plurality of wafers in each cleaning module in parallel. FIG. 29F is a schematic diagram for explaining an example of the operation of the cleaning section transfer mechanism when cleaning a plurality of wafers in each cleaning module in parallel. FIG. 29G is a schematic diagram for explaining an example of the operation of the cleaning section transfer mechanism when cleaning a plurality of wafers in each cleaning module in parallel. FIG. 29H is a schematic diagram for explaining an example of the operation of the cleaning section transfer mechanism when cleaning a plurality of wafers in each cleaning module in parallel. FIG. 29I is a schematic diagram for explaining an example of the operation of the cleaning section transfer mechanism when cleaning a plurality of wafers in each cleaning module in parallel. FIG. 30A is a schematic diagram for explaining a modification of the operation of the cleaning section transfer mechanism when multiple wafers are cleaned in parallel in each cleaning module. FIG. 30B is a schematic diagram for explaining a modification of the operation of the cleaning section transfer mechanism when multiple wafers are cleaned in parallel in each cleaning module. FIG. 30C is a schematic diagram for explaining a modification of the operation of the cleaning section transfer mechanism when multiple wafers are cleaned in parallel in each cleaning module. FIG. 30D is a schematic diagram for explaining a modification of the operation of the cleaning section transfer mechanism when a plurality of wafers are cleaned in parallel in each cleaning module. FIG. 30E is a schematic diagram for explaining a modification of the operation of the cleaning section transfer mechanism when multiple wafers are cleaned in parallel in each cleaning module. FIG. 30F is a schematic diagram for explaining a modification of the operation of the cleaning section transfer mechanism when multiple wafers are cleaned in parallel in each cleaning module. FIG. 30G is a schematic diagram for explaining a modification of the operation of the cleaning section transfer mechanism when multiple wafers are cleaned in parallel in each cleaning module. FIG. 30H is a schematic diagram for explaining a modification of the operation of the cleaning section transfer mechanism when multiple wafers are cleaned in parallel in each cleaning module. FIG. 30I is a schematic diagram for explaining a modification of the operation of the cleaning section transfer mechanism when multiple wafers are cleaned in parallel in each cleaning module. FIG. 31 is a schematic diagram for explaining occurrence of deadlock in parallel processing.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in the following description and the drawings used in the following description, the same reference numerals are used for parts that can be configured in the same manner, and redundant description is omitted.

FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a side view of the polishing apparatus shown in FIG. 1 as seen from the cleaning section side. As shown in FIGS. 1 and 2, the substrate processing apparatus 10 according to the present embodiment includes a substantially rectangular housing in a plan view. It is divided into a section 13 and a transport section 14 . These load/unload section 11, polishing section 12, cleaning section 13
, and the conveying section 14 are independently assembled and independently evacuated. The substrate processing apparatus 10 is also provided with a control section 15 (also referred to as a control panel) that controls the operations of the loading/unloading section 11 , the polishing section 12 , the cleaning section 13 , and the transfer section 14 .

<Load/Unload part>
The loading/unloading section 11 includes a plurality of (four in the illustrated example) front loading sections 113 on which wafer cassettes stocking a large number of wafers (substrates) W are placed. These front load sections 113 are arranged adjacent to each other in the width direction (perpendicular to the longitudinal direction) of the substrate processing apparatus 10 . The front load section 113 includes an open cassette, SMIF (
Standard Manufacturing Interface) pod or FOUP (Front Opening Unified Pod). Here, the SMIF and FOUP are sealed containers that contain wafer cassettes and are covered with partition walls to maintain an environment independent of the external space.

A traveling mechanism 112 is laid in the loading/unloading section 11 along the direction in which the front loading sections 113 are arranged. A robot 111 is installed. The transfer robot 111 can access the wafer cassette mounted on the front load section 113 by moving on the traveling mechanism 112 . This transfer robot 111 has two upper and lower hands. For example, when returning the wafer W to the wafer cassette, the upper hand is used,
When the wafer W before polishing is transported, the lower hand is used, and the upper and lower hands can be selectively used.
Instead of this, the wafer W may be transported using only a single hand.

Since the loading/unloading section 11 is an area that needs to be kept in the cleanest state, the inside of the loading/unloading section 11 includes the outside of the apparatus, the polishing section 12, the cleaning section 13, and the transfer section 1.
4 is always maintained at a higher pressure than any of 4. A filter fan unit (not shown) having a clean air filter such as a HEPA filter or a ULPA filter is provided above the traveling mechanism 112 of the transfer robot 111. This filter fan unit removes particles, toxic vapors, Clean air from which gas has been removed is constantly blown downward.

<Conveyor>
The transfer section 14 is a region for transferring wafers before polishing from the load/unload section 11 to the polishing section 12 , and is provided so as to extend along the longitudinal direction of the substrate processing apparatus 10 . Figure 1
2, the transport section 14 is arranged adjacent to both the load/unload section 11, which is the cleanest area, and the polishing section 12, which is the dirtiest area. Therefore, in order to prevent the particles in the polishing section 12 from diffusing into the load/unload section 11 through the transfer section 14, as will be described later, inside the transfer section 14, from the load/unload section 11 side to the polishing section 1
An air current flowing to two sides is formed.

The structure of the transport section 14 will be described in detail. FIG. 3 is an exploded perspective view showing the internal configuration of the transport section 14. As shown in FIG. As shown in FIG. 3, the transfer unit 14 includes a cover 41 extending in the longitudinal direction, a slide stage 42 arranged inside the cover 41 to hold the wafer W, and linearly moving the slide stage 42 along the longitudinal direction. It has a stage moving mechanism 43 and an exhaust duct 44 for exhausting the inside of the cover 41 .

The cover 41 has a bottom plate, four side plates, and a top plate (not shown in FIG. 3). On one of the side plates in the longitudinal direction, a carry-in port 4 communicating with the loading/unloading section 11 is provided.
1a is formed. An outlet 41b communicating with the polishing section 12 is formed at the end of one side plate in the width direction opposite to the inlet 41a. The carry-in port 41a and the carry-out port 41b can be opened and closed by a shutter (not shown). The transfer robot 111 of the loading/unloading section 11 can access the slide stage 42 inside the cover 41 from the carry-in port 41a, and the transfer robot 23 of the polishing section 12 can access the cover 4 from the carry-out port 41b.
A slide stage 42 inside 1 is accessible.

As the stage moving mechanism 43, for example, a motor drive mechanism using a ball screw or an air cylinder is used. It is preferable to use a rodless cylinder as the stage moving mechanism 43 because dust generation from the sliding portion can be prevented. The slide stage 42 is fixed to the movable portion of the stage moving mechanism 43 and linearly moved along the longitudinal direction inside the cover 41 by the power given from the stage moving mechanism 43 .

Four pins are provided on the outer periphery of the slide stage 42 so as to protrude upward. The wafer W placed on the slide stage 42 by the transfer robot 111 of the loading/unloading section 11 is supported on the slide stage 42 with its outer periphery being guided and positioned by four pins. It's becoming These pins are made of resins such as polypropylene (PP), polychlorotrifluoroethylene (PCTFE) and polyetheretherketone (PEEK).

The exhaust duct 44 is provided on the other side plate of the cover 41 in the longitudinal direction (the side plate opposite to the carry-in port 41a). By exhausting air through the exhaust duct 44 with the carry-in port 41 a opened, an air current flowing from the carry-in port 41 a side to the carry-out port 41 b side is formed inside the cover 41 . This prevents particles in the polishing section 12 from diffusing into the loading/unloading section 11 through the transport section 14 .

<Polishing part>
As shown in FIG. 1, the polishing section 12 is an area where the wafer W is polished.
a second polishing unit 20b having a fourth polishing device 21d, and a polishing section transport mechanism 22 arranged adjacent to the transport section 14 and the first polishing unit 20a and the second polishing unit 20b, respectively. have. The polishing section transport mechanism 22 is arranged between the cleaning section 13 and the first polishing unit 20 a and the second polishing unit 20 b in the width direction of the substrate processing apparatus 10 .

The first polishing device 21 a, the second polishing device 21 b, the third polishing device 21 c, and the fourth polishing device 21 d are arranged along the longitudinal direction of the substrate processing apparatus 10 . second polishing device 21b,
Since the third polishing device 21c and the fourth polishing device 21d have the same configuration as the first polishing device 21a, the first polishing device 21a will be described below.

FIG. 4 is a perspective view schematically showing the first polishing device 21a. The first polishing apparatus 21a includes a polishing table 101a to which a polishing pad 102a having a polishing surface is attached, and a top ring for holding and polishing the wafer W while pressing the wafer W against the polishing pad 102a on the polishing table 101a. 25a, a polishing liquid supply nozzle 104a for supplying a polishing liquid (also referred to as slurry) or a dressing liquid (for example, pure water) to the polishing pad 102, and a dresser for dressing the polishing surface of the polishing pad 102a. ) and an atomizer (not shown) for atomizing a mixture of liquid (eg, pure water) and gas (eg, nitrogen gas) or liquid (eg, pure water) and spraying it onto the polishing surface.

Of these, the top ring 25a is supported by a top ring shaft 103a. A polishing pad 102a is attached to the upper surface of the polishing table 101a.
The upper surface of 02a constitutes a polishing surface for polishing the wafer W. FIG. A fixed whetstone can also be used instead of the polishing pad 102a. The top ring 25a and the polishing table 101a are
As indicated by the arrow in FIG. 4, it is configured to rotate around its axis. The wafer W is held by vacuum suction on the lower surface of the top ring 25a. During polishing, the polishing liquid is supplied from the polishing liquid supply nozzle 104a to the polishing surface of the polishing pad 102a, and the wafer W to be polished is polished by being pressed against the polishing surface by the top ring 25a.

Considering the use of slurry during polishing, the polishing portion 12 is the dirtiest area. Therefore, in this embodiment, the first polishing device 21a, the second polishing device 21b, and the third polishing device 21 are arranged so that the particles in the polishing section 12 do not scatter to the outside.
The surroundings of the respective polishing tables of the fourth polishing apparatus 21d and the fourth polishing apparatus 21d are evacuated, and the pressure inside the polishing section 12 is released to the outside of the apparatus, the surrounding cleaning section 13, the loading/unloading section 11, and the conveying section. Particle scattering is prevented by making the pressure lower than 14 . In addition, an exhaust duct (not shown) is normally provided below the polishing table, and a filter (not shown) is provided above the polishing table, and purified air is blown out through these exhaust ducts and filters. , a down flow is formed.

As shown in FIG. 1, the top ring 25a of the first polishing device 21a moves between the polishing position and the first substrate transfer position TP1 by swinging the top ring head, and transfers the wafer to the first polishing device 21a. Delivery is performed at the first substrate transfer position TP1. Similarly, the top ring 25b of the second polishing device 21b is moved between the polishing position and the second substrate transfer position TP2 by the swinging motion of the top ring head, and the transfer of the wafer to the second polishing device 21b is performed at the second position. At the substrate transfer position TP2, the top ring 25c of the third polishing device 21c moves between the polishing position and the third substrate transfer position TP3 by the swinging motion of the top ring head. Wafer transfer is performed at the third substrate transfer position TP3.
The top ring 25d of the polishing device 21d moves between the polishing position and the fourth substrate transfer position TP4 by swinging the top ring head. is done.

The polishing section transport mechanism 22 includes a first transport unit 24a that transports the wafer W to the first polishing unit 20a, a second transport unit 24b that transports the wafer W to the second polishing unit 20b,
It is arranged between the first transport unit 24a and the second transport unit 24b, and the transport section 14 and the first
It has a transfer robot 23 for transferring wafers between the transfer unit 24a and the second transfer unit 24b. In the illustrated example, the transfer robot 23 is the substrate processing apparatus 1
0 housing in the approximate center.

FIG. 5 is a side view showing the transport robot 23. As shown in FIG. As shown in FIG. 5, the transport robot 23
are a hand 231 that holds the wafer W, and an inversion mechanism 234 that inverts the hand 231 upside down.
, an extendable arm 232 that supports the hand W, and a robot body 233 that includes an arm vertical movement mechanism that vertically moves the arm 232 and an arm rotation mechanism that rotates the arm 232 around a vertical axis. ing. The robot main body 233 is attached to the ceiling frame of the polishing section 14 so as to be suspended.

In this embodiment, the hand 231 moves from the carry-out port 41b of the transport unit 14 to the slide stage 4.
2 is accessible. The hand 231 can also access the first transport unit 24 a and the second transport unit 24 b of the polishing section 12 . Therefore, the wafers W continuously transferred from the transfer section 14 to the polishing section 12 are distributed by the transfer robot 23 to the first transfer unit 24a and the second transfer unit 24b.

Since the second transport unit 24b has the same configuration as the first transport unit 24a,
The first transport unit 24a will be described below. FIG. 6 is a perspective view showing the first transport unit 24a.

As shown in FIG. 6, the first transfer unit 24a is arranged at a first substrate transfer position TP1 with respect to the first polishing device 21a, and moves vertically moving first pusher 51a and a second substrate transfer position with respect to the second polishing device 21b. A second pusher 51b which is arranged at TP2 and moves up and down, and a first stage 52a, a second stage 52b and a third stage which horizontally move independently between the first substrate transfer position TP1 and the second substrate transfer position TP2. exchanger 5 with 52c
0 and .

Among them, the first pusher 51a transfers the wafer W held on any one of the first to third stages 52a to 52c to the top ring 25a of the first polishing device 21a, and also transfers the wafer W to the top ring 25a of the first polishing device 21a. The wafer W is delivered to one of the first to third stages 52a to 52c. Further, the second pusher 51b includes first to third stages 52a to 52
The wafer W held by one of the stages c is transferred to the top ring 25b of the second polishing device 21b, and the wafer W after polishing in the second polishing device 21b is transferred to the first to third stages 52a.
to 52c. Thus, the first pusher 51a and the second
The pusher 51b functions as a transfer mechanism that transfers the wafer W between the exchanger 50 and each top ring. Since the second pusher 51b has the same structure as the first pusher 51a, only the first pusher 51a will be described below.

FIG. 7 is a longitudinal sectional view showing the first pusher 51a. As shown in FIG. 7, the first pusher 51a includes a guide stage 331 for holding the top ring of the first polishing device 21a and a push stage 333 for holding the wafer W. As shown in FIG. Four top ring guides 337 are installed on the outermost periphery of the guide stage 331 . Top ring guide 33
An upper step portion 338 of the top ring 7 is an access portion to the lower surface of a guide ring (not shown surrounding the outer circumference of the wafer W) of the top ring. The upper section 338 has a taper (25 mm) for introducing the top ring.
° to 35°) is formed. When the wafer is unloaded, the top ring guide 337 directly receives the wafer edge.

A guide sleeve 340 having a waterproof function is installed on the back surface of the guide stage 331 . A center sleeve 341 is installed inside the guide sleeve 340 for waterproofing the pusher.

In order to provide the top ring guide 337 with an alignment mechanism, a linear way 346 that moves in the horizontal X-axis and Y-axis directions to center the guide stage 331 is arranged. Guide stage 331 is fixed to linear way 346 . This linear way 346 has a structure capable of returning to the central position by applying pressure. Centering of the guide stage 331 is realized by this structure. Alternatively, only the spring inside the linear way 346 can return to the central position without applying pressure.

Also, the linear way 346 is fixed to a shaft 330, and this shaft 330 is connected to a cylinder 347 having a ball spline mechanism. A motor (not shown) drives the cylinder 347 to move the guide stage 331 up and down via the shaft 330 .

The push stage 333 is arranged above the guide stage 331 , and an electric actuator 349 for vertically moving the push stage 333 with respect to the guide stage 331 is provided at the center of the push stage 333 . The push stage 333 is vertically moved by an electric actuator 349 to load the wafer W onto the top ring. In this embodiment, the push stage 333 can be positioned at a desired height position by driving the push stage 333 with the electric actuator 349 . This will
When the wafer W is received by the push stage 333, the push stage 333 can be made to stand by immediately below the wafer W as a preliminary operation, thereby shortening the time required for the receiving operation. A compression spring 351 is arranged at the end of the push stage 333 for positioning.

In addition, in order to prevent reverse contamination of the wafer from slurry adhering to the pusher, a cleaning nozzle for cleaning dirt is separately installed. A wafer presence/absence sensor for checking the presence/absence of a wafer on the pusher may be installed separately.

As shown in FIG. 6, the exchanger 52a includes the first stage 5 arranged in multiple stages.
2a, a second stage 52b and a third stage 52c. In the illustrated example,
The first stage 52a is arranged in the lower stage, the second stage 52b is arranged in the middle stage, and the third stage 52c is arranged in the upper stage. The first stage 52a, the second stage 52b, and the third stage 52c are located at the first substrate transfer position TP1 and the second substrate transfer position TP2 in plan view.
Although they move on the same axis that passes through, they are installed at different heights, so they can move freely without interfering with each other.

As shown in FIG. 6, the first stage 52a is provided with a first stage drive mechanism 54a for linearly moving the first stage 52a in one axial direction, and the second stage 52b is provided with a second stage drive mechanism 54a.
A second stage driving mechanism 54b is provided for linearly moving the stage 52b in the uniaxial direction, and a third stage driving mechanism 54c for linearly moving the third stage 52c in the uniaxial direction is provided for the third stage 52c. ing. First to third stage drive mechanisms 54a-5
As 4c, for example, an electric actuator or a motor drive mechanism using a ball screw is used. The first to third stages 52a to 52c receive power from different first to third stage drive mechanisms 54a to 54c, respectively, so that they can move in different directions at different timings.

Since the second stage 52b and the third stage 52c have the same configuration as the first stage 52a, the first stage 52a will be described below. FIG. 10 is a plan view showing the first stage 52a.

As shown in FIG. 6, the first stage 52a has a U-shape in plan view with one side (right rear side in FIG. 6) in the direction of linear movement by the first stage drive mechanism 54a opened. Therefore, when the first stage 52a is arranged at the first substrate transfer position TP1, the first pusher 5
1a is vertically movable so as to pass through the inside of the first stage 52a. again,
The first stage 52a can move to the other side (left front side in FIG. 6) in the linear movement direction even when the first pusher 51a has passed through the inside of the first stage 52a.

Although not shown, the first stage 52a is provided with four pins protruding upward. Therefore, the wafer placed on the first stage 52a is supported on the first stage 52a in a state where its outer peripheral edge is guided and positioned by four pins. These pins are made of resins such as polypropylene (PP), polychlorotrifluoroethylene (PCTFE) and polyetheretherketone (PEEK).

Next, an example of the operation of the first pusher 51a and the exchanger 50 configured as described above will be described.

First, when loading a wafer, the first pusher of the exchanger 50 is positioned above the first pusher 51a.
A wafer W is carried by the stage 52a. Top ring 25 of first polishing device 21a
When a is at the wafer load position (first substrate transfer position TP1) above the first pusher 51a and the wafer W is not held, the set of components around the guide stage 331 is lifted from the cylinder 347. The guide stage 331 passes inside the first stage 52a during the ascent. At this time, as the guide stage 331 passes, the wafer W is centered by the taper of the top ring guide 337, and the push stage 333 moves the wafer W (other than the edge).
Hold the pattern side.

While the push stage 333 holds the wafer W, the top ring guide 337 is raised without stopping, and the taper 338a of the top ring guide 337 pulls the guide ring. The linear way 346, which is freely movable in the X and Y directions, is centered on the top ring, and the upper step portion 338 of the top ring guide 337 comes into contact with the lower surface of the guide ring to complete the upward movement of the guide stage 331.

The guide stage 331 does not rise any further because the upper step portion 338 of the top ring guide 337 contacts and is fixed to the lower surface of the guide ring. At this time, the push stage 333 is further raised by the electric actuator 349 . At this time, the push stage 333 holds the pattern surface (other than the edge) of the wafer W and conveys the wafer W to the top ring. When the top ring completes the adsorption of the wafer W, the first pusher 51a starts to descend, and the operation is completed when the descent ends.

In the present embodiment, since the first stage 52a has a U-shape in plan view with one side in the linear movement direction (right rear side in FIG. 6) open, the first pusher 51a is lowered. can be moved to the other side of the linear movement direction (the front left side in FIG. 6) even before the start of . Therefore, it is not necessary to wait for the first pusher 51a to descend when moving the first stage 52a, thereby improving the throughput of the process.

Next, during wafer unloading, the wafer W is transferred by the top ring to the wafer unloading position above the first pusher 51a. First stage 52a of exchanger 50
is above the first pusher 51a and no wafer is mounted, the cylinder 347 raises the set of components around the guide stage 331, and the taper of the top ring guide 337 draws in the guide ring. The guide stage 331 is centripetally centered on the top ring due to alignment by the linear way 346, and the upper step portion 338 of the top ring guide 337 comes into contact with the lower surface of the guide ring to complete the upward movement of the guide stage 331.

The electric actuator 349 raises the push stage 333. At this time,
The push stage 333 is never positioned higher than the wafer holding portion of the top ring guide 337 . When the lifting of the electric actuator 349 is completed, the wafer W is released from the top ring. At this time, the wafer W is centered by the lower taper of the top ring guide 337 and the edge portion is held by the top ring guide 337 . When the wafer W is held by the first pusher 51a, the first pusher 51a starts to descend. During the descent, the guide stage 331 that has moved to the center position due to the centripetal of the top ring is centered by the guide sleeve 340 and the center sleeve 341 . During the descent, the edge portion of the wafer W is transferred from the first pusher 51a to the first stage 52a, and the operation is completed when the descent ends.

<Washing part>
As shown in FIGS. 1 and 2, the cleaning section 13 is an area for cleaning wafers after polishing, and has a first cleaning unit 30a and a second cleaning unit 30b arranged in two stages, one above the other. The transport section 14 described above is arranged between the first cleaning unit 30a and the second cleaning unit 30b. Since the first cleaning unit 30a, the conveying section 14, and the second cleaning unit 30b are arranged so as to overlap in the vertical direction, an advantage of a small footprint can be obtained.

As shown in FIGS. 1 and 2, the first cleaning unit 30a includes a plurality of (four in the illustrated example).
3) cleaning modules 311a, 312a, 313a, and 314a, a wafer station 33a, and a cleaning section transfer mechanism 32a for transferring wafers W between the cleaning modules 311a to 314a and the wafer station 33a. . multiple cleaning modules 311
a to 314a and the wafer station 33a are arranged in series along the longitudinal direction of the substrate processing apparatus . A filter fan unit (not shown) having a clean air filter is provided above each of the cleaning modules 311a to 314a, and clean air from which particles have been removed by the filter fan unit is always blown downward. there is Also, the inside of the first cleaning unit 30a is always maintained at a pressure higher than that of the polishing section 12 in order to prevent particles from entering from the polishing section 12 .

Similarly, the second cleaning unit 30b includes a plurality (four in the illustrated example) of cleaning modules 311b, 312b, 313b, 314b, a wafer station 33b, and between each cleaning module 311b-314b and the wafer station 33b. and a cleaning unit transport mechanism 32b for transporting the wafer W at the . A plurality of cleaning modules 311b to 314b and wafer station 33b are arranged in series along the longitudinal direction of substrate processing apparatus .
A filter fan unit (not shown) having a clean air filter is provided above each of the cleaning modules 311b to 314b, and clean air from which particles have been removed by this filter fan unit is always blown downward. there is Also, the second
The inside of the cleaning unit 30b is always maintained at a pressure higher than that of the polishing section 12 in order to prevent particles from entering from the polishing section 12 .

As will be described later (FIGS. 27, 28A-28E and related description), the pre-cleaning modules 39a and 39b are respectively connected to the cleaning modules 311a-314a and 311b-314b.
may be added in addition to

FIG. 8 is a perspective view showing the wafer station 33a of the first cleaning unit 30a. FIG. 9 is an exploded perspective view showing the internal construction of this wafer station 33a. As shown in FIGS. 8 and 9, the wafer station 33a includes a housing 71 having a substantially rectangular parallelepiped shape, a stage 72 disposed inside the housing 71 for holding the wafer W, and a drive for moving the stage 72 up and down. a mechanism 75;

Of these, the housing 71 has a bottom plate, four side plates, and a top plate. As shown in FIG. 9 , a carry-in port 73 communicating with the polishing section 12 is formed at the lower end of one of the four side plates facing the polishing section 12 . The carry-in port 73 can be opened and closed by a shutter (not shown). As shown in FIG. 9 , the transfer robot 23 of the polishing section 12 can access the inside of the housing 71 through the loading port 73 .

Further, as shown in FIG. 8, the remaining three side plates (that is, the side plate facing the first cleaning section transport mechanism 32a and the left and right side plates) out of the four side plates are higher than the loading port 73. At the height position, an arm passage opening 7 for passing the arm of the cleaning section transport mechanism 32a is provided.
4 is formed. The wafer transfer opening 74 can be opened and closed by a shutter (not shown). As shown in FIGS. 12 and 13, the cleaning section transport mechanism 3 of the first cleaning unit 30a
2 a is accessible to the inside of the housing 71 through the arm passage opening 74 .

As the drive mechanism 75, for example, a motor drive mechanism using a ball screw or an air cylinder is used. The stage 72 is fixed to the movable portion of the drive mechanism 75, and the drive mechanism 75
is moved up and down between a height position facing the carry-in port 73 and a height position facing the wafer transfer opening 74 (see FIG. 9).

Four pins 76 are provided on the outer periphery of the stage 72 so as to protrude upward.
Therefore, the wafer W placed on the stage 72 is supported on the stage 72 with its outer peripheral edge guided and positioned by the four pins 76 . These pins 76 are polypropylene (PP), polychlorotrifluoroethylene (PCT
FE) or polyetheretherketone (PEEK).

FIG. 10 is a perspective view showing the wafer station 33b of the second cleaning unit 30b.
FIG. 11 is an exploded perspective view showing the internal construction of this wafer station 33b. As shown in FIGS. 10 and 11, the wafer station 33b includes a housing 81 having a substantially rectangular parallelepiped shape.
, a stage 82 arranged inside a housing 81 to hold a wafer W, and a driving mechanism 85 for vertically moving the stage 82 .

Among them, the housing 81 has a bottom plate, four side plates, and a top plate. As shown in FIG. 11 , a carry-in port 83 that communicates with the polishing section 12 is formed at the upper end portion of one of the four side plates that faces the polishing section 12 . The carry-in port 83 can be opened and closed by a shutter (not shown). As shown in FIG. 11 , the transfer robot 23 of the polishing section 12 can access the inside of the housing 81 through the loading port 83 .

Further, as shown in FIG. 10, the remaining three side plates (that is, the side plate on the side opposite to the polishing section 12 and the left and right side plates) out of the four side plates are positioned at a height lower than the carry-in port 83. is formed with an arm passage opening 84 for allowing the arm of the cleaning section transport mechanism 32b to pass therethrough. The arm passage opening 84 can be opened and closed by a shutter 87 . As shown in FIG. 11, the cleaning section transport mechanism 32b of the second cleaning unit 30b can access the inside of the housing 81 through the arm passage opening 84. As shown in FIG.

As the drive mechanism 85, for example, a motor drive mechanism using a ball screw or an air cylinder is used. The stage 82 is fixed to the movable portion of the drive mechanism 85, and the drive mechanism 85
is moved up and down between a height position facing the carry-in port 83 and a height position facing the wafer transfer opening 84 (see FIG. 11).

Four pins 86 are provided on the outer periphery of the stage 82 so as to protrude upward.
Therefore, the wafer placed on the stage 82 is supported on the stage 82 with its outer peripheral edge guided and positioned by four pins 86 . These pins 86 are polypropylene (PP), polychlorotrifluoroethylene (PCTF)
E) or a resin such as polyetheretherketone (PEEK).

The cleaning modules 311b to 314b of the second cleaning unit 30b include the first cleaning unit 3
0a, the cleaning modules 311a to 314a of the first cleaning unit 30a will be described below.

As shown in FIGS. 1 and 2, four cleaning modules 311a to 314a (hereinafter referred to as primary to
(sometimes referred to as a quaternary cleaning module) are arranged in series from the wafer station 33a in this order. Each of the cleaning modules 311a to 314a has a cleaning machine (not shown) and a housing 91 covering the cleaning machine.

The cleaning machine of the primary cleaning module 311a and the secondary cleaning module 312a is, for example, a roll type that cleans the front and back surfaces of the wafer by rotating roll-shaped sponges arranged above and below and pressing them against the front and back surfaces of the wafer. washing machine can be used.
As the cleaning machine of the tertiary cleaning module 313a, for example, a pencil-type cleaning machine that cleans the wafer by pressing a hemispherical sponge while rotating it can be used.
As the cleaning machine of the quaternary cleaning module 314a, for example, a pencil-type cleaning machine can be used that can rinse the back surface of the wafer and clean the front surface of the wafer by pressing a hemispherical sponge while rotating it. can. The cleaning machine of the quaternary cleaning module 314a has a stage for rotating the chucked wafer at high speed, and has a function (spin dry function) for drying the wafer after cleaning by rotating the wafer at high speed. note that,
In addition to the roll-type washer and pencil-type washer in each of the washing modules 311a to 314a, a megasonic-type washer that cleans by applying ultrasonic waves to the cleaning liquid may be additionally provided. good.

The housing of each cleaning module 311a to 314a is the housing 71 of the wafer station 33a.
has a bottom plate, four side plates, and a top plate. Of the four side plates, the side plate facing the cleaning section transport mechanism 32a and the left and right side plates are formed with arm passage openings 94 for allowing the arms of the cleaning section transport mechanism 32a to pass (FIGS. 13A to 13C). See Figure 13E). The arm passage opening 94 can be opened and closed by a shutter 97 . The height position of the arm passage opening 94 is formed at the same height position as the arm passage opening 74 of the wafer station 33a. The washing section transport mechanism 32 a can access the inside of the housing 91 through the arm passage opening 94 .

Since the cleaning section transport mechanism 32b of the second cleaning unit 30b has the same configuration as the cleaning section transport mechanism 32a of the first cleaning unit 30a, the cleaning section transport mechanism 32a of the first cleaning unit 30a will be described below. do.

FIG. 12 is a perspective view showing the cleaning section transport mechanism 32a of the first cleaning unit 30a. Figure 1
2, the cleaning section transport mechanism 32a includes a first wafer gripping mechanism 601 and a second wafer gripping mechanism 602 which grip the wafer W, respectively, and a first wafer gripping mechanism 601 and a second wafer gripping mechanism 602, which are divided into a plurality of wafer gripping mechanisms 601 and 602. and an arm transfer mechanism 62 that linearly moves along the arrangement direction of the cleaning modules 311a to 314a. That is, in this embodiment, the number of wafer gripping mechanisms 601 and 602 is smaller than the number of cleaning modules 311a-314a.

In this embodiment, for example, the first wafer gripping mechanism 601 and the second
The wafer gripping mechanism 602 can be used properly. For example, among the primary to quaternary cleaning modules 311a to 314a, the primary cleaning module 311a and secondary cleaning module 312a in the first half of the cleaning process use the first wafer gripping mechanism 601, and the tertiary cleaning module 313a and the secondary cleaning module 313a in the latter half of the cleaning process. By using the second wafer gripping mechanism 602 in the quaternary cleaning module 314a, it is possible to prevent the wafer W in the latter half of the cleaning process from coming into contact with the first wafer gripping mechanism 601 and being contaminated.

More specifically, the first wafer gripping mechanism 601 is a pair of openable and closable first wafer gripping mechanisms.
an arm 611, a first vertical movement mechanism 641 for vertically moving the pair of first arms 611,
A first arm that rotates a pair of first arms 611 about a rotation shaft 631A parallel to the opening/closing direction.
It has a rotating mechanism 631 and a first opening/closing mechanism 661 that opens and closes the pair of first arms 611 in a direction toward or away from each other.

Similarly, the second wafer gripping mechanism 602 includes a pair of openable/closable second arms 612 for gripping a wafer, a second vertical movement mechanism 642 for vertically moving the pair of second arms 612 , and a pair of second arms 612 . and a second opening/closing mechanism 662 that opens and closes the pair of second arms 612 in a direction toward or away from each other. are doing.

A motor drive mechanism using a ball screw, for example, is used as the arm transport mechanism 62 . As shown in FIG. 12, the ball screw of the arm transfer mechanism 62 is connected to cleaning modules 311a to 311a.
314a so as to extend in the arrangement direction of the cleaning modules 311a to 314a.

A main frame 68 is attached to the ball screw of the arm transfer mechanism 62 . The main frame 68 is attached so as to hang downward from the ball screw of the arm transfer mechanism 62, and faces the side surfaces of the cleaning modules 311a to 314a. By driving the motor connected to the ball screw of the arm transport mechanism 62, the main frame 6
8 faces the side surfaces of the cleaning modules 311a to 314a.
It is linearly moved along the arrangement direction of 314a.

In the illustrated example, the main frame 68 extends in the depth direction (cleaning modules 311a-31
It has a depth direction moving mechanism 67 for adjusting the position in the direction perpendicular to both the arrangement direction and the vertical direction of 4a. As the depth direction moving mechanism 67, for example, a motor drive mechanism using a rack and pinion is used. By driving the depth direction moving mechanism 67,
The position of the main frame 68 in the depth direction is adjusted.

The first vertical movement mechanism 641 and the second vertical movement mechanism 642 are provided on the main frame 68 . As the first vertical movement mechanism 641 and the second vertical movement mechanism 642, for example, a motor drive mechanism using a ball screw is used. As shown in FIG. 16, the ball screw of the first vertical movement mechanism 641 is mounted on the left end of the main frame 68 so as to extend vertically, and the ball screw of the second vertical movement mechanism 642 is mounted on the main frame 68. It is attached so as to extend in the vertical direction at the right end of the .

A first sub-frame 691 that supports the pair of first arms 611 is attached to the ball screw of the first vertical movement mechanism 641 . The first subframe 691 is the mainframe 6
8 adjacent to the main frame 68, and a cleaning module 311
It is designed to face the side surfaces of a to 314a. A motor connected to the ball screw of the first vertical movement mechanism 641 is driven to linearly move the first sub-frame 691 in the vertical direction.

Similarly, a second sub-frame 692 that supports the pair of second arms 612 is attached to the ball screw of the second vertical movement mechanism 642 . The second sub-frame 692 is provided on the right side of the main frame 68 so as to be adjacent to the main frame 68, and can face the side surfaces of the cleaning modules 311a to 314a. A motor connected to the ball screw of the second vertical movement mechanism 642 is driven to linearly move the second sub-frame 692 in the vertical direction.

Since the first sub-frame 691 and the second sub-frame 692 have substantially similar structures except that they are symmetrical with respect to the main frame 68, the second sub-frame 692 will be described below.

As shown in FIG. 12, the pair of second arms 612 are arranged parallel to each other, and the proximal ends of the second arms 612 are connected to a rotating shaft 632 rotatably provided on the second sub-frame 692 .
attached to A. A second rotating mechanism 632 is provided on the second sub-frame 692 to rotate the pair of second arms 612 around a rotating shaft 632A. A motor drive mechanism, for example, is used as the second rotation mechanism 632 . The rotating shaft of the second rotating mechanism 632 is connected to the rotating shaft 632A via a link member 632L. The rotational force of the second rotating mechanism 632 is transmitted to the rotating shaft 632A via the link member 632L,
Arm 612 is rotated around rotation axis 632A.

A second opening/closing mechanism 662 is provided on the second sub-frame 692 to open and close the pair of second arms 612 in a direction toward or away from each other. For example, an air cylinder is used as the second opening/closing mechanism 662 . By closing the pair of second arms 612 by the second opening/closing mechanism 662, the pair of second arms 612 sandwich and hold the peripheral portion of the wafer W. As shown in FIG.

As shown in FIGS. 14 and 15, the pair of second arms 612 is provided with chuck pieces 612a and 612b that can come into contact with the outer periphery of the wafer W in two stages. For example, a wafer W with a relatively high degree of cleanliness is held by the upper chuck piece 612a, and a wafer with a relatively low degree of cleanliness is held by the lower chuck piece 612b.
12b can be prevented from coming into contact with a wafer W with a high degree of cleanliness and contaminating this wafer W.

Next, an example of the operation of the pair of second arms 612 will be described with reference to FIGS. 13A to 13E. As described above, each cleaning module is partitioned by the housing 91 so that the fluid to be used does not scatter outside during cleaning of the wafer W, and the arm passage opening 94 is formed in the side surface of the housing 91. . A shutter 97 that can be opened and closed is provided in the arm passage opening 94 .

When the wafer W after cleaning is to be taken out of the housing 91, the pair of second arms 612 whose tips are directed upward are driven by the arm transfer mechanism 62 to be adjacent to the housing 91, as shown in FIG. 13A. Moved to standby position. In the present embodiment, even when the shutter 97 of the housing 91 is closed, the tip ends of the pair of second arms 612 are directed upward so that the pair of second arms 612 are positioned adjacent to the housing 91 on standby. position can be moved. Therefore, the start timing of the wafer unloading operation can be advanced, and the throughput of the entire process can be improved.

Next, as shown in FIGS. 13B and 13C, the second rotation mechanism 632 is driven to rotate the pair of second arms 612 about the rotation shaft 632A. In the illustrated example, the pair of second arms 612 rotate 90 degrees clockwise around the rotation axis 632A in side view.
Rotated, the tips of the pair of second arms 612 are oriented sideways.

Next, as shown in FIG. 13D , the second vertical drive mechanism 642 is driven to raise the pair of second arms 612 to the same height position as the arm passage opening 94 . At this time, the shutter 97 is retracted and the arm passage opening 94 is opened.

Next, as shown in FIG. 13E, by driving the second opening/closing mechanism 662, the pair of second arms 6
12 are closed in the direction of approaching each other, are inserted into the housing 91 through the arm passage opening 94 , and hold the wafer W in the housing 91 . Then, the pair of second arms 612 holding the wafer W are moved to the next cleaning module by driving the arm transfer mechanism 62 .

When loading the wafer W before cleaning into the housing 91, the above-described operations shown in FIGS. 13A to 13E are performed in reverse order. That is, as shown in FIG. 13E , the pair of second arms 612 holding the wafer W is driven by the arm transfer mechanism 62 to move inside the housing 91 through the arm passage opening 94 .

Next, as shown in FIG. 13D, by driving the second opening/closing mechanism 662, the pair of second arms 6
12 are opened in a direction away from each other and come out of the housing 91 through the arm passage opening 94 .

Next, as shown in FIG. 13C, the pair of second arms 612 are lowered to a height position lower than the arm passage opening 94 by driving the second vertical drive mechanism 642 . At this time, the arm passing opening 94 is opened by the shutter 97 to start the cleaning process of the wafer W inside the housing 91 .

Next, as shown in FIGS. 13B and 13A, the second rotating mechanism 632 is driven to rotate the pair of second arms 612 about the rotating shaft 632A. In the illustrated example, the pair of second arms 612 rotate counterclockwise 90 degrees around the rotation axis 632A in side view.
, and the tips of the pair of second arms 612 are directed upward. Then, the pair of second arms 612 whose tips are directed upward are moved to the next cleaning module by driving the arm transfer mechanism 62 . In this embodiment, the second rotation mechanism 632 is a pair of second arms 61
2 so that the tip faces upward, the second vertical movement mechanism 642 lowers the pair of second arms 612, so the space required above the pair of second arms 612 can be reduced.

A plurality of wafers W can be cleaned in parallel in each cleaning module 311a-314a and 311b-314b. Referring to FIGS. 29A-29I, first cleaning unit 30
The operation of the cleaning section transfer mechanism 32a when cleaning a plurality of wafers W in parallel in the primary to tertiary cleaning modules 311a to 313a of a will be described as an example.

First, as shown in FIG. 29A, in the primary cleaning module 311a, the shutter 97 is closed and the second wafer W2 is being cleaned in the first stage.
In 2a, it is assumed that the second-stage cleaning of the first wafer W1 is completed and the arm passing opening 94 is open. In this case, the pair of first arms 611 are connected to the secondary cleaning module 31
2a, and the tips of the pair of first arms 611 are oriented sideways.

Then, as shown in FIG. 29B, the pair of first arms 611 are closed so as to be close to each other, and the first wafer W1 in the secondary cleaning module 312a is held by the pair of first arms 611. As shown in FIG. Also, the shutter 97 of the tertiary cleaning module 313a is retracted to open the arm passage opening 94. As shown in FIG.

Next, as shown in FIG. 29C, the first wafer W held by the pair of first arms 611
1 is moved from the secondary cleaning module 312a to the tertiary cleaning module 313a through the arm passage opening 94. As shown in FIG.

Then, as shown in FIG. 29D, the pair of first arms 611 are opened so as to be separated from each other and extended to the left and right outside of the tertiary cleaning module 313a. The shutter 97 is closed in the secondary cleaning module 312a to prevent drying.

Next, as shown in FIG. 29E, the shutter 97 of the tertiary cleaning module 313a is closed, and the first wafer W1 is cleaned in the tertiary cleaning module 313a in the third stage.

Next, as shown in FIG. 29F, when the first-stage cleaning of the second wafer W2 in the primary cleaning module 311a is completed, the shutter 97 of the primary cleaning module 311a is retracted and the arm passing opening 94 is opened. be At this time, the pair of first arms 611 are rotated by the rotation mechanism, and the tips of the pair of first arms 611 are directed upward.

Then, as shown in FIG. 29G, the pair of first arms 611 are moved to avoid (skip) the tertiary cleaning module 313a and the secondary cleaning module 312a with the shutter 97 closed, and 311a is placed in the standby position.

Next, as shown in FIG. 29H, the pair of first arms 611 are rotated by the rotation mechanism, and the tips of the pair of first arms 611 are oriented sideways. Then, as shown in FIG. 29I, the pair of first arms 611 are closed so as to be close to each other, and the second wafer W2 in the primary cleaning module 311a is held by the pair of first arms 611. As shown in FIG. After that, the second wafer W2 held by the pair of first arms 611 is transferred to the secondary cleaning module 312a and subjected to the second stage of cleaning.

As described above, in this embodiment, each of the cleaning modules 311a to 314a and 311b
. . 314b, multiple wafers W can be cleaned in parallel, thereby increasing the throughput of the overall process.

Next, referring to FIGS. 30A to 30I, operation of the cleaning section transfer mechanism 32a when a plurality of wafers W are cleaned in parallel in the primary to tertiary cleaning modules 311a to 313a of the first cleaning unit 30a. A modification of is explained.

First, as shown in FIG. 30A, in the primary cleaning module 311a, the shutter 97 is closed and the second wafer W2 is being cleaned in the first stage.
In 2a, it is assumed that the second-stage cleaning of the first wafer W1 is completed and the arm passing opening 94 is open. In this case, the pair of first arms 611 are connected to the secondary cleaning module 31
2a, and the tips of the pair of first arms 611 are oriented sideways.

Then, as shown in FIG. 30B, the pair of first arms 611 are closed so as to be close to each other, and the first wafer W1 in the secondary cleaning module 312a is held by the pair of first arms 611. As shown in FIG. Also, the shutter 97 of the tertiary cleaning module 313a is retracted to open the arm passage opening 94. As shown in FIG.

Next, as shown in FIG. 30C, the first wafer W held by the pair of first arms 611
1 is moved from the secondary cleaning module 312a to the tertiary cleaning module 313a through the arm passage opening 94. As shown in FIG.

Then, as shown in FIG. 30D, the pair of first arms 611 are opened to be separated from each other and extended to the left and right outside of the tertiary cleaning module 313a. The shutter 97 of the secondary cleaning module 312 is closed.

Next, as shown in FIG. 30E, before starting the third-stage cleaning of the first wafer W1 in the tertiary cleaning module 313a, the first-stage cleaning of the second wafer W2 in the primary cleaning module 311a is performed. When the cleaning is completed, the shutter 97 of the primary cleaning module 311a is retracted to open the arm passage opening 94. As shown in FIG.

At this time, as shown in FIG. 30F, the pair of first arms 611 is raised to a height position higher than the first wafer W1. Also, the shutter 97 of the secondary cleaning module 312a is retracted to open the arm passage opening 94. As shown in FIG.

Then, as shown in FIG. 30G, the pair of first arms 611 are moved so as to pass through the arm passage openings 94 of the tertiary cleaning module 313a and the secondary cleaning module 312a, with their tips facing sideways. It is arranged at the standby position of the primary cleaning module 311a.

Next, as shown in FIG. 30H, the pair of first arms 611 are lowered to the same height position as the second wafer W2. On the other hand, in the tertiary cleaning module 313a, the shutter 97 is closed and the third-stage cleaning of the first wafer W1 is started. The shutter 97 is closed in the secondary cleaning module 312a to prevent drying.

Then, as shown in FIG. 30I, the pair of first arms 611 are closed so as to be close to each other, and the second wafer W2 in the primary cleaning module 311a is held by the pair of first arms 611. As shown in FIG. After that, the second wafer W2 held by the pair of first arms 611 is transferred to the secondary cleaning module 312a and subjected to the second stage of cleaning.

According to the modified example as described above, from the tertiary cleaning module 313a to the primary cleaning module 3
When moving the pair of first arms 611 to 11a, the operation of rotating the pair of first arms 611 can be omitted. Therefore, the throughput of the entire process can be further improved.

On the other hand, as shown in FIGS. 29A to 29I, by rotating the pair of first arms 611,
The tertiary cleaning module 313a and the secondary cleaning module 312 with the shutter 97 closed
When moving to avoid (skip) a, the pair of first arms 611 moves three
Since it does not pass over the first wafer W1 in the next cleaning module 313a, the cleaning liquid falling from the pair of first arms 611 can be prevented from adhering to the surface of the first wafer W1. Also, the third-stage cleaning of the first wafer W1 in the tertiary cleaning module 313a can be started early.

Each wash module 311a-314a and 311b-314b has a detector (not shown) to detect faults. Wash modules 311a-314a and 311b-3
14b, the detector detects this and sends a signal to the controller 15. FIG. The control unit 15 selects a cleaning line that avoids the failed cleaning module, and switches the current cleaning line to the newly selected cleaning line.

More specifically, for example, as shown in FIG. 22A, when an abnormality occurs in the tertiary cleaning module 313a of the first cleaning unit 30a, the wafer W positioned in the secondary cleaning module 312a is transferred to the cleaning section transfer mechanism 32a. is gripped by the first arm 611 of the . And Figure 2
As shown in 2B, the wafer held by the first arm 611 is transferred to the first wafer station 33a by driving the arm transfer mechanism 62 with the tip of the second arm 612 of the cleaning section transfer mechanism 32a directed upward. transported to At this time, even if the shutter 97 of the tertiary cleaning module 313a fails and remains closed, the tip of the second arm 612 is directed upward. 313a can be avoided (skipped) and moved.

Next, as shown in FIGS. 22C and 22D, the transfer robot 23 of the polishing section 12 takes out the wafer W from the first wafer station 33a and transfers it to the second wafer station 33b. The wafer W transferred to the second wafer station 33b is gripped by the first arm 611 of the cleaning section transfer mechanism 32b. Then, as shown in FIG. 22E, by driving the arm transport mechanism 62, the wafer W gripped by the first arm 611 is transported to the primary cleaning module 311b and cleaned.

As described above, in the present embodiment, even if an abnormality occurs in any one of the plurality of first cleaning modules 311a to 314a, wafers W positioned in the first cleaning modules 311a to 314a are not subjected to the second cleaning. The wafers W positioned in the first cleaning modules 311a to 314a can be rescued by being transported to the modules 311b to 314b and cleaned. Similarly, even if an abnormality occurs in any one of the plurality of second cleaning modules 311b to 314b, the wafer W positioned in the second cleaning modules 311b to 314b is transferred to the first cleaning modules 311a to 314a. The second cleaning module 3 is cleaned by
Wafers W located within 11b-314b can be rescued.

As shown in FIG. 12, in this embodiment, the first wafer gripping mechanism 601 and the second wafer gripping mechanism 602 are arranged below the arm transfer mechanism 62 in a suspended manner. This will
The maintenance space for the first wafer gripping mechanism 601 and the second wafer gripping mechanism 602 is enlarged. Therefore, the time required for maintenance can be shortened.

<Pre-cleaning module>
As shown in FIG. 27, the first cleaning unit 30a of the cleaning section 13 further includes a pre-cleaning module 39a arranged in parallel with the plurality of cleaning modules 311a to 314a for cleaning the wafer W before polishing, The cleaning section transport mechanism 32a may transport the wafer W between the preliminary cleaning module 39a and each of the cleaning modules 311a to 314a. In the illustrated example, the preclean module 39a is positioned adjacent to the first wafer station 33a on the opposite side of the first wafer station 33a from the cleaning modules 311a-314a.

Similarly, the second cleaning unit 30b further has a pre-cleaning module 39a arranged in the same row as the plurality of cleaning modules 311b to 314b and cleaning the wafer W before polishing,
The cleaning unit transport mechanism 32a includes a pre-cleaning module 39a and each of the cleaning modules 311a to 311a.
4a, the wafer W may be transferred. In the example shown, the prewash module 39
b is arranged adjacent to the second wafer station 33b on the opposite side of the second wafer station 33b from the cleaning modules 311b-314b.

The pre-cleaning modules 39a and 39b each have a cleaning machine (not shown) and a housing 91 covering the cleaning machine. Examples of cleaning machines for the pre-cleaning modules 39a and 39b include a wet etching device for removing a natural oxide film from the surface of the wafer W before polishing,
Alternatively, a buffing device that removes coarse particles that cause scratches from the surface of the wafer W before polishing can be used.

The wafer transfer operation to the pre-cleaning module 39b of the second cleaning unit 30b is the same as the wafer transfer operation to the pre-cleaning module 39a of the first cleaning unit 30a. The operation of transferring wafers to .

First, as shown in FIG. 28A, the wafer W before polishing is placed on the slide stage 4 of the transport section 14.
2, and is stopped at a position accessible by a transfer robot 23 of the polishing section 12. As shown in FIG.

Next, as shown in FIG. 28B , the wafer W is taken out from the transfer section 14 by the transfer robot 23 of the polishing section 12 . Then, as shown in FIG. 28C, the wafer W held by the transfer robot 23 is delivered to the wafer station 33a.

Next, as shown in FIG. 28D, the wafer W positioned within the wafer station 33a is held by the first arm 611 of the cleaning section transfer mechanism 32a. Then, as shown in FIG. 28E, with the tip of the second arm 612 of the cleaning section transport mechanism 32a facing upward, the arm transport mechanism 62 is driven to move the wafer W gripped by the first arm 611 to the first position. 1 Wafer station 33a is transferred to pre-cleaning module 39a and cleaned.

The wafer W cleaned by the preliminary cleaning module 39a is again held by the first arm 611 of the cleaning section transfer mechanism 32a. Then, as shown in FIG. 28C, the wafer W gripped by the first arm 611 is driven by the arm transfer mechanism 62 to be transferred from the preliminary cleaning module 39a to the wafer station 33a. Then, as shown in FIG. 28B, the polishing section 1
2, the wafer W is taken out from the wafer station 33a by the transfer robot 23, transferred to the first polishing unit 20a or the second polishing unit 20b via the first transfer unit 24a or the second transfer unit 24b, and polished. .

More specifically, the preliminary cleaning module 39a and the primary cleaning module 311a move the wafer W and the buffing pad relative to each other while bringing the buffing pad into contact with the wafer W, thereby interposing slurry between the wafer W and the buffing pad. It has a buffing device (for example, the device disclosed in FIG. 1 of Japanese Unexamined Patent Application Publication No. 2016-43471) that polishes and/or scrubs the surface of the wafer W by applying A roll-shaped sponge placed in the wafer W is rotated and pressed against the front and back surfaces of the wafer W
has a roll-type washing machine (for example, the apparatus disclosed in FIG. 32 of Japanese Patent Application Laid-Open No. 2010-50436) for washing the front and back surfaces of the substrate, and the tertiary washing module 313a rotates a hemispherical sponge. The quaternary cleaning module 314a has a pencil-type cleaning machine (for example, the device disclosed in FIG. 10 of Japanese Unexamined Patent Application Publication No. 2000-173966) that cleans the wafer W by pressing it against the wafer W while rotating it. An IPA drying device that dries by spraying IPA (isopropyl alcohol) vapor on the surface of the wafer W (for example, JP-A-2010-504
36 to 39), the wafer W before polishing is buffed in the pre-cleaning module 39a and then transferred to the first polishing unit 20a.
Alternatively, it is transported to the second polishing unit 20b and polished, and then the primary cleaning module 3
11a, it is washed with a roll-shaped sponge in a secondary washing module 312a, washed with a pencil-shaped sponge in a tertiary washing module 313a, and dried by IPA vapor in a quaternary washing module 314a. , to the load/unload unit 11 .

Further, the preliminary cleaning module 39a has a buffing device, and the primary cleaning module 311a
and the secondary cleaning module 312a each have a roll-type cleaning machine, the tertiary cleaning module 313a has a pencil-type cleaning machine, and the quaternary cleaning module 314a has an IPA dryer. After being buffed in the preliminary cleaning module 39a, the wafer W is transported to the first polishing unit 20a or the second polishing unit 20b and polished,
Next, it is continuously washed with a roll-shaped sponge in the primary washing module 311a and the secondary washing module 312a, washed with a pencil-shaped sponge in the tertiary washing module 313a, and IPA vapor in the quaternary washing module 314a. It is dried and then taken out to the loading/unloading section 11 .

Further, the pre-cleaning module 39a, the primary cleaning module 311a and the secondary cleaning module 312a each have a roll-type cleaning machine, the tertiary cleaning module 313a has a pencil-type cleaning machine, and the quaternary cleaning module 314a has an IPA drying module. If you have a device
The wafer W before polishing is cleaned with a roll-shaped sponge in the pre-cleaning module 39a, then transported to the first polishing unit 20a or the second polishing unit 20b and polished.
Next, it is continuously washed with a roll-shaped sponge in the primary washing module 311a and the secondary washing module 312a, washed with a pencil sponge in the tertiary washing module 313a, and dried by IPA steam in the quaternary washing module 314a. , then load/
It is taken out to the unloading section 11 .

Further, the preliminary cleaning module 39a and the primary cleaning module 311a each have a roll-type cleaning machine, the secondary cleaning module 312a has a pencil-type cleaning machine, and the tertiary cleaning module 313a directs the wafer W to the cleaning liquid. A two-fluid jet cleaning machine that jets gas at high speed to generate a two-fluid jet stream and sprays it at high speed to clean the wafer W (for example, Japanese Patent Laid-Open No. 20
10-238850) and the quaternary cleaning module 314a has an IPA drying device, the wafer W before polishing is placed in the pre-cleaning module 39a. After being cleaned with a roll-shaped sponge, it is transported to the first polishing unit 20a or the second polishing unit 20b and polished, and then the primary cleaning module 311a.
is washed with a roll-shaped sponge in the secondary washing module 312a, washed with a pencil-shaped sponge in the secondary washing module 312a, two-fluid jet washing is performed in the tertiary washing module 313a, and 4
IPA vapor drying in the next cleaning module 314a, then load/unload unit 11
taken out to

<Leakage detector>
FIG. 23 shows the liquid leakage detector 1 provided in the lower part (near the base frame) of the substrate processing apparatus 10.
It is a schematic diagram showing. As shown in FIG. 23 , the liquid leakage detection unit 1 includes a drain pot 2 , a drain pan 6 having a slope inclined toward the drain pot 2 , and a first installation type liquid leakage detector installed on the bottom surface of the drain pot 2 . It has a sensor 3 a and a second installation type liquid leakage sensor 3 b installed on the slope of the drain pan 6 .

Photoelectric sensors, for example, are used as the first installation type liquid leakage sensor 3a and the second installation type liquid leakage sensor 3b. The first installed type liquid leakage sensor 3a and the second installed type liquid leakage sensor 3b each send a signal to the control unit 15 upon detection of liquid leakage. The control unit 15 controls the first installation type liquid leakage sensor 3
When a signal is received from a, an alarm is issued, and when a signal is received from the second installation type liquid leakage sensor 3b, the operation of the substrate processing apparatus 10 is stopped.

By the way, as shown in FIG. 24, in the conventional liquid leakage detection unit 200, an installation type liquid leakage sensor 203a installed on the bottom surface of the drain pot 202 is used to form a two-stage detection type level sensor.
and a float-type liquid leakage sensor 203b arranged in the drain pot 202 were used. Due to its structure, the float-type liquid leakage sensor 203b requires vertical movement in order to detect liquid leakage. Therefore, the drain pot 202 must have a certain depth, and the bottom surface of the drain pot 202 protrudes below the bottom surface 205 of the base frame of the substrate processing apparatus. In this case, when the substrate processing apparatus is moved, the fork of the forklift is pulled into the drain pot 2 .
There was a possibility that the drain pot 202 would be damaged by contacting the bottom surface of the 02 and trying to lift it.

Further, as shown in FIG. 24, in the conventional liquid leakage detector 200, the drain pot 202 is formed separately from the drain pan 206 so that the drain pot 202 can be easily replaced when it is damaged. Therefore, there is a possibility that liquid leakage occurs between the drain pot 202 and the drain pan 206 .

On the other hand, as shown in FIG. 23, in the present embodiment, a two-stage detection level sensor is constructed using two installation type leakage sensors 3a and 3b. Therefore, the depth of the drain pot 2 can be made shallow, and the bottom surface of the drain pot 2 can be arranged above the bottom surface 5 of the base frame of the substrate processing apparatus 10 . This prevents the drain pot 2 from being damaged by the fork of the forklift when the substrate processing apparatus 10 is moved.

Further, in the present embodiment, since the depth of the drain pot 2 can be made shallow, it is possible to integrally mold the drain pot 2 and the drain pan 6 . In this case, leakage from between the drain pot 2 and the drain pan 6 can be prevented.

FIG. 25 is a schematic diagram showing a modification of the liquid leakage detector 1. As shown in FIG. In this modification, the central portion of the bottom surface of the drain pot 2 is raised by one step, and the second installation type liquid leakage sensor 3b is set in this raised portion. According to this aspect, in addition to obtaining the same effects as those of the aspect shown in FIG. We can make it big.

As in the modification shown in FIG. 26, the bottom surface of the drain pot 2 gradually rises in two steps toward the central portion, and the second installation type liquid leakage sensor 3b is located at a portion higher than the bottom surface by one step. may be installed, and the third installation type liquid leakage sensor 3c may be installed at a portion one step higher than that. According to this aspect, it is possible to detect liquid leakage at three levels. Similarly, the number of stages may be increased to four or more.

<Polishing process using substrate processing apparatus>
Next, an example of processing for polishing the wafer W using the substrate processing apparatus 10 having such a configuration will be described. The polishing process described below is performed by controlling the operations of the load/unload section 11, the polishing section 12, the cleaning section 13, and the transport section 14 by the control section 15. FIG.

First, as shown in FIG. 16A, the unpolished wafer W is taken out from the wafer cassette of the front loading section 113 by the transfer robot 111 of the loading/unloading section 11, and placed at a position facing the inlet 41a of the transfer section 14. is moved to Then, as shown in FIG. 16B,
After the loading port 41a of the transport unit 14 is opened, the wafer W held by the transport robot 111 is inserted into the cover 41 through the loading port 41a and placed on the slide stage 42 to be supported.

Next, as shown in FIG. 16C, the slide stage 42 holding the wafer W is moved along the longitudinal direction by the power given from the stage moving mechanism 43 to a position facing the carry-out port 41b. Then, the outlet 41b of the transport section 14 is opened. At this time, the transport unit 1
Inside the cover 41 of 4, an air flow is formed by the exhaust duct 44 to flow from the carry-in port 41a side to the carry-out port 41b side. As a result, the particles in the polishing section 12 are transferred to the conveying section 1
4 into the load/unload section 11 is prevented.

As shown in FIG. 17A, the hand 231 of the transfer robot 23 of the polishing section 12 moves to the transfer section 14.
, the arm 23
2 is stretched. A hand 231 supported at the tip of the arm is inserted into the inside of the cover 41 through the carry-out port 41 b and below the wafer W held on the slide stage 42 . Next, the hand 231 is lifted and the wafer W is transferred from the slide stage 42 to the hand 231 . By contracting the arm 232, the wafer W held on the hand 231 is taken out from the transfer section 14 to the polishing section 12 as shown in FIG. 17B. After that, as shown in FIG. 17C, by the reversing mechanism 234 of the transfer robot 23,
The hand 231 is turned upside down together with the wafer W. In the drawings, wafers W painted in gray indicate wafers that are upside down.

Next, as shown in FIG. 17D, the arm 232 is rotated around the axis of the robot body 233, and the hand 231 is directed toward the first transport unit 24a. Then, the arm 232 is extended, and the wafer W held by the hand 231 is transferred to the first transfer unit 24a and transferred from the first transfer unit 24a to the first polishing unit 20a. When the first polishing unit 20a is crowded, the wafer W held by the hand 231 is transferred to the second transfer unit 24b, and transferred from the second transfer unit 24b to the second polishing unit 2.
A substrate may be loaded into 0b. In this embodiment, wafers W transported from transport unit 14 to polishing unit 12 are sorted by transport robot 23 into first transport unit 24a and second transport unit 24b, and transferred from first transport unit 24a to first transport unit 24b. Polishing unit 20a
The wafer W is loaded into the second polishing unit 20 from the second transfer unit 24b.
A wafer W is loaded to b. Therefore, the first polishing unit 20a and the second polishing unit 20b do not share the carrying-in route, and the congestion at the time of carrying the substrates into the first polishing unit 20a and the second polishing unit 20b is eliminated. Therefore, the throughput of the whole process is improved.

Since the wafer transfer operation by the second transfer unit 24b is the same as the wafer transfer operation by the first transfer unit 24a, the wafer transfer operation by the first transfer unit 24a will be described below.

When one wafer is processed continuously (in series) by the first polishing device 21a and the second polishing device 21b, as shown in FIG. 18A and FIG. The first wafer W1 is delivered to the third stage 52c of the exchanger 50 arranged at the standby position L1. Then, as shown in FIG. 18C, the third stage 52c holding the first wafer W1 is moved from the standby position L1 to the first substrate transfer position TP1.

Next, as shown in FIG. 18D, the first pusher 51a rises and passes inside the third stage 52c, and the first wafer W1 on the third stage 52c is pushed up by the first pusher 51a to perform the first polishing. It is delivered to the top ring 25a of the device 21a. After the first wafer W1 is sucked and held by the top ring 25a of the first polishing device 21a, the first pusher 51a descends to the initial height position as shown in FIG. 18E. Thereafter, as shown in FIG. 18F, the first wafer W1 is polished at the polishing position of the first polishing device 21a (more specifically,
Referring to FIG. 4, the top ring 25a is moved onto the polishing pad 102a by a moving means (not shown), and the polishing pad 102a is brought into contact with the first wafer W1 held by the top ring 25a by an elevating means (not shown). The first wafer W is polished by relative movement between the ring 25a and the polishing table 101a. Below, the wafer W at the polishing position of another polishing apparatus
polishing is performed in the same way). At this time, the third stage 52c is moved from the first substrate transfer position TP1 to the standby position L1, and the second stage 52b is moved from the standby position L1 to the first substrate transfer position TP1. The transfer robot 23 holds the second wafer W2 before polishing.

After finishing the polishing of the first wafer W1 in the first polishing device 21a, as shown in FIG. 18G,
The first pusher 51a rises to receive the polished first wafer W1 from the top ring 25a of the first polishing device 21a. Then, as shown in FIG. 18H, the first pusher 51a descends to pass through the second stage 52b, and the first wafer W1 on the first pusher 51a is delivered to the second stage 52b. The first wafer W1 held on the second stage 52b is cleaned by a cleaning nozzle (not shown) at the first substrate transfer position TP1. Further, the second wafer W2 before polishing held by the transfer robot 23 is transferred to the third stage 52c arranged at the standby position L1.

Next, as shown in FIG. 18I, the second stage 52b holding the first wafer W1 moves to the first stage.
At the same time when the substrate transfer position TP1 is moved to the second transfer position TP2, the second wafer W2
is moved from the standby position L1 to the first substrate transfer position TP1. In this way, the two stages 52b and 52c holding the wafers W1 and W2 can be moved in opposite directions so as to intersect each other, thereby improving the throughput of the process.

Next, as shown in FIG. 18J, the second pusher 51b rises and passes inside the second stage 52b, and the first wafer W1 on the second stage 52b is pushed up by the second pusher 51b to perform the second polishing. It is delivered to the top ring 25b of the device 21b. In addition, the first pusher 51a rises and passes inside the third stage 52c, and the second wafer W2 on the third stage 52c is pushed up by the first pusher 51a, and the top ring 2 of the first polishing device 21a is pushed up.
5a. Then, as shown in FIG. 18K, the first wafer W1 is transferred to the second polishing apparatus 2.
After being sucked and held by the top ring 25b of 1b, the second pusher 51b descends to the initial height position. Also, after the second wafer W2 is sucked and held by the top ring 25a of the first polishing device 21a, the first pusher 51a descends to the initial height position.

Thereafter, as shown in FIG. 18L, the first wafer W1 is further polished by the second polishing device 21b, and the second wafer W2 is polished by the first polishing device 21a. At this time, the third stage 52c is moved from the first substrate transfer position TP1 to the standby position L1, and the second stage 52b is moved from the second substrate transfer position TP2 to the first substrate transfer position TP1. Also, the first stage 52a is moved from the standby position L1 to the second substrate transfer position TP2. The transfer robot 23 holds the third wafer W3 before polishing.

After finishing the polishing of the first wafer W1 in the second polishing device 21b, as shown in FIG. 18M,
The second pusher 51b rises to receive the polished first wafer W1 from the top ring 25b of the second polishing device 21b. Further, after the polishing of the second wafer W2 in the first polishing device 21a is completed, the first pusher 51a is raised to push the polished second wafer W2 to the first polishing device 2.
It is received from the top ring 25a of 1a.

Then, as shown in FIG. 18N, the second pusher 51b descends to pass through the first stage 52a, and the first wafer W1 on the second pusher 51b is delivered to the first stage 52a.
The first wafer W1 held on the first stage 52a is cleaned by a cleaning nozzle (not shown) at the second substrate transfer position TP2. Also, the first pusher 51a descends to pass through the second stage 52b, and the second wafer W2 on the first pusher 51a is delivered to the second stage 52b. The second wafer W2 held on the second stage 52b is moved to the first substrate transfer position T
It is cleaned by a cleaning nozzle (not shown) at P1. The unpolished third wafer W3 held by the transfer robot 23 is transferred to the third stage 52c arranged at the standby position L1.

Next, as shown in FIG. 18O, the first stage 52a holding the first wafer W1 is moved to the second stage.
The first wafer W1 moved from the substrate transfer position TP2 to the standby position L1 and held on the first stage 52a is taken out from the first stage 52a by the transfer robot . On the other hand, the second stage 52b holding the second wafer W2 is moved from the first substrate transfer position TP1 to the second substrate transfer position TP2 for polishing processing by the second polishing device 21b. At the same time, the third stage 52c holding the third wafer W3 is moved from the standby position L1 to the first substrate transfer position TP1 for polishing processing in the first polishing device 21b.

When two wafers are processed in parallel by the first polishing device 21a and the second polishing device 21b, as shown in FIGS. The first wafer W1 is delivered to the third stage 52c of the exchanger 50 arranged at the standby position L1. Then, as shown in FIG. 19C, the third stage 52c holding the first wafer W1 is moved from the standby position L1 to the first substrate transfer position TP1.

Next, as shown in FIG. 19D, the first pusher 51a rises to pass inside the third stage 52c, and the first wafer W1 on the third stage 52c is pushed up by the first pusher 51a to perform the first polishing. It is delivered to the top ring 25a of the device 21a. After the first wafer W1 is sucked and held by the top ring 25a of the first polishing device 21a, the first pusher 51a is lowered to the initial height position as shown in FIG. 19E. The transfer robot 23 holds the second wafer W2 before polishing.

After that, as shown in FIG. 19F, the first wafer W1 is polished by the first polishing device 21a. At this time, the third stage 52c is moved from the first substrate transfer position TP1 to the standby position L1, and the second stage 52b is moved from the standby position L1 to the first substrate transfer position TP1. The second wafer W2 before polishing held by the transfer robot 23 is delivered to the third stage 52c arranged at the standby position L1. Then, as shown in FIG. 19G, the third stage 52c holding the second wafer W2 is moved from the standby position L1 to the second substrate transfer position TP2.

By the way, even when the parallel processing is performed by the first polishing device 21a and the second polishing device 21b, the second stage 52b is set to It is also possible to use the second stage 52b to receive wafers from the first polishing apparatus 21a and transfer the wafers to the second polishing apparatus 21b using the same second stage 52b. However, in this case, as shown in FIG. 31, if a trouble occurs when the wafer is received from the first polishing device 21a and the second stage 52b becomes unusable, it will be dragged by this and the second stage 52b will be transferred to the second polishing device 21b. Wafer delivery becomes impossible (deadlock occurs).

On the other hand, in the present embodiment, when wafers are polished in parallel by the first polishing device 21a and the second polishing device 21b, the same third stage 52c is used to polish the first polishing device 21a and the second polishing device 21b. 21b, and the second stage 52b and the first stage 52a are dedicated to receiving wafers from the first polishing apparatus 21a and the second polishing apparatus 21b, respectively. Even if trouble occurs during wafer reception and the second stage 52b cannot be used, the wafer can be continuously transferred to the second polishing device 21b (no deadlock occurs).

Next, as shown in FIG. 19H, the second pusher 51b rises and passes inside the third stage 52c, and the second wafer W2 on the third stage 52c is pushed up by the second pusher 51b to perform the second polishing. It is delivered to the top ring 25b of the device 21b. After the second wafer W2 is sucked and held by the top ring 25b of the second polishing device 21b, the second pusher 51b descends to the initial height position as shown in FIG. 19I. The transfer robot 23 holds the third wafer W3 before polishing.

Thereafter, as shown in FIG. 19J, the second wafer W2 is polished by the second polishing device 21b. At this time, the third stage 52c is moved from the second substrate transfer position TP2 to the standby position L1, and the first stage 52a is moved from the standby position L1 to the second substrate transfer position TP2. The unpolished third wafer W3 held by the transfer robot 23 is transferred to the third stage 52c arranged at the standby position L1.

When the polishing by the first polishing device 21a is completed before the polishing by the second polishing device 21b is completed, the first pusher 51a is raised to move the polished first wafer W1 to the first wafer W1 as shown in FIG. 19K. 1 received from the top ring 25a of the polishing device 21a. Then, as shown in FIG. 19L, the first pusher 51a descends to pass through the second stage 52b, and the first wafer W1 on the first pusher 51a is delivered to the second stage 52b. The first wafer W1 held on the second stage 52b is cleaned by a cleaning nozzle (not shown) at the first substrate transfer position TP1.

Next, as shown in FIG. 19M, the second stage 52b holding the first wafer W1 moves to the first stage.
Simultaneously with the movement from the substrate transfer position TP1 to the standby position L1, the third stage 52c holding the third wafer W3 is moved from the standby position L1 to the first substrate transfer position TP1. The first wafer W1 held on the second stage 52b is taken out from the second stage 52b by the transfer robot 23 at the waiting position L1.

On the other hand, if the polishing by the second polishing device 21b is completed before the polishing by the first polishing device 21a is completed, the second pusher 51b is raised to lift the polished second wafer W2 as shown in FIG. 19N. is received from the top ring 25b of the second polishing device 21b. Then, as shown in FIG. 19O, the second pusher 51b descends to pass the first stage 52a, and the second pusher 51
The second wafer W2 on b is transferred to the first stage 52a. The second wafer W2 held on the first stage 52a is cleaned by a cleaning nozzle (not shown) at the second substrate transfer position TP2.

Next, as shown in FIG. 19P, the first stage 52a holding the second wafer W2 moves to the second stage.
Simultaneously with the movement from the substrate transfer position TP2 to the standby position L1, the third stage 52c holding the third wafer W3 is moved from the standby position L1 to the second substrate transfer position TP2. The second wafer W2 held on the first stage 52a is taken out from the first stage 52a by the transfer robot 23 at the waiting position L1.

As described above, the wafer W held on the first stage 52a is taken out from the first stage 52a by the hand 231 of the transfer robot 23, as shown in FIG. 20A. After that, the hand 231 is turned upside down together with the wafer W by the turnover mechanism 234 of the transfer robot 23 .

Next, as shown in FIG. 20B, the arm 232 of the transfer robot 23 moves to the robot main body 233.
, and the hand 231 is directed toward the first wafer station 33 a of the first cleaning unit 30 a of the cleaning section 13 . Then, as shown in FIG. 20C, the arm 232 is extended, and the wafer W held by the hand 231 is transferred to the first wafer station 33a. More specifically, the arm 232 is extended with the hand 231 of the transfer robot 23 positioned at the same height as the loading port 73 of the first wafer station 33a, and the wafer W held by the hand 231 is The wafer is loaded into the housing 71 through the loading port 73 of the first wafer station 33a and placed on the stage 72 to be supported.

When the first cleaning unit 30a is crowded, the wafer W held by the hand 231 may be transferred to the second wafer station 33b of the second cleaning unit 30a. In the present embodiment, wafers W transported from the polishing section to the cleaning section are distributed to the first cleaning unit 30a and the second cleaning unit 30b by the transport robot 23, and the first cleaning unit 30a and the second cleaning unit Washed in parallel at 30b. Therefore, the throughput of the whole process is improved.

Since the wafer cleaning process in the second cleaning unit 30b is the same as the wafer cleaning process in the first cleaning unit 30a, the wafer cleaning process in the first cleaning unit 30a will be described below.

As shown in FIG. 21A, first, a pair of first arms 611 and a pair of second arms 612
are directed upward, arm transfer mechanism 62 drives first wafer gripping mechanism 601 and second wafer gripping mechanism 602 to first cleaning modules 311a-311a-3.
14a, and the pair of first arms 611 are stopped at the standby position adjacent to the first wafer station 33a. Then, by driving the first rotating mechanism 631,
The pair of first arms 611 are rotated around the rotation shaft 631A, and the pair of first arms 61
The tip of 1 is oriented sideways. After the shutter of the first wafer station 33a is retracted and the arm passage opening 74 is opened, the pair of first arms 611 moves toward the arm passage opening 74.
, and the wafer W held on the stage 72 is gripped inside the first wafer station 33a. After the wafer W is gripped by the pair of first arms 611, the stage 72
is retracted downwards.

Next, as shown in FIG. 21B, after the shutter 97 of the primary cleaning module 311a is retracted to open the arm passage opening 94, the hand transport mechanism 62 is driven to drive the first wafer gripping mechanism 601 and the second The wafer gripping mechanism 602 is moved along the direction in which the cleaning modules 311a to 314a are arranged, and the wafer W gripped by the pair of first arms 611 is transferred from the first wafer station 33a to the primary cleaning module 311a. It is delivered to the washing machine of the next washing module 311a. Next, after the pair of first arms 611 are brought out of the housing 91 of the primary cleaning module 311a, the arm passage opening 94 is closed by the shutter 97, and the wafer W is washed by the cleaning machine of the primary cleaning module 311a. cleaning is performed.

After the cleaning process in the primary cleaning module 311a is completed, the shutter 97 is retracted to open the arm passage opening 94. As shown in FIG. A pair of first arms 611 are inserted into the housing 91 of the primary cleaning module 311a through the arm passage openings 94 to grip the wafer W cleaned by the cleaning machine.

Next, as shown in FIG. 21C, after the shutter 97 of the secondary cleaning module 312a is retracted to open the arm passage opening 94, the arm transfer mechanism 62 is driven to drive the first wafer gripping mechanism 601 and the second The wafer gripping mechanism 602 is moved along the direction in which the cleaning modules 311a to 314a are arranged, and the wafer W gripped by the pair of first arms 611 is transferred from the primary cleaning module 311a to the secondary cleaning module 312a. It is delivered to the washer of the next washing module 312a. Next, after the pair of first arms 611 are brought out of the housing 91 of the secondary cleaning module 312a, the arm passing opening 94 is closed by the shutter 97, and the wafer W is washed by the cleaning machine of the secondary cleaning module 312a. cleaning is performed.

Next, as shown in FIG. 21D, by driving the first rotating mechanism 631, the pair of first arms 6
11 is rotated around the rotation shaft 631A, and the tips of the pair of first arms 611 are directed upward. With the tip ends of the pair of first arms 611 and the pair of second arms 612 directed upward, the arm transfer mechanism 62 is driven to move the first wafer gripping mechanism 601 and the second wafer gripping mechanism 602 to the second position. The first cleaning modules 311a to 314a are moved along the arrangement direction, and the pair of second arms 612 is stopped at the standby position adjacent to the second cleaning module 312a. By driving the second rotating mechanism 632, the pair of second arms 61
2 is rotated around a rotating shaft 632A, and the tips of the pair of second arms 612 are oriented sideways.

After the cleaning process in the secondary cleaning module 312a is completed, the shutter 97 is retracted to open the arm passage opening 94. As shown in FIG. A pair of second arms 612 are inserted into the housing 91 of the secondary cleaning module 312a through the arm passage openings 94 to grip the wafer W cleaned by the cleaning machine.

Thus, in this embodiment, the wafers W before being cleaned in the secondary cleaning module 312a are held by the pair of first arms 611 and transported, and the wafers W after being cleaned in the secondary cleaning module 312a are paired. is gripped and conveyed by the second arm 612 of the . That is, the arm is replaced in the secondary cleaning module 312a. This prevents the pair of first arms 611 from coming into contact with the wafer W after cleaning in the secondary cleaning module 312a and the wafer W from being contaminated.

Next, as shown in FIG. 21E, after the shutter 97 of the tertiary cleaning module 313a is retracted to open the arm passage opening 94, the arm transfer mechanism 62 is driven to drive the first wafer gripping mechanism 601 and the second The wafer gripping mechanism 602 is moved along the direction in which the cleaning modules 311a to 314a are arranged, and the wafer W gripped by the pair of second arms 612 is transferred from the secondary cleaning module 312a to the tertiary cleaning module 313a. It is delivered to the washing machine of the next washing module 313a. Next, after the pair of second arms 612 are brought out of the housing 91 of the tertiary cleaning module 313a, the arm passing opening 94 is closed by the shutter 97, and the wafer W is washed by the cleaning machine of the tertiary cleaning module 313a. cleaning is performed.

After the cleaning process in the tertiary cleaning module 313a is completed, the shutter 97 is retracted to open the arm passage opening 94. As shown in FIG. A pair of second arms 612 are inserted into the housing 91 of the tertiary cleaning module 313a through the arm passage openings 94 to grip the wafer W cleaned by the cleaning machine.

Next, as shown in FIG. 21F, after the shutter 97 of the quaternary cleaning module 314a is retracted to open the arm passage opening 94, the arm transfer mechanism 62 is driven to drive the first wafer gripping mechanism 601 and the second The wafer gripping mechanism 602 is moved along the direction in which the cleaning modules 311a to 314a are arranged, and the wafer W gripped by the pair of second arms 612 is transferred from the tertiary cleaning module 313a to the quaternary cleaning module 314a. It is delivered to the washer of the next washing module 314a. Next, after the pair of second arms 612 are brought out of the housing 91 of the quaternary cleaning module 314a, the arm passing opening 94 is closed by the shutter 97, and the wafer W is cleaned by the cleaning machine of the quaternary cleaning module 314a. is washed and dried.

After the cleaning and drying processes in the quaternary cleaning module 314a are completed, the shutter 97 is retracted to open the arm passage opening 94. As shown in FIG. The hand of the transfer robot 111 of the loading/unloading section 11 described above is inserted through the arm passage opening 94 into the housing 91 of the quaternary cleaning module 314a and cleaned by the cleaning machine. A wafer W that has been dried (for example, spin) is taken out to the load/unload section 11 .

According to the present embodiment as described above, since the cleaning section 13 has the first cleaning unit 30a and the second cleaning unit 30b arranged in two stages, a plurality of wafers W can be continuously polished. Even when it is transported from the section 12 to the cleaning section 13, the first cleaning unit 30a
and the second cleaning unit 30b, the plurality of wafers W can be cleaned in parallel. Therefore, the throughput of the entire process can be improved.

Further, according to the present embodiment, the wafer W before polishing is placed on the slide stage 42 of the transfer section 14 .
Since the wafer is further transferred to the polishing section 12, it is possible to prevent the transfer robot 111 arranged in the loading/unloading section 11 from coming into contact with the polishing environment and being contaminated.

Further, according to the present embodiment, the first cleaning unit 30a and the second cleaning unit 30a
are arranged in two stages, one above the other, and the slide stage 42 is arranged between the first cleaning unit 30a and the second cleaning unit 30b, thereby suppressing an increase in the footprint of the entire apparatus.

Further, according to the present embodiment, the polishing section transport mechanism 22 is configured to move between the transport section 14 and the first polishing unit 2 .
0a and the second polishing unit 20b are arranged adjacent to each other. 24a and the second transport unit 24b. Then, the wafer W is loaded from the first transport unit 24a to the first polishing unit 20a, and the wafer W is loaded from the second transport unit 24b to the second polishing unit 20b. As described above, since the first polishing unit 20a and the second polishing unit 20b do not share the wafer loading path, congestion during wafer loading into the first polishing unit 20a and the second polishing unit 20b is eliminated. This can improve the throughput of the entire process.

Further, according to the present embodiment, the cleaning modules 311a-3 of the first cleaning unit 30a
14a, the wafer W positioned in the first cleaning unit 30a is transported to the second cleaning unit 30b and cleaned, so that the wafer W in the first cleaning unit 30a is cleaned. The located wafer W can be rescued.

Further, according to the present embodiment, the first transfer unit 24a of the polishing section 12 can transfer the wafer W received from the transfer robot 23 to each of the first polishing device 21a and the second polishing device 21b. In addition, the second transport unit 24b of the polishing section 12 has a transport robot 23
can be transferred to each of the third polishing device 21c and the fourth polishing device 21d. For example, the first stage 52a of the first transfer unit 24a receives the first wafer from the transfer robot 23, moves to the first substrate transfer position TP1, and moves the first pusher 51a.
rises to deliver the first wafer from the first stage 52a to the first polishing device 21a,
While the wafer is being polished by the first polishing device 21a, the second stage 52b receives the second wafer from the transfer robot 23, moves to the second substrate transfer position TP2, and the second pusher 51b
rises to deliver the second wafer from the second stage 52b to the second polishing device 21b, and the second
The wafer can be polished in the second polishing device 21b. By polishing two wafers in parallel in this way, the throughput of the entire process can be improved. After the wafer is polished by the first polishing device 21a, the first pusher 51a descends to transfer the substrate from the first polishing device 21a to the second stage 52b. It is also possible to move to TP2, lift the second pusher 51b, transfer the wafer from the second stage 52b to the second polishing device 21b, and further polish the wafer continuously in the second polishing device 21b. .

Further, according to the present embodiment, the exchanger 50 of the polishing section 12 has three stages 5
2a to 52c, for example, while both the first stage 52a and the second stage 52b are used to transfer wafers to and from the first polishing device 21a and the second polishing device 21b, the third stage 52c can be left waiting to receive the next wafer.
As a result, the start timing of the polishing process for the next wafer can be advanced, and the throughput can be further improved.

Further, according to the present embodiment, when polishing the first wafer W1 and the second wafer W2 in parallel with the first polishing device 21a and the second polishing device 21b, the same third stage 52c is used. are used to transfer wafers to both the first polishing device 21a and the second polishing device 21b.
a and the second polishing device 21b, so that one polishing device 21
Even if trouble occurs in receiving the wafer from a, the wafer can be continuously transferred to the other polishing apparatus 21b (occurrence of deadlock can be avoided).

Further, according to the present embodiment, the cleaning unit transport mechanism 32a for transporting the wafer W between the cleaning modules 311a to 314a has a pair of arms 611 that can be opened and closed and a rotating mechanism 631. Since the driving mechanism 631 can rotate the pair of arms 611 so that the tip faces upward, even if the shutter 97 of a specific cleaning module among the plurality of cleaning modules 311a to 314a is closed, this cleaning module can be used. It is possible to avoid (skip) and move the arm 611 . Therefore, there is no need to wait for the shutter 97 to open when moving the arm 611 past this cleaning module, thereby improving the throughput of the overall process.

In addition, according to the present embodiment, when the rotating mechanism 631 rotates the pair of arms 611 so that the distal ends of the arms 611 are directed upward, the vertical movement mechanism 641 lowers the pair of arms 611 . The space required above 611 can be reduced.

Further, according to this embodiment, the pair of arms 611 and 612 and the vertical movement mechanisms 641 and 6
42 and rotating mechanisms 631 and 632, the two arms can be used according to the cleanliness of the wafers to be held. For example, one set of arms is used in the first half of the cleaning process in each cleaning module, and the other set of arms is used in the second half of the cleaning process. can be prevented from contacting one set of arms and being contaminated.

Further, according to this embodiment, since the pair of arms 611 are provided with chuck pieces 612a and 612b that can come into contact with the outer periphery of the wafer in two stages, the cleanliness of the wafer to be held can be improved. Chuck pieces 612a and 612b can be selectively used depending on the situation. For example, among the cleaning processes in each cleaning module, the lower chucking piece 612b is used in the first half of the cleaning process, and the upper chucking piece 612a is used in the second half of the cleaning process. can be prevented from coming into contact with the lower chuck piece 612b and being contaminated.

Further, according to this embodiment, the pair of arms 611, the vertical movement mechanism 641, and the rotation mechanism 6
31 is suspended below the arm transport mechanism 62, the maintenance space for the wafer gripping mechanism 601 can be expanded. Therefore, the time required for maintenance can be shortened.

Further, according to the present embodiment, before the wafer W to be polished is polished by the polishing apparatus 12, the surface of the wafer W can be washed by the preliminary washing module 39a. As a result, it is possible to reduce troubles such as the occurrence of scratches due to coarse particles being caught during the polishing process of the wafer W.

In the above-described embodiment, the wafer W before being cleaned in the secondary cleaning module 312a is gripped and conveyed by the pair of first arms 611, and the wafer W after cleaning in the secondary cleaning module 312a is held in a pair of Although it is gripped and transported by the second arm 612, it is not limited to this. For example, the wafer W before cleaning in the primary cleaning module 311 a is held by the pair of first arms 611 and transported, and the wafer W after cleaning in the primary cleaning module 311 a is held by the pair of second arms 612 . or the tertiary cleaning module 31
The wafer W before cleaning in 3a may be gripped and transported by the pair of first arms 611, and the wafer W after cleaning in the tertiary cleaning module 313a may be gripped and transported by the pair of second arms 612. .

Further, in the above-described embodiment, the transfer unit (for example, the first transfer unit 24a) of the polishing section 12 is arranged to transfer two substrates to each of the two polishing devices (the first polishing device 21a and the second polishing device 21b). Transfer position (first substrate transfer position TP1 and second substrate transfer position TP2)
Two pushers (first pusher 51a and second pusher 51b) that are arranged in and move up and down
and at least two stages ( The exchanger 50 includes the first stage 52a and the second stage 52b), but is not limited thereto, and the transport units of the polishing section 12 are M (
(M is a natural number of 3 or more), and are arranged at M substrate transfer positions for each of the polishing apparatuses. An exchanger 50 including at least M stages that horizontally move independently of each other between the standby position L1 and M substrate transfer positions may be provided. In this case, the exchanger 50 is arranged in multiple stages above and below the M stages, and is positioned at the standby position L1.
and M substrate transfer positions independently of the M stages.

In the above-described embodiments, the polishing apparatus for polishing wafers has been described as an example, but the present invention is applicable not only to the polishing apparatus but also to other substrate processing apparatuses. For example, a plurality of polishing units can be replaced with other substrate processing units (for example, film formation processing units such as plating processing units and CVD units, wet etching units and dry etching units, etc.), and substrate processing devices other than polishing devices can be used. may be configured. Also, a plurality of different substrate processing units may be combined and arranged side by side in a predetermined direction.

Although the preferred embodiments of the present invention have been described so far, it goes without saying that the present invention is not limited to the above-described embodiments and may be embodied in various forms within the scope of its technical concept.

10 Substrate Processing Apparatus 11 Loading/Unloading Section 12 Polishing Section 13 Cleaning Section 14 Transfer Section 15 Control Section 20a First Polishing Unit 20b Second Polishing Unit 21a First Polishing Device 21b Second Polishing Device 21c Third Polishing Device 21d Fourth Polishing apparatus 22 Polishing unit transport mechanism 23 Transport robot 231 Hand 232 Arm 233 Robot body 234 Reversing mechanism 24a First transport unit 24b Second transport units 25a to 25d Top rings 311a to 314a Cleaning modules 311b to 314b Cleaning module 32a Cleaning unit transport mechanism 32b cleaning unit transfer mechanism 33a wafer station 33b wafer station 39a preliminary cleaning module 39b preliminary cleaning module 330 shaft 331 guide stage 333 push stage 337 top ring guide 338 upper stage portion 338a taper 339a receiving portion 339b spring 340 guide sleeve 341 center sleeve 346 linear way 347 cylinder 349 electric actuator 351 compression spring 41 cover 41a loading port 41b loading port 42 slide stage 43 stage moving mechanism 44 exhaust duct 50 exchanger 51a first pusher 51b second pusher 52a first stage 52a1 pin 52b second stage 52c third Stage 601 First wafer gripping mechanism 602 Second wafer gripping mechanism 611 First arm 612 Second arms 612a, 612b Chuck piece 62 Arm transfer mechanism 631 First rotating mechanism 631A Rotating shaft 632 Second rotating mechanism 632A Rotating shaft 632L Link Member 641 First vertical movement mechanism 642 Second vertical movement mechanism 661 First opening/closing mechanism 662 Second opening/closing mechanism 67 Depth direction movement mechanism 68 Main frame 691 First sub-frame 692 Second sub-frame 71 Housing 72 Stage 73 Loading port 74 Arm Passage Opening 75 Drive Mechanism 76 Pin 81 Case 82 Stage 83 Loading Port 84 Arm Passage Opening 85 Drive Mechanism 86 Pin 87 Shutter 91 Case 94 Arm Passage Opening 97 Shutter 101 Polishing Table 102 Polishing Pad 103 Top Ring Shaft 104 Polishing liquid supply nozzle

Claims (8)

In a method of processing a substrate,
Preliminarily cleaning the surface of the substrate that has been taken out from the wafer cassette in the loading/unloading section and transported to the preprocessing module without being polished, using a roll-shaped sponge in the preprocessing module, and The cleaning module is provided in a cleaning unit having a plurality of cleaning modules, the plurality of cleaning modules and the pre-cleaning module are arranged linearly in plan view, and the pre-cleaning module is arranged on the side opposite to the wafer cassette with respect to the plurality of cleaning modules,
The substrate processing method, wherein after the preliminary cleaning, the substrate is transported to a polishing unit, and the surface of the substrate is polished. 2. The substrate processing method according to claim 1, wherein after said polishing, said substrate is transported to a first cleaning module among said plurality of cleaning modules to clean said substrate. The first cleaning module cleans the substrate with a roll-shaped sponge,
3. The method according to claim 2, wherein after cleaning in the first cleaning module, the substrate is moved to a second cleaning module among the plurality of cleaning modules, and the substrate is cleaned with a roll-shaped sponge or a pencil-shaped sponge. The substrate processing method described. 4. The substrate processing method according to claim 3, wherein the cleaning in the second cleaning module uses a roll-shaped sponge to clean the substrate. 4. After cleaning in said second cleaning module, said substrate is moved to a third cleaning module among said plurality of cleaning modules, and said substrate is cleaned with a pencil-shaped sponge or two-fluid jet cleaning. 5. The substrate processing method according to 4. 6. The substrate processing method according to claim 5, wherein after cleaning in said third cleaning module, said substrate is moved to a fourth cleaning module among said plurality of cleaning modules, and IPA vapor drying is performed on said substrate. 7. The substrate processing method according to claim 1, wherein said preprocessing module preliminarily cleans the front and back surfaces of said substrate with a roll-shaped sponge. A cleaning unit having a plurality of cleaning modules, in which wafers are removed from the wafer cassette by the loading/unloading section and transported to the pretreatment module without being polished by a roll-shaped sponge in the cleaning unit. a pre-cleaning module for pre-cleaning the surface of the substrate that has been coated, the plurality of cleaning modules and the pre-cleaning module are arranged in a straight line in a plan view, and the pre-cleaning module a cleaning unit disposed on the opposite side of the wafer cassette with respect to the plurality of cleaning modules;
a polishing section transport mechanism for transporting the substrate to a polishing unit after the preliminary cleaning;
a polishing unit for polishing the surface of the substrate transported to the polishing unit by the polishing section transport mechanism;
A substrate processing apparatus with

Images