WO2017170191A1

WO2017170191A1 - Conveyance apparatus, cleaning apparatus, and substrate conveying method

Info

Publication number: WO2017170191A1
Application number: PCT/JP2017/011928
Authority: WO
Inventors: 英立磯川
Original assignee: 株式会社荏原製作所
Priority date: 2016-03-31
Filing date: 2017-03-24
Publication date: 2017-10-05

Abstract

This conveyance apparatus is provided with: a substrate gripping mechanism configured to grip substrates; and a conveying mechanism for conveying the substrate gripping mechanism so as to sequentially convey the substrates among three or more cleaning modules. After the substrates have been fed to any of the cleaning modules from the substrate gripping mechanism, when a first cleaning module among the three or more cleaning modules is currently engaged in cleaning of a first substrate and a second cleaning module not continuous in conveying order from the first cleaning module is currently engaged in cleaning of a second substrate, the conveying mechanism causes the substrate gripping mechanism to stand by at a stand-by position corresponding to whichever cleaning module that finishes cleaning earlier, between the first cleaning module and the second cleaning module.

Description

Conveying device, cleaning device, and substrate conveying method

The present technology relates to a transfer mechanism, a cleaning apparatus, and a substrate transfer method, and more particularly, to a transfer apparatus, a cleaning apparatus, and a substrate transfer method that can be applied to a substrate processing apparatus used for polishing a substrate such as a semiconductor wafer flatly.

In recent years, as the integration of semiconductor devices has increased, circuit wiring has become finer, and the distance between wirings is becoming narrower. In the manufacture of semiconductor devices, many types of materials are repeatedly formed in a film shape on a silicon wafer to form a laminated structure. In order to form this laminated structure, a technique for flattening the surface of the wafer is important. As one means for flattening the surface of such a wafer, a polishing apparatus (also referred to as a chemical mechanical polishing apparatus) that performs chemical mechanical polishing (CMP) is widely used.

This chemical mechanical polishing (CMP) apparatus generally includes a polishing table to which a polishing pad is attached, a top ring for holding a wafer, and a nozzle for supplying a polishing liquid onto the polishing pad. While supplying the polishing liquid onto the polishing pad from the nozzle, the wafer is pressed against the polishing pad by the top ring, and the top ring and the polishing table are moved relative to each other to polish the wafer and flatten the surface.

The substrate processing apparatus is an apparatus having a function of cleaning and further drying the polished wafer in addition to such a CMP apparatus. In such a substrate processing apparatus, it is required to improve the throughput of the substrate processing.

As related prior art, there is International Publication No. 2007/099976.

It is desirable to provide a transfer device, a cleaning device, and a substrate transfer method that can improve throughput.

The transport device according to one embodiment
A substrate gripping mechanism configured to grip a substrate;
A transport mechanism that transports the substrate gripping mechanism so that the substrate is transported in order between three or more cleaning modules,
The transport mechanism is configured such that the first cleaning module of the three or more cleaning modules is cleaning the first substrate after the substrate is put into any of the cleaning modules from the substrate gripping mechanism; and The first cleaning module corresponds to the first cleaning module and the cleaning module that finishes cleaning earlier when the second cleaning module whose transport order is not continuous is cleaning the second substrate. The substrate gripping mechanism is put on standby at a standby position.

The cleaning apparatus according to one embodiment
3 or more cleaning modules;
A substrate gripping mechanism configured to grip a substrate;
A transport mechanism that transports the substrate gripping mechanism so that the substrate is transported in order between the three or more cleaning modules;
The transport mechanism is configured such that the first cleaning module of the three or more cleaning modules is cleaning the first substrate after the substrate is put into any of the cleaning modules from the substrate gripping mechanism; and The first cleaning module corresponds to the first cleaning module and the cleaning module that finishes cleaning earlier when the second cleaning module whose transport order is not continuous is cleaning the second substrate. The substrate gripping mechanism is put on standby at a standby position.

A substrate carrying method according to an embodiment is as follows:
A substrate transfer method for transferring a substrate in sequence between three or more cleaning modules,
Throwing the substrate into one of the cleaning modules from the substrate gripping mechanism;
Of the three or more cleaning modules, the first cleaning module is cleaning the first substrate, and the second cleaning module whose transport order is not continuous with the first cleaning module is cleaning the second substrate. In this case, the substrate holding mechanism is caused to wait at a standby position corresponding to the cleaning module that finishes cleaning earlier among the first cleaning module and the second cleaning module.

FIG. 1 is a plan view showing an overall configuration of a substrate processing apparatus according to an embodiment. FIG. 2 is a side view of the substrate processing apparatus shown in FIG. 1 viewed from the cleaning unit side. FIG. 3 is an exploded perspective view showing the internal configuration of the first wafer station. FIG. 4 is a perspective view showing the cleaning unit transport mechanism of the first cleaning unit of the cleaning unit. FIG. 5 is a perspective view showing a state where the second wafer gripping mechanism grips the substrate by the upper chuck piece. FIG. 6 is a perspective view showing a state in which the second wafer gripping mechanism grips the substrate with the lower chuck piece. FIG. 7A is a schematic diagram for explaining the operation of the second wafer gripping mechanism. FIG. 7B is a schematic diagram for explaining the operation of the second wafer gripping mechanism. FIG. 7C is a schematic diagram for explaining the operation of the second wafer gripping mechanism. FIG. 7D is a schematic diagram for explaining the operation of the second wafer gripping mechanism. FIG. 7E is a schematic diagram for explaining the operation of the second wafer gripping mechanism. FIG. 8A is a schematic diagram for explaining an example of the operation of the cleaning unit transport mechanism when a plurality of wafers are cleaned in parallel by each cleaning module. FIG. 8B is a schematic diagram for explaining an example of the operation of the cleaning unit transport mechanism when a plurality of wafers are cleaned in parallel by each cleaning module. FIG. 8C is a schematic diagram for explaining an example of the operation of the cleaning unit transport mechanism when a plurality of wafers are cleaned in parallel by each cleaning module. FIG. 8D is a schematic diagram for explaining an example of the operation of the cleaning unit transport mechanism when a plurality of wafers are cleaned in parallel by each cleaning module. FIG. 8E is a schematic diagram for explaining an example of the operation of the cleaning unit transport mechanism when a plurality of wafers are cleaned in parallel by each cleaning module. FIG. 8F is a schematic diagram for explaining an example of the operation of the cleaning unit transport mechanism when a plurality of wafers are cleaned in parallel by each cleaning module. FIG. 8G is a schematic diagram for explaining an example of the operation of the cleaning unit transport mechanism when a plurality of wafers are cleaned in parallel by each cleaning module. FIG. 8H is a schematic diagram for explaining an example of the operation of the cleaning unit transport mechanism when a plurality of wafers are cleaned in parallel by each cleaning module. FIG. 8I is a schematic diagram for explaining an example of the operation of the cleaning unit transport mechanism when a plurality of wafers are cleaned in parallel by each cleaning module. FIG. 9 is a flowchart for explaining the processing operation of the cleaning unit transport mechanism 32a.

Hereinafter, embodiments will be described with reference to the drawings. In the following description and the drawings used in the following description, the same reference numerals are used for portions that can be configured identically, and redundant descriptions are omitted.

FIG. 1 is a plan view showing an overall configuration of a substrate processing apparatus according to an embodiment, and FIG. 2 is a side view of the polishing apparatus shown in FIG. As shown in FIGS. 1 and 2, the substrate processing apparatus 10 in the present embodiment includes a housing having a substantially rectangular shape in plan view. It is divided into a section 13 and a transport section 14. The load / unload unit 11, the polishing unit 12, the cleaning unit 13, and the transport unit 14 are each assembled independently and exhausted independently. In addition, the substrate processing apparatus 10 is provided with a control unit 15 (also referred to as a control panel) that controls operations of the load / unload unit 11, the polishing unit 12, the cleaning unit 13, and the transfer unit 14.

<Load / Unload section>
The load / unload unit 11 includes a plurality of (four in the illustrated example) front load units 113 on which wafer cassettes for stocking a large number of wafers (substrates) W are placed. These front load portions 113 are arranged adjacent to each other in the width direction (direction perpendicular to the longitudinal direction) of the substrate processing apparatus 10. The front load unit 113 may be equipped with an open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod). Here, SMIF and FOUP are sealed containers that can maintain an environment independent of the external space by accommodating a wafer cassette inside and covering with a partition wall.

In addition, a traveling mechanism 112 is laid along the arrangement direction of the front load unit 113 in the load / unload unit 11, and the conveyance mechanism 112 is movable on the traveling mechanism 112 along the arrangement direction of the front load unit 113. A robot 111 is installed. The transfer robot 111 can access the wafer cassette mounted on the front load unit 113 by moving on the traveling mechanism 112. The transfer robot 111 has two hands on the upper and lower sides. For example, the upper hand is used when returning the wafer W to the wafer cassette, and the lower hand is used when transferring the wafer W before polishing. The upper and lower hands can be used properly.

Since the load / unload unit 11 is an area where it is necessary to maintain the cleanest state, the inside of the load / unload unit 11 is more than any of the outside of the apparatus, the polishing unit 12, the cleaning unit 13, and the transport unit 14. It is constantly maintained at a high pressure. In addition, a filter fan unit (not shown) having a clean air filter such as a HEPA filter or a ULPA filter is provided above the traveling mechanism 112 of the transfer robot 111, and particles, toxic vapor, Clean air from which gas has been removed is constantly blowing downward.

<Transport section>
The transfer unit 14 is a region for transferring a wafer before polishing from the load / unload unit 11 to the polishing unit 12, and is provided so as to extend along the longitudinal direction of the substrate processing apparatus 10. As shown in FIG. 1, the transport unit 14 is disposed adjacent to both the load / unload unit 11 that is the cleanest region and the polishing unit 12 that is the cleanest region. Therefore, in order to prevent the particles in the polishing unit 12 from diffusing into the load / unload unit 11 through the transfer unit 14, the polishing unit 12 is provided inside the transfer unit 14 from the load / unload unit 11 side, as will be described later. An airflow flowing toward the 12 side is formed.

<Polishing part>
As shown in FIG. 1, the polishing unit 12 is a region where the wafer W is polished, and includes a first polishing unit 20a having a first polishing device 21a and a second polishing device 21b, a third polishing device 21c, A second polishing unit 20b having a fourth polishing apparatus 21d, and a polishing unit transport mechanism 22 disposed adjacent to each of the transport unit 14, the first polishing unit 20a and the second polishing unit 20b. ing. The transfer unit 14 is disposed between the transfer unit 14 and the first polishing unit 20 a and the second polishing unit 20 b in the width direction of the substrate processing apparatus 10.

The first polishing apparatus 21a, the second polishing apparatus 21b, the third polishing apparatus 21c, and the fourth polishing apparatus 21d are arranged along the longitudinal direction of the substrate processing apparatus 10.

As shown in FIG. 1, the top ring of the first polishing apparatus 21a is moved between the polishing position and the first substrate transfer position TP1 by the swing operation of the top ring head, and the wafer is transferred to the first polishing apparatus 21a. Is performed at the first substrate transfer position TP1. Similarly, the top ring of the second polishing apparatus 21b is moved between the polishing position and the second substrate transfer position TP2 by the swing operation of the top ring head, and the wafer is transferred to the second polishing apparatus 21b by the second substrate. The top ring of the third polishing apparatus 21c is moved between the polishing position and the third substrate transfer position TP3 by the swing operation of the top ring head, and the wafer is transferred to the third polishing apparatus 21c. The delivery is performed at the third substrate transfer position TP3, and the top ring of the fourth polishing apparatus 21d is moved between the polishing position and the fourth substrate transfer position TP4 by the swing operation of the top ring head. Transfer of the wafer to 21d is performed at the fourth substrate transfer position TP4.

The polishing unit transport mechanism 22 includes a first transport unit 24a that transports the wafer W to the first polishing unit 20a, a second transport unit 24b that transports the wafer W to the second polishing unit 20b, a first transport unit 24a, And a transfer robot 23 which is disposed between the transfer unit 24b and transfers a wafer between the transfer unit 14 and the first transfer unit 24a and the second transfer unit 24b. In the illustrated example, the transfer robot 23 is disposed substantially at the center of the housing of the substrate processing apparatus 10.

<Washing part>
As shown in FIGS. 1 and 2, the cleaning unit 13 is a region for cleaning the polished wafer, and includes a first cleaning unit 30a and a second cleaning unit 30b arranged in two upper and lower stages. The transport unit 14 described above is disposed between the first cleaning unit 30a and the second cleaning unit 30b. Since the 1st washing | cleaning unit 30a, the conveyance part 14, and the 2nd washing | cleaning unit 30b are arranged so that it may overlap with an up-down direction, the advantage that a footprint is small is acquired.

The first cleaning unit 30a includes a plurality (four in the illustrated example) of

cleaning modules

311a, 312a, 313a, 314a, a wafer station 33a, and a wafer between each of the cleaning modules 311a to 314a and the wafer station 33a. And a cleaning section transport mechanism 32a for transporting W. The plurality of cleaning modules 311 a to 314 a and the wafer station 33 a are arranged in series along the longitudinal direction of the substrate processing apparatus 10. A filter fan unit (not shown) having a clean air filter is provided above each of the cleaning modules 311a to 314a, and clean air from which particles have been removed by this filter fan unit always blows downward. Yes. Further, the inside of the first cleaning unit 30 a is always maintained at a pressure higher than that of the polishing unit 12 in order to prevent inflow of particles from the polishing unit 12.

Similarly, the second cleaning unit 30b includes a plurality (four in the illustrated example) of cleaning

modules

311b, 312b, 313b, 314b, a wafer station 33b, and between each of the cleaning modules 311b to 314b and the wafer station 33b. And a cleaning unit transfer mechanism 32b for transferring the wafer W. The plurality of cleaning modules 311 b to 314 b and the wafer station 33 b are arranged in series along the longitudinal direction of the substrate processing apparatus 10. A filter fan unit (not shown) having a clean air filter is provided above each of the cleaning modules 311b to 314b. Clean air from which particles have been removed by this filter fan unit always blows downward. Yes. Further, the inside of the second cleaning unit 30 b is always maintained at a pressure higher than that of the polishing unit 12 in order to prevent inflow of particles from the polishing unit 12.

FIG. 3 is an exploded perspective view showing the internal configuration of the wafer station 33a. As shown in FIG. 3, the wafer station 33 a includes a casing 71 having a substantially rectangular parallelepiped shape, a stage 72 that is disposed inside the casing 71 and holds the wafer W, and a drive mechanism 75 that moves the stage 72 up and down. ,have.

Of these, the casing 71 has a bottom plate, four side plates, and a top plate. As shown in FIG. 3, a carry-in port 73 communicating with the polishing unit 12 is formed at the lower end of the side plate facing the polishing unit 12 among the four side plates. The carry-in port 73 can be opened and closed by a shutter (not shown). As shown in FIG. 3, the transfer robot 23 of the polishing unit 12 can access the inside of the housing 71 from the carry-in port 73.

Further, the cleaning unit is transported to a height position higher than the carry-in port 73 of the remaining three side plates among the four side plates (that is, the side plate facing the cleaning unit transport mechanism 32a described later and the left and right side plates). An arm passage opening 74 for passing the arm of the mechanism 32a is formed. The arm passage (wafer transfer) opening 74 can be opened and closed by a shutter (not shown). As shown in FIG. 3, the cleaning unit transport mechanism 32 a of the first cleaning unit 30 a can access the inside of the housing 71 from the arm passage opening 74.

As the drive mechanism 75, for example, a motor drive mechanism using a ball screw or an air cylinder is used. The stage 72 is fixed to a movable portion of the drive mechanism 75, and is driven by a power applied from the drive mechanism 75 to a height position facing the carry-in port 73 and a height facing the arm passage (wafer transfer) opening 74. It is moved up and down between positions (see FIG. 3).

The outer periphery of the stage 72 is provided with four pins 76 protruding upward. Therefore, the wafer W placed on the stage 72 is supported on the stage 72 in a state where the outer peripheral edge is guided and positioned by the four pins 76. These pins 76 are made of a resin such as polypropylene (PP), polychlorotrifluoroethylene (PCTFE), or polyetheretherketone (PEEK).

Since the cleaning unit transport mechanism 32b of the second cleaning unit 30b has the same configuration as the cleaning unit transport mechanism 32a of the first cleaning unit 30a, the cleaning unit transport mechanism 32a of the first cleaning unit 30a will be described below. To do.

FIG. 4 is a perspective view showing the cleaning unit transport mechanism 32a of the first cleaning unit 30a. As illustrated in FIG. 4, the cleaning unit transport mechanism 32 a includes a plurality of first wafer gripping mechanisms 601 and second wafer gripping mechanisms 602 that grip the wafer W, and a plurality of first wafer gripping mechanisms 601 and second wafer gripping mechanisms 602. Arm transfer mechanism 62 that linearly moves along the direction in which the cleaning modules 311a to 314a are arranged. That is, in the present embodiment, the number of

wafer gripping mechanisms

601 and 602 is smaller than the number of cleaning modules 311a to 314a.

In the present embodiment, for example, the first wafer gripping mechanism 601 and the second wafer gripping mechanism 602 can be used properly according to the cleanliness of the wafer W. For example, among the primary to quaternary cleaning modules 311a to 314a, the primary cleaning module 311a and the secondary cleaning module 312a in the first half of the cleaning process use the first wafer gripping mechanism 601 and the third cleaning module 313a in the second half of the cleaning process and By using the second wafer gripping mechanism 602 in the fourth cleaning module 314a, it is possible to prevent the wafer W in the latter half of the cleaning process from coming into contact with the first wafer gripping mechanism 601 and being contaminated.

More specifically, the first wafer gripping mechanism 601 includes a pair of first arms 611 that can be opened and closed to grip a wafer, a first vertical movement mechanism 641 that moves the pair of first arms 611 up and down, and a pair of first arms. A first rotation mechanism 631 that rotates 611 about a rotation shaft 631A parallel to the opening and closing direction, and a first opening and closing mechanism 661 that opens and closes the pair of first arms 611 in directions close to each other or in directions away from each other. Have.

Similarly, the second wafer gripping mechanism 602 includes a pair of openable and closable second arms 612 that grip a wafer, a second vertical movement mechanism 642 that moves the pair of second arms 612 up and down, and a pair of second arms 612. And a second opening / closing mechanism 662 for opening / closing the pair of second arms 612 in a direction close to each other or in a direction away from each other. is doing.

As the arm transport mechanism 62, for example, a motor drive mechanism using a ball screw is used. As shown in FIG. 4, the ball screw of the arm transport mechanism 62 is provided above the cleaning modules 311a to 314a so as to extend in the arrangement direction of the cleaning modules 311a to 314a.

A main frame 68 is attached to the ball screw of the arm transport mechanism 62. The main frame 68 is attached so as to hang downward from the ball screw of the arm transport mechanism 62, and faces the side surfaces of the cleaning modules 311a to 314a. By driving a motor connected to the ball screw of the arm transport mechanism 62, the main frame 68 is linearly moved along the arrangement direction of the cleaning modules 311a to 314a while facing the side surfaces of the cleaning modules 311a to 314a.

In the illustrated example, the main frame 68 has a depth direction moving mechanism 67 for adjusting the position in the depth direction (a direction perpendicular to both the arrangement direction of the cleaning modules 311a to 314a and the vertical direction). Yes. As the depth direction moving mechanism 67, for example, a motor driving mechanism using a rack and pinion is used. The position of the main frame 68 in the depth direction is adjusted by driving the depth direction moving mechanism 67.

The first vertical movement mechanism 641 and the second vertical movement mechanism 642 are provided on the main frame 68. As the first vertical movement mechanism 641 and the second vertical movement mechanism 642, for example, a motor drive mechanism using a ball screw is used. As shown in FIG. 4, the ball screw of the first vertical movement mechanism 641 is attached to extend in the vertical direction at the left end portion of the main frame 68, and the ball screw of the second vertical movement mechanism 642 is the main frame 68. It is attached so that it may extend in the up-and-down direction at the right end of the.

The first sub-frame 691 that supports the pair of first arms 611 is attached to the ball screw of the first vertical movement mechanism 641. The first sub frame 691 is provided on the left side of the main frame 68 so as to be adjacent to the main frame 68, and is opposed to the side surfaces of the cleaning modules 311a to 314a. The first subframe 691 is linearly moved along the vertical direction by driving a motor coupled to the ball screw of the first vertical movement mechanism 641.

Similarly, a second sub-frame 692 that supports the pair of second arms 612 is attached to the ball screw of the second vertical movement mechanism 642. The second sub frame 692 is provided on the right side of the main frame 68 so as to be adjacent to the main frame 68, and can face the side surfaces of the cleaning modules 311a to 314a. The second sub-frame 692 is linearly moved along the vertical direction by driving a motor coupled to the ball screw of the second vertical movement mechanism 642.

As shown in FIGS. 5 and 6, the pair of second arms 612 are provided with chuck tops 612 a and 612 b that can contact the outer peripheral portion of the wafer W in two upper and lower stages. For example, a relatively clean wafer W is held by the upper chuck piece 612a, and a relatively clean wafer is held by the lower chuck piece 612b, so that the lower chuck piece 612b is cleaned. It is possible to prevent the wafer W from being contaminated by coming into contact with the wafer W having a high degree.

Next, an example of the operation of the pair of second arms 612 will be described with reference to FIGS. 7A to 7E. As described above, each cleaning module is partitioned by the casing 91 so that the used fluid is not scattered outside during cleaning of the wafer W, and an arm passage opening 94 is formed on the side surface of the casing 91. . The arm passage opening 94 is provided with a shutter 97 that can be opened and closed.

When the wafer W after cleaning is taken out from the housing 91, as shown in FIG. 7A, the pair of second arms 612 whose front ends are directed upward are adjacent to the housing 91 by driving the arm transport mechanism 62. Move to the standby position. In the present embodiment, even when the shutter 97 of the housing 91 is closed, the pair of second arms 612 are placed on standby adjacent to the housing 91 by turning the tips of the pair of second arms 612 upward. Can be moved to a position. Therefore, the start timing of the wafer take-out operation can be advanced, and the throughput of the entire process can be improved.

Next, as shown in FIG. 7B and FIG. 7C, the pair of second arms 612 are rotated about the rotation shaft 632 </ b> A by driving the second rotation mechanism 632. In the illustrated example, the pair of second arms 612 is rotated 90 ° clockwise around the rotation axis 632A in a side view, and the ends of the pair of second arms 612 are directed sideways.

Next, as shown in FIG. 7D, the second vertical movement mechanism 642 is driven to raise the pair of second arms 612 to the same height position as the arm passage opening 94. At this time, the shutter 97 is retracted and the arm passage opening 94 is opened.

Next, as shown in FIG. 7E, by driving the second opening / closing mechanism 662, the pair of second arms 612 are closed in a direction approaching each other and inserted into the inside of the casing 91 through the arm passage opening 94. Then, the wafer W in the housing 91 is gripped. Then, the pair of second arms 612 holding the wafer W is moved to the next cleaning module by driving the arm transfer mechanism 62.

When the uncleaned wafer W is loaded into the casing 91, the above-described operations shown in FIGS. 7A to 7E are performed in the reverse order. That is, as shown in FIG. 7E, the pair of second arms 612 holding the wafer W is moved to the inside of the housing 91 through the arm passage opening 94 by the drive of the arm transfer mechanism 62.

Next, as shown in FIG. 7E, by driving the second opening / closing mechanism 662, the pair of second arms 612 is opened in a direction away from each other, and is projected to the outside of the housing 91 through the arm passage opening 94. It is.

Next, as shown in FIG. 7C, the second vertical movement mechanism 642 is driven to lower the pair of second arms 612 to a height position lower than the arm passage opening 94. At this time, the cleaning process of the wafer W is started inside the housing 91 by the shutter 97 through the arm passage opening 94.

Next, as shown in FIGS. 7B and 7A, the pair of second arms 612 is rotated about the rotation shaft 632 </ b> A by driving the second rotation mechanism 632. In the illustrated example, the pair of second arms 612 are rotated 90 ° counterclockwise about the rotation shaft 632A in a side view, and the ends of the pair of second arms 612 are directed upward. Then, the pair of second arms 612 whose front ends are directed upward are moved to the next cleaning module by driving the arm transport mechanism 62. In the present embodiment, when the second rotation mechanism 632 rotates the pair of second arms 612 so that the tip ends upward, the second vertical movement mechanism 642 moves the pair of second arms 612 down. The space required above the pair of second arms 612 can be reduced.

In each of the cleaning modules 311a to 314a and 311b to 314b, a plurality of wafers W can be cleaned in parallel. Referring to FIGS. 8A to 8I, as an example, the operation of the cleaning unit transport mechanism 32a when the plurality of wafers W are cleaned in parallel by the primary to tertiary cleaning modules 311a to 313a of the first cleaning unit 30a. explain.

First, as shown in FIG. 8A, in the primary cleaning module 311a, the shutter 97 is closed to perform the first stage cleaning on the second wafer W2, and in the secondary cleaning module 312a, the first wafer is cleaned. Assume that the second-stage cleaning for W1 is completed and the arm passage opening 94 is open. In this case, the pair of first arms 611 is moved to the standby position for the secondary cleaning module 312a, and the tips of the pair of first arms 611 are directed sideways.

8B, the pair of first arms 611 are closed so as to be close to each other, and the first wafer W1 in the secondary cleaning module 312a is held by the pair of first arms 611. Further, the shutter 97 of the tertiary cleaning module 313a is retracted and the arm passage opening 94 is opened.

Next, as shown in FIG. 8C, the first wafer W1 held by the pair of first arms 611 is moved from the secondary cleaning module 312a to the tertiary cleaning module 313a through the arm passage opening 94. The

And as shown to FIG. 8D, a pair of 1st arm 611 is opened so that it may mutually space apart, and it comes out to the left-right outer side of the tertiary washing module 313a. In the secondary cleaning module 312a, the shutter 97 is closed to prevent drying.

Next, as shown in FIG. 8E, the shutter 97 of the tertiary cleaning module 313a is closed, and the tertiary cleaning module 313a performs the third stage cleaning on the first wafer W1.

Next, as shown in FIG. 8F, when the first cleaning of the second wafer W2 in the primary cleaning module 311a is completed, the shutter 97 of the primary cleaning module 311a is retracted and the arm passage opening 94 is opened. It is. At this time, the pair of first arms 611 are rotated by the rotation mechanism, and the tips of the pair of first arms 611 are directed upward.

Then, as shown in FIG. 8G, the pair of first arms 611 are moved so as to avoid (skip) the tertiary cleaning module 313a and the secondary cleaning module 312a in which the shutter 97 is closed, and the primary cleaning module. It is arranged at the standby position 311a.

Next, as shown in FIG. 8H, the pair of first arms 611 are rotated by the rotation mechanism, and the tips of the pair of first arms 611 are directed sideways. Then, as shown in FIG. 8I, the pair of first arms 611 are closed so as to be close to each other, and the second wafer W2 in the primary cleaning module 311a is held by the pair of first arms 611. Thereafter, the second wafer W2 held by the pair of first arms 611 is transferred to the secondary cleaning module 312a, and the second stage cleaning is performed.

As described above, in the present embodiment, since the plurality of wafers W can be cleaned in parallel by the cleaning modules 311a to 314a and 311b to 314b, the throughput of the entire process can be improved.

By the way, wafers are not always transferred at equal time intervals between cleaning modules. For example, as shown in FIG. 8E, when the wafers W2 and W1 are cleaned in the primary cleaning module 311a and the tertiary cleaning module 313a, respectively, the cleaning start timing of the wafers W1 and W2, the primary cleaning modules 311a and the tertiary Depending on the difference in cleaning time by the cleaning module 313a, the cleaning of the wafer W2 by the primary cleaning module 311a may be completed early, or the cleaning of the wafer W1 by the tertiary cleaning module 313a may be completed early.

In FIG. 8E, the first arm 611 in the first wafer gripping mechanism 601 puts the wafer W2 into the tertiary cleaning module 313a and stands by at the standby position of the tertiary cleaning module 313a. Then, upon completion of the cleaning by the primary cleaning module 311a (FIG. 8F), the first arm 611 is disposed at the standby position of the primary cleaning module 311a (FIG. 8G).

In this case, while the substrate cleaning of the wafer W1 is completed while the first arm 611 moves from FIG. 8F to FIG. 8G, the wafer W1 cannot be transported to the next secondary cleaning module 312a. This wastes time. Therefore, when the wafers W1 and W2 are being cleaned by the tertiary cleaning module 313a and the primary cleaning module 311a whose transfer order is not continuous, if the cleaning of the wafer W2 is completed first, the next secondary cleaning is immediately performed. Desirably, cleaning can be initiated at module 312a.

Therefore, in the present embodiment, the following is performed.
FIG. 9 is a flowchart for explaining the processing operation of the cleaning unit transport mechanism 32a. As shown in FIG. 8E, it is assumed that the introduction of the wafer W1 from the first arm 611 to the tertiary cleaning module 313a is completed (step S1).

Then, while the primary cleaning module 311a cleans the wafer W2, the tertiary cleaning module 313a whose transport order is not continuous with the primary cleaning module 311a cleans the wafer W1. However, the secondary cleaning module 312a does not perform cleaning. That is, the next operation is to transfer the wafer W2 from the primary cleaning module 311a to the secondary cleaning module 312a, or to transfer the wafer W1 from the tertiary cleaning module 313a to another apparatus (for example, the fourth cleaning module 314a). It is to convey.

Therefore, the arm transport mechanism 62 predicts which of the primary cleaning module 311a and the tertiary cleaning module 313a is expected to finish the cleaning earlier (step S2). Which one completes the cleaning earlier is specified based on, for example, a substrate processing recipe. For example, since the control unit 15 in FIG. 1 knows the substrate processing recipe, it can identify which one finishes the cleaning earlier. For this reason, the arm transport mechanism 62 may receive a notification from the control unit 15 as to which cleaning is completed earlier. Or cleaning part conveyance mechanism 32a itself may specify based on a substrate processing recipe.

When the primary cleaning module 311a is expected to finish the cleaning first (YES in step S2), the arm transport mechanism 62 moves the first arm 611 to the standby position of the primary cleaning module 311a and waits at this position. (Step S3a). When the primary cleaning module 311a finishes cleaning (YES in step S4a), the first arm 611 immediately takes out the wafer W2 from the primary cleaning module 311a (step S5a).

On the other hand, when the tertiary cleaning module 313a is expected to finish the cleaning first (NO in step S2), the arm transport mechanism 62 makes the first arm 611 stand by at the standby position of the tertiary cleaning module 313a (step S3b). . When the tertiary cleaning module 313a finishes cleaning (YES in step S4b), the first arm 611 immediately takes out the wafer W1 from the tertiary cleaning module 313a (step S5b).

In this way, after the wafer is loaded from the first arm 611 to the tertiary cleaning module 313a, the cleaning module in which the cleaning is completed in advance without waiting for the cleaning by the primary cleaning module 311a and the tertiary cleaning module 313a to end. The first arm 611 waits at the standby position. Therefore, the wafer can be transferred as soon as the cleaning is completed, the waiting time is minimized, and the throughput is improved.

It should be noted that this method can be applied to cases other than the situation shown in FIG. 8E. For example, when a wafer is being cleaned by the tertiary cleaning module 313a, even if another wafer is loaded into the primary cleaning module 311a, the cleaning is completed earlier of the primary cleaning module 311a and the tertiary cleaning module 313a. The first arm 611 can be put on standby at the standby position of the cleaning module to be used.

In addition, when cleaning is performed by sequentially transporting wafers to four or more cleaning modules, cleaning is completed earliest after a wafer is loaded into another cleaning module whose transport order is not continuous during wafer cleaning with a certain cleaning module. What is necessary is just to make the arm which hold | grips a substrate stand by in the stand-by position of a cleaning module.

In the above-described embodiment, the wafer W before cleaning by the secondary cleaning module 332a is held and transported by the pair of first arms 611, and the wafer W after cleaning by the secondary cleaning module 332a is paired. Although gripped and transported by the second arm 612, the present invention is not limited to this. For example, the wafer W before cleaning in the primary cleaning module 331a is gripped and transferred by the pair of first arms 611, and the wafer W after cleaning in the primary cleaning module 331a is gripped by the pair of second arms 612. The wafer W before cleaning in the tertiary cleaning module 333a may be held and transported by the pair of first arms 611, and the wafer W after cleaning in the tertiary cleaning module 333a may be transferred to the pair of first arms. The two arms 612 may be held and conveyed.

In the above-described embodiment, the polishing apparatus that polishes the wafer has been described as an example. However, the present technology is not limited to the polishing apparatus, but can be applied to other substrate processing apparatuses. For example, a plurality of polishing units are replaced with another substrate processing unit (for example, a film processing unit such as a plating unit or a CVD unit, a wet etching unit or a dry etching unit), and a substrate processing apparatus different from the polishing apparatus is used. It may be configured. Also, a plurality of different substrate processing units may be combined and arranged in a predetermined direction.

Although preferred embodiments of the present technology have been described so far, it is needless to say that the present technology is not limited to the above-described embodiments, and may be implemented in various forms within the scope of the technical idea.

Claims

A substrate gripping mechanism configured to grip a substrate;
A transport mechanism that transports the substrate gripping mechanism so that the substrate is transported in order between three or more cleaning modules,
The transport mechanism is configured such that the first cleaning module of the three or more cleaning modules is cleaning the first substrate after the substrate is put into any of the cleaning modules from the substrate gripping mechanism; and The first cleaning module corresponds to the first cleaning module and the cleaning module that finishes cleaning earlier when the second cleaning module whose transport order is not continuous is cleaning the second substrate. A transport apparatus, wherein the substrate gripping mechanism is placed on standby at a standby position.
2. The transfer device according to claim 1, wherein a cleaning module that finishes cleaning earlier is identified based on a substrate processing recipe among the first cleaning module and the second cleaning module.
The transport mechanism corresponds to a cleaning module in which cleaning is completed earlier among the first cleaning module and the second cleaning module before both the first cleaning module and the second cleaning module are cleaned. The transport apparatus according to claim 1, wherein the substrate gripping mechanism is placed on standby at a standby position where the substrate is held.
3 or more cleaning modules;
A substrate gripping mechanism configured to grip a substrate;
A transport mechanism that transports the substrate gripping mechanism so that the substrate is transported in order between the three or more cleaning modules;
The transport mechanism is configured such that the first cleaning module of the three or more cleaning modules is cleaning the first substrate after the substrate is put into any of the cleaning modules from the substrate gripping mechanism; and The first cleaning module corresponds to the first cleaning module and the cleaning module that finishes cleaning earlier when the second cleaning module whose transport order is not continuous is cleaning the second substrate. A cleaning apparatus, wherein the substrate holding mechanism is made to wait at a standby position.
A substrate transfer method for transferring a substrate in sequence between three or more cleaning modules,
Throwing the substrate into one of the cleaning modules from the substrate gripping mechanism;
Of the three or more cleaning modules, the first cleaning module is cleaning the first substrate, and the second cleaning module whose transport order is not continuous with the first cleaning module is cleaning the second substrate. In this case, the substrate transport method comprises: waiting the substrate gripping mechanism at a standby position corresponding to a cleaning module that finishes cleaning earlier among the first cleaning module and the second cleaning module.