JP2000294616A - Alignment mechanism with temporary loading table and polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a positioning mechanism with a temporary loading table and polishing device by which both semiconductor wafers subject to pre- processing and post-processing in two reverse directions can be handled smoothly and simultaneously. SOLUTION: This alignment mechanism pushes up a semiconductor wafer which is placed on a supporting member 55, from the supporting member 55 by using an alignment member 58, and rotates it so as to align the reference position of a notch or the like of the semiconductor wafer at a desired position. A temporary loading table 59 on which the semiconductor wafer is placed separately is installed under a part placing and aligning the semiconductor wafer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning mechanism with a temporary mounting table and a polishing apparatus suitable for use in a polishing apparatus for polishing a semiconductor wafer in a flat and mirror-like manner.

[0002]

2. Description of the Related Art Conventionally, as a means for flattening the surface of a semiconductor wafer, a semiconductor wafer held on a top ring is pressed while supplying a polishing liquid to a polishing surface such as a polishing cloth stuck on a rotating turntable. Mechanical polishing (CM
P) A polishing apparatus has been developed and used.

In this type of polishing apparatus, a semiconductor wafer is taken out of a wafer cassette section in which a wafer cassette is mounted, transported to a polishing section and polished, and the polished semiconductor wafer is cleaned in a cleaning section and then again. Of the wafer cassette.

The above-described conventional polishing apparatus does not include a positioning mechanism for aligning the positions (reference positions) of notches and orientation flats provided on the semiconductor wafer. Therefore, the reference positioning of these semiconductor wafers is not performed. In addition, the polishing is performed in a separate process by a dedicated alignment machine installed separately from the polishing apparatus.

For this reason, there is a problem that not only a separate process for aligning the semiconductor wafer needs to be independently incorporated into the semiconductor manufacturing process, but also a dedicated alignment machine is required.

In order to solve this problem, an alignment mechanism is installed at a position between a processing section for performing polishing and cleaning of the polishing apparatus and a semiconductor wafer transfer path of a wafer cassette section, and the processing section performs processing. The reference position of the completed semiconductor wafer may be adjusted by this mechanism and then returned to the wafer cassette.

However, the position between the processing section and the wafer cassette section of the polishing apparatus is different from the route for transferring the semiconductor wafer before polishing from the wafer cassette section to the processing section (in this case, usually no positioning is necessary), and conversely, the position after polishing. Since there are two routes in the opposite direction of the route for transferring the semiconductor wafer to the wafer cassette section, if an alignment mechanism is installed at this position, the semiconductor wafers that do not need to be aligned also pass through the alignment mechanism. Have to be
There is a problem that the semiconductor wafer cannot be smoothly transferred to the routes in both directions.

On the other hand, the conventional alignment mechanism sucks the central portion of the lower surface of the semiconductor wafer by vacuum suction, rotates it, detects a notch or orientation flat provided on the outer periphery of the semiconductor wafer, and stops it at a predetermined position. In such a case, the positioning is performed.

However, since the central portion of the lower surface of the semiconductor wafer is vacuum-sucked by the suction member, there is a problem that dust adheres to the lower surface of the wafer from the suction member.

When the semiconductor wafer is vacuum-sucked, the position of the vacuum-suction may be shifted from the center of the semiconductor wafer. Even if the vacuum suction position is deviated from the center of the semiconductor wafer, to detect a small notch or the like provided on the outer periphery of the semiconductor wafer, even if the position of the notch or the like is slightly deviated as a detection sensor, it is detected. Expensive detection sensors had to be used to be able.

[0011]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to perform a process for aligning a semiconductor wafer in a polishing apparatus. Also, two semiconductor wafers can be simultaneously and smoothly moved in the two opposite directions: a route for transferring the semiconductor wafer before polishing from the wafer cassette portion to the processing portion and a route for transferring the semiconductor wafer after polishing to the wafer cassette portion. An object of the present invention is to provide a positioning mechanism with a temporary mounting table and a polishing apparatus that can be handled.

It is another object of the present invention to provide a positioning mechanism with a temporary mounting table which makes it difficult for dust to adhere to a semiconductor wafer.

Another object of the present invention is to provide an alignment mechanism with a temporary mounting table which can easily center a mounted semiconductor wafer and can use an inexpensive detection sensor.

[0014]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a positioning mechanism which is installed in a path for transporting a semiconductor wafer, places the semiconductor wafer thereon, and adjusts its reference position in a predetermined direction. In the above, a temporary mounting table on which the semiconductor wafer is separately mounted is provided in the vicinity of a portion of the positioning mechanism on which the semiconductor wafer is mounted, thereby forming a positioning mechanism with a temporary mounting table. Further, the present invention provides a support member for supporting the outer peripheral edge of the semiconductor wafer, wherein the supporting member has a tapered surface at an angle at which the outer peripheral edge of the supported semiconductor wafer slides, thereby causing the supported semiconductor wafer to be centered, and / or A guide member for guiding the outer peripheral edge of the semiconductor wafer on the mounting table is provided with a tapered surface at an angle at which the outer peripheral edge of the guided semiconductor wafer slides, thereby reducing the centering of the guided semiconductor wafer. Further, the present invention provides a positioning mechanism with a temporary mounting table, wherein a supporting member for supporting an outer peripheral edge of the semiconductor wafer and an outer peripheral portion of the lower surface of the semiconductor wafer are brought into contact with the vicinity of the outer periphery and pushed up from the supporting member to rotate the semiconductor wafer. The apparatus includes a positioning member for adjusting a reference position to a desired position, and a detecting means for detecting a reference position of the semiconductor wafer. In addition, the present invention provides a method for manufacturing a semiconductor device, comprising the steps of: mounting a temporary mounting table between a processing section for polishing a semiconductor wafer; A polishing apparatus was constructed by installing a positioning mechanism. The present invention also provides a processing unit for polishing a semiconductor wafer, a semiconductor wafer to be polished to the processing unit, and a plurality of storage units for receiving the polished semiconductor wafer and a semiconductor wafer transport path between the semiconductor wafer transport path, Install a temporary mounting table alignment mechanism that adjusts the reference position of the semiconductor wafer in a predetermined direction,
A polishing apparatus having a structure in which a semiconductor wafer positioned by the positioning mechanism with a temporary mounting table is stored in a plurality of storage sections, wherein the positioning mechanism adjusts a reference position of a reference position of the semiconductor wafer according to the plurality of storage sections. Were configured to be different. Further, the positioning mechanism with a temporary mounting table can selectively store the semiconductor wafer in the plurality of storage portions.

[0015]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1 and 2 are views showing a positioning mechanism 50 with a temporary table according to an embodiment of the present invention. FIG. 1 (a) is a plan view, FIG. 1 (b) is a side view, and FIG.
FIG. 2A is a view taken along the line AA in FIG. 1B, and FIG.
FIG. 2B is a view taken along the arrow BB, and FIG.
2D is a side sectional view of the upper part of the mechanism (a sectional view taken along the line DD in FIG. 1A).

As shown in these figures, the positioning mechanism 50 with a temporary table is provided with a frame 51 assembled in a box shape.
And four support members 55 erected upward from the periphery of a through hole 53a at the center of the mounting table 53 mounted on the upper surface of the frame 51, and a plate 5 installed below the mounting table 53.
7, four positioning members 58 that stand upright from the upper surface and enter the inner peripheral surface of the through hole 53 a, and a temporary mounting table 59 installed below the plate 57.

Here, a notch detection sensor 61 for detecting a notch provided on the outer peripheral portion of the semiconductor wafer is fixed to the upper surface of the mounting table 53. Further, a wafer detection sensor 63 for detecting whether or not the semiconductor wafer 6 exists on the support member 55 is fixed to the upper surface of the frame 51.

The plate 57 is formed by four columns 65
The temporary mounting table 59 is fixed to a rotating table 67 installed below the temporary mounting table 59 so as not to touch the same, and the rotating table 67 is rotatably attached to a motor 69. The motor 69 is fixed to the lift 71, and the lift 71 is supported by a spline shaft 73 so as to be vertically movable, and the lift 71 is driven by an air cylinder (vertical drive means) 75 so as to be vertically movable.

On the other hand, the temporary table 59 has four pins (guide members) 77 for supporting the semiconductor wafer 6 standing on the upper surface thereof, and a reflection type wafer presence / absence sensor 79 at a predetermined position.
Is installed. Further, the temporary mounting table 59 is fixed on a column 81 erected from a lower portion of the frame 51 via a through hole provided in the center of the motor 69. An origin sensor 83 is mounted on the elevating table 71,
The sensor dog 85 is attached to the lower surface of the.

That is, the positioning mechanism 50 with the temporary table
When the motor 69 is driven, the turntable 67, the plate 57, and the positioning member 58 are rotated. When the air cylinder 75 is driven, the elevator 71 and the motor 6 are driven.
9, turntable 67, plate 57 and alignment member 58
Moves up and down. During these rotations and vertical movements, the temporary table 59 does not move while maintaining the original position.

FIGS. 3A and 3B are diagrams showing the relationship among a notch detection sensor (detection means) 61, a support member 55, and a positioning member 58. FIG. As shown in FIGS. 1 to 3, an inverted conical tapered surface 55 a that supports the semiconductor wafer 6 in contact with the outer peripheral edge of the semiconductor wafer 6 is provided above the inner peripheral surface of the support member 55. The inclination angle of the tapered surface 55a is set to an angle at which the outer peripheral edge of the supported semiconductor wafer 6 slides. In this embodiment, the support member 55
Teflon material or PEEK (polyetheretherketone) material is used as the material of the. This inclination angle varies depending on various conditions such as the weight and size of the semiconductor wafer 6, the material of the support member 55, and the surface condition of the tapered surface 55a. By providing the tapered surface 55a having such an angle, 4
Even if the semiconductor wafer 6 placed on the tapered surface 55a of the book supporting member 55 is placed at an angle, the outer peripheral edge of the semiconductor wafer 6 slides on the tapered surface 55a due to its own weight, and stops at a position where it is just horizontal. Becomes That is, by setting the taper surface 55a to the inclination angle, the semiconductor wafer 6 placed thereon can be easily centered (centered).

On the other hand, as shown in FIG.
1 includes a light projecting unit 61a and a light receiving unit 61b.

The semiconductor wafer 6 placed on the tapered surface 55a of the support member 55 and centered as shown in FIG. 3A is moved by an alignment member 58 which is raised by an air cylinder 75 shown in FIG. 1B. 3 (b), the positioning member 58 is received and lifted.
9 is driven to rotate. The notch detection sensor 61 has its optical axis aligned with a position at which the notch provided on the rotating semiconductor wafer 6 can be detected, and the light from the light projecting portion 61a is normally in a light-blocking state. Only when passing through the axis, the light receiving unit 61b receives the light from the light projecting unit 61a, converts the light into an electric signal, and outputs the electric signal.

As shown in FIG. 1, the wafer detection sensor 63 includes a light projecting portion 63a and a light receiving portion 63b.
The light receiving portion 63 is shielded from light by the semiconductor wafer 6 on 5a.
When it does not reach b, it is determined that the semiconductor wafer 6 exists on the support member 55.

FIG. 4 is a block diagram showing a control circuit of the notch detection sensor 61, the wafer detection sensor 63, the motor 69, the wafer presence / absence sensor 79, and the origin sensor 83. As shown in the figure, the notch detection sensor 61 is connected to a drive unit 93 via a sensor amplifier 91. Drive unit 93 and motor (direct drive motor)
69 are mutually connected by a motor cable and a resolver cable. Drive unit 93 is RS2
It is connected to the board computer 95 by a 32C cable. The wafer detection sensor 63 is a sensor amplifier 97
Is connected to the board computer 95 via the. Further, the wafer presence sensor 79 and the origin sensor 83 for confirming the origin of the motor 69 are each provided with a sensor amplifier 9.
9 and 101 are connected to the board computer 95.

FIG. 5 is an enlarged view of a main part of the pin 77 of the temporary table 59. As shown in FIG. As shown in the figure, the pin 77 has a columnar shape and projects a conical projection 77a from the upper surface thereof. The outer peripheral surface of the projection 77a is a tapered surface 77b.
Is formed as a wafer mounting surface 77c.

The angle of inclination of the tapered surface 77b is also set to an angle at which the outer peripheral edge of the guided semiconductor wafer 6 slides, similarly to the case of the tapered surface 55a shown in FIG. In this embodiment, the material of the pin 77 is Teflon or P
Although the EEK material is used, the inclination angle varies depending on various conditions such as the weight and size of the semiconductor wafer 6, the material of the pins 77, and the surface condition of the tapered surface. By providing the tapered surface 77b having such an angle, even if the semiconductor wafer 6 is placed on the tapered surface 77b of the four pins 77 at an angle, the outer peripheral edge slides down on the tapered surface 77b due to its own weight. , Is surely placed on the wafer mounting surface 77c, and is surely horizontal. That is, similarly to the case of the tapered surface 55a, by setting the taper surface 77b to the inclination angle, the semiconductor wafer 6 placed thereon can be easily centered.

The wafer presence / absence sensor 79 shown in FIG. 5 is of a reflection type. If the semiconductor wafer 6 is placed obliquely on the pins 77, the reflected light does not return to the wafer presence / absence sensor 79, so that the detection is performed. it can.

Next, FIGS. 6 to 11 are plan views of the entire polishing apparatus constituted by using the positioning mechanism 50 with the temporary table shown in FIGS. This polishing apparatus comprises polishing units 1 and 1, a cleaning unit 10 and a clean room 20.
And load / unload units 30-1 and 30-2, and wafer cassette units (storage units) 40-1 and 40-2. In this polishing apparatus, the entire portion excluding the wafer cassette units 40-1 and 40-2 is the housing 1
00.

The polishing section 1 includes a pair of polishing units 2a,
2b are disposed to face left and right. In the cleaning unit 10, two SCARA robots 11a and 11b are disposed at the center, and one reversing machine 12 and 13 are disposed on both sides of the two SCARA robots 11a and 11b, respectively. Two cleaning machines, that is, primary cleaning machines 14a and 14b and secondary cleaning machines 15a and 15b, are arranged on both sides of 13. A partition 10 is provided between the polishing section 1 and the cleaning section 10.
The transfer of the semiconductor wafer between the polishing section 1 and the cleaning section 10 is performed through an opening formed in the partition wall 101.

A partition 102 is provided to partition the cleaning section 10 from the clean chamber 20 and the load / unload section 30. The wafer cassette units 40-1 and 40-2 adjacent to the load / unload units 30-1 and 30-2 are of a sealed type capable of accommodating a wafer cassette in a space sealed by a housing. When the camera is taken out, the shutter is opened. The wafer cassette units 40-1 and 40-2 form a storage unit that supplies semiconductor wafers to be polished to processing units such as the polishing unit 1 and the cleaning unit 10 and that receives the polished semiconductor wafers.

As shown in FIG. 7, filter units 70 and 80 are provided above the cleaning unit 10 and the load / unload units 30-1 and 30-2. Clean the air,
Loading / unloading unit 3 by the filter unit 80
The air in 0-1 and 30-2 is cleaned. Further, an opening is provided at the upper part of the partition wall 103 so that the air volume can be arbitrarily adjusted. Through this opening, the air in the load sections 30-1 and 30-2 is supplied to the clean chamber 20 to clean the air. The inside of the room 20 is also cleaned.

FIG. 8 is a perspective view showing details of the polishing section 1 and the cleaning section 10. In FIG. 8, the housing 10
0 and the partition 101 between the polishing unit 1 and the cleaning unit 10 are not shown. As shown in FIG. 9, the two polishing units 2a and 2b are basically symmetrically arranged with devices having the same specifications. Each of the two polishing units 2a and 2b has a turntable 3 having a polishing cloth 9 adhered to the upper surface thereof and a semiconductor wafer. Top ring head 4 that presses against the turntable surface while holding by vacuum suction
And a dressing head 5 for dressing (dressing) the polishing cloth.

The top ring head 4 has a top ring 7 which is located above the turntable 3 and presses the semiconductor wafer 6 against the turntable 3 while holding the semiconductor wafer 6. The turntable 3 is connected to a motor (not shown) and is rotatable around its axis.
The top ring 7 is connected to a motor and a lifting cylinder (not shown). Thereby, the top ring 7
Is liftable and rotatable around its axis,
The semiconductor wafer 6 can be pressed against the polishing cloth 9 with an arbitrary pressure. Semiconductor wafer 6
Is adsorbed to the lower end surface of the top ring 7 by vacuum or the like.

A polishing liquid supply nozzle (not shown) is provided above the turntable 3, and the polishing cloth 9 adhered to the turntable 3 by the polishing liquid supply nozzle.
A polishing abrasive is supplied on the top. The dressing head 5 has a dressing member 8. The dressing member 8 is located on the side opposite to the position of the top ring 7 on the polishing pad 9, and is configured to be able to dress the polishing pad 9. A dressing liquid used for dressing, for example, pure water, is supplied to the polishing pad 9 from a dressing liquid supply nozzle (not shown) extending on the table. The dressing member 8 is connected to a lifting cylinder and a rotation motor, and can be raised and lowered and rotatable around its axis.

In the polishing section 1 having the above-described configuration, the semiconductor wafer 6 held by the top ring 7 is pressed onto the polishing pad 9 and the turntable 3 and the top ring 7 are rotated to thereby lower the lower surface ( The surface to be polished is rubbed with the polishing pad 9. At this time, by simultaneously supplying the polishing liquid from the polishing liquid supply nozzle onto the polishing cloth 9, the surface to be polished of the semiconductor wafer 6 is a mechanical polishing action of the abrasive grains in the polishing liquid and a liquid component of the polishing liquid. Polishing is performed by a combined action with the chemical polishing action of an alkali.

The polishing is terminated when the semiconductor wafer 6 has been polished to a predetermined polishing amount. When the polishing is completed, the characteristics of the polishing cloth 9 change due to the polishing, and the polishing performance of the next polishing deteriorates. Therefore, the dressing member 8 dresses the polishing cloth 9.

As shown in FIG. 6, the polishing units 2a, 2
b has a pusher P for exchanging the semiconductor wafer with the top ring 7. The top ring 7 is pivotable in a horizontal plane, and the pusher P is vertically movable.

The structure of the washing machine is optional. For example, the primary washing machines 14a and 14b are of the type in which the front and back surfaces of the semiconductor wafer are wiped by a sponge-equipped roller, and the secondary washing machines 15a and 15b are used. Is a cleaning machine of the type in which a cleaning liquid is supplied while gripping the edge of a semiconductor wafer and rotating it in a horizontal plane. The latter has a function as a dryer for drying by centrifugal dehydration. The first cleaning machines 14a and 14b can perform the primary cleaning of the semiconductor wafer, and the second cleaning machines 15a and 15b can perform the second cleaning of the semiconductor wafer after the first cleaning. ing.

Each of the SCARA robots 11a and 11b has, for example, an articulated arm provided at the upper part of the robot body so as to be able to bend in a horizontal plane. Has become. In this embodiment, two robots are used.
Basically, the first robot 11a
Is the area on the cassette side of the reversing machines 12 and 13, and the second robot 11 b is the area on the polishing unit side of the reversing machines 12 and 13.

In the following description, the configuration around the right side of the clean room 20 will be described. However, the left side of the clean room 20 is also provided with an opposite configuration at a symmetrical position, and the left side is not illustrated. I do.

9 to 11 are diagrams showing the relationship between the cleaning unit 10, the clean room 20, and the load / unload units 30-1 and 30-2. FIG. 9 is a sectional view taken along the line aa in FIG. , FIG.
0 is a sectional view taken along the line bb in FIG. 6, and FIG. 11 is a sectional view taken along the line cc in FIG. As shown in FIG. 9, the load / unload unit 3
At 0 (30-1 in the figure), a SCARA robot 31 (31-1 in the figure) is installed. The SCARA robot 31 can travel between a solid line and a broken line in FIG. There is a wall of the housing 100 between the load / unload unit 30 and the wafer cassette unit 40, and an opening 100a (see FIG. 10) is formed in this wall. Then, the semiconductor wafers 6 are taken out one by one from the wafer cassette 41 in the wafer cassette unit 40 (40-2 in the figure) by the SCARA robot 31 and supplied to the adjacent clean room 20. In addition, the wafer cassette 41 includes each of the wafer cassette units 40-1 and 40-1.
40-2 are provided in parallel with the opening 100a.

As shown in FIG. 10, a positioning mechanism 50 with a temporary table is provided in the clean room 20. In addition, an opening 103a is provided in a partition wall 103 that partitions between the clean room 20 and the load / unload section 30, and a shutter 22 that opens and closes the opening 103a is provided.
The shutter 22 is opened and closed by an air cylinder 23. As shown in FIG. 11, an opening 102a is provided in a partition 102 that separates between the clean room 20 and the cleaning unit 10, and a shutter 24 that opens and closes the opening 102a is provided. The shutter 24 is opened and closed by an air cylinder 25.

9 to 11, the SCARA robot 31 takes out the semiconductor wafer 6 from the wafer cassette unit 40 when the wafer is loaded into the processing unit, and then loads and unloads the semiconductor wafer. The shutter 22 on the side of the load unit 30 is opened, and the semiconductor wafer 6 is set on the positioning mechanism 50 with the temporary table in the clean room 20. Next, the shutter 22 is closed, and the shutter 2 on the processing unit side is closed.
4 is opened, and the semiconductor wafer 6 on the positioning mechanism 50 with the temporary table is taken out by the SCARA robot 11a.
The shutter 24 on the processing unit side is closed. When the wafer is unloaded from the processing section, the above procedure is performed in the reverse order. By carrying the wafer in and out of the processing section in this procedure, contamination from each wafer processing section does not enter the load / unload section 30.

The processing procedure in the processing section is as follows.
Either series processing (sequential processing) or parallel processing (parallel processing) as described below is performed. Of course, processing procedures other than these processing procedures may be used.

(1) Series Processing In the case of series processing (two-stage polishing), three washing machines are operated. The flow of semiconductor wafers is controlled by the wafer cassette 4
1 → positioning mechanism with temporary table 50 → reversing machine 12 → first polishing unit 2a → washer 14a → second polishing unit 2b
→ Washing machine 14b → Reversing machine 13 → Washing machine 15a → Positioning mechanism 50 with temporary table → Wafer cassette 41 The transfer of the semiconductor wafer is performed by two SCARA robots 11a and 11
b. Each of the robots 11a and 11b uses a dry finger when handling a dry semiconductor wafer, and uses a wet finger when handling a wet semiconductor wafer.

The pusher P receives the semiconductor wafer from the SCARA robot 11b, and ascends when the top ring 7 comes up to deliver the semiconductor wafer. The top ring 7 pivots on the polishing surface 9 of the turntable 3 to move down the semiconductor wafer and abut on the polishing surface to perform polishing. The top ring 7 holding the polished semiconductor wafer again pivots above the pusher P, the pusher P rises, and the semiconductor wafer is
And rinsed by a rinsing liquid supply device provided at the position of the pusher P.

In such a polishing apparatus, the semiconductor wafer is placed on the top ring 7 by the pusher P and the cleaning machine 14a.
Since the semiconductor wafer is cleaned while being separated from the semiconductor wafer, it is possible to completely remove not only the polishing surface of the semiconductor wafer but also the polishing liquid for the first polishing, which adheres to the back surface and side surfaces. After being subjected to the second polishing, it is washed by the washing machine 14b and the washing machine 15a, spin-dried, and returned to the cassette 41 via the positioning mechanism 50 with the temporary table. In the series processing, the polishing conditions in the first polishing unit 2a and the polishing conditions in the second polishing unit 2b are different.

(2) Parallel processing In this case, four washing machines are operated. 2 cassettes
One or a single cassette may be used. The flow of the semiconductor wafer is as follows: wafer cassette 41 → positioning mechanism with temporary table 50 → reversing machine 12 → polishing unit 2a → cleaning machine 14a → reversing machine 13 → cleaning machine 15a → positioning mechanism with temporary table 50 → wafer cassette 41 Moving flow and wafer cassette 41 → positioning mechanism 5 with temporary table
0 → reversing machine 12 → polishing unit 2b → cleaning machine 14b → reversing machine 13 → cleaning machine 15b → positioning mechanism 50 with temporary table
→ There are two series of flows that move with the wafer cassette 41. The reversing machines 12 and 13 are the same in the case of series processing, but the reversing machines 1 for handling dry semiconductor wafers before polishing.
2 and reversing machine 1 for handling wet semiconductor wafers after polishing
The washing machine may be used on either side of the transport line. In the parallel processing, the polishing conditions in the polishing units 2a and 2b are the same, the cleaning conditions in the cleaning machines 14a and 14b are the same, and the cleaning conditions in the cleaning machines 15a and 15b are the same. In the cleaning machines 15a and 15b, the semiconductor wafer is cleaned and spin-dried, and then returned to the cassette 41 via the positioning mechanism 50 with the temporary table.

In the embodiment, the closed-type wafer cassette has been described. However, the wafer cassette may be an ordinary open-type wafer cassette.

In the case of the present invention, the wafer cassette unit 40-1 or 4
The unprocessed semiconductor wafer taken out from 0-2 is placed on the temporary table 5.
9 (see FIG. 1B), and the notch position of the processed semiconductor wafer is set to the supporting member 55.
After the alignment, the process of transporting and storing the wafer in the wafer cassette unit 40-1 or 40-2 can be performed simultaneously. In other words, semiconductor wafers traveling in both directions are simultaneously
It can be conveyed via the positioning mechanism 50 with a temporary placement table. Hereinafter, an example of a specific operation will be described.

1) First, in order to carry the semiconductor wafer into the processing section, the SCARA robot 31-1 or 31-2 takes out the semiconductor wafer from the wafer cassette 40-1 or 40-2. It is inserted between the four pins 77 on the temporary table 59 of the alignment mechanism 50. As shown in FIG. 5, the inserted semiconductor wafer slides down on the tapered surface 77b of each pin 77 and is securely placed on the wafer mounting surface 77c to be horizontal.

2) The wafer presence / absence sensor 79 detects whether or not the semiconductor wafer is placed on the temporary mounting table 59. At this time, since the reflection type is used as the wafer presence / absence sensor 79, when the semiconductor wafer is inclined, there is no reaction, and it can be reliably determined whether the semiconductor wafer is placed horizontally.

3) Next, another semiconductor wafer that has been processed by the processing unit by the SCARA robot 11a is inserted and placed in the four support members 55 of the positioning mechanism 50 with a temporary mounting table. At this time, as described above, even if the outer peripheral edge of the semiconductor wafer abuts on the tapered surface 55a, the semiconductor wafer slides on the tapered surface 55a due to its own weight and becomes just horizontal (the wafer shown in FIG. 3A). Stop at (position) (centered).

4) The wafer detection sensor 63 detects that the processed semiconductor wafer has been delivered to the support member 55.

5) When the wafer detection sensor 63 detects a semiconductor wafer, the SCARA robot 11a
The unprocessed semiconductor wafer placed on 9 is unloaded and transported to the processing section to start the serial processing or parallel processing.

6) Next, after the unprocessed semiconductor wafer is unloaded from the temporary mounting table 59, the air cylinder 75 is operated to raise the positioning member 58 to the wafer raising position shown in FIG. The semiconductor wafer after processing is received and lifted.

7) In this state, the motor 69 is driven by the board computer 95 to rotate the semiconductor wafer.

8) When a notch of the rotating semiconductor wafer crosses the notch detection sensor 61, a sensor signal is output (O
N), and this signal is input to the drive unit 93. Since the rotating semiconductor wafer is centered by the support member 55, the position where the notch rotates is exactly constant, and an inexpensive notch detecting sensor 61 can be used.

9) Then, the motor 69 is rotated by the preset number of pulses from the timing when the signal is output (ON), and then stopped. As a result, the notch position of the semiconductor wafer is aligned in a predetermined direction.

10) After stopping the motor 69, the air cylinder 7
5 is operated to lower the positioning member 58 and transfer the semiconductor wafer to the supporting member 55.

11) After the positioning member 58 is lowered, the motor 69 is rotated again, and the origin member 83 and the sensor dog 85 return the positioning member 58 to the original position. If the positioning member 58 is returned to the origin, otherwise, the positions of the four columns 65 may not be determined, and the semiconductor wafer may not be delivered to the temporary mounting table 59 at the center of the column 65. It is.

12) Next, as in 1), an unprocessed semiconductor wafer is mounted on the temporary mounting table 59 by the SCARA robot 31-1 or 31-2.

13) Next, similarly to the above-mentioned 2), whether or not the semiconductor wafer is mounted on the temporary mounting table 59 is detected by the wafer presence / absence sensor 79.

14) Next, the SCARA robot 31-1 or 3
1-2 receives the processed semiconductor wafer with the direction of the notch position on the support member 55 being a predetermined direction, and stores it in the wafer cassette 40-1 or 40-2.

As described above, in the present invention, since the temporary mounting table for separately mounting and transporting the semiconductor wafer is provided in the positioning mechanism for adjusting the notch position (reference position) of the semiconductor wafer in a predetermined direction, the unprocessed unprocessed table is provided. The semiconductor wafer and the processed semiconductor wafer can be smoothly transferred and processed in the opposite directions.

By the way, the positioning mechanism 50 with the temporary table is provided.
In this case, since the motor 69 and the air cylinder 75 serving as the driving units may generate dust, they are installed below the temporary mounting table 59. This makes it difficult for dust to adhere to the semiconductor wafer.

However, for this purpose, it is necessary to support the motor 69 and the positioning member 58 and the plate 57 with the four columns 65 so as not to touch the temporary table 59.

For this reason, the transfer of the semiconductor wafer to the temporary mounting table 59 cannot be performed unless the motor 69 is stopped and the support 65 is stationary, and the transfer of the semiconductor wafer is restricted.

FIG. 12 is a side view showing a positioning mechanism 50-2 with a temporary table according to another embodiment. The same parts as those in the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

The difference between this embodiment and the positioning mechanism 50 with a temporary table is that the temporary table 59 is
It is a point installed underneath. With this configuration, there is no support 65 or the like around the temporary table 59, so that the semiconductor wafer can be transferred to the temporary table 59 without any limitation even when the motor 69 or the like is driven. become.

Accordingly, the positioning mechanism with temporary table 50-
In the case of step 2, the operation of step 5) or step 12) in the specific example of the operation can be freely performed irrespective of the operations of step 3), step 4), and steps 6) to 11).

Note that, with such a configuration, the motor 6
9, the plate 57 can be directly driven to rotate, so that the column 65 used in the positioning mechanism 50 with a temporary table can be omitted, and the plate 57 and the rotary table 67 can be constituted by one member, and the height direction can be increased. And the number of parts can be reduced. In FIG. 12, the illustration of the air cylinder 75 that moves the elevator 71 up and down is omitted.

In the positioning mechanisms 50, 50-2 in the above embodiments, the outer peripheral edge of the semiconductor wafer is tapered by the tapered surface 55a of the support member 55 in order to support the semiconductor wafer and align the notch positions. Then, the positioning member 58 is brought into contact with the vicinity of the outer periphery of the lower surface of the semiconductor wafer, and is pushed up from the supporting member 55 to be rotated. That is, unlike the related art, the center of the lower surface of the semiconductor wafer is not vacuum-sucked by the vacuum suction mechanism. On the other hand, near the outer periphery of the semiconductor wafer (usually 3 m from the outer periphery)
The portion having a width of about m) is a portion that is not used as an element, and there is no problem even if this portion is held. From these facts, according to the present invention, contamination of the semiconductor wafer can be more effectively prevented. This effect similarly occurs in that the pins (guide members) 77 of the temporary mounting table 59 are a mechanism for supporting the outer periphery of the semiconductor wafer.

On the other hand, in the above-described embodiment, as shown in FIG. 6, the processed semiconductor wafer is placed in either the left or right SCARA robot 31 after the notch position is aligned by the alignment mechanism 50 with the temporary table. -1 or 31-
2 for example, the wafer cassette units 40-1 and 40
It is stored in the wafer cassette in 0-2. Therefore, if the position of the notch is aligned in only one direction in the positioning mechanism 50 with the temporary table, the operation of the SCARA robot 31-1 or 31-2 is reversed left and right. , 40-2, the direction of the notch of the semiconductor wafer is reversed.

Therefore, in the present embodiment, the SCARA robot 31- in the positioning mechanism 50 with the temporary table is set so that the notches of the semiconductor wafers stored in the wafer cassette units 40-1 and 40-2 are in the same direction. 1, the direction of the notch when stored in the wafer cassette unit 40-1 is different from the direction of the notch when stored in the wafer cassette unit 40-2 by the SCARA robot 31-2.

That is, for example, in FIG.
The notch position in the positioning mechanism with provisional table 50 when using 1-1 is aligned in the direction of the point e shown in FIG. 6, and the notch position in the positioning mechanism 50 with provisional table when using the SCARA robot 31-2 is represented by the point f. In this case, the notch positions of the semiconductor wafers stored in the wafer cassette unit 40-1 and the wafer cassette unit 40-2 are aligned in the direction of the point g. By adjusting the notch position in the direction determined in each storage section in this manner, the semiconductor wafer can be selectively stored in the storage section for each wafer from the temporary mounting table.

The direction in which the notch positions are aligned by the temporary-table-attached positioning mechanism 50 can be variously changed in accordance with the installation state of a plurality of wafer cassette units (storage units). Further, the present invention is not necessarily applied only to the positioning mechanism with the temporary mounting table, but can be similarly applied to the positioning mechanism without the temporary mounting table. In other words, what is essential is that the alignment mechanism is configured to make the alignment direction of the reference position of the semiconductor wafer different according to the plurality of storage sections.

In the above-described embodiment, the temporary mounting table 59 is installed below the support member 55 for mounting the semiconductor wafer of the alignment mechanism 50 with the temporary mounting table. Is also good. In addition, although the miniaturization is somewhat sacrificed, it may be installed on the side of the support member 55. In short, it may be installed near the support member 55.

In the above embodiment, only one stage 59 is provided. However, a plurality of stages may be provided. Then, the semiconductor wafer can be transported more efficiently.

Although the notch of the semiconductor wafer is aligned in the above embodiment, the present invention can be similarly applied to a case where another reference position such as an orientation flat is provided on the semiconductor wafer.

In the above embodiment, the notch detecting sensor 61 having the structure shown in FIG. 3 is used as the detecting means for detecting the notch position (reference position) of the semiconductor wafer. However, the shape and structure of the sensor can be variously changed. For example, a reflection type may be used instead of a transmission type. This is the same for other sensors.

[0083]

As described in detail above, the present invention has the following excellent effects. Since the temporary mounting table is installed in the alignment mechanism, two routes, one for transferring the semiconductor wafer before polishing from the wafer cassette unit to the processing unit and the other for transferring the semiconductor wafer after polishing to the wafer cassette unit, are used. The semiconductor wafers on the route to be taken can be handled smoothly at the same time, and the time required for transporting the semiconductor wafers can be reduced.

The inclination angle of the tapered surface of the support member is set to the angle at which the outer peripheral edge of the supported semiconductor wafer slides, or the inclination angle of the tapered surface of the guide member on the temporary table is set to the angle at which the outer peripheral edge of the guided semiconductor wafer slides. Therefore, the centering of the semiconductor wafer placed on these can be easily performed. In addition, since the centering is performed accurately in this manner, the rotational position of the notch can always be accurately determined, and an inexpensive notch detection sensor can be used. In addition, since the centering is performed accurately, it is possible to eliminate a semiconductor wafer shift (a wafer position shift in a wafer cassette or a wafer position shift on a robot hand) during subsequent transfer.

Since the centering is performed as described above, there is no rotation shift during the rotation of the semiconductor wafer (during the detection of the reference position), so that the semiconductor wafer fixing means by vacuum or the like becomes unnecessary.

Since the positioning mechanism is constituted by the supporting member for supporting the outer periphery of the semiconductor wafer and the positioning member which is brought into contact with the vicinity of the outer periphery of the lower surface of the semiconductor wafer to push up and rotate, the semiconductor wafer is not contaminated.

Since the positioning mechanism with a temporary mounting table according to the present invention is installed in the path for transporting the semiconductor wafer of the polishing apparatus, the reference position (notch, orientation flat, etc.) of the semiconductor wafer can be positioned in a predetermined direction. This can be performed in the polishing apparatus, so that a separate process for positioning the semiconductor wafer and a dedicated machine for positioning are not required.

Since the positioning direction of the reference position of the semiconductor wafer by the positioning mechanism is made different depending on the plurality of storage sections, the notch positions in the plurality of storage sections can be directed in a desired constant direction. .

Since the semiconductor wafer before processing and the semiconductor wafer after processing can be transported by independent transport paths, the cleanliness of the semiconductor wafer after processing does not depend on the semiconductor wafer before processing.

[Brief description of the drawings]

FIG. 1 is a view showing a positioning mechanism with a temporary placement table 50 according to an embodiment of the present invention. FIG. 1A is a plan view, and FIG.
(B) is a side view.

FIG. 2A is a view taken along the line AA in FIG. 1B, FIG.
1B is a view taken along the line BB in FIG. 1B, and FIG.
FIG. 2B is a view taken along the line CC of FIG. 1B, and FIG.
It is a D section principal part arrow view.

FIGS. 3A and 3B show a notch detection sensor 6;
FIG. 5 is a view showing a relationship among a position adjustment member, a support member, and a positioning member.

FIG. 4 shows a notch detection sensor 61 and a wafer detection sensor 6.
3. Motor 69, wafer presence sensor 79, origin sensor 8
3 is a block diagram illustrating a control circuit of No. 3; FIG.

FIG. 5 is an enlarged view of a main part of a pin 77 portion of a temporary placing table 59;

FIG. 6 is a plan view of the entire polishing apparatus configured by using the positioning mechanism with a temporary mounting table 50;

FIG. 7 is a side view showing the appearance of the polishing apparatus of the present invention.

FIG. 8 is a perspective view showing details of a polishing unit and a cleaning unit shown in FIGS. 6 and 7;

FIG. 9 is a sectional view taken along line aa of FIG. 6;

FIG. 10 is a sectional view taken along line bb of FIG. 6;

FIG. 11 is a sectional view taken along line cc of FIG. 6;

FIG. 12 is a side view showing a positioning mechanism with a temporary placement stand 50-2 according to another embodiment.

[Explanation of symbols]

 Reference Signs List 1 polishing section 3 turntable 4 top ring head 5 dressing head 6 semiconductor wafer 7 top ring P pusher 8 dressing tool 9 polishing surface 11 cleaning section 11a, 11b SCARA robot 12, 13 reversing machine 14a, 14b primary cleaning machine 15a, 15b Secondary washing machine 20 Clean chamber 30-1, 30-2 Load / unload section 40-1, 40-2 Wafer cassette section (storage section) 50, 50-2 Positioning mechanism with temporary table 51 Frame 53 Mounting table 55 Supporting member 55a Tapered surface 57 Plate 58 Positioning member 59 Temporary mounting table 61 Notch detection sensor (detection means) 61a Light emitting unit 61b Light receiving unit 63 Wafer detection sensor 63a Light emitting unit 63b Light receiving unit 65 Support 67 Rotating stand 69 Motor 71 Lifting table 73 Spline shaft 7 The air cylinder 77 pin (guide member) 77a protrusion 77b tapered surface 77c wafer mounting surface 79 wafer presence sensor 81 struts 83 origin sensor 85 sensor dog

Claims (5)

[Claims] 1. A positioning mechanism which is installed in a path for transporting a semiconductor wafer, mounts the semiconductor wafer, and adjusts a reference position thereof in a predetermined direction, wherein a portion of the positioning mechanism on which the semiconductor wafer is mounted is provided. An alignment mechanism with a temporary mounting table, wherein a temporary mounting table for separately mounting a semiconductor wafer is installed in the vicinity. 2. The method according to claim 1, wherein the supporting member for supporting the outer peripheral edge of the semiconductor wafer is provided with a tapered surface at an angle at which the outer peripheral edge of the supported semiconductor wafer slides, thereby causing the supported semiconductor wafer to be centered, and / or 2. The provisional center according to claim 1, wherein the guide member for guiding the outer peripheral edge of the semiconductor wafer on the mounting table is provided with a tapered surface at an angle at which the outer peripheral edge of the guided semiconductor wafer slides, thereby causing centering of the guided semiconductor wafer. Positioning mechanism with table. 3. The positioning mechanism with a temporary mounting table, comprising: a support member for supporting an outer peripheral edge of a semiconductor wafer; 2. The positioning mechanism with a temporary mounting table according to claim 1, further comprising a positioning member for adjusting a reference position to a desired position, and a detecting means for detecting a reference position of the semiconductor wafer. 4. A semiconductor wafer transfer path between a processing section for polishing a semiconductor wafer and a storage section for supplying a semiconductor wafer to be polished to the processing section and receiving a polished semiconductor wafer. 3. A polishing apparatus, comprising the positioning mechanism with a temporary mounting table according to any one of 3. 5. A processing unit for processing a semiconductor wafer, a plurality of storage units for supplying the semiconductor wafer to be processed to the processing unit and receiving the processed semiconductor wafer and a semiconductor wafer transfer path, Install a temporary mounting table alignment mechanism that adjusts the reference position of the wafer in a predetermined direction,
A semiconductor wafer processing apparatus having a structure in which a semiconductor wafer positioned by the positioning mechanism with a temporary mounting table is stored in a plurality of storage units, wherein the positioning mechanism with a temporary mounting table is configured to store a semiconductor wafer according to a plurality of storage units. The positioning direction of the position can be set and / or the semiconductor wafer can be selectively stored in the plurality of storage portions from the positioning mechanism with the temporary mounting table. Processing equipment.