SG11201706108UA - Adhesive sheet for semiconductor processing - Google Patents

Adhesive sheet for semiconductor processing

Info

Publication number
SG11201706108UA
SG11201706108UA SG11201706108UA SG11201706108UA SG11201706108UA SG 11201706108U A SG11201706108U A SG 11201706108UA SG 11201706108U A SG11201706108U A SG 11201706108UA SG 11201706108U A SG11201706108U A SG 11201706108UA SG 11201706108U A SG11201706108U A SG 11201706108UA
Authority
SG
Singapore
Prior art keywords
adhesive sheet
semiconductor processing
semiconductor
processing
adhesive
Prior art date
Application number
SG11201706108UA
Inventor
Hironobu Fujimoto
Sayaka Bandou
Yasuhiko Kakiuchi
Yuichiro Komasu
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG11201706108UA publication Critical patent/SG11201706108UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J121/00—Adhesives based on unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
SG11201706108UA 2015-01-30 2016-01-12 Adhesive sheet for semiconductor processing SG11201706108UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015016919 2015-01-30
PCT/JP2016/050702 WO2016121488A1 (en) 2015-01-30 2016-01-12 Adhesive sheet for semiconductor processing

Publications (1)

Publication Number Publication Date
SG11201706108UA true SG11201706108UA (en) 2017-08-30

Family

ID=56543108

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201706108UA SG11201706108UA (en) 2015-01-30 2016-01-12 Adhesive sheet for semiconductor processing

Country Status (6)

Country Link
JP (1) JP6566365B2 (en)
KR (1) KR102510144B1 (en)
CN (1) CN107207920B (en)
SG (1) SG11201706108UA (en)
TW (1) TWI753851B (en)
WO (1) WO2016121488A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102368740B1 (en) * 2016-11-17 2022-02-28 린텍 가부시키가이샤 Adhesive sheet for semiconductor processing
JP7119320B2 (en) * 2017-09-15 2022-08-17 住友ベークライト株式会社 Temporary fixing tape
JP7079609B2 (en) * 2018-01-19 2022-06-02 日東電工株式会社 Masking tape for forming electromagnetic wave shield
JP7092526B2 (en) * 2018-03-14 2022-06-28 マクセル株式会社 Adhesive tape for back grind
KR102228537B1 (en) * 2018-03-23 2021-03-15 주식회사 엘지화학 Back-grinding tape
TWI830764B (en) * 2018-08-08 2024-02-01 日商琳得科股份有限公司 Terminal protection tape and method for manufacturing semiconductor device with electromagnetic wave shielding film
JP7413356B2 (en) 2019-03-22 2024-01-15 リンテック株式会社 Film adhesives and sheets for semiconductor processing
WO2020196224A1 (en) * 2019-03-26 2020-10-01 リンテック株式会社 Release sheet
KR20210149688A (en) * 2019-03-29 2021-12-09 린텍 가부시키가이샤 Protective sheet for semiconductor processing and manufacturing method of semiconductor device
WO2021019868A1 (en) * 2019-07-29 2021-02-04 昭和電工株式会社 Adhesive sheet and adhesive agent composition
KR20220113345A (en) * 2019-12-06 2022-08-12 린텍 가부시키가이샤 Manufacturing method of semiconductor device with electromagnetic shielding film and tape for terminal protection
JPWO2022190728A1 (en) * 2021-03-11 2022-09-15
JP7362872B2 (en) * 2022-03-25 2023-10-17 日東電工株式会社 Optical semiconductor device encapsulation sheets and display bodies

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3648462A (en) 1970-05-22 1972-03-14 Whirlpool Co Evaporator cover construction for an ice making apparatus
JP4828009B2 (en) * 1998-11-20 2011-11-30 リンテック株式会社 Adhesive sheet and method of using the same
CN1137028C (en) * 1998-11-20 2004-02-04 琳得科株式会社 Pressure-sensitive adhesive piece and its application method
CN101116182B (en) 2005-02-18 2010-10-06 三井化学株式会社 Semiconductor wafer surface protecting sheet and semiconductor wafer protecting method using such protecting sheet
JP5501060B2 (en) * 2009-04-02 2014-05-21 日東電工株式会社 Method for laminating adhesive sheet for protecting semiconductor wafer, and adhesive sheet for protecting semiconductor wafer used in this laminating method
US20120156456A1 (en) * 2010-03-14 2012-06-21 Mitsubishi Plastics, Inc. Transparent double-sided self-adhesive sheet
JP5572431B2 (en) * 2010-03-23 2014-08-13 リンテック株式会社 Flat plate laminating resin laminate and laminated flat plate
JP5762781B2 (en) * 2011-03-22 2015-08-12 リンテック株式会社 Base film and pressure-sensitive adhesive sheet provided with the base film
WO2014046096A1 (en) * 2012-09-24 2014-03-27 リンテック株式会社 Back grinding sheet
WO2014192630A1 (en) * 2013-05-29 2014-12-04 三井化学東セロ株式会社 Semiconductor wafer protection film and production method for semiconductor device

Also Published As

Publication number Publication date
CN107207920A (en) 2017-09-26
TW201700666A (en) 2017-01-01
JP6566365B2 (en) 2019-08-28
CN107207920B (en) 2021-02-09
WO2016121488A1 (en) 2016-08-04
JPWO2016121488A1 (en) 2017-11-09
TWI753851B (en) 2022-02-01
KR102510144B1 (en) 2023-03-14
KR20170108014A (en) 2017-09-26

Similar Documents

Publication Publication Date Title
SG11201802780QA (en) Sheet for semiconductor processing
HUE056688T2 (en) Adhesive sheet
SG11201706108UA (en) Adhesive sheet for semiconductor processing
SG10201600648YA (en) Wafer processing system
SG11201708797YA (en) Adhesive tape for work processing
EP3378812A4 (en) Sheet transporting device
SG11201704894WA (en) Adhesive sheet
HK1248025A1 (en) Paper sheet processing device
SG11201610591XA (en) Adhesive sheet for cooling
EP3264461A4 (en) Semiconductor device
SG11201707829WA (en) Semiconductor processing tape
EP3279926A4 (en) Semiconductor device
EP3276661A4 (en) Semiconductor device
HK1223962A1 (en) Adhesive sheet
SG10201502813TA (en) Substrate Processing Apparatus
SG11201800285PA (en) Removable adhesive sheet for semiconductor processing
EP3312875A4 (en) Semiconductor device
EP3285289A4 (en) Semiconductor device
EP3276671A4 (en) Semiconductor device
SG11201601526XA (en) Sheet for processing semiconductor
EP3285288A4 (en) Semiconductor device
EP3276653A4 (en) Semiconductor device
HK1247951A1 (en) Sheet for washing
SG11201706197VA (en) Semiconductor processing tape
SG11201800287UA (en) Removable adhesive sheet for semiconductor processing