SG11201707829WA - Semiconductor processing tape - Google Patents
Semiconductor processing tapeInfo
- Publication number
- SG11201707829WA SG11201707829WA SG11201707829WA SG11201707829WA SG11201707829WA SG 11201707829W A SG11201707829W A SG 11201707829WA SG 11201707829W A SG11201707829W A SG 11201707829WA SG 11201707829W A SG11201707829W A SG 11201707829WA SG 11201707829W A SG11201707829W A SG 11201707829WA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor processing
- processing tape
- tape
- semiconductor
- processing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Laser Beam Processing (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015060783 | 2015-03-24 | ||
| PCT/JP2016/059313 WO2016152957A1 (en) | 2015-03-24 | 2016-03-24 | Semiconductor processing tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201707829WA true SG11201707829WA (en) | 2017-10-30 |
Family
ID=56977489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201707829WA SG11201707829WA (en) | 2015-03-24 | 2016-03-24 | Semiconductor processing tape |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP6230730B2 (en) |
| KR (1) | KR102007111B1 (en) |
| CN (1) | CN107431002B (en) |
| MY (1) | MY181315A (en) |
| SG (1) | SG11201707829WA (en) |
| TW (1) | TWI699420B (en) |
| WO (1) | WO2016152957A1 (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6577341B2 (en) * | 2015-11-13 | 2019-09-18 | 日東電工株式会社 | LAMINATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD |
| CN109906504B (en) * | 2016-11-02 | 2023-04-14 | 琳得科株式会社 | Adhesive sheet for stealth dicing |
| JP7041476B2 (en) * | 2017-07-04 | 2022-03-24 | 日東電工株式会社 | Dicing tape and dicing die bond film |
| JP6535118B1 (en) | 2018-03-28 | 2019-06-26 | 古河電気工業株式会社 | Semiconductor processing tape |
| JP6535117B1 (en) | 2018-03-28 | 2019-06-26 | 古河電気工業株式会社 | Semiconductor processing tape |
| MY187307A (en) * | 2018-03-28 | 2021-09-21 | Furukawa Electric Co Ltd | Tape for semiconductor processing |
| JP6535119B1 (en) | 2018-03-28 | 2019-06-26 | 古河電気工業株式会社 | Semiconductor processing tape |
| KR102112771B1 (en) | 2018-03-28 | 2020-05-19 | 후루카와 덴키 고교 가부시키가이샤 | Semiconductor processing tape |
| JP7523881B2 (en) * | 2018-12-05 | 2024-07-29 | 日東電工株式会社 | Dicing die bond film |
| CN111524848A (en) * | 2019-02-01 | 2020-08-11 | 相丰科技股份有限公司 | Stretched film expanding method and film expander |
| TWI677932B (en) * | 2019-02-01 | 2019-11-21 | 相豐科技股份有限公司 | Expansion method of stretch film and expander thereof |
| JP7269096B2 (en) * | 2019-05-29 | 2023-05-08 | 古河電気工業株式会社 | glass processing tape |
| JP7060548B2 (en) | 2019-05-29 | 2022-04-26 | 古河電気工業株式会社 | Glass processing tape |
| JP7269095B2 (en) | 2019-05-29 | 2023-05-08 | 古河電気工業株式会社 | glass processing tape |
| JP7060547B2 (en) | 2019-05-29 | 2022-04-26 | 古河電気工業株式会社 | Glass processing tape |
| JP7446773B2 (en) * | 2019-11-07 | 2024-03-11 | 日東電工株式会社 | Dicing tape and dicing die bond film |
| JP2024000458A (en) | 2022-06-20 | 2024-01-05 | マクセル株式会社 | Dicing tape, semiconductor chip using dicing tape and manufacturing method of semiconductor device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4947564B2 (en) * | 2000-01-21 | 2012-06-06 | 日東電工株式会社 | Adhesive sheet for semiconductor wafer processing |
| JP2003138228A (en) * | 2001-11-02 | 2003-05-14 | Nitto Denko Corp | Pressure-sensitive adhesive sheet for protecting semiconductor wafer |
| JP4358502B2 (en) | 2002-03-12 | 2009-11-04 | 浜松ホトニクス株式会社 | Semiconductor substrate cutting method |
| JP4342775B2 (en) * | 2002-07-31 | 2009-10-14 | 日東電工株式会社 | Surface protective film for transparent conductive film, method for producing the same, and transparent conductive film with surface protective film |
| JP2004273895A (en) | 2003-03-11 | 2004-09-30 | Disco Abrasive Syst Ltd | Dividing method of semiconductor wafer |
| JPWO2004090962A1 (en) * | 2003-04-08 | 2006-07-06 | 帝人デュポンフィルム株式会社 | Base film for semiconductor wafer processing |
| JP4566527B2 (en) * | 2003-08-08 | 2010-10-20 | 日東電工株式会社 | Re-peelable adhesive sheet |
| JP4754278B2 (en) | 2005-06-23 | 2011-08-24 | リンテック株式会社 | Chip body manufacturing method |
| JP5554118B2 (en) | 2010-03-31 | 2014-07-23 | 古河電気工業株式会社 | Wafer processing tape |
| JP5323779B2 (en) * | 2010-07-26 | 2013-10-23 | 古河電気工業株式会社 | Wafer processing tape |
-
2016
- 2016-03-24 SG SG11201707829WA patent/SG11201707829WA/en unknown
- 2016-03-24 MY MYPI2017703477A patent/MY181315A/en unknown
- 2016-03-24 WO PCT/JP2016/059313 patent/WO2016152957A1/en active Application Filing
- 2016-03-24 KR KR1020177029820A patent/KR102007111B1/en active IP Right Grant
- 2016-03-24 JP JP2016570125A patent/JP6230730B2/en active Active
- 2016-03-24 CN CN201680016498.8A patent/CN107431002B/en active Active
- 2016-03-24 TW TW105109373A patent/TWI699420B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| MY181315A (en) | 2020-12-21 |
| CN107431002B (en) | 2020-09-11 |
| WO2016152957A1 (en) | 2016-09-29 |
| JP6230730B2 (en) | 2017-11-15 |
| CN107431002A (en) | 2017-12-01 |
| KR102007111B1 (en) | 2019-08-02 |
| TWI699420B (en) | 2020-07-21 |
| KR20170131504A (en) | 2017-11-29 |
| JPWO2016152957A1 (en) | 2017-05-25 |
| TW201702334A (en) | 2017-01-16 |
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