SG11201800287UA - Removable adhesive sheet for semiconductor processing - Google Patents
Removable adhesive sheet for semiconductor processingInfo
- Publication number
- SG11201800287UA SG11201800287UA SG11201800287UA SG11201800287UA SG11201800287UA SG 11201800287U A SG11201800287U A SG 11201800287UA SG 11201800287U A SG11201800287U A SG 11201800287UA SG 11201800287U A SG11201800287U A SG 11201800287UA SG 11201800287U A SG11201800287U A SG 11201800287UA
- Authority
- SG
- Singapore
- Prior art keywords
- adhesive sheet
- semiconductor processing
- removable adhesive
- removable
- semiconductor
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016073264 | 2016-03-31 | ||
| PCT/JP2017/012456 WO2017170437A1 (en) | 2016-03-31 | 2017-03-27 | Adhesive sheet for semiconductor processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201800287UA true SG11201800287UA (en) | 2018-02-27 |
Family
ID=59965578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201800287UA SG11201800287UA (en) | 2016-03-31 | 2017-03-27 | Removable adhesive sheet for semiconductor processing |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP6606191B2 (en) |
| KR (1) | KR102350744B1 (en) |
| CN (1) | CN107995997B (en) |
| MY (1) | MY186142A (en) |
| SG (1) | SG11201800287UA (en) |
| TW (1) | TWI654234B (en) |
| WO (1) | WO2017170437A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7112205B2 (en) * | 2018-02-13 | 2022-08-03 | 株式会社ディスコ | splitter |
| CN109536068B (en) * | 2018-11-16 | 2021-08-17 | 宁波激智科技股份有限公司 | High-viscosity protective film and preparation method thereof |
| CN109880551A (en) * | 2019-03-05 | 2019-06-14 | 广东聚益新材有限公司 | Without aldehyde fire-resistant binder and its preparation method and application, board-like material |
| CN113613897B (en) * | 2019-03-26 | 2023-05-12 | 琳得科株式会社 | Stripping sheet |
| CN111995812B (en) * | 2020-08-19 | 2022-06-14 | 中裕软管科技股份有限公司 | High-air-tightness material for repairing gas pipeline and preparation method thereof |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5140910B2 (en) | 2005-08-30 | 2013-02-13 | 住友ベークライト株式会社 | Film base and adhesive tape for semiconductor wafer processing |
| JP2007100064A (en) | 2005-09-07 | 2007-04-19 | Furukawa Electric Co Ltd:The | Pressure-sensitive adhesive tape for dicing |
| JP5143352B2 (en) * | 2005-11-14 | 2013-02-13 | 電気化学工業株式会社 | Film base and adhesive tape |
| JP5448430B2 (en) | 2007-12-18 | 2014-03-19 | 古河電気工業株式会社 | Wafer sticking sheet and wafer processing method |
| CN102473617B (en) * | 2009-07-08 | 2015-04-29 | 古河电气工业株式会社 | Wafer-pasting adhesive sheet and wafer processing method using the same |
| JP2011216704A (en) * | 2010-03-31 | 2011-10-27 | Furukawa Electric Co Ltd:The | Adhesive tape for semiconductor wafer processing |
| JP2013098443A (en) * | 2011-11-02 | 2013-05-20 | Furukawa Electric Co Ltd:The | Semiconductor adhesive sheet |
| JP5993255B2 (en) * | 2012-09-11 | 2016-09-14 | 三菱樹脂株式会社 | Acrylic resin film and dicing adhesive sheet |
| JP6107230B2 (en) * | 2013-02-28 | 2017-04-05 | 住友ベークライト株式会社 | Dicing film |
| JP6264126B2 (en) * | 2014-03-20 | 2018-01-24 | 日立化成株式会社 | Wafer processing tape |
| JP6330468B2 (en) * | 2014-05-13 | 2018-05-30 | 住友ベークライト株式会社 | Dicing film base film and dicing film |
| EA031760B1 (en) * | 2014-07-01 | 2019-02-28 | Асахи Касеи Кабусики Кайся | Polypropylene-based resin composition, film, medical bag and tube |
-
2017
- 2017-03-27 MY MYPI2018700842A patent/MY186142A/en unknown
- 2017-03-27 CN CN201780002840.3A patent/CN107995997B/en active Active
- 2017-03-27 WO PCT/JP2017/012456 patent/WO2017170437A1/en active Application Filing
- 2017-03-27 KR KR1020187007178A patent/KR102350744B1/en active IP Right Grant
- 2017-03-27 JP JP2017554096A patent/JP6606191B2/en active Active
- 2017-03-27 SG SG11201800287UA patent/SG11201800287UA/en unknown
- 2017-03-31 TW TW106110948A patent/TWI654234B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| JP6606191B2 (en) | 2019-11-13 |
| JPWO2017170437A1 (en) | 2019-02-07 |
| WO2017170437A1 (en) | 2017-10-05 |
| KR102350744B1 (en) | 2022-01-14 |
| CN107995997A (en) | 2018-05-04 |
| TW201800463A (en) | 2018-01-01 |
| TWI654234B (en) | 2019-03-21 |
| KR20180127300A (en) | 2018-11-28 |
| CN107995997B (en) | 2023-11-14 |
| MY186142A (en) | 2021-06-25 |
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