CN108207116B - Adhesive sheet for semiconductor processing - Google Patents
Adhesive sheet for semiconductor processing Download PDFInfo
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- CN108207116B CN108207116B CN201780003496.XA CN201780003496A CN108207116B CN 108207116 B CN108207116 B CN 108207116B CN 201780003496 A CN201780003496 A CN 201780003496A CN 108207116 B CN108207116 B CN 108207116B
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- styrene
- copolymer
- ethylene
- adhesive sheet
- semiconductor processing
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A pressure-sensitive adhesive sheet for semiconductor processing, which comprises a pressure-sensitive adhesive layer on a substrate film, wherein the loss factor at a frequency of 0.01 to 10Hz is 0.08 or more and less than 0.15, the substrate film comprises 1 layer and comprises 5 to 39 parts by mass of a styrene-based block copolymer per 100 parts by mass of a base resin, the styrene-based block copolymer is at least one resin selected from the group consisting of a styrene-hydrogenated isoprene-styrene block copolymer, a styrene-hydrogenated butadiene-styrene block copolymer and a styrene-hydrogenated isoprene/butadiene-styrene block copolymer, and the base resin is at least one resin selected from the group consisting of specific resins such as polypropylene and polyethylene.
Description
Technical Field
The present invention relates to an adhesive sheet for semiconductor processing.
More specifically, the present invention relates to a dicing tape suitable for fixing and holding a semiconductor wafer when the semiconductor wafer is diced into chips, and a dicing tape used in semiconductor packaging processing. In particular, the present invention relates to a dicing tape suitable for high-density mounting semiconductor packages.
Background
In a dicing step of separating a semiconductor wafer having a circuit pattern formed thereon into chips, a dicing tape protects and fixes the wafer. After being fixed by a tape, the semiconductor wafer is cut by a rotary knife called a dicing blade to be separated into chip-shaped semiconductor chips. Before the pickup process, the semiconductor chip is held by the tape.
When a plurality of semiconductor chips are molded at a time with a resin and separated into individual semiconductor packages, the semiconductor packages are attached to a dicing tape and cut with a rotary blade called a dicing blade. In the dicing step of the package once encapsulated with the resin, the load at the time of cutting is large, and the encapsulating resin has a structure in which the resin surface has fine irregularities while containing the releasing agent. Therefore, a soft adhesive is used, which can firmly hold the package on the adhesive used in the semiconductor processing tape, and does not cause a problem that the package cannot be held and scatters (hereinafter referred to as "package scattering") at the time of dicing.
However, by using such a soft adhesive, the following problems arise: the adhesive is attached to the package side resulting from the dicing; the laser marks printed on the package peel off.
In order to reduce such package scattering, studies have been made.
For example, an adhesive tape using a (meth) acrylate as an adhesive layer is proposed (see patent document 1).
However, in recent years, the area of the package held by the tape has decreased due to the miniaturization of the package, and the package is more likely to scatter. Therefore, improving the adhesive alone is not sufficient to suppress package scattering.
In addition, in order to suppress vibration of the semiconductor wafer, it is proposed to suppress chipping (dicing) by adding an elastomer to the base material surface of the adhesive sheet (see patent document 2). Such a method is preferable because not only the adhesive but also the substrate side is flexible to improve adhesion to the package. On the other hand, as the miniaturization of the package in the market advances, the picking up takes a lot of time in the conventional picking up method using the needle jack-up (ピン, き and the potting). Therefore, the tape is bent by scraping the back surface of the tape with tweezers or the like, and the package is instantaneously dropped (hereinafter, scraped) for pickup.
However, when an elastomer is added to the base material surface of the pressure-sensitive adhesive sheet to make the base material side soft, the following problems are caused by the softness: even if the tape is bent by scraping, the package does not fall off, and thus the scraping cannot be smoothly performed.
Documents of the prior art
Patent literature
Patent document 1: japanese patent laid-open No. 2007-100064
Patent document 2: japanese laid-open patent publication No. 2009-170886
Disclosure of Invention
Problems to be solved by the invention
The present invention has been made to solve the problems associated with the above-described conventional techniques, and an object of the present invention is to provide an adhesive sheet for semiconductor processing that can reduce the occurrence of package scattering during dicing and can be quickly and reliably peeled off from a tape even during picking up by scraping or the like after dicing.
Means for solving the problems
The present inventors have conducted extensive studies and, as a result, have conducted detailed studies on the content of a styrenic copolymer relative to a base resin and the loss factor of a pressure-sensitive adhesive sheet, and as a result, have found that it is important that the content of the styrenic copolymer is small and the loss factor value is low, thereby completing the present invention.
That is, the above problem of the present invention can be solved by the following means.
[1] A pressure-sensitive adhesive sheet for semiconductor processing having a pressure-sensitive adhesive layer on a base film,
using a test piece obtained by processing the adhesive sheet for semiconductor processing into a width of 5mm, the loss factor measured in a film shape by a dynamic viscoelasticity measuring apparatus is 0.08 or more and less than 0.15 at a frequency of 0.01 to 10Hz,
the base film comprises 1 layer and 5 to 39 parts by mass of a styrene block copolymer per 100 parts by mass of a base resin,
the styrene-based block copolymer is at least one resin selected from the group consisting of a styrene-hydrogenated isoprene-styrene block copolymer, a styrene-hydrogenated butadiene-styrene block copolymer, and a styrene-hydrogenated isoprene/butadiene-styrene block copolymer,
the above-mentioned base resin is at least one resin selected from the group consisting of polypropylene, high-density polyethylene, low-density polyethylene, linear low-density polyethylene, ethylene-propylene copolymer, ethylene-propylene-diene copolymer sulfide, polybutene, polybutadiene, polymethylpentene, ethylene-vinyl acetate copolymer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) methyl acrylate copolymer, ethylene- (meth) ethyl acrylate copolymer, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, ethylene-vinyl chloride-vinyl acetate copolymer, polystyrene, polyurethane, polyamide, ionomer, nitrile rubber, butyl rubber, styrene-isoprene rubber, styrene-butadiene rubber, natural rubber, and hydrides or modifications thereof.
[2] The adhesive sheet for semiconductor processing as recited in [1], wherein the base resin is polypropylene.
[3] The pressure-sensitive adhesive sheet for semiconductor processing according to any one of [1] and [2], wherein the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is an acrylic pressure-sensitive adhesive.
[4] The adhesive sheet for semiconductor processing according to any one of [1] to [3], wherein the styrene-based block copolymer is 10 to 35 parts by mass with respect to 100 parts by mass of the base resin.
[5] The adhesive sheet for semiconductor processing according to any one of [1] to [4], which is used for dicing a semiconductor package.
In the present invention, when it is referred to as acrylic, methacrylic is also included.
In order to further clarify the acrylic group, the parenthesis of "(meth)" means the presence or absence thereof as in the case of (meth) acrylic group, and for example, the (meth) acrylic group may be either acrylic group, methacrylic group, or both of them.
Effects of the invention
According to the present invention, it is possible to provide an adhesive sheet for semiconductor processing that can reduce the occurrence of package scattering during dicing and can be quickly and reliably peeled off from a tape even during picking up by scraping or the like after dicing.
The above and other features and advantages of the present invention will be further apparent from the following description with reference to the accompanying drawings, where appropriate.
Drawings
Fig. 1 is a sectional view showing one embodiment of the adhesive sheet for semiconductor processing of the present invention.
Fig. 2 is a sectional view illustrating a dicing process and a picking process of a semiconductor wafer.
Fig. 3 is a sectional view illustrating a dicing process and a picking process of a semiconductor wafer.
Fig. 4 is a sectional view illustrating a dicing process and a picking process of a semiconductor wafer.
Fig. 5 is a sectional view illustrating a dicing process and a picking process of a semiconductor wafer.
Detailed Description
The adhesive sheet for semiconductor processing of the present invention will be described in detail below.
< adhesive sheet for semiconductor processing >)
As shown in a schematic cross-sectional view schematically illustrated in fig. 1, the adhesive sheet 12 for semiconductor processing of the present invention has an adhesive layer 2 on at least one surface of a substrate film 1.
First, description will be given in order from the base film.
< substrate film >
In the present invention, the base film is not a laminate in which two or more resin films are laminated, but is composed of one layer, that is, a single resin film.
The resin constituting the base film is not a single resin but is composed of a base resin and at least a styrene-based block copolymer.
(styrenic Block copolymer)
Styrenic block copolymers are elastomers, also known as styrenic thermoplastic elastomers or styrenic elastomers.
The styrene-based block copolymer is preferably a styrene block copolymer composed of a hard block of polystyrene and a soft block, and examples of the soft block include polybutadiene, polyisobutylene, polyisoprene, hydrogenated polybutadiene (i.e., ethylene/propylene), hydrogenated polyisobutylene (i.e., ethylene/butylene), hydrogenated isoprene/butadiene (i.e., ethylene-ethylene/propylene), butadiene rubber, epoxidized polybutadiene, and the like.
By using the styrene-based block copolymer, the base material film becomes flexible and adhesion to the semiconductor package can be improved. In addition, the expansion can be easily performed.
In the present invention, at least one resin selected from the group consisting of a styrene-hydrogenated isoprene-styrene block copolymer (SEPS), a styrene-isoprene-styrene copolymer ((SIS), a styrene-hydrogenated butadiene-styrene copolymer (SEBS), and a styrene-hydrogenated isoprene/butadiene-styrene copolymer (SEEPS) is used.
Here, in the styrene-based block copolymer, "-" means linked by a block unit (1 block), and "/" means forming 1 repeating unit, which becomes a block unit (1 block).
One or more kinds of the styrenic block copolymers may be used.
The styrene block copolymer is used together with the base resin, and in the present invention, the styrene block copolymer is contained in an amount of 5 to 39 parts by mass, preferably 10 to 35 parts by mass, based on 100 parts by mass of the base resin.
When the content of the styrenic block copolymer is less than 5 parts by mass, the base film becomes rigid and adhesion to the semiconductor package cannot be improved. On the other hand, if the amount exceeds 39 parts by mass, the package does not fall even if the adhesive sheet for semiconductor processing is bent by scraping, and thus the scraping cannot be performed smoothly.
(base resin)
In the present invention, the base resin is a resin other than a styrenic block copolymer.
The base resin is preferably a thermoplastic resin, more preferably a base film excellent in water resistance and heat resistance, and particularly preferably a synthetic resin film.
Examples of the thermoplastic resin include polyolefin resins, polyamide resins, polyetheramide resins, thermoplastic polyimide resins, thermoplastic polyamideimide resins, polyurethane resins, urea resins, polyester resins, liquid crystal polyester resins, polyacetal resins, polycarbonate resins, polyphenylene ether (including modified polyphenylene ether) resins, polysulfone resins, polyethersulfone resins, polyphenylene sulfide resins, polyether ether ketone (including modified polyether ether ketone) resins, polyether ketone resins, polyaryl ether ketone resins, polyarylate resins, fluorine-based resins, polyphenylene ether resins, polylactic acid, phenol resins, melamine resins, epoxy resins, phenoxy resins, and silicone resins.
Among the thermoplastic resins, polyolefin resins are particularly preferable.
The thermoplastic resin may be modified with an acid or the like, and may be crystalline or amorphous.
In the present invention, at least one resin selected from the group consisting of polypropylene, high density polyethylene, low density polyethylene, linear low density polyethylene, ethylene-propylene copolymer, ethylene-propylene-diene copolymer sulfide, polybutene, polybutadiene, polymethylpentene, ethylene-vinyl acetate copolymer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) methyl acrylate copolymer, ethylene- (meth) ethyl acrylate copolymer, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, ethylene-vinyl chloride-vinyl acetate copolymer, polystyrene, polyurethane, polyamide, ionomer, nitrile rubber, butyl rubber, styrene-isoprene rubber, styrene-butadiene rubber, natural rubber, and hydrides or modifications thereof is used.
(polyolefin resin)
The polyolefin resin is a polyolefin resin obtained by polymerizing at least one kind of olefin, and may be a homopolymer or a copolymer.
Examples of such olefins include, for example, α -olefins having 4 to 12 carbon atoms including ethylene, propylene, isobutylene, and isobutylene (1-butene); butadiene, isoprene, (meth) acrylate, (meth) acrylic acid, (meth) acrylamide, vinyl alcohol, vinyl acetate, vinyl chloride, styrene, acrylonitrile, and the like.
Examples of the α -olefin having 4 to 12 carbon atoms include 1-butene, 2-methyl-1-propene, 2-methyl-1-butene, 3-methyl-1-butene, 1-hexene, 2-ethyl-1-butene, 2,3-dimethyl-1-butene, 2-methyl-1-pentene, 3-methyl-1-pentene, 4-methyl-1-pentene, 3,3-dimethyl-1-butene, 1-heptene, methyl-1-hexene, dimethyl-1-pentene, ethyl-1-pentene, trimethyl-1-butene, methylethyl-1-butene, 1-octene, methyl-1-pentene, ethyl-1-hexene, dimethyl-1-hexene, propyl-1-heptene, methylethyl-1-heptene, trimethyl-1-pentene, propyl-1-pentene, diethyl-1-butene, 1-nonene, 1-decene, 1-undecene, and 1-dodecene.
Examples of the polyolefin resin include polyethylene resins, polypropylene resins, polyisobutylene resins, polyisoprene resins, polybutadiene resins, vinyl resins such as (meth) acrylic resins (so-called allyl resins) and polyvinyl chloride resins, poly (meth) acrylamide resins, polystyrene resins, acrylonitrile/butadiene/styrene copolymer resins (ABS resins), ethylene/(meth) acrylate copolymers, and ethylene/vinyl acetate copolymers.
Among these resins, polyethylene resins, polypropylene resins, and acrylonitrile/butadiene/styrene copolymer resins (ABS resins) are preferable, and among them, polyethylene resins and polypropylene resins are preferable.
Examples of the polyethylene resin include ethylene homopolymers and ethylene- α -olefin copolymers. As the α -olefin, 1-butene, 1-pentene, 1-hexene, 1-octene are preferred.
Examples of the ethylene- α -olefin copolymer include an ethylene-1-butene copolymer, an ethylene-1-pentene copolymer, an ethylene-1-hexene copolymer, and an ethylene-1-octene copolymer.
When classified by density or shape, the polyethylene may be any of High Density Polyethylene (HDPE), low Density Polyethylene (LDPE), very Low Density Polyethylene (VLDPE), linear Low Density Polyethylene (LLDPE), and ultra high molecular weight polyethylene (UHMW-PE).
Examples of the polypropylene resin include a propylene homopolymer, a propylene-ethylene random copolymer, a propylene- α -olefin random copolymer, a propylene-ethylene- α -olefin copolymer, a propylene block copolymer (a copolymer obtained by copolymerizing propylene with at least one monomer selected from ethylene and α -olefins, a copolymer component mainly composed of propylene, and a propylene homopolymer component), and the like. These polypropylene resins may be used alone or in combination of two or more.
The α -olefin used in the polypropylene resin is preferably 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene, 1-octene, or 1-decene, and more preferably 1-butene, 1-hexene, or 1-octene.
Examples of the propylene- α -olefin random copolymer include a propylene-1-butene random copolymer, a propylene-1-hexene random copolymer, a propylene-1-octene random copolymer, and the like.
Examples of the propylene-ethylene- α -olefin copolymer include a propylene-ethylene-1-butene copolymer, a propylene-ethylene-1-hexene copolymer, and a propylene-ethylene-1-octene copolymer.
Examples of the propylene block copolymer include (propylene) - (propylene-ethylene) copolymer, (propylene) - (propylene-ethylene-1-butene) copolymer, (propylene) - (propylene-ethylene-1-hexene) copolymer, (propylene) - (propylene-1-butene) copolymer, (propylene) - (propylene-1-hexene) copolymer, (propylene-ethylene) - (propylene-ethylene-1-butene) copolymer, (propylene-ethylene) - (propylene-ethylene-1-hexene) copolymer, (propylene-ethylene) - (propylene-1-butene) copolymer, (propylene-ethylene) - (propylene-1-hexene) copolymer, (propylene-ethylene) - (propylene-1-butene) copolymer, (propylene-1-butene) - (propylene-ethylene-1-butene) copolymer, (propylene-1-butene) - (propylene-ethylene-1-hexene) copolymer, (propylene-1-butene) - (propylene-1-butene) copolymer, (propylene-1-butene) - (propylene-1-hexene) copolymers, and the like.
Among these polypropylene resins, propylene homopolymers, propylene-ethylene random copolymers, propylene-1-butene random copolymers, propylene-ethylene-1-butene copolymers, and propylene block copolymers are preferable.
The crystallinity of the polypropylene resin is required to have a melting temperature (melting point) or stereoregularity, and is adjusted according to the quality required for the polyolefin resin composition of the present invention or the quality required for a molded article obtained by molding the polyolefin resin composition.
Stereoregularity is referred to as isotactic index and syndiotactic index.
The isotactic index is determined by using Macromolecules, 8 th vol.687 (1975) 13 Determined by C-NMR method. Specifically, to 13 The isotactic index of a polypropylene resin was determined as the area fraction of mmmm peak in the total absorption peak of the carbon region of methyl group in the C-NMR spectrum.
When the isotactic index is high, the crystallinity is high, and is preferably 0.96 or more, more preferably 0.97 or more, and further preferably 0.98 or more.
On the other hand, the syndiotactic index is determined by the method described in j.am.chem.soc.,110,6255 (1988) or angelw.chem.int.ed.engl., 1955,34,1143-1170, and when the syndiotactic index is high, the crystallinity is high.
Examples of the vinyl resin include vinyl chloride resins [ e.g., homopolymers of vinyl chloride monomers (such as polyvinyl chloride resins), copolymers of vinyl chloride monomers and other monomers (such as vinyl chloride-vinyl acetate copolymers and vinyl chloride- (meth) acrylate copolymers) ], vinyl alcohol resins (e.g., homopolymers of polyvinyl alcohol, copolymers of ethylene-vinyl alcohol copolymers), and polyvinyl acetal resins such as polyvinyl formal. These vinyl resins may be used alone or in combination of 2 or more.
The Melt Flow Rate (MFR) of the polyolefin resin is usually 0.01 to 400g/10 min, and from the viewpoint of improving mechanical strength or production stability, it is preferably 1 to 400g/10 min, more preferably 1 to 100g/10 min, and still more preferably 1 to 50g/10 min.
In the present invention, the Melt Flow Rate (MFR) is the mass (g/10 min) of the polymer flowing out at 190 ℃ under a load of 2.16kg per 10 min in accordance with JIS K7210.
In the present invention, the base resin is particularly preferably polypropylene.
In order to improve the adhesion, the surface of the base film in contact with the pressure-sensitive adhesive layer may be subjected to corona treatment or provided with another layer such as a primer layer.
The thickness of the base film is not particularly limited, but is preferably 30 to 300. Mu.m, more preferably 30 to 200. Mu.m, and still more preferably 50 to 150. Mu.m.
In the present invention, it is also preferable that the particle diameter is more than 100. Mu.m, and in this case, it is preferably more than 100 μm and 300 μm or less, more preferably 110 to 300 μm, still more preferably 110 to 250 μm, and particularly preferably 110 to 200 μm.
< pressure-sensitive adhesive agent, pressure-sensitive adhesive layer >
The adhesive layer may be formed using various adhesives known in the art. The adhesive is not limited at all, and for example, an adhesive containing a base polymer such as a rubber-based, acrylic, silicone-based or polyvinyl ether-based adhesive is used.
In the present invention, an acrylic adhesive is preferable.
In order to add cohesion to these base polymers, a crosslinking agent may be compounded.
Examples of the crosslinking agent corresponding to the base polymer include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, metal chelate-based crosslinking agents, aziridine-based crosslinking agents, and amine resins. Further, various additives may be added to the binder as desired within a range not to impair the object of the present invention.
In addition, a radiation-curable or thermally foamable adhesive may be used.
As the radiation-curable adhesive, an adhesive which is easily peeled off at the time of peeling by curing with ultraviolet rays, electron beams, or the like can be used. As the heat-expandable adhesive, an adhesive which is easily released by heating and using a foaming agent or an expanding agent can be used. Further, the adhesive may be a bonding agent that can also be used as a die-cutting/die-bonding agent. As the radiation-curable adhesive, for example, the radiation-curable adhesive described in Japanese patent publication No. 1-56112, japanese patent application laid-open No. 7-135189 and the like is preferably used, but not limited thereto. In the present invention, an ultraviolet-curable adhesive is preferably used. In this case, the curing agent may be cured by radiation and may have a three-dimensional network structure, and for example, a low molecular weight compound having at least 2 photopolymerizable carbon-carbon double bonds in the molecule (hereinafter referred to as a photopolymerizable compound) and a photopolymerization initiator may be mixed with a general rubber-based or acrylic pressure-sensitive base resin (polymer).
The rubber-based or acrylic base resin may be a rubber-based polymer such as natural rubber or various synthetic rubbers, or an acrylic polymer such as a copolymer of polyalkyl (meth) acrylate, alkyl (meth) acrylate, or alkyl (meth) acrylate with another unsaturated monomer copolymerizable therewith.
Further, by mixing an isocyanate-based curing agent with the adhesive, the initial adhesive strength can be set to any value. Specific examples of the curing agent include polyisocyanate compounds such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane-4,4 '-diisocyanate, diphenylmethane-2,4' -diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4 '-diisocyanate, dicyclohexylmethane-2,4' -diisocyanate, and lysine isocyanate.
In the case of an ultraviolet-curable adhesive, the polymerization curing time and the amount of ultraviolet irradiation by ultraviolet irradiation can be reduced by mixing a photopolymerization initiator into the adhesive.
Specific examples of such photopolymerization initiators include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzil, butanedione, and β -chloroanthraquinone.
The mass average molecular weight of the base polymer of the acrylic adhesive is preferably 10 ten thousand or more, more preferably 20 ten thousand or more, further preferably 25 ten thousand or more, particularly preferably 30 ten thousand or more, and most preferably 40 ten thousand or more. The upper limit of the mass average molecular weight is preferably 200 ten thousand or less, more preferably 150 ten thousand or less, further preferably 100 ten thousand or less, and particularly preferably 80 ten thousand or less.
In the present invention, for example, 10 to 200 ten thousand are preferable ranges, and 25 to 200 ten thousand are more preferable ranges. For example, a range of 20 to 150 ten thousand may be mentioned as an example of another range.
The mass average molecular weight was obtained by Gel Permeation Chromatography (GPC) in terms of standard polystyrene.
The thickness of the pressure-sensitive adhesive layer is not particularly limited, but is preferably 4 to 30 μm, and particularly preferably 5 to 25 μm.
< loss factor of adhesive sheet for semiconductor processing >
A test piece obtained by processing a semiconductor processing adhesive sheet into a width of 5mm is used, and the loss factor (tan delta) measured in a film shape by a dynamic viscoelasticity measuring apparatus by a method in accordance with JIS K7244 is 0.08 or more and less than 0.15 at a frequency of 0.01 to 10 Hz.
In the present invention, the loss factor (tan δ) is preferably 0.1 to 0.13.
The loss factor (tan δ) is represented by tan δ = loss modulus E "/storage modulus E', and a material that is softer as the number is larger.
When the loss factor (tan δ) is less than 0.08, the risk of package scattering increases; if the amount is 39 or more, the risk of chips remaining on the adhesive sheet for semiconductor processing during the scrape-off pickup increases.
The loss factor can be measured by a dynamic viscoelasticity measuring apparatus (for example, rheogel-E4000 manufactured by UBM).
In the present invention, a test piece 5mm wide by 10mm long was cut out from an adhesive sheet for semiconductor processing, the test piece was fixed to a dynamic viscoelasticity measuring apparatus with a holding jig, and the measurement was performed at a temperature of 23 ℃ and a frequency of 0.01 to 10Hz, and the obtained value was a loss factor.
In order to adjust the loss factor to the above range, the kind and compounding amount of the base resin, the styrene-based block copolymer, and the binder may be adjusted.
A semiconductor wafer may be bonded to the adhesive sheet for semiconductor processing of the present invention, and dicing and picking up of the wafer as shown in fig. 2 to 5 may be performed by a conventional method. In the method for processing a semiconductor wafer using the adhesive sheet for semiconductor processing of the present invention, it is preferable to reduce the cutting resistance of the dicing blade without cutting into the base material film, to smoothly cut the semiconductor wafer, and to reduce chipping. In order to prevent the notch from reaching the base film, the setting of the cutting depth of the cutting device used may be appropriately changed according to a manual, for example.
The bare wafer used in the present invention is not particularly limited, and can be selected and used from any conventionally used bare wafers.
Examples
The present invention will be described in more detail below with reference to examples, but the present invention is not limited thereto.
< production of base Material film >
1) Substrate film A
Styrene-hydrogenated isoprene-styrene block copolymer (SEPS) [ trade name: septon KF-2104, manufactured by Kuraray corporation ] and homopolypropylene (PP) [ trade name: J-105G, manufactured by Utsui Kabushiki Kaisha ] was mixed at a compounding ratio shown in Table 1, and processed by film extrusion at about 200 ℃ using a twin-screw kneader to produce a base film A having a thickness of 150 μm.
2) Base film B
Styrene-isoprene-styrene copolymer (SIS) [ trade name: hybrid 5127, manufactured by Kuraray corporation ] and homopolypropylene (PP) [ trade name: J-105G, manufactured by Utsui Kagaku K.K. ] were mixed at the compounding ratios shown in Table 1 below, and processed by film extrusion at about 200 ℃ using a twin-screw kneader to produce a base film B having a thickness of 150 μm.
3) Base material film C
Styrene-hydrogenated butadiene-styrene copolymer (SEBS) [ product name: septon 8104, manufactured by Kuraray corporation ] and homopolypropylene (PP) [ trade name: J-105G, manufactured by Utsui Kagaku K.K. ] were mixed at the compounding ratios shown in Table 1 below, and processed by film extrusion at about 200 ℃ using a twin-screw kneader to produce a base film C having a thickness of 150 μm.
4) Base material film D
Styrene-hydrogenated isoprene/butadiene-styrene copolymer (SEEPS) [ trade name: septon4033, manufactured by Kuraray corporation ] and homopolypropylene (PP) [ trade name: J-105G, manufactured by Utsui Kagaku K.K. ] were mixed at the compounding ratios shown in Table 1 below, and processed by film extrusion at about 200 ℃ using a twin-screw kneader to produce a base film D having a thickness of 150 μm.
< preparation of adhesive >
To 100 parts by mass of an acrylic base polymer (a copolymer of 2-ethylhexyl acrylate, methyl acrylate, and 2-hydroxyethyl acrylate, having a mass average molecular weight of 40 ten thousand and a glass transition temperature of-35 ℃ C.), was added a polyisocyanate compound [ trade name: coronate L, manufactured by japan polyurethane industries co. ]3 parts by mass, 50 parts by mass of tetramethylolmethane tetraacrylate, which is a compound having a photopolymerizable carbon-carbon double bond, and 1 part by mass of α -hydroxycyclohexylphenylketone, which is a photopolymerization initiator, were mixed to obtain a pressure-sensitive adhesive.
Examples 1 to 3 and comparative example 1
The adhesive was applied to one surface of the substrate film a to a thickness of 20 μm to form an adhesive layer, thereby producing adhesive sheets for semiconductor processing of examples 1 to 3 and comparative example 1.
Example 4
A pressure-sensitive adhesive sheet for semiconductor processing was produced in the same manner as in example 1, except that the base film B was used.
Example 5
A pressure-sensitive adhesive sheet for semiconductor processing was produced in the same manner as in example 1, except that the base film C was used.
Example 6
A pressure-sensitive adhesive sheet for semiconductor processing was produced in the same manner as in example 1, except that the base film D was used.
For each of these adhesive sheets for semiconductor processing, the loss factor (tan δ), package scattering, and pickup success rate were evaluated as follows.
(loss factor)
A test piece 5mm wide by 10mm long was cut out from the adhesive sheet for semiconductor processing.
The test piece was fixed to a dynamic viscoelasticity measuring apparatus (Rheogel-E4000, manufactured by UBM) by a method according to JIS K7244 using a holding jig, and measured at a temperature of 23 ℃ and a frequency of 0.01 to 10 Hz. The loss coefficient in this frequency range (tan δ = loss modulus E "/storage modulus E') was obtained.
(Package flying)
QFN packages (60 mm. Times.150 mm, thickness 0.95 mm) were attached to each adhesive sheet for semiconductor processing. The adhesive sheet was cut with a dicing machine (DFD 6340 manufactured by DISCO) so that the chip size was 1mm × 1mm under the conditions of a blade rotation speed of 20000rpm, a cutting speed of 30mm/min, and a cut of 60 μm into the adhesive sheet.
After cutting, evaluation was performed according to the following evaluation criteria.
Evaluation criteria
O: the chips are all left on the adhesive sheet for semiconductor processing
X: 1 or more chips fly off
(success rate of pickup)
Evaluation was performed by the method using scraping described below.
After cutting, ultraviolet irradiation (200 mJ/cm) 2 ) The back surface of the adhesive sheet for semiconductor processing was scraped with tweezers to drop the chip.
The results obtained are summarized in table 1 below.
The blank in the table means unused.
[ TABLE 1]
From table 1 above, the values of the loss factor of the adhesive sheets for semiconductor processing of examples 1 to 6 were all 0.08 or more and less than 0.15, package scattering did not occur, and good pick-up by scraping was also achieved.
In contrast, the adhesive sheet for semiconductor processing of comparative example 1 had a large amount of elastomer component, and the loss factor value was increased, and as a result, although package scattering did not occur, all packages did not fall even if the adhesive sheet for semiconductor processing was bent at the time of scrape-off pickup, and therefore, chips that were not smoothly scraped off remained on the adhesive sheet for semiconductor processing.
On the other hand, the adhesive sheet for semiconductor processing of comparative example 2 had a low elastomer component and a low loss factor, and as a result, the adhesive sheet for semiconductor processing did not completely absorb the vibration during dicing and package scattering occurred.
While the invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not to be limited to the disclosed embodiment, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
The present application claims priority to Japanese patent application 2016-073263, filed in Japan on the basis of 2016, 3, 31, which is hereby incorporated by reference and the contents of which are incorporated as part of the disclosure of this specification.
Description of the symbols
1 film of substrate
2 adhesive layer
11 sample holder
12 adhesive sheet for semiconductor processing
13 semiconductor wafer
14 semiconductor chip
15 direction of solid arrow
16 expander
17 direction of dotted arrow
Claims (5)
1. A pressure-sensitive adhesive sheet for semiconductor processing having a pressure-sensitive adhesive layer on a base film,
a loss factor measured in a film form by a dynamic viscoelasticity measuring apparatus using a test piece obtained by processing the adhesive sheet for semiconductor processing into a width of 5mm at a frequency of 0.01 to 10Hz of 0.08 or more and less than 0.15,
the base film comprises 1 layer and 5 to 39 parts by mass of a styrene block copolymer per 100 parts by mass of a base resin,
the styrene block copolymer is at least one resin selected from the group consisting of a styrene-hydrogenated isoprene-styrene block copolymer, a styrene-hydrogenated butadiene-styrene block copolymer, and a styrene-hydrogenated isoprene/butadiene-styrene block copolymer,
the base resin is at least one resin selected from the group consisting of polypropylene, high density polyethylene, low density polyethylene, linear low density polyethylene, ethylene-propylene copolymer, ethylene-propylene-diene copolymer sulfide, polybutene, polybutadiene, polymethylpentene, ethylene-vinyl acetate copolymer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) methyl acrylate copolymer, ethylene- (meth) ethyl acrylate copolymer, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, ethylene-vinyl chloride-vinyl acetate copolymer, polystyrene, polyurethane, polyamide, ionomer, nitrile rubber, butyl rubber, styrene-isoprene rubber, styrene-butadiene rubber, natural rubber, and hydrides or modifications thereof.
2. The adhesive sheet for semiconductor processing according to claim 1, wherein the base resin is polypropylene.
3. The adhesive sheet for semiconductor processing according to claim 1 or 2, wherein the adhesive forming the adhesive layer is an acrylic adhesive.
4. The adhesive sheet for semiconductor processing according to any one of claims 1 to 3, wherein the styrene-based block copolymer is 10 to 35 parts by mass with respect to 100 parts by mass of a base resin.
5. The adhesive sheet for semiconductor processing according to any one of claims 1 to 4, which is used for dicing of a semiconductor package.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-073263 | 2016-03-31 | ||
| JP2016073263 | 2016-03-31 | ||
| PCT/JP2017/012455 WO2017170436A1 (en) | 2016-03-31 | 2017-03-27 | Adhesive sheet for semiconductor processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108207116A CN108207116A (en) | 2018-06-26 |
| CN108207116B true CN108207116B (en) | 2023-02-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780003496.XA Active CN108207116B (en) | 2016-03-31 | 2017-03-27 | Adhesive sheet for semiconductor processing |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP6615223B2 (en) |
| KR (1) | KR102355077B1 (en) |
| CN (1) | CN108207116B (en) |
| MY (1) | MY186094A (en) |
| SG (1) | SG11201800285PA (en) |
| TW (1) | TWI654242B (en) |
| WO (1) | WO2017170436A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109536068B (en) * | 2018-11-16 | 2021-08-17 | 宁波激智科技股份有限公司 | High-viscosity protective film and preparation method thereof |
| KR20200141102A (en) | 2019-06-10 | 2020-12-18 | 황진혁 | moisture remover wiper |
| JP2021077861A (en) * | 2019-11-07 | 2021-05-20 | 日東電工株式会社 | Dicing tape and dicing die bond film |
| CN112048253B (en) * | 2020-09-04 | 2022-04-12 | 浙江洁美电子科技股份有限公司 | Self-adhesion type protection film |
| JP2023066585A (en) * | 2021-10-29 | 2023-05-16 | タキロンシーアイ株式会社 | Base film for semiconductor manufacturing tape |
| JP2023066587A (en) * | 2021-10-29 | 2023-05-16 | タキロンシーアイ株式会社 | Base film for semiconductor manufacturing tape |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007063340A (en) * | 2005-08-30 | 2007-03-15 | Sumitomo Bakelite Co Ltd | Film substrate and adhesive tape for processing semiconductor wafer |
| WO2011004825A1 (en) * | 2009-07-08 | 2011-01-13 | 古河電気工業株式会社 | Wafer-pasting adhesive sheet and wafer processing method using the same |
| JP2011216704A (en) * | 2010-03-31 | 2011-10-27 | Furukawa Electric Co Ltd:The | Adhesive tape for semiconductor wafer processing |
| JP2015185591A (en) * | 2014-03-20 | 2015-10-22 | 日立化成株式会社 | Wafer processing tape |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007100064A (en) | 2005-09-07 | 2007-04-19 | Furukawa Electric Co Ltd:The | Pressure-sensitive adhesive tape for dicing |
| JP5448430B2 (en) | 2007-12-18 | 2014-03-19 | 古河電気工業株式会社 | Wafer sticking sheet and wafer processing method |
| KR101397686B1 (en) * | 2010-12-06 | 2014-05-22 | 제일모직주식회사 | Base film and adhesive film for semiconductor devices using the same |
| JP5294365B1 (en) | 2012-09-27 | 2013-09-18 | 古河電気工業株式会社 | Radiation curable adhesive tape for dicing |
| JP6107230B2 (en) * | 2013-02-28 | 2017-04-05 | 住友ベークライト株式会社 | Dicing film |
-
2017
- 2017-03-27 CN CN201780003496.XA patent/CN108207116B/en active Active
- 2017-03-27 MY MYPI2018700844A patent/MY186094A/en unknown
- 2017-03-27 SG SG11201800285PA patent/SG11201800285PA/en unknown
- 2017-03-27 JP JP2017554095A patent/JP6615223B2/en active Active
- 2017-03-27 KR KR1020187010108A patent/KR102355077B1/en active IP Right Grant
- 2017-03-27 WO PCT/JP2017/012455 patent/WO2017170436A1/en active Application Filing
- 2017-03-31 TW TW106110947A patent/TWI654242B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007063340A (en) * | 2005-08-30 | 2007-03-15 | Sumitomo Bakelite Co Ltd | Film substrate and adhesive tape for processing semiconductor wafer |
| WO2011004825A1 (en) * | 2009-07-08 | 2011-01-13 | 古河電気工業株式会社 | Wafer-pasting adhesive sheet and wafer processing method using the same |
| JP2011216704A (en) * | 2010-03-31 | 2011-10-27 | Furukawa Electric Co Ltd:The | Adhesive tape for semiconductor wafer processing |
| JP2015185591A (en) * | 2014-03-20 | 2015-10-22 | 日立化成株式会社 | Wafer processing tape |
Also Published As
| Publication number | Publication date |
|---|---|
| SG11201800285PA (en) | 2018-02-27 |
| MY186094A (en) | 2021-06-21 |
| TW201800467A (en) | 2018-01-01 |
| KR102355077B1 (en) | 2022-01-25 |
| JPWO2017170436A1 (en) | 2019-02-07 |
| JP6615223B2 (en) | 2019-12-04 |
| WO2017170436A1 (en) | 2017-10-05 |
| CN108207116A (en) | 2018-06-26 |
| TWI654242B (en) | 2019-03-21 |
| KR20180127302A (en) | 2018-11-28 |
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