MY188629A - Release film - Google Patents
Release filmInfo
- Publication number
- MY188629A MY188629A MYPI2018002035A MYPI2018002035A MY188629A MY 188629 A MY188629 A MY 188629A MY PI2018002035 A MYPI2018002035 A MY PI2018002035A MY PI2018002035 A MYPI2018002035 A MY PI2018002035A MY 188629 A MY188629 A MY 188629A
- Authority
- MY
- Malaysia
- Prior art keywords
- release film
- release layer
- filler
- substrate
- release
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2398/00—Unspecified macromolecular compounds
- B32B2398/10—Thermosetting resins
Abstract
A release film (10) includes a substrate (1) and a release layer (2) formed on the substrate (1), the release layer (2) including a resin component and a filler, wherein a ratio (A/B) of a volume average particle diameter A (?m) of the filler to a mass B (g/m2) per 1 m2 of the release layer (2) is 1 or less. (Figure 1)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016101820 | 2016-05-20 | ||
PCT/JP2017/018930 WO2017200102A1 (en) | 2016-05-20 | 2017-05-19 | Mold release film |
Publications (1)
Publication Number | Publication Date |
---|---|
MY188629A true MY188629A (en) | 2021-12-22 |
Family
ID=60326238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2018002035A MY188629A (en) | 2016-05-20 | 2017-05-19 | Release film |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP6414345B2 (en) |
KR (1) | KR102340703B1 (en) |
CN (1) | CN109153155B (en) |
MY (1) | MY188629A (en) |
SG (1) | SG11201810343TA (en) |
TW (2) | TW202237368A (en) |
WO (1) | WO2017200102A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2019244448A1 (en) | 2018-06-22 | 2020-06-25 | 株式会社コバヤシ | Release film and method for producing release film |
WO2020040240A1 (en) * | 2018-08-24 | 2020-02-27 | 住友ベークライト株式会社 | Release film and method for producing molded article |
JPWO2021079746A1 (en) * | 2019-10-24 | 2021-04-29 | ||
CN111016017B (en) * | 2019-12-31 | 2021-10-22 | 上海凯陆高分子材料有限公司 | Material for surface treatment of vulcanization mold and preparation method and application thereof |
TWI724765B (en) * | 2020-01-21 | 2021-04-11 | 達興材料股份有限公司 | Laser-debondable composition, laminate thereof, and laser-debonding method |
WO2022038712A1 (en) * | 2020-08-19 | 2022-02-24 | 昭和電工マテリアルズ株式会社 | Release film and electronic component device manufacturing method |
JP6870775B1 (en) * | 2020-10-21 | 2021-05-12 | 住友ベークライト株式会社 | Manufacturing method of release film and molded product |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001038850A (en) * | 1999-07-28 | 2001-02-13 | Oji Paper Co Ltd | Releasing sheet for electron beam curing processing |
JP2002158242A (en) | 1999-11-30 | 2002-05-31 | Hitachi Chem Co Ltd | Mold release sheet for semiconductor mold and method for manufacturing resin-sealed semiconductor device |
JP2004200467A (en) * | 2002-12-19 | 2004-07-15 | Hitachi Chem Co Ltd | Release sheet for semiconductor mould |
JP4183558B2 (en) * | 2003-05-26 | 2008-11-19 | ヤマウチ株式会社 | Heat press sheet |
KR20070033420A (en) * | 2004-07-13 | 2007-03-26 | 린텍 가부시키가이샤 | Releasing sheet and formed article obtained by using such releasing sheet |
JP2007287937A (en) | 2006-04-17 | 2007-11-01 | Kyocera Chemical Corp | Resin-sealed semiconductor device and its manufacturing method |
JP2008018679A (en) * | 2006-07-14 | 2008-01-31 | Dainippon Printing Co Ltd | Release film |
TWI501871B (en) * | 2007-10-31 | 2015-10-01 | Unitika Ltd | Mold-releasable polyester film |
JP5080232B2 (en) * | 2007-12-13 | 2012-11-21 | 帝人デュポンフィルム株式会社 | Release film for green sheet molding and method for producing the same |
WO2011068129A1 (en) * | 2009-12-03 | 2011-06-09 | 旭硝子株式会社 | Process for producing fluorocopolymer nanocomposite |
JP5834918B2 (en) * | 2010-02-15 | 2015-12-24 | 旭硝子株式会社 | Release agent composition |
JP5799893B2 (en) * | 2012-05-25 | 2015-10-28 | 信越化学工業株式会社 | Emulsion heavy release additive for release sheet, emulsion composition for release sheet, and release sheet |
KR101944200B1 (en) * | 2012-06-08 | 2019-01-30 | 히타치가세이가부시끼가이샤 | Method for manufacturing semiconductor device |
MY165588A (en) * | 2012-10-19 | 2018-04-06 | Toray Industries | Biaxially orientated polyester film for mold release |
JP6204051B2 (en) * | 2013-04-19 | 2017-09-27 | 株式会社巴川製紙所 | Mold release sheet |
JP6284313B2 (en) * | 2013-08-02 | 2018-02-28 | ライオン・スペシャリティ・ケミカルズ株式会社 | Release film production method and release film |
-
2017
- 2017-05-19 TW TW111121026A patent/TW202237368A/en unknown
- 2017-05-19 TW TW106116589A patent/TW201819141A/en unknown
- 2017-05-19 WO PCT/JP2017/018930 patent/WO2017200102A1/en active Application Filing
- 2017-05-19 CN CN201780031301.2A patent/CN109153155B/en active Active
- 2017-05-19 KR KR1020187036120A patent/KR102340703B1/en active IP Right Grant
- 2017-05-19 MY MYPI2018002035A patent/MY188629A/en unknown
- 2017-05-19 JP JP2017554553A patent/JP6414345B2/en active Active
- 2017-05-19 SG SG11201810343TA patent/SG11201810343TA/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW202237368A (en) | 2022-10-01 |
WO2017200102A1 (en) | 2017-11-23 |
SG11201810343TA (en) | 2018-12-28 |
TW201819141A (en) | 2018-06-01 |
JP6414345B2 (en) | 2018-10-31 |
CN109153155B (en) | 2020-11-10 |
CN109153155A (en) | 2019-01-04 |
KR102340703B1 (en) | 2021-12-16 |
KR20190008883A (en) | 2019-01-25 |
JPWO2017200102A1 (en) | 2018-05-31 |
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