MY188629A - Release film - Google Patents

Release film

Info

Publication number
MY188629A
MY188629A MYPI2018002035A MYPI2018002035A MY188629A MY 188629 A MY188629 A MY 188629A MY PI2018002035 A MYPI2018002035 A MY PI2018002035A MY PI2018002035 A MYPI2018002035 A MY PI2018002035A MY 188629 A MY188629 A MY 188629A
Authority
MY
Malaysia
Prior art keywords
release film
release layer
filler
substrate
release
Prior art date
Application number
MYPI2018002035A
Inventor
Shuichi Mori
Ryo Tamura
Takeo Otomo
Waka Sasaki
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=60326238&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY188629(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of MY188629A publication Critical patent/MY188629A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/56Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68Release sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/748Releasability
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2398/00Unspecified macromolecular compounds
    • B32B2398/10Thermosetting resins

Abstract

A release film (10) includes a substrate (1) and a release layer (2) formed on the substrate (1), the release layer (2) including a resin component and a filler, wherein a ratio (A/B) of a volume average particle diameter A (?m) of the filler to a mass B (g/m2) per 1 m2 of the release layer (2) is 1 or less. (Figure 1)
MYPI2018002035A 2016-05-20 2017-05-19 Release film MY188629A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016101820 2016-05-20
PCT/JP2017/018930 WO2017200102A1 (en) 2016-05-20 2017-05-19 Mold release film

Publications (1)

Publication Number Publication Date
MY188629A true MY188629A (en) 2021-12-22

Family

ID=60326238

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018002035A MY188629A (en) 2016-05-20 2017-05-19 Release film

Country Status (7)

Country Link
JP (1) JP6414345B2 (en)
KR (1) KR102340703B1 (en)
CN (1) CN109153155B (en)
MY (1) MY188629A (en)
SG (1) SG11201810343TA (en)
TW (2) TW202237368A (en)
WO (1) WO2017200102A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019244448A1 (en) 2018-06-22 2020-06-25 株式会社コバヤシ Release film and method for producing release film
WO2020040240A1 (en) * 2018-08-24 2020-02-27 住友ベークライト株式会社 Release film and method for producing molded article
JPWO2021079746A1 (en) * 2019-10-24 2021-04-29
CN111016017B (en) * 2019-12-31 2021-10-22 上海凯陆高分子材料有限公司 Material for surface treatment of vulcanization mold and preparation method and application thereof
TWI724765B (en) * 2020-01-21 2021-04-11 達興材料股份有限公司 Laser-debondable composition, laminate thereof, and laser-debonding method
WO2022038712A1 (en) * 2020-08-19 2022-02-24 昭和電工マテリアルズ株式会社 Release film and electronic component device manufacturing method
JP6870775B1 (en) * 2020-10-21 2021-05-12 住友ベークライト株式会社 Manufacturing method of release film and molded product

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001038850A (en) * 1999-07-28 2001-02-13 Oji Paper Co Ltd Releasing sheet for electron beam curing processing
JP2002158242A (en) 1999-11-30 2002-05-31 Hitachi Chem Co Ltd Mold release sheet for semiconductor mold and method for manufacturing resin-sealed semiconductor device
JP2004200467A (en) * 2002-12-19 2004-07-15 Hitachi Chem Co Ltd Release sheet for semiconductor mould
JP4183558B2 (en) * 2003-05-26 2008-11-19 ヤマウチ株式会社 Heat press sheet
KR20070033420A (en) * 2004-07-13 2007-03-26 린텍 가부시키가이샤 Releasing sheet and formed article obtained by using such releasing sheet
JP2007287937A (en) 2006-04-17 2007-11-01 Kyocera Chemical Corp Resin-sealed semiconductor device and its manufacturing method
JP2008018679A (en) * 2006-07-14 2008-01-31 Dainippon Printing Co Ltd Release film
TWI501871B (en) * 2007-10-31 2015-10-01 Unitika Ltd Mold-releasable polyester film
JP5080232B2 (en) * 2007-12-13 2012-11-21 帝人デュポンフィルム株式会社 Release film for green sheet molding and method for producing the same
WO2011068129A1 (en) * 2009-12-03 2011-06-09 旭硝子株式会社 Process for producing fluorocopolymer nanocomposite
JP5834918B2 (en) * 2010-02-15 2015-12-24 旭硝子株式会社 Release agent composition
JP5799893B2 (en) * 2012-05-25 2015-10-28 信越化学工業株式会社 Emulsion heavy release additive for release sheet, emulsion composition for release sheet, and release sheet
KR101944200B1 (en) * 2012-06-08 2019-01-30 히타치가세이가부시끼가이샤 Method for manufacturing semiconductor device
MY165588A (en) * 2012-10-19 2018-04-06 Toray Industries Biaxially orientated polyester film for mold release
JP6204051B2 (en) * 2013-04-19 2017-09-27 株式会社巴川製紙所 Mold release sheet
JP6284313B2 (en) * 2013-08-02 2018-02-28 ライオン・スペシャリティ・ケミカルズ株式会社 Release film production method and release film

Also Published As

Publication number Publication date
TW202237368A (en) 2022-10-01
WO2017200102A1 (en) 2017-11-23
SG11201810343TA (en) 2018-12-28
TW201819141A (en) 2018-06-01
JP6414345B2 (en) 2018-10-31
CN109153155B (en) 2020-11-10
CN109153155A (en) 2019-01-04
KR102340703B1 (en) 2021-12-16
KR20190008883A (en) 2019-01-25
JPWO2017200102A1 (en) 2018-05-31

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