JPWO2021079746A1 - - Google Patents
Info
- Publication number
- JPWO2021079746A1 JPWO2021079746A1 JP2021554257A JP2021554257A JPWO2021079746A1 JP WO2021079746 A1 JPWO2021079746 A1 JP WO2021079746A1 JP 2021554257 A JP2021554257 A JP 2021554257A JP 2021554257 A JP2021554257 A JP 2021554257A JP WO2021079746 A1 JPWO2021079746 A1 JP WO2021079746A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019193307 | 2019-10-24 | ||
PCT/JP2020/038125 WO2021079746A1 (en) | 2019-10-24 | 2020-10-08 | Mold-release film and method for manufacturing semiconductor package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021079746A1 true JPWO2021079746A1 (en) | 2021-04-29 |
Family
ID=75620015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021554257A Pending JPWO2021079746A1 (en) | 2019-10-24 | 2020-10-08 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2021079746A1 (en) |
KR (1) | KR20220085765A (en) |
CN (1) | CN114599495B (en) |
TW (1) | TW202124141A (en) |
WO (1) | WO2021079746A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024023945A1 (en) * | 2022-07-26 | 2024-02-01 | 株式会社レゾナック | Release film and method for manufacturing semiconductor package |
WO2024063127A1 (en) * | 2022-09-22 | 2024-03-28 | リンテック株式会社 | Pressure-sensitive adhesive sheet and method for producing electronic component or semiconductor device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002158242A (en) | 1999-11-30 | 2002-05-31 | Hitachi Chem Co Ltd | Mold release sheet for semiconductor mold and method for manufacturing resin-sealed semiconductor device |
JP2006049850A (en) * | 2004-06-29 | 2006-02-16 | Asahi Glass Co Ltd | Mold-releasing film for sealing semiconductor chip |
JP5563981B2 (en) * | 2008-08-28 | 2014-07-30 | 三井化学東セロ株式会社 | Mold release film for manufacturing semiconductor resin package, and method for manufacturing semiconductor resin package using the same |
JP5335731B2 (en) * | 2010-05-17 | 2013-11-06 | 三井化学株式会社 | Release film and LED package manufacturing method using the same |
JP6520055B2 (en) * | 2014-11-06 | 2019-05-29 | 日立化成株式会社 | Semiconductor compression molding release sheet and semiconductor package molded using the same |
JP2017205902A (en) * | 2016-05-16 | 2017-11-24 | 三井化学東セロ株式会社 | Release film suitable for manufacture of multilayer printed wiring board |
MY188629A (en) * | 2016-05-20 | 2021-12-22 | Hitachi Chemical Co Ltd | Release film |
-
2020
- 2020-10-08 CN CN202080072916.1A patent/CN114599495B/en active Active
- 2020-10-08 WO PCT/JP2020/038125 patent/WO2021079746A1/en active Application Filing
- 2020-10-08 JP JP2021554257A patent/JPWO2021079746A1/ja active Pending
- 2020-10-08 KR KR1020227011557A patent/KR20220085765A/en unknown
- 2020-10-19 TW TW109136149A patent/TW202124141A/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN114599495B (en) | 2024-04-02 |
TW202124141A (en) | 2021-07-01 |
KR20220085765A (en) | 2022-06-22 |
CN114599495A (en) | 2022-06-07 |
WO2021079746A1 (en) | 2021-04-29 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230809 |