CN109153155A - Mold release film - Google Patents
Mold release film Download PDFInfo
- Publication number
- CN109153155A CN109153155A CN201780031301.2A CN201780031301A CN109153155A CN 109153155 A CN109153155 A CN 109153155A CN 201780031301 A CN201780031301 A CN 201780031301A CN 109153155 A CN109153155 A CN 109153155A
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- CN
- China
- Prior art keywords
- methyl
- resin
- release layer
- acrylate
- release film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2398/00—Unspecified macromolecular compounds
- B32B2398/10—Thermosetting resins
Abstract
A kind of mold release film with substrate and is set on the substrate and the release layer comprising resin component and filler, the volume average particle size A (μm) of the filler and every 1m of the release layer2Quality B (g/m2) the ratio between (A/B) be less than or equal to 1.
Description
Technical field
The present invention relates to mold release films.
Background technique
Semiconductor chip is sealed generally for completely cutting off with outside air and being protected using resin, and to be claimed
State for the molded product of encapsulation is installed on substrate.The molded product is usually shaped to the stream by the flow path as sealing resin
Road and the encapsulated moulding product of each chip linked.In this case, pass through mold used in the molding in molded product
Structure adds release agent etc. into sealing resin, to obtain release property of the molded product from mold.
On the other hand, due to the requirement such as the miniaturization of encapsulation, more pins, thus to ball grid array (Ball Grid
Array, BGA) mode, four side flat non-pins (Quad Flat Non-leaded, QFN) mode, crystal wafer chip dimension envelope
The increase in demand of the encapsulation such as (Wafer Level Chip Size Package, the WL-CSP) mode of dress.In QFN mode, in order to
Ensure gap (standoff) and prevent from being caused to generate burr in portion of terminal by sealing material, in addition in BGA mode and WL-CSP
In mode, in order to improve release property of the encapsulation from mold, use resin mold release film (for example, referring to patent document 1).It will use
The forming method of such mold release film is known as " film assistant formation ".
In the field of BGA mode and WL-CSP mode, the in large size and high efficiency of (shot) is injected as mesh using 1 time
, forming method is carrying out the change from previous transfer modling mode to compression molding mode.
In addition, also studied following technique, it may be assumed that it is unrelated with these forming methods, by the functional piece with other function
It is equipped on mold release film in advance, is formed in molding procedure by functional piece to be configured in the way of semiconductor package is loaded onto
(for example, referring to patent document 2 and patent document 3).
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2002-158242 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2007-287937 bulletin
Patent document 3:WO2013/183671 bulletin
Summary of the invention
Subject to be solved by the invention
It, can in the process of molding semiconductor packages for the method recorded in patent document 2 and patent document 3
Functional piece semiconductor package is configured at together to load onto.On the other hand, in actual process, it is desirable to mold release film meet until
The performance and the function in molding procedure that functional piece is not kept from release layer removing in process until molding procedure
The performance that property piece is demoulded well.
Currently, not assigning the performance for keeping functional piece for mold release film widely used in compression molding mode.
Therefore, it in order to use the mold release film to load onto functional sheetmolding in semiconductor package in molding procedure, needs by mold release film
Functional piece is set after being configured in mold.However, being set in the mold release film being configured in complex-shaped and heated mold
The process for setting functional piece is difficult to automate, and there are lack operating efficiency and safety such problems when manual operation.
The present invention completes in view of the foregoing, and project is that provide one kind protects during until molding procedure
It holds the performance of functional piece and makes the mold release film of functional piece demoulding haveing excellent performance in molding procedure.
The method used for solving the problem
It include the following embodiments and the accompanying drawings in method for solving the above subject.
A kind of mold release film of 1 > of < with substrate and is set on above-mentioned substrate and comprising resin component and filler
Release layer, the volume average particle size A (μm) of above-mentioned filler and every 1m of above-mentioned release layer2Quality B (g/m2) the ratio between (A/B) it is small
In or equal to 1.
2 > of < mold release film according to 1 > of <, the volume average particle size A of above-mentioned filler are 1 μm~50 μm.
3 > of < mold release film according to 2 > of < 1 > or <, every 1m of above-mentioned release layer2Quality B be 0.1g/m2~
100g/m2。
4 > of < mold release film according to any one of 1 > of <~<, 3 >, above-mentioned resin component include thermosetting resin.
5 > of < mold release film according to any one of 1 > of <~<, 4 >, further contains crosslinking agent, relative to upper
100 mass parts of resin component are stated, the content of above-mentioned crosslinking agent is 1 mass parts~10 mass parts.
6 > of < mold release film according to any one of 1 > of <~<, 5 >, above-mentioned substrate contain selected from by gathering to benzene two
At least one of formic acid glycol ester, polybutylene terephthalate (PBT) and group of polyethylene naphthalate composition.
Invention effect
In accordance with the invention it is possible to provide a kind of performance that functional piece is kept during until molding procedure and
Make the mold release film of functional piece demoulding haveing excellent performance in molding procedure.
Detailed description of the invention
Fig. 1 is the figure for schematically showing the section of mold release film for the state for maintaining functional piece.
Fig. 2 is the figure for schematically showing equipment section when being formed using mold release film by transfer modling mode.
Fig. 3 is the figure for schematically showing equipment section when being formed using mold release film by transfer modling mode.
Fig. 4 is the figure for schematically showing equipment section when being formed using mold release film by transfer modling mode.
Specific embodiment
Hereinafter, being illustrated to mode for carrying out the present invention.But the present invention is not limited to embodiment party below
Formula.In the following embodiments, constituent element (also including element step etc.) other than the case where especially expressing not
It is necessary.It is also the same about numerical value and its range, it is not intended to limit the present invention.
In the present specification, " process " word is other than the process independently of other processes, though with other processes
It also include the process as long as can be realized the purpose of the process in the case where can not clearly distinguishing.
In the present specification, the numberical range indicated using "~" include "~" front and back documented by numerical value respectively as
Minimum value and maximum value.
In the numberical range recorded interim in the present specification, upper limit or lower limit documented by a numberical range
It could alternatively be the upper limit or lower limit for the numberical range that other stages are recorded.In addition, the number recorded in the present specification
It is worth in range, the upper limit or lower limit of numberical range also could alternatively be value shown in embodiment.
In the present specification, there are a variety of phases in the composition in the containing ratio or content about each ingredient in composition
In the case where the substance in each ingredient, unless otherwise specified, just refer to the conjunction of many kinds of substance present in composition
Count containing ratio or content.
In the present specification, the partial size about each ingredient in composition, exist in the composition it is a variety of be equivalent to it is each at
In the case where the particle divided, unless otherwise specified, exactly refer to the mixture for a variety of particles present in composition
Value.
In the present specification, about " layer " or " film " word, in addition in observation, there are be formed in when the region of this layer or film
It also include the situation for being only formed in a part in the region other than the whole situation in the region.
In the present specification, " stacking " word expression layer heap is folded, can more than two layers combination, can also two with
On layer can load and unload.
In this specification, " (methyl) acryloyl group " refers at least one party of acryloyl group and methylacryloyl, " (first
Base) acrylic acid " refer at least one party of acrylic acid and methacrylic acid, " (methyl) acrylate " refers to acrylate and methyl
At least one party of acrylate.
< mold release film >
The mold release film of present embodiment has substrate and is set on above-mentioned substrate and includes resin component and filler
Release layer, the volume average particle size A (μm) of above-mentioned filler and every 1m of above-mentioned release layer2Quality B (g/m2) the ratio between (A/B) it is small
In or equal to 1.
The mold release film of present embodiment keeps the performance of functional piece and is being formed during until molding procedure
Make haveing excellent performance for functional piece demoulding in process.Therefore, it may be suitably used to for example in the molding procedure of semiconductor packages
Functional piece is configured to the method on the surface of semiconductor packages.
The mold release film of present embodiment keeps the performance of functional piece and is being formed during until molding procedure
Make the although not necessarily clear the reasons why haveing excellent performance of functional piece demoulding in process, but speculates it is as contained in through release layer
Resin component and assign appropriateness adherence and by filler contained in release layer assign appropriateness concave-convex surface
It is caused.
From the viewpoint of the performance for keeping functional piece, the volume average particle size A (μm) of filler contained in release layer
With every 1m of release layer2Quality B (g/m2) the ratio between be preferably less than or equal to 1.0, more preferably less than or equal to 0.7, into one
Step is preferably less than or equal to 0.5.
The lower limit value of A/B is not particularly limited.Such as wanted to improve molding according to type and the purposes of semiconductor packages
When pressure the case where, whens wanting the machined surface of the most surface for making semiconductor packages and carrying out roughened situation etc., to demoulding
From the viewpoint of film assigns high demolding performace or keeps the degree of roughness on surface roughening, the preferably value of A/B is big.For example, it is preferable to
For more than or equal to 0.3, more preferably greater than or equal to 0.5.
[release layer]
Release layer includes resin component and filler, and the volume average particle size A (μm) of above-mentioned filler is every with above-mentioned release layer
1m2Quality B (g/m2) the ratio between (A/B) be less than or equal to 1.
In present embodiment, the volume average particle size A (μm) of filler is to be set as using optical diffraction/scattering method value
By the partial size (D50) when being built up as 50% in the size distribution of volume reference from path side.
Every 1m of release layer2Quality B (g/m2) range be not particularly limited, it is contemplated that with the average grain diameter of filler
Relationship and select.For example, it is preferable to be 0.1g/m2~100g/m2, more preferably 1g/m2~50g/m2。
If every 1m of release layer2Quality B be greater than or equal to 0.1g/m2, then release layer include an adequate amount of resin at
Point, can fully obtain the flexibility needed for molding procedure and extensibility, have can inhibit release layer from substrate removing or
The tendency to fall off.In addition, flexibility can be obtained fully, there is the tendency for the holding capacity that can be well maintained functional piece.
If every 1m of release layer2Quality B be less than or equal to 100g/m2, then there is the tendency that can inhibit following phenomenon,
The phenomenon are as follows: release layer becomes blocked up, leads to the thermal shrinkage stress when heat cure due to keeps the flatness of mold release film impaired.Separately
Outside, there is the tendency that can inhibit following phenomenon, the phenomenon are as follows: release layer becomes excessively soft, leads to functional piece mounted
It is embedded in release layer and can not accurately be configured at package surface.
In present embodiment, every 1m of release layer is found out2Quality B (g/m2) method be not particularly limited.For example, can
To become 100cm according to area2The quality (g) of mold release film that cuts out of mode (for example, size of 10cm × 10cm) and make
With organic solvent etc. from the mold release film remove release layer after the quality (g) of substrate find out the quality (g) of release layer, and by institute
The value of acquisition is converted into every 1m multiplied by 1002Release layer quality (g), so as to find out.
The thickness of release layer is not particularly limited.Such as preferably 0.1 μm~100 μm.If the thickness of release layer is greater than
Or being equal to 0.1 μm, then resin component can fully keep filler, therefore be not likely to produce filler at the time of molding and fall off and be mixed into envelope
A problem that in dress, has the tendency that can steadily produce semiconductor packages.If the thickness of release layer is less than or equal to
100 μm, then raw material used in release layer can be saved, from the viewpoint of manufacturing cost preferably.
The number average value with a thickness of the value obtained in 5 points of arbitrary Site Determination of release layer in present embodiment.It is de-
For example general micrometer can be used to be measured for the thickness of mold layer.
Release layer can have bumps in outer surface (face opposite with the face of substrate side) depending on the application.Release layer is in outer surface
In the case where with bumps, from the viewpoint of the homogeneity of package surface appearance, the preferred outer surface of release layer is (with substrate side
The opposite face in face) arithmetic average roughness (Ra) be 0.5 μm~5 μm.Additionally, it is preferred that 10 mean roughness of outer surface
It (Rz) is 5 μm~50 μm.
The arithmetic average roughness (Ra) of the outer surface of release layer and 10 mean roughness (Rz) examples in present embodiment
It such as can be with are as follows: straight in contact pilotage front end using surface roughness measurement device (for example, (strain) little Ban research institute, model SE-3500)
Diameter: 2 μm, transmission speed: 0.5mm/s and scanning distance: being measured under conditions of 8mm, and measured result is used to pass through
Method specified in JIS B0601 (2013) or ISO 4287 (1997) is parsed and the value that obtains.
Viscous force (タ ッ Network power) at 25 DEG C of the outer surface of release layer is preferably greater than or equal to 1.0gf.If outer surface
25 DEG C when viscous force be greater than or equal to 1.0gf, then have during until molding procedure until keep functionality piece property
It can more excellent tendency.
Viscous force at 170 DEG C of the outer surface of release layer is preferably less than or equal to 20.0gf.If 170 DEG C of outer surface
When viscous force be less than or equal to 20.0gf, then there is the performance more excellent tendency for making the demoulding of functional piece in molding procedure.
In present embodiment the viscous force (gf) of the outer surface of release layer for example can for using adhesiveness tester (for example,
The manufacture of Rhesca company) and diameter 5mm probe, with load-time 1 second before load 10gf, measurement before measuring, measure when rise
The value that speed 600mm/min is measured.
The containing ratio of filler in release layer is not particularly limited.For example, it is preferable to 1.0 matter of the gross mass for release layer
Measure the mass of %~50.0 %.If the containing ratio of filler is greater than or equal to 1.0 mass % of the gross mass of release layer, have logical
Cross release layer surface roughness can by the surface finish work of semiconductor packages after molding at no unevenness uniform appearance
Tendency.If the containing ratio of filler is less than or equal to 50.0 mass % of the gross mass of release layer, resin component can fill
Divide ground to keep filler ingredient, therefore be not likely to produce filler ingredient at the time of molding and fall off and be mixed into the unfavorable condition in encapsulation, has
The tendency of semiconductor packages can steadily be produced.
Release layer can also include solvent, anchoring enhancer, crosslinking promotion in addition to resin component and filler as needed
The other compositions such as agent, antistatic agent, colorant.
(resin component)
The type of resin component contained in release layer is not particularly limited.Such as can for by heating generation
Cross-linking reaction and the resin (thermosetting resin) for carrying out cured property.As the resin that can be used as resin component, can enumerate
Acrylic resin, olefin resin, styrene resin, acrylonitrile resin, silicone resin, epoxy resin, cyanate ester resin, maleimide
Polyimide resin, allyl nadikimide resin, phenolic resin, urea resin, melamine resin, alkyd resin, unsaturation
Polyester resin, diallyl phthalate resin, resorcinol formaldehyde resin, xylene resin, furane resins, polyurethane tree
Rouge, ketone resin, triallyl cyanurate resin, isocyanate resin, containing three (2- hydroxyethyl) isocyanuric acid esters resin,
Resin containing triallyltrimelitate, the thermosetting resin synthesized by cyclopentadiene, by the trimerizing of aromatic series cdicynanmide
The thermosetting resin etc. of acquisition.Resin component contained in release layer can be only a kind of or two or more.
From the viewpoint of the release property relative to semiconductor packages, release layer is preferably comprised selected from acrylic resin, alkene
At least one of hydrocarbon resin, styrene resin and acrylonitrile resin are used as resin component.
As acrylic resin, the homopolymer that (methyl) acrylic monomers is included at least in polymeric composition or total can be enumerated
Polymers.Specifically, poly- (methyl) acrylic acid, poly- (methyl) acrylate etc. can be enumerated.
As (methyl) acrylic monomers for constituting acrylic resin, can enumerate: (methyl) acrylic acid, (methyl) acrylic acid
Methyl esters, (methyl) ethyl acrylate, (methyl) n-propyl, (methyl) isopropyl acrylate, the positive fourth of (methyl) acrylic acid
Ester, (methyl) isobutyl acrylate, (methyl) sec-butyl acrylate, (methyl) tert-butyl acrylate, (methyl) amyl acrylate,
(methyl) Hexyl 2-propenoate, (methyl) heptylacrylate, (methyl) 2-EHA, (methyl) 2-ethyl hexyl acrylate, (first
Base) nonyl acrylate, (methyl) decyl acrylate, (methyl) dodecylacrylate, (methyl) acrylic acid tetradecane base ester,
(methyl) aliphatic acrylate, (methyl) octadecyl acrylate, (methyl) acrylic acid eicosane base ester, (methyl) third
Olefin(e) acid docosane base ester, (methyl) acrylic acid ring pentyl ester, (methyl) cyclohexyl acrylate, (methyl) acrylic acid cycloheptyl ester, (first
Base) benzyl acrylate, (methyl) phenyl acrylate, (methyl) methoxyethyl acrylate, (methyl) acrylate
Ethyl ester, (methyl) acrylic acid diethylamino ethyl ester, (methyl) acrylate propyl ester, (methyl) acrylic acid 2- chloroethene
Ester, (methyl) acrylic acid 2- fluorine ethyl ester, (methyl) dicyclopentanyl acrylate etc..
As the monomer in addition to (methyl) acrylic monomers for constituting acrylic resin, styrene, Alpha-Methyl can be enumerated
Styrene, N-cyclohexylmaleimide, vinyltoluene, vinyl chloride, vinyl acetate, n-vinyl pyrrolidone, butadiene,
Isoprene, chlorobutadiene etc..
As olefin resin, the homopolymer of olefinic monomer or alkene monomer can be enumerated, comprising olefinic monomer or alkene monomer
Copolymer as polymeric composition.Specifically, the polyolefin such as polyethylene, polypropylene, polymethylpentene can be enumerated.
As styrene resin, the homopolymer of styrene or styrene derivative can be enumerated, comprising styrene or styrene
Copolymer etc. of the derivative as polymeric composition.It as styrene derivative, can enumerate: α-methylstyrene, 4- methylbenzene second
Alkene, 2-methyl styrene, 3- methyl styrene, 2- ethyl styrene, 3- ethyl styrene, 4- ethyl styrene etc. have alkyl
The alkyl-substituted styrene of chain, the halogen-substituted styrenes such as 2- chlorostyrene, 3- chlorostyrene, 4- chlorostyrene, 4- fluorophenethyl
The fluorine substituted phenylethylenes such as alkene, 2,5- difluoro styrene, vinyl naphthalene etc..
As acrylonitrile resin, the homopolymer of (methyl) acrylonitrile monemer can be enumerated, made comprising (methyl) acrylonitrile monemer
For the copolymer etc. of polymeric composition.
Use thermosetting resin as in the case where resin component, crosslinking agent can be used.In the case where using crosslinking agent, hand over
Connection agent is not particularly limited relative to the content of 100 mass parts of thermosetting resin.For example, relative to 100 mass of thermosetting resin
Part, the content of crosslinking agent can be 1 mass parts~10 mass parts.
The type of crosslinking agent is not particularly limited, can be according to type, the desired curing rate etc. of thermosetting resin
To select.For example, use acrylic resin as in the case where thermosetting resin, it can be from isocyanate compound, melamine
It is selected in crosslinking agent well known to amine compounds, epoxide etc..
[filler]
As long as the volume average particle size of filler meets every 1m of volume average particle size A (μm) Yu above-mentioned release layer2Quality B
(g/m2) the ratio between (A/B) be less than or equal to 1 as condition, be just not particularly limited.For example, it is preferable to be 1 μm~50 μm.
If the volume average particle size of filler is greater than or equal to 1 μm, having can form sufficiently in the outer surface of release layer
Concave-convex tendency, and there is the homogeneity raising of institute's appearance of molding semiconductor package surface, can inhibit the stream of sealing material
The tendency of trace.If the volume average particle size of filler is less than or equal to 50 μm, there is inhibition filler to fall off from release layer required
Release layer the tendency that is inhibited of thickness.
From the viewpoint of the appearance of semiconductor package surface, the upper limit of the volume average particle size of filler is preferably 50 μm,
More preferably 20 μm.From adjustment molding semiconductor packages surface roughness from the viewpoint of, the volume of filler is averaged grain
The lower limit of diameter is preferably 1 μm.
The shape of filler contained in release layer is not particularly limited.Such as spherical, oval, unsetting etc. can be enumerated.
As long as filler can be in the form of the state being contained in release layer keeps it (i.e., it is difficult to be dissolved in release layer
In resin component contained in organic solvent, release layer used in formation etc.), material is just not particularly limited, Ke Yiwei
The filler being made of organic substance can be the filler being made of inorganic substances, or by organic substance and inorganic substances
The filler that the two is constituted.Filler contained in release layer can be only one kind, or two or more.
As the inorganic substances for becoming filler material, can enumerate: the metals such as silver, gold, copper, silica, aluminium oxide, dioxy
Change titanium, iron oxide etc..Inorganic substances can have electric conductivity, can also not have electric conductivity.
In the case where using the filler being made of inorganic substances, can also and inorganic ion exchanger be used.As inorganic ions
Permutoid, effectively following substance, it may be assumed that can confirm to have to capture when extracting demoulding tunic in the hot water and extracts in aqueous solution
Ion (Na+、K+, Cl-, F-, RCOO-, Br- etc., R is alkyl, aryl etc.) effect substance.As it is such it is inorganic from
The example of sub- permutoid can be enumerated: the natural mine such as zeolite, zeolites, Emathlite, dolomite, hydrotalcite for naturally producing
Object, artificial synthesized synthetic zeolite etc..
As the organic substance for becoming filler material, acrylic resin, imide resin, amide resin, amide can be enumerated
Imide resin, olefin resin, styrene resin, carbonate resin, silicone resin, ABS resin etc..These resins preferably by
Cross-linking reaction has carried out cured state.
In above-mentioned filler, comprising having carried out the acrylic resin of cured state by cross-linking reaction (hereinafter also referred to as friendship
Connection type acrylic resin) dispersibility of the filler in resin component it is excellent, and the monomer by being selected to polymeric composition
Type and be easy to adjust the characteristics such as shape, partial size, heat resistance of filler, therefore preferably.
As cross-linking type acrylic acid resin, preferably by make (methyl) butyl acrylate, (methyl) ethyl acrylate,
(methyl) 2-EHA etc. does not include (methyl) acrylic monomers and (methyl) acrylic acid, (methyl) first of functional group
Base Hydroxyethyl Acrylate, (methyl) acrylamide, (methyl) acrylonitrile etc. have functional group (methyl) acrylic monomers or
Other monomers are copolymerized and obtain (methyl) acrylic copolymer.
As (methyl) acrylic monomers for the polymeric composition for becoming cross-linking type acrylic acid resin, (1) can be enumerated with chain
(methyl) acrylic monomers of shape alkyl, (2) have (methyl) acrylic monomers of alicyclic skeleton, (3) multifunctional (methyl)
Acrylic monomers, (4) have (methyl) acrylic monomers of functional group etc..Hereinafter, being said to each (methyl) acrylic monomers
It is bright.
(1) with (methyl) acrylic monomers of chain-like alkyl
As (methyl) acrylic monomers with chain alkyl, (methyl) that there is chain alkyl in ester moiety can be enumerated
Acrylate (hereinafter, (methyl) acrylate is also recorded as (methyl) acrylate sometimes).
As (methyl) acrylate with chain alkyl, such as the chain hydrocarbon with carbon atom number 1~20 can be enumerated
(methyl) acrylate of base.If the carbon atom number of alkyl is less than or equal to 20, there is the tendency as low elastic modulus.
From the viewpoint of the dissolubility of acrylate copolymer, carbon atom number is preferably 2~18, from the sight of the heat resistance in molding procedure
Point considers that carbon atom number is more preferably 4~18.Chain alkyl is preferably the alkyl of carbon atom number 1~20.
Chain alkyl can also can have branch for straight-chain, in the case where branch, preferably not include tertiary carbon atom.It is logical
It crosses and does not include tertiary carbon atom, so that the Mass lost because of caused by thermal decomposition when low temperature is not susceptible to, in terms of heat resistance
Consideration is advantageous.
As with chain and (methyl) acrylate of alkyl that carbon atom number is 1~20, specifically, can enumerate:
(methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) n-propyl, (methyl) isopropyl acrylate, (first
Base) n-butyl acrylate, (methyl) isobutyl acrylate, (methyl) sec-butyl acrylate, (methyl) amyl acrylate, (methyl)
The just own ester of acrylic acid, (methyl) n-octyl, (methyl) 2-EHA, (methyl) decyl acrylate, (first
Base) acrylic acid DODECANOL, 1- ester, (methyl) isostearyl acrylate etc..
(2) with (methyl) acrylic monomers of alicyclic skeleton
As (methyl) acrylic monomers with alicyclic skeleton, (methyl) propylene with alicyclic skeleton can be enumerated
Acid esters.As alicyclic skeleton, cycloalkanes hydrocarbon skeleton, bicyclic alkane skeleton, norborny skeleton, isobornyl skeleton can be enumerated
Deng.Wherein, from the viewpoint of improving the transparency, preferably bicyclic alkane skeleton and norborny skeleton.
As (methyl) acrylic monomers with alicyclic skeleton, specifically, can enumerate: (methyl) acrylic acid ring penta
Ester (cyclopentyl (meth) acrylate), (methyl) acrylic acid pentamethylene base ester (cyclopentanyl (meth)
Acrylate), (methyl) cyclohexyl acrylate, (methyl) acrylic methyl cyclohexyl, (methyl) acrylic acid 3-methyl cyclohexanol ester,
(methyl) acrylic acid norbornyl ester, (methyl) acrylic acid norborny methyl esters, (methyl) phenylethyl norbornyl ester, (methyl)
Acrylic acid cyano norbornyl ester, (methyl) isobornyl acrylate, (methyl) acrylic acid norbornene ester, (methyl) acrylic acid peppermint
Ester, (methyl) acrylic acid turnip ester, (methyl) adamantyl acrylate, (methyl) acrylic acid dimethyladamantane base ester, (first
Base) acrylic acid tricyclic [5.2.1.02,6] decyl- 8- base ester, (methyl) acrylic acid tricyclic [5.2.1.02,6] decyl- 4- methyl esters, (methyl)
Acrylic acid ring last of the ten Heavenly stems ester etc..
From the viewpoint of heat resistance, preferably acrylic acid ring pentyl ester, cyclohexyl acrylate, isobornyl acrylate, third
Olefin(e) acid norbornyl ester, acrylic acid norborny methyl esters, acrylic acid tricyclic [5.2.1.02,6] decyl- 8- base ester, acrylic acid tricyclic
[5.2.1.02,6] decyl- 4- methyl esters, adamantyl acrylate, methacrylic acid ring pentyl ester, cyclohexyl methacrylate, methyl
Acrylic methyl cyclohexyl, methacrylic acid 3-methyl cyclohexanol ester, norbornyl ester, norbornyl base
Methyl esters, isobornyl methacrylate, methacrylic acid norbornene ester, Menthyl methacrylate, methacrylic acid turnip ester, methyl
Adamantyl acrylate, dimethylaminoethyl acrylate methyl adamantyl ester, methacrylic acid tricyclic [5.2.1.02,6] decyl- 8- base
Ester, methacrylic acid tricyclic [5.2.1.02,6] decyl- 4- methyl esters, methacrylic acid ring last of the ten Heavenly stems ester, methacrylic acid phenyl norbornyl ester
Deng.
Further from the aspect of high-fire resistance, more preferably acrylic acid ring pentyl ester, cyclohexyl acrylate, acrylic acid are different
Norbornene ester, acrylic acid norbornyl ester, acrylic acid norborny methyl esters, acrylic acid tricyclic [5.2.1.02,6] decyl- 8- base ester, propylene
Sour tricyclic [5.2.1.02,6] decyl- 4- methyl esters, adamantyl acrylate etc..
(3) multifunctional (methyl) acrylic monomers
Multifunctional (methyl) does not limit especially as long as acrylic monomers has more than two (methyl) acryloyl groups
System.It as multifunctional (methyl) acrylic monomers, can enumerate: there is more than two (methyl) acryloyl groups and alicyclic skeleton
(methyl) acrylic monomers, with more than two (methyl) acryloyl groups and aliphatic skeleton (methyl) acrylic acid list
Body has more than two (methyl) acryloyl groups and two(methyl) acrylic monomers of two ol skeleton of alkane, tool there are two with
On (methyl) acryloyl group and aftermentioned (4) (first of functional group that there is (methyl) acrylic monomers of functional group can have
Base) acrylic monomers etc..
It as multifunctional (methyl) acrylic monomers, such as can enumerate: hexamethylene-Isosorbide-5-Nitrae-dimethanol two (methyl) acrylic acid
Ester, hexamethylene -1,3- dimethanol two (methyl) acrylate, tristane dihydroxymethyl two (methyl) acrylate are (for example, day
This chemical drug Co. Ltd. system, KAYARAD R-684, tristane dihydroxymethyl diacrylate etc.), Tricyclodecane Dimethanol two
(methyl) acrylate (for example, the village Xin Zhong Chemical Co., Ltd. system, A-DCP, Tricyclodecane Dimethanol diacrylate etc.), twoAlkane glycol two (methyl) acrylate (for example, Nippon Kayaku K. K's system, KAYARAD R-604, twoAlkane glycol two
Acrylate etc.), neopentyl glycol two (methyl) acrylate, two (methyl) dicyclopentanyl acrylates, two (first of 1,6-HD
Base) acrylate, ethylene-oxide-modified 1,6-hexylene glycols two (methyl) acrylate, neopentyl glycol two (methyl) acrylate,
(poly-) ethylene-oxide-modified neopentyl glycol two (methyl) acrylate, hydroxy new pentane acid neopentyl glycol two (methyl) acrylate,
Polyethylene glycol two (methyl) acrylate, polypropylene glycol two (methyl) acrylate, ethylene-oxide-modified bisphenol A-type two (methyl)
(preferably polyethylene oxide modified bisphenol A-type two (methyl) acrylate, more preferably ethylene oxide 5~15 rub acrylate
Two (methyl) acrylate of that modified bisphenol A type) and (poly-) ethylene-oxide-modified di(2-ethylhexyl)phosphate (methyl) acrylate etc..
(4) with (methyl) acrylic monomers of functional group
As (methyl) acrylic monomers with functional group, intramolecular can be enumerated have and select free carboxyl group, hydroxyl, acid anhydrides
(methyl) acrylic monomers of at least one of the group of base, amino, amide groups and epoxy group composition functional group.
It as (methyl) acrylic monomers with carboxyl as functional group, can enumerate: (methyl) acrylic acid, 2- (methyl)
Acryloyl-oxyethyl succinic acid, 2- (methyl) acryloyl-oxyethyl phthalic acid, 2- (methyl) acryloyl-oxyethyl
Hexahydrophthalic acid, 2- (methyl) acryloxypropyl hexahydrophthalic acid etc..
As (methyl) acrylic monomers with hydroxyl as functional group, can enumerate (methyl) Hydroxyethyl Acrylate,
(methyl) hydroxypropyl acrylate, (methyl) hydroxy butyl acrylate, cyclohexanedimethanol list (methyl) acrylate, N- hydroxyl first
Base (methyl) acrylamide etc..
As (methyl) acrylic monomers with anhydride group as functional group, trimellitic anhydride (methyl) propylene can be enumerated
Acyloxy ethyl ester, hexamethylene front three acid anhydrides (methyl) acryloyloxyethyl ester etc..
As (methyl) acrylic monomers with amino as functional group, (methyl) acrylic acid diethylamino can be enumerated
Ethyl ester, (methyl) acrylic acid -2,2,6,6- tetramethyl piperidine ester, (methyl) acrylamide etc..
As (methyl) acrylic monomers with amide groups as functional group, the sweet ammonia of N- (methyl) acryloyl group can be enumerated
Amide etc..
As (methyl) acrylic monomers with epoxy group as functional group, can enumerate: (methyl) acrylic acid shrinks sweet
Grease, α-ethyl (methyl) glycidyl acrylate, α-n-propyl (methyl) glycidyl acrylate, (methyl) acrylic acid
2- (2,3- glycidoxy) ethyl ester, (methyl) acrylic acid 3- (2,3- glycidoxy) propyl ester, (methyl) acrylic acid 4- (2,3-
Glycidoxy) butyl ester, (methyl) acrylic acid 5- (2,3- glycidoxy) pentyl ester, (methyl) acrylic acid 6- (2,3- epoxy third
Oxygroup) own ester, (methyl) acrylic acid -3,4- epoxy butyl ester, (methyl) acrylic acid -4,5- epoxy pentyl ester, (methyl) acrylic acid -6,
7- epoxy heptyl ester, α-ethyl (methyl) acrylic acid -6,7- epoxy heptyl ester, (methyl) acrylic acid -3- methyl -3,4- epoxy butyl ester,
(methyl) acrylic acid -4- methyl -4,5- epoxy pentyl ester, the own ester of (methyl) acrylic acid -5- methyl -5,6- epoxy, (methyl) propylene
Acid-Beta-methyl ethylene oxidic ester, α-ethyl (methyl) senecioate-methylglycidyl esters, (methyl) acrylic acid -3- methyl -
3,4- epoxy butyl ester, (methyl) acrylic acid -4- methyl -4,5- epoxy pentyl ester, (methyl) acrylic acid -5- methyl -5,6- epoxy oneself
Ester etc..
In (methyl) acrylic monomers with functional group, using with epoxy group as (methyl) acrylic acid list of functional group
Body (preferably glycidyl methacrylate) is polymerize and the acrylic resin that obtains is since air-tightness is excellent, from
From the viewpoint of the soil resistance of raising mold release film preferably.
(other monomers)
Cross-linking type acrylic acid resin also may include the monomer (other monomers) in addition to above-mentioned (methyl) acrylic monomers
As polymeric composition.As other monomers, (methyl) acrylic monomers, aromatic ethenyl comprising phenyl ring or heterocycle can be enumerated
Compound, vinyl cyanide based compound, unsaturated dicarboxylic acid anhydride, N- substituted maleimide amine etc..
As (methyl) acrylic monomers comprising phenyl ring or heterocycle, (methyl) phenyl acrylate, (methyl) third can be enumerated
Olefin(e) acid benzyl ester, (methyl) phenoxyethyl acrylate, (methyl) acrylic acid naphthalene ester, (methyl) tetrahydrofurfuryl acrylate etc..
As aromatic ethenyl compound, can enumerate 4-vinylpridine, 2- vinylpyridine, α-methylstyrene,
α-ethyl styrene, α-fluorobenzene ethene, α-chlorostyrene, bromstyrol, fluorobenzene ethene, chlorostyrene, bromstyrol, methyl
Styrene, methoxy styrene, (o-, m-, p-) hydroxy styrenes, styrene etc..
As vinyl cyanide based compound, acrylonitrile, methacrylonitrile etc. can be enumerated.
As unsaturated dicarboxylic anhydride, maleic anhydride etc. can be enumerated.
As N- substituted maleimide, N- methylmaleimido, n-ethylmaleimide, N- propyl can be enumerated
Maleimide, N- isopropylmaleimide, N- butyl maleimide, N- isobutyl group maleimide, N- tert-butyl horse
Come acid imide, N- lauryl maleimide, N- N-cyclohexylmaleimide, N- benzyl maleimide, N- phenyl Malaysia acyl
Imines etc..
(crosslinking agent)
The type of the crosslinking agent used to make cross-linking type acrylic acid resin crosslink reaction is not particularly limited.Example
As crosslinking agent well known to isocyanate compound, melamine compound, epoxide etc. can be enumerated.In order in cross-linking type third
Slow widened areolation is formed in olefin(e) acid resin, it is preferable to use polyfunctional crosslinking agent.In this specification, " multifunctional "
Refer to 3 functions or more.
[substrate]
The type of substrate is not particularly limited.The tolerable pre- timing of the heating of mold when substrate preferably has both for molding
Between degree heat resistance and can fully follow mold structure flexibility.It, can as the substrate with such characteristic
Enumerate the substrate comprising the resin with heat resistance.In the case that substrate includes resin, resin, which can be only a kind of, may be
It is two or more.
If it is considered that being sealed the molding of material in high temperature (usually 100 DEG C~200 DEG C degree), then it is expected that substrate has
There is the heat resistance for the degree that can tolerate the predetermined time for the temperature.In addition, in order to inhibit when mold release film is installed on mold
And the generation of rupture of the fold of sealing resin, mold release film flowed in molding etc., it is important to consider that the elasticity under high temperature
Modulus, elongation etc. are selected.
From the viewpoint of elasticity modulus when from heat resistance and high temperature, substrate preferably comprises polyester as resin.As
Polyester can enumerate polyethylene terephthalate, polybutylene terephthalate (PBT), polyethylene naphthalate, include
Two or more resins as polymeric composition in the polymeric composition of these polyester, by resin made of these polyester modifications etc..
Wherein, it preferably comprises selected from by polyethylene terephthalate, polybutylene terephthalate (PBT) and poly- naphthalenedicarboxylic acid second
At least one of the group of diol ester composition.
Substrate is preferably sheet.Specifically, can enumerate will be resin-molded into substrate obtained by sheet.It is chased after to mold
Resin sheet (film) from the viewpoint of casual, preferably through twin shaft extension.
The thickness of substrate is not particularly limited.For example, it is preferable to be 1 μm~100 μm, more preferably 3 μm~20 μm.If base
The thickness of material is greater than or equal to 1 μm, then the treatability with mold release film is excellent, is not likely to produce the tendency of fold.If thickness is small
In or be equal to 100 μm, then have when molding it is excellent to the tracing ability of mold, can inhibit the molding semiconductor packages of institute and generate a fold
Deng tendency.
The number average value with a thickness of the value obtained in 5 points of arbitrary Site Determination of substrate in present embodiment.Substrate
Thickness general micrometer can be used for example be measured.
Substrate is since the surface with mold contacts, according to its material, sometimes for removing mold release film from mold
Need bigger peeling force.Substrate is difficult in the case where removing from mold, preferably adjusts base in a manner of being easy from mold removing
Material.
It the method for substrate is adjusted as in a manner of being easy from mold removing, can enumerate: to substrate and release layer side
The face (face with mold contact side) of face opposite side implement pear skin processing etc. surface is assigned concave-convex processing method,
The method etc. of another release layer (the 2nd release layer) is further set on substrate.
In the case where 2 release layer is arranged on substrate, the material of the 2nd release layer is not particularly limited.Such as it can make
It is formed with material identical with material used in above-mentioned release layer.The thickness of 2nd release layer is not particularly limited, preferably
0.1 μm~100 μm.The thickness of 2nd release layer defines in the same manner as the thickness of above-mentioned release layer.
[other components]
As needed, mold release film also can have the component in addition to release layer and substrate.For example, can release layer with
The anchoring that release layer or the 2nd release layer are arranged between substrate, between substrate and the 2nd release layer etc. improves layer, antistatic layer, coloring
The components such as layer.In addition, the surface in order to protect mold release film, also can be set protective layer.
The production method > of < mold release film
The production method of mold release film is not particularly limited.For example, the composition for being used to form release layer can be modulated and incited somebody to action
It is assigned to the single side of substrate, and removes the volatile ingredient in composition as desired by dry, is formed on substrate de-
Mold layer, to make mold release film.In such a case it is possible to by adjusting the amount assigned to the composition on substrate and being used
Filler amount, thus by every 1m of the volume average particle size A (μm) and release layer that are formed by filler contained in release layer2
Quality B (g/m2) the ratio between (A/B) be set as be less than or equal to 1.
The modulator approach for being used to form the composition of release layer is not particularly limited.Such as it can be by resin component, filler
It mixes and modulates with solvent.From the viewpoint of the release layer for inhibiting uneven thickness is formed on substrate, preferably will
The organic solvent of dissolving resin ingredient is used as solvent.As organic solvent, toluene, methyl ethyl ketone, ethyl acetate etc. can be enumerated.
The method that composition is assigned to substrate is not particularly limited.Such as rolling method, stick coating method, kiss coating etc. can be passed through
Well known coating method is assigned.It is preferably de- to be formed by when the composition for being used to form release layer is assigned to substrate
The thickness of mold layer is assigned as 0.1 μm~100 μm of mode.
As needed, it is dry and remove the solvent in composition etc. and be volatilized into that the composition to substrate will can also be assigned
Point.Dry method is not particularly limited, and can be carried out by well known method.It is dry for example to be carried out at 50 DEG C~150 DEG C
0.1 minute~60 minutes.
[application method of mold release film]
Hereinafter, being illustrated referring to an example of attached drawing to the application method of the mold release film of present embodiment.In addition, in each figure
The size of component be notional size, it's not limited to that for the relativeness of the size between component.
Fig. 1 schematically shows the section for maintaining the mold release film of state of functional piece.In Fig. 1, mold release film 10 has
Substrate 1 and release layer 2, configured with functional piece 3 on release layer 2.
Fig. 2 schematically shows the mold release film 10 that supply is rolled out from the state of volume, and uses the molding of transfer modling mode
The section of equipment when equipment is formed.Symbol 4 indicates that mold, symbol 5 are indicated for sealing resin to be injected into mould in Fig. 2
The plunger in the gap in tool.Symbol 6 is the supporting member of semiconductor-sealing-purpose, in encapsulation form of BGA mode etc., Duo Shuo
Supporting member is internally provided with circuit.Symbol 7 is semiconductor chip, and the circuit of semiconductor core on piece generally passes through gold, copper etc.
Metal line (not shown) and with the circuit connection in supporting member.
As shown in Fig. 2, mold release film 10 is rolled out and is configured at the recess portion of mold 4 from volume 8A.At this point, mold release film will be equipped on
Functional piece 3 on 10 is also configured at the recess portion of mold 4.In addition, by mold 4 heat (for example, 170 DEG C or so), and according to
The mode for the sealing resin melting injected in subsequent handling is set.
Fig. 3, which is schematically shown, contacts upper and lower mold 4, and sealing resin 9 is injected into mold 4 using plunger 5
Gap state.
After Fig. 4 is shown schematically in molding, by the separated state of upper and lower mold 4.As shown in figure 4, being equipped on
Functional piece 3 in mold release film 10 is detached from from mold release film 10 and is configured at semiconductor package and loads onto.Mold release film 10 after use is wound
Coiled 8B and recycled.
The mold release film of present embodiment since the retentivity of piece functional during until molding procedure is excellent, because
This, functional piece does not fall off from mold release film and is configured in mold.In addition, due to making functional piece demoulding in molding procedure
It has excellent performance, therefore, functionality piece can be detached from from release sheet and be configured at half when separating upper/lower die after molding
In conductor encapsulation.
Embodiment
Hereinafter, the present invention is specifically described referring to embodiment.But the present invention is not by the limit of these embodiments
System.
< Examples 1 to 10,1~7 > of comparative example
(release layer forms the modulation for using composition)
Table 1 will be become according to the nonvolatile component of each material as the acrylic resin, crosslinking agent and filler of resin component
Or the mode for the amount (mass parts) recorded in table 2 is mixed with toluene, and the toluene solution of 15 mass % of solid component is made, from
And modulate release layer formation composition.
As acrylic resin, 24 mass % of the copolymer of acrylate, ethyl acetate and n-butyl acrylate are used
Toluene solution (Soken Chemical & Engineering Co., Ltd., trade name " S-43 ").
As crosslinking agent, 75 mass % toluene solution (TOSOH Co., Ltd, trade names of isocyanate compound are used
" Coronate L ") and hexamethylene diisocyanate (the Asahi Chemical Industry's chemistry strain formula meeting of addition product modified polyisocyanate
Society, trade name " Duranate AE710-100 ").
As filler, particle (comprehensive the grinding of the cross-linking type acrylic acid resin of the copolymer used as methacrylate
Learn Co., Ltd., trade name " MX-150 (volume average particle size: 1.5 μm) ", " MX-300 (volume average particle size: 3.0 μm) ", with
And " MX-1000 (volume average particle size: 10.0 μm) ") or silicon dioxide granule (volume average particle size: 5.0 μm, Fuji's silicon
(FUJI Silysia) Chemical Co., Ltd., trade name " Sylosphere C-0809 ").
(production of mold release film)
The release layer formation modulated is coated on composition with the speed of 0.5m/min~3m/min using roll coater
The single side of substrate, in this state with 100 DEG C in length to be dried in the drying oven of 3m, form release layer on substrate and
Obtain mold release film.At this point, according to every 1m of the composition after drying2Coating weight (quality of release layer) becomes shown in table 1 or table 2
Gap when adjusting coating of the mode of value (g).
As substrate, using will be with a thickness of 25 μm of polyethylene terephthalate (PET) film (Supreme Being extended through twin shaft
People's Du Pont membrane Co., Ltd., trade name " FT3-25 ") and through twin shaft extend polybutylene terephthalate (PBT) (PBT) film
(Okura Industrial Co., Ltd.) carries out substrate obtained by sided corona treatment respectively.
(quality determination of release layer)
Made mold release film is cut out to the size and quality measurement of 10cm × 10cm.Then, it is removed using methyl ethyl ketone
Release layer is removed, quality measurement again after air-drying, according to the quality of the calculating release layer of poor quality of front and back.By it is obtained value multiplied by
100, calculate every 1m2Release layer quality (g/m2).Show the result in table 1 or table 2.
(measurement of viscous force)
Made mold release film is set to adhesiveness tester in the way of measurement probe is contacted with release layer when measurement
(Rhesca corporation, trade name " TAC-II ").Then, using the probe of diameter 5mm, in probe decrease speed: 120mm/
Load before min, measurement: viscous force (gf) rate of climb when 10gf, measurement: is measured under conditions of 600mm/min.The measurement of viscous force
Implemented respectively in the temperature (25 DEG C) for being envisioned for room temperature and the temperature (170 DEG C) for being envisioned for molding procedure.Result is shown
In table 1 or table 2.
(evaluation of retentivity)
In order to evaluate the ability that mold release film keeps functional piece, test below is carried out
The size that made mold release film is cut out to 15cm × 30cm, using silica gel roller by the dustless of 50cm × 100cm
Paper fits on the release layer of cut out mold release film.Then, it is placed in such a way that dust-free paper is in lower section in the environment of 25 DEG C
50cm~100cm is promoted in the end on platform, catching mold release film and along 90 ° of direction, observes whether be bonded dust-free paper is shelled
From.The unstripped situation of dust-free paper is set as " OK ", the case where removing is set as " NG ", shows the result in table 1 or table 2.
(evaluation of surface roughness)
It is straight in contact pilotage front end using surface roughness measurement device (Kosaka Laboratory Ltd., model SE-3500)
Diameter: 2 μm, transmission speed: 0.5mm/s and scanning distance: being measured under conditions of 8mm, by JIS B0601 (2013) or
ISO 4287 (1997) parses the result measured, to obtain the arithmetic average roughness of the outer surface of release layer
(Ra) and 10 mean roughness (Rz).Show the result in table 1 or table 2.
8 > of < comparative example
Widely used ETFT (the Ethylene Tetra for the mold release film mainly as compression molding mode
Fluoro Ethylene, ethylene-tetrafluoroethylene) film (Asahi Glass Co., Ltd, trade name: " Aflex 50HK "), it carries out and real
Example is applied similarly to evaluate.Show the result in table 2.It should be noted that Aflex 50HK due to do not have resin layer (release layer),
Therefore the quality determination of release layer is not carried out.
[table 1]
[table 2]
As shown in Table 1, every 1m about the volume average particle size A (μm) of filler and release layer2Quality B (g/m2)
The ratio between the Examples 1 to 10 of (A/B) less than or equal to 1 mold release film, viscous force at 25 DEG C is high, in the evaluation test of retentivity
The removing of dust-free paper is not seen, and retentivity is excellent yet.On the other hand it is found that viscous force at 170 DEG C is low, have in molding procedure
Good demolding performace.It is further known that it is thick to change surface even if adjusting the type and content of filler contained in release layer
Rugosity also obtains good as a result, the material and envelope of mold release film therefore can be coped with while maintaining desired characteristic
The combined diversification of dress.
About the volume average particle size A (μm) of filler and every 1m of release layer2Quality B (g/m2) the ratio between (A/B) be more than
The mold release film of 1 comparative example 1~7, viscous force at 25 DEG C is significantly low, it also seen that dust-free paper in the evaluation test of retentivity
Removing, retentivity are poorer than embodiment.
Viscous force at 25 DEG C of the Aflex 50HK of the mold release film as comparative example 8 and viscous force at 170 DEG C are low, demoulding
Property is excellent.However, seeing the removing of dust-free paper in the evaluation test of retentivity, retentivity is poorer than embodiment.
It can be seen from the above result that the mold release film of present embodiment keeps functional piece during until molding procedure
Performance and make haveing excellent performance for functional piece demoulding in molding procedure.
The disclosure that Japanese patent application the 2016-101820th is introduced into this specification entirely through reference
In.Documented whole documents, patent application and technical standard in this specification, with it is specific and respectively describe by referring to and
The case where introducing each document, patent application and technical standard to same extent, by referring to and be introduced into this specification.
Claims (6)
1. a kind of mold release film, with substrate and it is set on the substrate and the release layer comprising resin component and filler,
The volume average particle size A of the filler and every 1m of the release layer2The ratio between quality B i.e. A/B be less than or equal to 1, the A's
Unit is μm that the unit of the B is g/m2。
2. mold release film according to claim 1, the volume average particle size A of the filler is 1 μm~50 μm.
3. mold release film according to claim 1 or 2, every 1m of the release layer2Quality B be 0.1g/m2~100g/m2。
4. mold release film described in any one of claim 1 to 3, the resin component includes thermosetting resin.
5. mold release film according to any one of claims 1 to 4, further contains crosslinking agent, relative to the resin
100 mass parts of ingredient, the content of the crosslinking agent are 1 mass parts~10 mass parts.
6. mold release film according to any one of claims 1 to 5, the substrate contains selected from by poly terephthalic acid second two
At least one of alcohol ester, polybutylene terephthalate (PBT) and group of polyethylene naphthalate composition.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-101820 | 2016-05-20 | ||
| JP2016101820 | 2016-05-20 | ||
| PCT/JP2017/018930 WO2017200102A1 (en) | 2016-05-20 | 2017-05-19 | Mold release film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109153155A true CN109153155A (en) | 2019-01-04 |
| CN109153155B CN109153155B (en) | 2020-11-10 |
Family
ID=60326238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780031301.2A Active CN109153155B (en) | 2016-05-20 | 2017-05-19 | Mold release film |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP6414345B2 (en) |
| KR (1) | KR102340703B1 (en) |
| CN (1) | CN109153155B (en) |
| MY (1) | MY188629A (en) |
| SG (1) | SG11201810343TA (en) |
| TW (2) | TW202237368A (en) |
| WO (1) | WO2017200102A1 (en) |
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| CN111016017A (en) * | 2019-12-31 | 2020-04-17 | 上海凯陆高分子材料有限公司 | Material for surface treatment of vulcanization mold and preparation method and application thereof |
| CN114599495A (en) * | 2019-10-24 | 2022-06-07 | 昭和电工材料株式会社 | Mold release film and method for manufacturing semiconductor package |
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|---|---|---|---|---|
| JPWO2019244448A1 (en) | 2018-06-22 | 2020-06-25 | 株式会社コバヤシ | Release film and method for producing release film |
| WO2020040240A1 (en) * | 2018-08-24 | 2020-02-27 | 住友ベークライト株式会社 | Release film and method for producing molded article |
| TWI724765B (en) * | 2020-01-21 | 2021-04-11 | 達興材料股份有限公司 | Laser-debondable composition, laminate thereof, and laser-debonding method |
| WO2022038712A1 (en) * | 2020-08-19 | 2022-02-24 | 昭和電工マテリアルズ株式会社 | Release film and electronic component device manufacturing method |
| JP6870775B1 (en) * | 2020-10-21 | 2021-05-12 | 住友ベークライト株式会社 | Manufacturing method of release film and molded product |
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- 2017-05-19 WO PCT/JP2017/018930 patent/WO2017200102A1/en active Application Filing
- 2017-05-19 CN CN201780031301.2A patent/CN109153155B/en active Active
- 2017-05-19 KR KR1020187036120A patent/KR102340703B1/en active IP Right Grant
- 2017-05-19 MY MYPI2018002035A patent/MY188629A/en unknown
- 2017-05-19 JP JP2017554553A patent/JP6414345B2/en active Active
- 2017-05-19 SG SG11201810343TA patent/SG11201810343TA/en unknown
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114599495A (en) * | 2019-10-24 | 2022-06-07 | 昭和电工材料株式会社 | Mold release film and method for manufacturing semiconductor package |
| CN114599495B (en) * | 2019-10-24 | 2024-04-02 | 株式会社力森诺科 | Mold release film and method for manufacturing semiconductor package |
| CN111016017A (en) * | 2019-12-31 | 2020-04-17 | 上海凯陆高分子材料有限公司 | Material for surface treatment of vulcanization mold and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202237368A (en) | 2022-10-01 |
| WO2017200102A1 (en) | 2017-11-23 |
| SG11201810343TA (en) | 2018-12-28 |
| TW201819141A (en) | 2018-06-01 |
| JP6414345B2 (en) | 2018-10-31 |
| MY188629A (en) | 2021-12-22 |
| CN109153155B (en) | 2020-11-10 |
| KR102340703B1 (en) | 2021-12-16 |
| KR20190008883A (en) | 2019-01-25 |
| JPWO2017200102A1 (en) | 2018-05-31 |
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