SG11201807656WA - Adhesive sheet for semiconductor processing - Google Patents

Adhesive sheet for semiconductor processing

Info

Publication number
SG11201807656WA
SG11201807656WA SG11201807656WA SG11201807656WA SG11201807656WA SG 11201807656W A SG11201807656W A SG 11201807656WA SG 11201807656W A SG11201807656W A SG 11201807656WA SG 11201807656W A SG11201807656W A SG 11201807656WA SG 11201807656W A SG11201807656W A SG 11201807656WA
Authority
SG
Singapore
Prior art keywords
sensitive adhesive
pressure sensitive
functional group
reactive functional
semiconductor processing
Prior art date
Application number
SG11201807656WA
Inventor
Tomotaka Morishita
Yuichiro Komasu
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG11201807656WA publication Critical patent/SG11201807656WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The present invention is concerned with a semiconductor processing pressure sensitive adhesive sheet including a substrate and a pressure sensitive adhesive layer provided on the substrate, the pressure sensitive adhesive layer being formed of a pressure sensitive adhesive composition, wherein the pressure sensitive adhesive composition contains a polymer (A) having a reactive functional group (A1); a polymer (B) having a reactive functional group (B1) different from the reactive functional group (A1) and an energy ray-polymerizable group (B2); a crosslinking agent (C) that reacts with the reactive functional group (A1); and a crosslinking agent (D) that reacts with the reactive functional group (B1).
SG11201807656WA 2016-09-20 2017-06-22 Adhesive sheet for semiconductor processing SG11201807656WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016182892 2016-09-20
PCT/JP2017/022969 WO2018055859A1 (en) 2016-09-20 2017-06-22 Adhesive sheet for semiconductor processing

Publications (1)

Publication Number Publication Date
SG11201807656WA true SG11201807656WA (en) 2019-04-29

Family

ID=61690229

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201807656WA SG11201807656WA (en) 2016-09-20 2017-06-22 Adhesive sheet for semiconductor processing

Country Status (7)

Country Link
JP (1) JP6875011B2 (en)
KR (1) KR102326621B1 (en)
CN (1) CN109312199B (en)
PH (1) PH12019500576A1 (en)
SG (1) SG11201807656WA (en)
TW (1) TWI732895B (en)
WO (1) WO2018055859A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7463968B2 (en) 2018-12-28 2024-04-09 株式会社レゾナック Method for evaluating photocurable adhesive, integrated dicing/die bonding film and method for manufacturing same, and method for manufacturing semiconductor device
DE112021006833T5 (en) * 2021-01-18 2023-11-16 AGC Inc. Film and method for producing a semiconductor housing
WO2022186120A1 (en) * 2021-03-03 2022-09-09 日東電工株式会社 Resin sheet and use thereof
CN115975553A (en) * 2022-12-28 2023-04-18 佛山市顺德区凌晖实业有限公司 Acrylic ester ionic pressure-sensitive adhesive and preparation method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04367769A (en) 1991-06-12 1992-12-21 Shikoku Seisakusho:Kk Control of sorting rate of grain sorter
JP4947564B2 (en) * 2000-01-21 2012-06-06 日東電工株式会社 Adhesive sheet for semiconductor wafer processing
SG174366A1 (en) * 2009-03-16 2011-11-28 Denki Kagaku Kogyo Kk Adhesive and adhesive sheet
JP5144634B2 (en) * 2009-12-22 2013-02-13 日東電工株式会社 Heat-resistant adhesive sheet for substrate-less semiconductor package manufacturing, and substrate-less semiconductor package manufacturing method using the adhesive sheet
JP4851613B2 (en) * 2009-12-22 2012-01-11 古河電気工業株式会社 Adhesive tape for semiconductor wafer surface protection
JP5583098B2 (en) * 2011-09-28 2014-09-03 古河電気工業株式会社 Adhesive tape for brittle wafer processing and brittle wafer processing method using the same
MY186486A (en) * 2012-05-25 2021-07-22 Lintec Corp Dicing sheet
JP6116368B2 (en) * 2013-05-24 2017-04-19 ニッタ株式会社 Temperature sensitive adhesive
WO2015030186A1 (en) * 2013-08-30 2015-03-05 リンテック株式会社 Sheet for processing semiconductor
KR102301157B1 (en) * 2014-07-18 2021-09-10 미쯔비시 케미컬 주식회사 Adhesive composition and adhesive using same, and adhesive for polarizing plate
JP6103140B2 (en) * 2014-11-19 2017-03-29 住友ベークライト株式会社 Dicing film

Also Published As

Publication number Publication date
CN109312199A (en) 2019-02-05
PH12019500576A1 (en) 2019-12-11
KR20190053135A (en) 2019-05-17
JP6875011B2 (en) 2021-05-19
JPWO2018055859A1 (en) 2019-07-04
TWI732895B (en) 2021-07-11
KR102326621B1 (en) 2021-11-15
WO2018055859A1 (en) 2018-03-29
CN109312199B (en) 2021-11-02
TW201829698A (en) 2018-08-16

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