SG11201908493VA - Pressure-sensitive adhesive tape set and pressure-sensitive adhesive tape for semiconductor element transport - Google Patents

Pressure-sensitive adhesive tape set and pressure-sensitive adhesive tape for semiconductor element transport

Info

Publication number
SG11201908493VA
SG11201908493VA SG11201908493VA SG11201908493VA SG 11201908493V A SG11201908493V A SG 11201908493VA SG 11201908493V A SG11201908493V A SG 11201908493VA SG 11201908493V A SG11201908493V A SG 11201908493VA
Authority
SG
Singapore
Prior art keywords
pressure
sensitive adhesive
adhesive tape
semiconductor element
base material
Prior art date
Application number
Inventor
Masanori Ikenaga
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of SG11201908493VA publication Critical patent/SG11201908493VA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Abstract

The present invention (first invention) is a pressure-sensitive adhesive tape set including at least one pressure-sensitive adhesive tape for semiconductor wafer 5 fabrication constituted with a first laminate including a sheet-shaped first base material containing a resin material and a first pressure-sensitive adhesive layer laminated on the first base material and at least one pressure-sensitive adhesive tape for semiconductor element transport constituted with a 10 second laminate including a sheet-shaped second base material containing a resin material and a second pressure-sensitive adhesive layer laminated on the second base material, in which a contact angle of hexadecane with respect to the first pressure-sensitive adhesive layer is equal to or greater than 15 10 ° , and a contact angle of hexadecane with respect to the second pressure-sensitive adhesive layer is less than 10 ° .
SG11201908493V 2017-03-17 2018-02-28 Pressure-sensitive adhesive tape set and pressure-sensitive adhesive tape for semiconductor element transport SG11201908493VA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017053667 2017-03-17
JP2017131548 2017-07-04
PCT/JP2018/007586 WO2018168475A1 (en) 2017-03-17 2018-02-28 Adhesive tape set and adhesive tape for transferring semiconductor element

Publications (1)

Publication Number Publication Date
SG11201908493VA true SG11201908493VA (en) 2019-10-30

Family

ID=63522204

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201908493V SG11201908493VA (en) 2017-03-17 2018-02-28 Pressure-sensitive adhesive tape set and pressure-sensitive adhesive tape for semiconductor element transport

Country Status (5)

Country Link
JP (1) JP6418360B1 (en)
KR (1) KR102107347B1 (en)
SG (1) SG11201908493VA (en)
TW (1) TWI726199B (en)
WO (1) WO2018168475A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7003099B2 (en) * 2019-12-10 2022-01-20 住友ベークライト株式会社 Cover tape and electronic component packaging
WO2022157830A1 (en) * 2021-01-19 2022-07-28 株式会社新川 Method for manufacturing semiconductor device
JP7088388B1 (en) 2021-03-19 2022-06-21 住友ベークライト株式会社 Adhesive tape

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4800778B2 (en) * 2005-05-16 2011-10-26 日東電工株式会社 Dicing pressure-sensitive adhesive sheet and processing method of workpiece using the same
JP2007314636A (en) * 2006-05-24 2007-12-06 Nitto Denko Corp Pressure-sensitive adhesive sheet
JP4879702B2 (en) * 2006-10-20 2012-02-22 リンテック株式会社 Die sort sheet and chip transfer method having adhesive layer
WO2009117345A2 (en) * 2008-03-17 2009-09-24 Henkel Corporation Adhesive compositions for use in die attach applications
JP5464635B2 (en) 2008-03-28 2014-04-09 リンテック株式会社 Adhesive sheet for semiconductor wafer processing and method of using the same
JP5437681B2 (en) * 2009-03-30 2014-03-12 リンテック株式会社 Adhesive sheet and method for manufacturing semiconductor device
JP2012193317A (en) * 2011-03-17 2012-10-11 Nitto Denko Corp Pressure-sensitive adhesive tape for temporary fixing of electronic part
JP5908337B2 (en) * 2011-06-13 2016-04-26 日東電工株式会社 Cooling release adhesive sheet
JP6424205B2 (en) * 2014-03-03 2018-11-14 リンテック株式会社 Semiconductor-related member processing sheet and chip manufacturing method using the sheet
JP2015214681A (en) * 2014-04-24 2015-12-03 セントラル硝子株式会社 Curable composition, temporary adhesive material, and method for temporarily adhering member to substrate using the temporary adhesive material

Also Published As

Publication number Publication date
TW201839835A (en) 2018-11-01
TWI726199B (en) 2021-05-01
KR102107347B1 (en) 2020-05-06
JP6418360B1 (en) 2018-11-07
JPWO2018168475A1 (en) 2019-03-22
WO2018168475A1 (en) 2018-09-20
KR20190090876A (en) 2019-08-02

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