PH12019501058A1 - Adhesive sheet for semiconductor processing - Google Patents

Adhesive sheet for semiconductor processing

Info

Publication number
PH12019501058A1
PH12019501058A1 PH12019501058A PH12019501058A PH12019501058A1 PH 12019501058 A1 PH12019501058 A1 PH 12019501058A1 PH 12019501058 A PH12019501058 A PH 12019501058A PH 12019501058 A PH12019501058 A PH 12019501058A PH 12019501058 A1 PH12019501058 A1 PH 12019501058A1
Authority
PH
Philippines
Prior art keywords
energy ray
intermediate layer
semiconductor processing
adhesive sheet
layer
Prior art date
Application number
PH12019501058A
Inventor
Yasuhiko Kakiuchi
Yuichiro Komasu
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12019501058A1 publication Critical patent/PH12019501058A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09D133/10—Homopolymers or copolymers of methacrylic acid esters
    • C09D133/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C09J133/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Abstract

The invention provides an adhesive sheet for semiconductor processing including a substrate, an intermediate layer, and an adhesive layer, in this order, wherein the intermediate layer is a layer formed from an intermediate layer forming composition comprising a non-energy ray curable acrylic polymer (A) and an energy ray curable acrylic polymer (B) having a weight average molecular weight of 50000 to 250000, the adhesive layer is energy ray curable, and the elastic modulus difference at 23øC between the intermediate layer and the adhesive layer after energy ray cure is 20 MPa or less.
PH12019501058A 2016-11-17 2019-05-14 Adhesive sheet for semiconductor processing PH12019501058A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016224232 2016-11-17
PCT/JP2017/035971 WO2018092446A1 (en) 2016-11-17 2017-10-03 Adhesive sheet for semiconductor processing

Publications (1)

Publication Number Publication Date
PH12019501058A1 true PH12019501058A1 (en) 2019-12-11

Family

ID=62146577

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12019501058A PH12019501058A1 (en) 2016-11-17 2019-05-14 Adhesive sheet for semiconductor processing

Country Status (6)

Country Link
JP (1) JP6935872B2 (en)
KR (1) KR102368740B1 (en)
CN (1) CN109937245B (en)
PH (1) PH12019501058A1 (en)
TW (1) TWI754679B (en)
WO (1) WO2018092446A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6906402B2 (en) * 2017-09-07 2021-07-21 日東電工株式会社 Adhesive tape for semiconductor wafer protection
JP7146931B2 (en) * 2018-09-20 2022-10-04 三井化学東セロ株式会社 Electronic device manufacturing method
CN110511693A (en) * 2019-08-28 2019-11-29 张家港康得新光电材料有限公司 A kind of foam tape and preparation method thereof
KR20230154787A (en) * 2021-03-11 2023-11-09 린텍 가부시키가이샤 Manufacturing method of adhesive sheet for semiconductor processing and semiconductor device

Family Cites Families (18)

* Cited by examiner, † Cited by third party
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JPH04367769A (en) 1991-06-12 1992-12-21 Shikoku Seisakusho:Kk Control of sorting rate of grain sorter
JP3062302B2 (en) 1991-06-19 2000-07-10 藤倉ゴム工業株式会社 Blanket for offset printing and method of manufacturing the same
CN1137028C (en) * 1998-11-20 2004-02-04 琳得科株式会社 Pressure-sensitive adhesive piece and its application method
US20030064579A1 (en) * 2001-09-27 2003-04-03 Masafumi Miyakawa Surface protecting adhesive film for semiconductor wafer and protecting method for semiconductor wafer using said adhesive film
JP4841802B2 (en) * 2003-05-02 2011-12-21 リンテック株式会社 Adhesive sheet and method of using the same
JP4776189B2 (en) * 2004-08-03 2011-09-21 古河電気工業株式会社 Wafer processing tape
JP4507826B2 (en) * 2004-10-27 2010-07-21 日東電工株式会社 Protective sheet for processing semiconductor wafer and method for grinding back surface of semiconductor wafer
JP2007073930A (en) * 2005-08-11 2007-03-22 Furukawa Electric Co Ltd:The Tape for wafer processing
JP6085076B2 (en) * 2009-03-16 2017-02-22 リンテック株式会社 Adhesive sheet, semiconductor wafer processing method, and semiconductor chip manufacturing method
JP5679696B2 (en) * 2009-05-22 2015-03-04 日東電工株式会社 UV-curable adhesive composition, adhesive layer, adhesive sheet and method for producing the same
JP2011174042A (en) * 2010-02-01 2011-09-08 Nitto Denko Corp Film for producing semiconductor device and method for producing semiconductor device
JP6159163B2 (en) * 2013-06-21 2017-07-05 日東電工株式会社 Adhesive sheet
US10253222B2 (en) * 2014-01-21 2019-04-09 Lintec Corporation Adhesive sheet for wafer protection
WO2015133420A1 (en) * 2014-03-03 2015-09-11 リンテック株式会社 Sheet for semiconductor-related-member processing and process for producing chip using said sheet
CN106032650A (en) * 2014-09-18 2016-10-19 株式会社Sofos Thin film color coating method for hard-to-dye yarn
KR102510144B1 (en) * 2015-01-30 2023-03-14 린텍 가부시키가이샤 Adhesive sheet for semiconductor processing
JP2016192488A (en) * 2015-03-31 2016-11-10 リンテック株式会社 Pressure-sensitive adhesive sheet for semiconductor processing
JP6839925B2 (en) * 2016-03-16 2021-03-10 リンテック株式会社 Semiconductor processing sheet

Also Published As

Publication number Publication date
TWI754679B (en) 2022-02-11
JPWO2018092446A1 (en) 2019-10-17
KR20190084972A (en) 2019-07-17
TW201819569A (en) 2018-06-01
KR102368740B1 (en) 2022-02-28
CN109937245A (en) 2019-06-25
WO2018092446A1 (en) 2018-05-24
JP6935872B2 (en) 2021-09-15
CN109937245B (en) 2022-01-18

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