PH12016500005A1 - Dicing sheet - Google Patents
Dicing sheetInfo
- Publication number
- PH12016500005A1 PH12016500005A1 PH12016500005A PH12016500005A PH12016500005A1 PH 12016500005 A1 PH12016500005 A1 PH 12016500005A1 PH 12016500005 A PH12016500005 A PH 12016500005A PH 12016500005 A PH12016500005 A PH 12016500005A PH 12016500005 A1 PH12016500005 A1 PH 12016500005A1
- Authority
- PH
- Philippines
- Prior art keywords
- ray
- sensitive
- energy
- pressure
- polymerizable compound
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
This dicing sheet (1) comprises a substrate (2) and a pressure-sensitive-adhesive layer (3) laminated to at least one surface of said substrate (2). Said pressure-sensitive-adhesive layer (3) is 2 to 20 mm thick and is made from a pressure-sensitive-adhesive composition that contains both an acrylic polymer (A) and a polyfunctional acrylate energy-ray-polymerizable compound (B). Said polyfunctional acrylate energy-ray-polymerizable compound (B) contains 0.004 to 0.009 moles of polymerizable functional groups per gram and constitutes 20 pcnt to 65 pcnt of the combined mass of the acrylic polymer (A) and the polyfunctional acrylate energy-ray-polymerizable compound (B). When adhered to a high-surface-roughness workpiece such as a semiconductor package, this dicing sheet (1) exhibits sufficient adhesive strength before energy-ray exposure, also exhibits appropriate adhesive strength after energy-ray exposure, and is resistant to the formation of pressure-sensitive-adhesive aggregates.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013141816 | 2013-07-05 | ||
PCT/JP2014/067798 WO2015002270A1 (en) | 2013-07-05 | 2014-07-03 | Dicing sheet |
Publications (2)
Publication Number | Publication Date |
---|---|
PH12016500005B1 PH12016500005B1 (en) | 2016-03-28 |
PH12016500005A1 true PH12016500005A1 (en) | 2016-03-28 |
Family
ID=52143839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12016500005A PH12016500005A1 (en) | 2013-07-05 | 2016-01-04 | Dicing sheet |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6317744B2 (en) |
CN (1) | CN105378899B (en) |
MY (1) | MY176995A (en) |
PH (1) | PH12016500005A1 (en) |
SG (1) | SG11201600047XA (en) |
WO (1) | WO2015002270A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6547632B2 (en) | 2014-01-29 | 2019-07-24 | 日立化成株式会社 | Adhesive composition, resin cured product obtained from adhesive composition, method of manufacturing semiconductor device using adhesive composition, and solid-state imaging device |
JP6610263B2 (en) | 2014-01-29 | 2019-11-27 | 日立化成株式会社 | Semiconductor device manufacturing method and solid-state imaging device |
CN108359390A (en) | 2014-01-29 | 2018-08-03 | 日立化成株式会社 | Adhesive composite, used adhesive composite semiconductor device manufacturing method and solid-state imager |
JP6209097B2 (en) * | 2014-02-07 | 2017-10-04 | 株式会社ディスコ | Wafer processing method |
CN108028292B (en) * | 2015-03-06 | 2020-11-17 | 亮锐控股有限公司 | Method of attaching a ceramic phosphor plate to a Light Emitting Device (LED) die using a dicing tape, method of forming a dicing tape, and dicing tape |
KR102595289B1 (en) * | 2017-08-29 | 2023-10-27 | 도아고세이가부시키가이샤 | Resin sheet and curable composition for producing the same |
WO2021065070A1 (en) * | 2019-10-04 | 2021-04-08 | リンテック株式会社 | Adhesive sheet and method for producing adhesive sheet |
WO2024185314A1 (en) * | 2023-03-06 | 2024-09-12 | 三菱ケミカル株式会社 | Pressure-sensitive adhesive sheet, pressure-sensitive adhesive sheet with release film, laminate for image display device, flexible image display device, and pressure-sensitive adhesive sheet for constituent member of flexible image display device |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4063614B2 (en) * | 2002-08-30 | 2008-03-19 | 日東電工株式会社 | Water-dispersed acrylic pressure-sensitive adhesive composition for re-peeling and pressure-sensitive adhesive sheet |
JP2004186263A (en) * | 2002-11-29 | 2004-07-02 | Sekisui Chem Co Ltd | Reinforced semiconductor wafer and method for manufacturing ic chip |
JP2007238802A (en) * | 2006-03-09 | 2007-09-20 | Sekisui Chem Co Ltd | Method for processing electronic part |
JP5049620B2 (en) * | 2007-03-20 | 2012-10-17 | リンテック株式会社 | Adhesive sheet |
JP5513866B2 (en) * | 2009-12-11 | 2014-06-04 | リンテック株式会社 | Adhesive sheet for processing electronic parts |
JP5743555B2 (en) * | 2010-02-02 | 2015-07-01 | リンテック株式会社 | Dicing sheet |
JP2012180494A (en) * | 2011-02-10 | 2012-09-20 | Nitto Denko Corp | Spontaneously rolling adhesive sheet, and method of manufacturing cut piece |
EP2676991B1 (en) * | 2011-02-14 | 2020-07-15 | LG Chem, Ltd. | Substrate film and method for manufacturing same |
JP5975621B2 (en) * | 2011-11-02 | 2016-08-23 | リンテック株式会社 | Dicing sheet and semiconductor chip manufacturing method |
JP6087122B2 (en) * | 2012-12-04 | 2017-03-01 | リンテック株式会社 | Dicing sheet |
-
2014
- 2014-07-03 JP JP2015525273A patent/JP6317744B2/en active Active
- 2014-07-03 SG SG11201600047XA patent/SG11201600047XA/en unknown
- 2014-07-03 CN CN201480038559.1A patent/CN105378899B/en active Active
- 2014-07-03 WO PCT/JP2014/067798 patent/WO2015002270A1/en active Application Filing
- 2014-07-03 MY MYPI2016700001A patent/MY176995A/en unknown
-
2016
- 2016-01-04 PH PH12016500005A patent/PH12016500005A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN105378899A (en) | 2016-03-02 |
PH12016500005B1 (en) | 2016-03-28 |
MY176995A (en) | 2020-08-31 |
JP6317744B2 (en) | 2018-04-25 |
WO2015002270A1 (en) | 2015-01-08 |
CN105378899B (en) | 2018-05-11 |
JPWO2015002270A1 (en) | 2017-02-23 |
SG11201600047XA (en) | 2016-02-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
PH12016500005A1 (en) | Dicing sheet | |
PH12018500421A1 (en) | Adhesive agent composition and adhesive sheet | |
PH12017500284B1 (en) | Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating | |
TW201613760A (en) | Composite sheet for resin film formation | |
PH12015500991A1 (en) | Adhesive sheet | |
TW201612275A (en) | Acryl foam adhesive tape | |
IN2014DN09432A (en) | ||
TW201614284A (en) | Polarizing plate with pressure-sensitive adhesive layer | |
MX2014009171A (en) | Pressure-sensitive adhesive. | |
PH12017500374B1 (en) | Adhesive film and semiconductor package using adhesive film | |
MY187016A (en) | First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip | |
MY182612A (en) | Coated compressive subpad for chemical mechanical polishing | |
EP3415582A4 (en) | Adhesive resin composition, method for bonding adherends, and adhesive resin film | |
MY188980A (en) | Method for die and clip attachment | |
WO2019059630A3 (en) | Adhesive composition and polarization plate comprising adhesive layer formed using same | |
PH12018500851A1 (en) | First protective film forming sheet | |
MX2016012548A (en) | Intermediate film for laminated glass, and laminated glass. | |
PH12019501058A1 (en) | Adhesive sheet for semiconductor processing | |
SG10201907601SA (en) | Film-like adhesive composite sheet and method for manufacturing semiconductor device | |
MY184455A (en) | Base film for dicing sheet and dicing sheet | |
PH12016501392A1 (en) | Adhesive composition and adhesive film having same, substrate provided with adhesive composition, and semiconductor device and method for manufacturing same | |
MX2017017122A (en) | Pressure-sensitive adhesive film and the use thereof for protecting surfaces. | |
MY193145A (en) | Adhesive sheet for producing semiconductor device and production method for semiconductor device using the same | |
SG11202110096QA (en) | Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer and pressure-sensitive adhesive sheet | |
MX2017009359A (en) | Release liner with different surface coating. |