PH12016500005B1 - Dicing sheet - Google Patents

Dicing sheet

Info

Publication number
PH12016500005B1
PH12016500005B1 PH12016500005A PH12016500005A PH12016500005B1 PH 12016500005 B1 PH12016500005 B1 PH 12016500005B1 PH 12016500005 A PH12016500005 A PH 12016500005A PH 12016500005 A PH12016500005 A PH 12016500005A PH 12016500005 B1 PH12016500005 B1 PH 12016500005B1
Authority
PH
Philippines
Prior art keywords
energy ray
pressure sensitive
sensitive adhesive
polymerizable compound
dicing sheet
Prior art date
Application number
PH12016500005A
Other versions
PH12016500005A1 (en
Inventor
Takuo Nishida
Yosuke Koma
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12016500005B1 publication Critical patent/PH12016500005B1/en
Publication of PH12016500005A1 publication Critical patent/PH12016500005A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Abstract

A dicing sheet (1) comprising a base film (2) and a pressure sensitive adhesive layer (3) laminated at least on one surface of the base film (2), wherein: the pressure sensitive adhesive layer (3) is formed of a pressure sensitive adhesive composition that contains an acrylic-based polymer (A) and a polyfunctional acrylate-based energy ray polymerizable compound (B); the polyfunctional acrylate-based energy ray polymerizable compound (B) has 0.004 to 0.009 moles of a polymerizable functional group in 1 g of the polyfunctional acrylate-based energy ray polymerizable compound (B); a ratio of the polyfunctional acrylate-based energy ray polymerizable compound (B) to a total amount of the acrylic-based polymer (A) and the polyfunctional acrylatebased energy ray polymerizable compound (B) is 20 to 65 mass pcnt ; and a thickness of the pressure sensitive adhesive layer (3) is 2 to 20 æm. When the adherend is a workpiece such as a semiconductor package having a large surface roughness, the dicing sheet (1) has a sufficient adhesive strength before energy ray irradiation and also has a moderate adhesive strength after energy ray irradiation, and pressure sensitive adhesive aggregates are unlikely to be generated in the dicing sheet (1).
PH12016500005A 2013-07-05 2016-01-04 Dicing sheet PH12016500005A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013141816 2013-07-05
PCT/JP2014/067798 WO2015002270A1 (en) 2013-07-05 2014-07-03 Dicing sheet

Publications (2)

Publication Number Publication Date
PH12016500005B1 true PH12016500005B1 (en) 2016-03-28
PH12016500005A1 PH12016500005A1 (en) 2016-03-28

Family

ID=52143839

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12016500005A PH12016500005A1 (en) 2013-07-05 2016-01-04 Dicing sheet

Country Status (6)

Country Link
JP (1) JP6317744B2 (en)
CN (1) CN105378899B (en)
MY (1) MY176995A (en)
PH (1) PH12016500005A1 (en)
SG (1) SG11201600047XA (en)
WO (1) WO2015002270A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015115537A1 (en) 2014-01-29 2015-08-06 日立化成株式会社 Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element
CN108359390A (en) * 2014-01-29 2018-08-03 日立化成株式会社 Adhesive composite, used adhesive composite semiconductor device manufacturing method and solid-state imager
CN105934488A (en) 2014-01-29 2016-09-07 日立化成株式会社 Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element
JP6209097B2 (en) * 2014-02-07 2017-10-04 株式会社ディスコ Wafer processing method
WO2016144732A1 (en) * 2015-03-06 2016-09-15 Koninklijke Philips N.V. Method for attaching ceramic phosphor plates on light-emitting device (led) dies using a dicing tape, method to form a dicing tape, and dicing tape
KR102595289B1 (en) * 2017-08-29 2023-10-27 도아고세이가부시키가이샤 Resin sheet and curable composition for producing the same
WO2021065071A1 (en) * 2019-10-04 2021-04-08 リンテック株式会社 Pressure-sensitive-adhesive sheet

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4063614B2 (en) * 2002-08-30 2008-03-19 日東電工株式会社 Water-dispersed acrylic pressure-sensitive adhesive composition for re-peeling and pressure-sensitive adhesive sheet
JP2004186263A (en) * 2002-11-29 2004-07-02 Sekisui Chem Co Ltd Reinforced semiconductor wafer and method for manufacturing ic chip
JP2007238802A (en) * 2006-03-09 2007-09-20 Sekisui Chem Co Ltd Method for processing electronic part
JP5049620B2 (en) * 2007-03-20 2012-10-17 リンテック株式会社 Adhesive sheet
JP5513866B2 (en) * 2009-12-11 2014-06-04 リンテック株式会社 Adhesive sheet for processing electronic parts
JP5743555B2 (en) * 2010-02-02 2015-07-01 リンテック株式会社 Dicing sheet
JP2012180494A (en) * 2011-02-10 2012-09-20 Nitto Denko Corp Spontaneously rolling adhesive sheet, and method of manufacturing cut piece
EP2676991B1 (en) * 2011-02-14 2020-07-15 LG Chem, Ltd. Substrate film and method for manufacturing same
JP5975621B2 (en) * 2011-11-02 2016-08-23 リンテック株式会社 Dicing sheet and semiconductor chip manufacturing method
JP6087122B2 (en) * 2012-12-04 2017-03-01 リンテック株式会社 Dicing sheet

Also Published As

Publication number Publication date
CN105378899A (en) 2016-03-02
JPWO2015002270A1 (en) 2017-02-23
WO2015002270A1 (en) 2015-01-08
JP6317744B2 (en) 2018-04-25
PH12016500005A1 (en) 2016-03-28
CN105378899B (en) 2018-05-11
MY176995A (en) 2020-08-31
SG11201600047XA (en) 2016-02-26

Similar Documents

Publication Publication Date Title
PH12016500005B1 (en) Dicing sheet
PH12015500991A1 (en) Adhesive sheet
MY186486A (en) Dicing sheet
PH12017500284B1 (en) Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating
JP2013226676A5 (en)
PH12016500400A1 (en) Sheet for semiconductor processing
EP2712908A3 (en) Phosphor adhesive sheet, optical semiconductor element-phosphor layer pressure-sensitive adhesive body, and optical semiconductor device
PH12018500421A1 (en) Adhesive agent composition and adhesive sheet
WO2009066435A1 (en) Resin laminate, pressure sensitive adhesive sheet, method for working adherend using the pressure sensitive adhesive sheet, and device for separating the pressure sensitive adhesive sheet
MY178423A (en) Pressure sensitive adhesive sheet and method of manufacturing processed device-related member
PH12015500230A1 (en) Dicing sheet and method for manufacturing device chips
JP2010215906A5 (en)
MY181765A (en) Heat-resistant adhesive sheet for semiconductor testing
MY182612A (en) Coated compressive subpad for chemical mechanical polishing
MX2016004011A (en) Articles and methods comprising polyacrylate primer with nitrogen-containing polymer.
MY184455A (en) Base film for dicing sheet and dicing sheet
PH12016501335A1 (en) Composite sheet for protective-film formation
PH12018500851B1 (en) First protective film forming sheet
MY189136A (en) Tape for electronic device packaging
MY187016A (en) First protective film-forming sheet, method for forming first protective film, and method for manufacturing semiconductor chip
GB2510300A (en) Heatsink attachment module
SG11201808291YA (en) Semiconductor processing sheet
PH12015502734A1 (en) Adhesive sheet and method of manufacturing electronic component using the same
TW201612010A (en) Surface-protective film and optical component attached with the same
MY171804A (en) Method for producing pressure-sensitive adhesive tape package