PH12015500230A1 - Dicing sheet and method for manufacturing device chips - Google Patents

Dicing sheet and method for manufacturing device chips

Info

Publication number
PH12015500230A1
PH12015500230A1 PH12015500230A PH12015500230A PH12015500230A1 PH 12015500230 A1 PH12015500230 A1 PH 12015500230A1 PH 12015500230 A PH12015500230 A PH 12015500230A PH 12015500230 A PH12015500230 A PH 12015500230A PH 12015500230 A1 PH12015500230 A1 PH 12015500230A1
Authority
PH
Philippines
Prior art keywords
adhesive layer
dicing sheet
energy ray
adhesive
test
Prior art date
Application number
PH12015500230A
Other versions
PH12015500230B1 (en
Inventor
Nakanishi Hayato
Nishida Takuo
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12015500230B1 publication Critical patent/PH12015500230B1/en
Publication of PH12015500230A1 publication Critical patent/PH12015500230A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

Abstract

Provided is a dicing sheet, which is provided with an adhesive layer, said adhesive layer being capable of exhibiting an excellent adhesiveness to the surface of a device-related part, in particular, even to an adherent surface that is a non-smooth surface of a device-related part having non-smooth surface, and has little trouble caused by adhesive aggregation products. The dicing sheet (1) is provided with a substrate (2) and an adhesive layer (3) that is laminated on at least one surface of the substrate (2), wherein: the adhesive layer (3) is formed of an adhesive composition containing an acrylic polymer (A) and an energy ray-polymerizable compound (B); the thickness of the adhesive layer (3) is not more than 25 mm; before energy ray irradiation, the storage elastic modulus of the adhesive layer (3) at 23oC is not more than 0.12 MPa; and, in a test for measuring the holding power of the adhesive layer (3) before energy ray irradiation, said test being conducted in accordance with JIS Z0237:2009, the holding time is 15,000 sec or longer. Also provided is a method for manufacturing a device chip using the dicing sheet (1).
PH12015500230A 2012-08-03 2015-02-02 Dicing sheet and method for manufacturing device chips PH12015500230A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012172653 2012-08-03
PCT/JP2013/062772 WO2014020962A1 (en) 2012-08-03 2013-05-02 Dicing sheet and method for manufacturing device chip

Publications (2)

Publication Number Publication Date
PH12015500230B1 PH12015500230B1 (en) 2015-04-06
PH12015500230A1 true PH12015500230A1 (en) 2015-04-06

Family

ID=50027656

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015500230A PH12015500230A1 (en) 2012-08-03 2015-02-02 Dicing sheet and method for manufacturing device chips

Country Status (6)

Country Link
JP (1) JP5414953B1 (en)
CN (1) CN104508801B (en)
MY (1) MY172228A (en)
PH (1) PH12015500230A1 (en)
TW (1) TWI564363B (en)
WO (1) WO2014020962A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6645959B2 (en) * 2014-03-17 2020-02-14 リンテック株式会社 Dicing sheet and method for manufacturing chip using the dicing sheet
JP6522617B2 (en) * 2014-07-31 2019-05-29 リンテック株式会社 Dicing sheet, method of manufacturing dicing sheet, and method of manufacturing mold chip
WO2017162800A1 (en) * 2016-03-24 2017-09-28 Siltectra Gmbh Polymer hybrid material for use in a splitting method
JP2018019022A (en) * 2016-07-29 2018-02-01 日東電工株式会社 Dicing tape integrated semiconductor rear face film and method of manufacturing semiconductor device
CN113226754A (en) * 2019-03-27 2021-08-06 琳得科株式会社 Sheet for processing workpiece
CN110465888B (en) * 2019-09-17 2021-01-15 泉州运城制版有限公司 Installation method of grinding wheel of plate roller grinding machine
JP7276555B1 (en) 2021-11-08 2023-05-18 大日本印刷株式会社 Adhesive tape for semiconductor processing

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4369584B2 (en) * 2000-01-21 2009-11-25 日東電工株式会社 Adhesive sheet for semiconductor wafer holding protection
JP4781633B2 (en) * 2004-03-29 2011-09-28 リンテック株式会社 Adhesive sheet
US7875501B2 (en) * 2006-03-15 2011-01-25 Shin-Etsu Polymer Co., Ltd. Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure
JP4991350B2 (en) * 2007-02-28 2012-08-01 リンテック株式会社 Adhesive sheet
JP4991348B2 (en) * 2006-04-06 2012-08-01 リンテック株式会社 Adhesive sheet
JP2012069586A (en) * 2010-09-21 2012-04-05 Nitto Denko Corp Dicing die-bonding film, manufacturing method of dicing die-bonding film, and manufacturing method of semiconductor device

Also Published As

Publication number Publication date
JPWO2014020962A1 (en) 2016-07-21
CN104508801A (en) 2015-04-08
WO2014020962A1 (en) 2014-02-06
MY172228A (en) 2019-11-18
CN104508801B (en) 2017-11-10
JP5414953B1 (en) 2014-02-12
TW201408750A (en) 2014-03-01
PH12015500230B1 (en) 2015-04-06
TWI564363B (en) 2017-01-01

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