MY159804A - Dicing tape for processing semiconductor - Google Patents
Dicing tape for processing semiconductorInfo
- Publication number
- MY159804A MY159804A MYPI2013004007A MYPI2013004007A MY159804A MY 159804 A MY159804 A MY 159804A MY PI2013004007 A MYPI2013004007 A MY PI2013004007A MY PI2013004007 A MYPI2013004007 A MY PI2013004007A MY 159804 A MY159804 A MY 159804A
- Authority
- MY
- Malaysia
- Prior art keywords
- adhesive agent
- agent layer
- dicing tape
- radiation
- exposure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68331—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding of passive members, e.g. die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
Abstract
THE PRESENT INVENTION PROVIDES A DICING TAPE FOR PROCESSING A SEMICONDUCTOR FOR USE IN A PROCESS OF DICING A SEMICONDUCTOR PACKAGE, WHEREIN: A RADIATION CURABLE ADHESIVE AGENT LAYER (5) IS FORMED ON AT LEAST ONE SURFACE OF A BASE FILM (3); THE ADHESIVE AGENT LAYER (5) INCLUDES A RESIN COMPOSITION CONTAINING AN ACRYLIC POLYMER AS A BASE POLYMER; THE ADHESIVE AGENT LAYER (5) HAS A THICKNESS OF 10 TO 30 µm; THE ADHESIVE AGENT LAYER (5) AFTER EXPOSURE TO RADIATION HAS AN ADHESION OF 1.0 TO 2.0 N/25 MM TAPE WIDTH TO SUS304 AS MEASURED BY A 90° PEEL TEST ACCORDING TO JIS Z0237; AND THE ADHESIVE AGENT LAYER (5) AFTER EXPOSURE TO RADIATION UNDER AN ATMOSPHERIC CONDITION HAS A PEAK PROBE TACK STRENGTH OF 50 TO 150 MN/MM2. THE MOST ILLUSTRATIVE DRAWING IS
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011237223A JP5053455B1 (en) | 2011-10-28 | 2011-10-28 | Dicing tape for semiconductor processing |
Publications (1)
Publication Number | Publication Date |
---|---|
MY159804A true MY159804A (en) | 2017-02-15 |
Family
ID=47189506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2013004007A MY159804A (en) | 2011-10-28 | 2012-10-22 | Dicing tape for processing semiconductor |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5053455B1 (en) |
CN (1) | CN103620743B (en) |
MY (1) | MY159804A (en) |
TW (1) | TWI421322B (en) |
WO (1) | WO2013061931A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101636378B1 (en) * | 2013-08-28 | 2016-07-05 | 주식회사 엘지화학 | Module Housing for Unit Module Having Heat Radiation Structure and Battery Module Comprising the Same |
JP6472972B2 (en) * | 2013-10-23 | 2019-02-20 | 三井・デュポンポリケミカル株式会社 | Resin composition for dicing tape substrate and dicing tape substrate |
JP6482818B2 (en) * | 2013-10-23 | 2019-03-13 | リンテック株式会社 | Dicing sheet |
JP5718515B1 (en) * | 2014-01-23 | 2015-05-13 | 古河電気工業株式会社 | Adhesive tape for protecting semiconductor wafer surface and method for processing semiconductor wafer |
JP6753631B2 (en) * | 2014-09-09 | 2020-09-09 | リケンテクノス株式会社 | Film processing method |
JP6536188B2 (en) * | 2015-06-05 | 2019-07-03 | コニカミノルタ株式会社 | Dielectric multilayer film |
TWI684524B (en) * | 2015-10-05 | 2020-02-11 | 日商琳得科股份有限公司 | Semiconductor processing sheet |
KR102117112B1 (en) * | 2016-04-06 | 2020-05-29 | 주식회사 엘지화학 | Adhesive composition for semiconductor, method for the same and protection film for semiconductor |
TWI797154B (en) * | 2018-01-31 | 2023-04-01 | 日商三星鑽石工業股份有限公司 | Film peeling mechanism and substrate breaking system |
JP7269095B2 (en) * | 2019-05-29 | 2023-05-08 | 古河電気工業株式会社 | glass processing tape |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4794971B2 (en) * | 2005-03-23 | 2011-10-19 | 古河電気工業株式会社 | Dicing die bond sheet |
JP4493643B2 (en) * | 2006-12-06 | 2010-06-30 | 日東電工株式会社 | Re-peelable pressure-sensitive adhesive composition, and pressure-sensitive adhesive tape or sheet |
JP5757625B2 (en) * | 2008-04-25 | 2015-07-29 | エルジー・ケム・リミテッド | Epoxy composition, adhesive film, dicing die bonding film, and semiconductor device |
TWI400311B (en) * | 2008-05-14 | 2013-07-01 | Lg Chemical Ltd | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet and semi-conductor wafer backgrinding method using the same |
JP4318743B1 (en) * | 2008-10-07 | 2009-08-26 | 昭和高分子株式会社 | Ultraviolet curable removable pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet using the same |
JP5569148B2 (en) * | 2009-05-28 | 2014-08-13 | 日立化成株式会社 | Dicing tape, dicing tape integrated adhesive sheet, semiconductor device, and method for manufacturing semiconductor device |
JP5089710B2 (en) * | 2010-01-05 | 2012-12-05 | 日東電工株式会社 | Adhesive tape or sheet |
JP5488001B2 (en) * | 2010-01-28 | 2014-05-14 | 日立化成株式会社 | Method for manufacturing semiconductor chip with adhesive and method for manufacturing semiconductor device |
-
2011
- 2011-10-28 JP JP2011237223A patent/JP5053455B1/en active Active
-
2012
- 2012-10-22 MY MYPI2013004007A patent/MY159804A/en unknown
- 2012-10-22 WO PCT/JP2012/077252 patent/WO2013061931A1/en active Application Filing
- 2012-10-22 CN CN201280028334.9A patent/CN103620743B/en active Active
- 2012-10-26 TW TW101139740A patent/TWI421322B/en active
Also Published As
Publication number | Publication date |
---|---|
CN103620743B (en) | 2015-04-01 |
TW201326347A (en) | 2013-07-01 |
TWI421322B (en) | 2014-01-01 |
CN103620743A (en) | 2014-03-05 |
WO2013061931A1 (en) | 2013-05-02 |
JP2013098224A (en) | 2013-05-20 |
JP5053455B1 (en) | 2012-10-17 |
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