MY154031A - Adhesive tape for processing semiconductor device - Google Patents

Adhesive tape for processing semiconductor device

Info

Publication number
MY154031A
MY154031A MYPI2013004008A MYPI2013004008A MY154031A MY 154031 A MY154031 A MY 154031A MY PI2013004008 A MYPI2013004008 A MY PI2013004008A MY PI2013004008 A MYPI2013004008 A MY PI2013004008A MY 154031 A MY154031 A MY 154031A
Authority
MY
Malaysia
Prior art keywords
adhesive tape
agent layer
package
adhesive agent
irradiated
Prior art date
Application number
MYPI2013004008A
Inventor
Tanagawa Yuri
Ota Satoshi
Yabuki Akira
Hattori Satoshi
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY154031A publication Critical patent/MY154031A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B32B2250/242—All polymers belonging to those covered by group B32B27/32
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/16—Presence of ethen-propene or ethene-propene-diene copolymers
    • C09J2423/166—Presence of ethen-propene or ethene-propene-diene copolymers in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Abstract

TECHNICAL PROBLEM THE PRESENT INVENTION IS AIMED AT PROVIDING AN ADHESIVE TAPE THAT ENABLES DICING WHILE PREVENTING CUTTING DUST FROM ADHERING TO SEMICONDUCTOR DEVICES DURING PROCESSING OF THE SEMICONDUCTOR DEVICES WITHOUT ANY NEW FACILITY MODIFICATION OR INTRODUCTION OF EXPENDABLE SUPPLIES. SOLUTION THE PRESENT INVENTION IS DIRECTED TO AN ADHESIVE TAPE (1) FOR USE IN SECURING AN INTEGRALLY-SEALED PACKAGE DURING DICING OF THE PACKAGE TO SINGULATE AND SEPARATE THE PACKAGE INTO INDIVIDUAL PACKAGES WHEREIN: THE ADHESIVE TAPE 1 HAS AN ULTRAVIOLET CURABLE ADHESIVE AGENT LAYER (5) ON A BASE FILM (3); THE CONTACT ANGLE OF A SURFACE OF THE ADHESIVE AGENT LAYER (5) BEFORE BEING IRRADIATED WITH ULTRAVIOLET RAYS WITH RESPECT TO PURE WATER IS EQUAL TO OR SMALLER THAN 115°; AND THE CONTACT ANGLE OF THE SURFACE OF THE ADHESIVE AGENT LAYER (5) BEFORE BEING IRRADIATED WITH ULTRAVIOLET RAYS WITH RESPECT TO METHYLENE IODIDE IS EQUAL TO OR SMALLER THAN 65°. THE MOST ILLUSTRATIVE DRAWING IS
MYPI2013004008A 2011-10-27 2012-10-22 Adhesive tape for processing semiconductor device MY154031A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011236071A JP5019657B1 (en) 2011-10-27 2011-10-27 Adhesive tape for semiconductor device processing

Publications (1)

Publication Number Publication Date
MY154031A true MY154031A (en) 2015-04-30

Family

ID=46980477

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013004008A MY154031A (en) 2011-10-27 2012-10-22 Adhesive tape for processing semiconductor device

Country Status (6)

Country Link
JP (1) JP5019657B1 (en)
KR (1) KR101402553B1 (en)
CN (1) CN103370770B (en)
MY (1) MY154031A (en)
TW (1) TWI477393B (en)
WO (1) WO2013061925A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5437681B2 (en) * 2009-03-30 2014-03-12 リンテック株式会社 Adhesive sheet and method for manufacturing semiconductor device
JP5460809B1 (en) * 2012-10-17 2014-04-02 古河電気工業株式会社 Adhesive tape for semiconductor processing
JP5379919B1 (en) * 2013-02-13 2013-12-25 古河電気工業株式会社 Adhesive tape for semiconductor processing
JP2015003988A (en) * 2013-06-20 2015-01-08 古河電気工業株式会社 Adhesive tape for semiconductor processing
JP6328397B2 (en) * 2013-10-02 2018-05-23 リンテック株式会社 Adhesive sheet for processing electronic parts and method for manufacturing semiconductor device
JP5607847B1 (en) * 2013-11-29 2014-10-15 古河電気工業株式会社 Adhesive tape for semiconductor processing
JP6066013B2 (en) * 2014-02-21 2017-01-25 株式会社村田製作所 Electronic component supplier and manufacturing method thereof
WO2015132852A1 (en) * 2014-03-03 2015-09-11 古河電気工業株式会社 Adhesive tape for semiconductor processing
CN112335022A (en) * 2018-09-12 2021-02-05 琳得科株式会社 Sheet for processing workpiece and method for manufacturing processed workpiece
JP7269095B2 (en) * 2019-05-29 2023-05-08 古河電気工業株式会社 glass processing tape
KR20220072634A (en) * 2020-11-25 2022-06-02 (주)이녹스첨단소재 Multi-layered film for spacer and method of forming spacer using the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4477346B2 (en) * 2003-12-05 2010-06-09 古河電気工業株式会社 Adhesive tape for semiconductor dicing
JP2006303472A (en) * 2005-03-23 2006-11-02 Nitto Denko Corp Dicing die bond film
CN101466540A (en) * 2006-06-02 2009-06-24 日东电工株式会社 Polymer member having incompatible material maldistributed polymer layer and surface uneven tape or sheet made of the polymer member
JP4767144B2 (en) * 2006-10-04 2011-09-07 日東電工株式会社 Adhesive sheet for laser processing
JP5000370B2 (en) * 2007-04-20 2012-08-15 日東電工株式会社 Adhesive sheet for water jet laser dicing
JP5048436B2 (en) * 2007-09-25 2012-10-17 日東電工株式会社 Manufacturing method of adhesive tape
JP2009242776A (en) * 2008-03-14 2009-10-22 Furukawa Electric Co Ltd:The Adhesive tape for surface protection for semiconductor wafer
JP5503357B2 (en) * 2009-03-23 2014-05-28 古河電気工業株式会社 Dicing tape, method for preventing hardening of dicing tape, and dicing method for semiconductor substrate encapsulated

Also Published As

Publication number Publication date
CN103370770B (en) 2015-07-29
TWI477393B (en) 2015-03-21
CN103370770A (en) 2013-10-23
KR20140004250A (en) 2014-01-10
KR101402553B1 (en) 2014-05-30
WO2013061925A1 (en) 2013-05-02
JP2013093519A (en) 2013-05-16
JP5019657B1 (en) 2012-09-05
TW201336684A (en) 2013-09-16

Similar Documents

Publication Publication Date Title
MY154031A (en) Adhesive tape for processing semiconductor device
GB2520905A (en) Advanced handler wafer debonding method
WO2012125560A3 (en) Method and apparatus for plasma dicing a semi-conductor wafer
PH12015000096A1 (en) Method of reducing residual contamination in singulated semiconductor die
MY165350A (en) Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet
SG11201708735SA (en) Tape for semiconductor processing
MY180537A (en) Wafer processing method using adhesive tape to pick up device chips
GB201102122D0 (en) Semiconductor devices and fabrication methods
PH12016500961B1 (en) Semiconductor-processing pressure-sensitive adhesive tape
PH12013000318A1 (en) Semiconductor die singulation method and apparatus
EP2724366A4 (en) Etching a laser-cut semiconductor before dicing a die attach film (daf) or other material layer
EP2003685A4 (en) Surface protective tape used for back grinding of semiconductor wafer and base film for the surface protective tape
TW201130022A (en) Methods of fabricating stacked device and handling device wafer
MY162761A (en) Adhesive tape for processing semiconductor wafer
EP2581954A4 (en) Die-bonding material for optical semiconductor devices and optical semiconductor device using same
WO2011100204A3 (en) Thin wafer carrier
KR102180168B9 (en) Adhesive tape for semiconductor wafer surface protection and processing method of semiconductor wafer
MY183013A (en) Sheet for semiconductor processing
TWI560256B (en) Surface protecting adhesive film for semiconductor wafer and method manufacturing the same
PH12017500374B1 (en) Adhesive film and semiconductor package using adhesive film
SG11202012963WA (en) Adhesive tape for semiconductor processing and method for producing semiconductor device
MY159804A (en) Dicing tape for processing semiconductor
SG11201404022UA (en) Protective film for semiconductor wafer and method for manufacturing semiconductor chip
EP3561010A4 (en) Bonding film and tape for wafer processing
TWI368269B (en) Method for cutting protective tape of semiconductor wafer and apparatus for cutting the protective tape